TW202236399A - Cutting device capable of suppressing slight static electricity generated by vacuum leakage - Google Patents

Abstract

The object of the present invention is to provide a cutting device capable of suppressing slight static electricity generated by vacuum leakage. A cutting device 1 includes a cutting unit 20 configured to cut a workpiece by mounting a cutting blade 21 on a spindle 23; a chuck table 10 in which a holding surface 11 is partitioned into a plurality of regions by a clearance groove of the cutting blade 21 and a suction hole that sucks and holds the workpiece is opened in a region of the holding surface 11; and a moving unit 40 that moves the cutting unit 20 relative to the chuck table 10. The cutting device further includes a static electricity suppression unit 50 that suppresses static electricity generated from vacuum leakage in a gap between the holding surface 11 of the chuck table 10 and the workpiece.

Description

cutting device

The present invention relates to a cutting device.

A cutting device (dicing machine) using a cutting blade is used to divide various electronic components such as resin package substrates, glass substrates, and ceramic substrates. In the division of semiconductor wafers, etc., the wafers are often fixed to the ring frame with an adhesive tape to form a frame unit that is easy to transport even after the wafers are divided into individual wafers. However, for relatively low unit price resin packaging substrates, in order to reduce the cost of adhesive tapes or frames, most of them use so-called jig cutters that directly fix the substrates to the work clamping platform and divide them without using adhesive tapes (see, for example, patent documents 1).

The jig cutting machine shown in Patent Document 1 directly fixes the workpiece to the work clamp, so there will be a vacuum leak due to the slight gap between the workpiece and the holding surface of the work clamp. . prior art literature patent documents

Patent Document 1: Japanese Patent No. 6173173

The problem to be solved by the invention

With the precision and high density of more advanced devices than before, the countermeasures against electrostatic damage of devices have become stricter, and it is beginning to be required to suppress even the slightest static electricity generated by vacuum leaks.

The object of the present invention is to provide a cutting device capable of suppressing even slight static electricity caused by vacuum leaks. means to solve problems

In order to solve the above-mentioned problems and achieve the purpose, the cutting device of the present invention includes: a cutting unit that mounts a cutting blade on a spindle to cut a workpiece; A region, the suction hole for attracting and holding the workpiece is opened in the region of the holding surface; and a moving unit that moves the cutting unit and the work chuck relatively, the aforementioned cutting device is characterized in that it is further equipped with an electrostatic suppression unit, and the aforementioned The static electricity suppression part suppresses the static electricity generated by the vacuum leak in the gap between the holding surface of the work clamp and the workpiece.

In the aforementioned cutting device, the work chuck may be formed by laying a resin layer as the holding surface on the metal main body, and the static electricity suppressing part may be a water supply part, and the water supply part may be supplied with Water is used to electrically connect the main body and the resin layer.

In the aforementioned cutting device, the work holder may be formed by laying a resin layer as the holding surface on a metal main body, and the static electricity suppressing portion may be the conductive resin layer.

In the aforementioned cutting device, the resin layer may be fixed to the metal main body with an adhesive having conductivity.

In the above-mentioned cutting device, it may also be that: the work holder includes a first work holder and a second work holder, and the transfer unit will, when the workpiece attracted and held by one of the work holders is being processed, The other work chuck unloads the processed workpiece and loads the processed workpiece before processing, and the processed workpiece waits in a state of being attracted and held before processing. Invention effect

The present invention can exert the following effects: even slight static electricity generated by vacuum air leakage can be suppressed.

form for carrying out the invention

The form (embodiment) for carrying out this invention is demonstrated in detail, referring drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include constituent elements that can be easily assumed by those skilled in the art and substantially the same constituent elements. In addition, the constitution described below can be combined suitably. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[Embodiment 1] A cutting device according to Embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a cutting device according to the first embodiment. Fig. 2 is a perspective view showing an example of a workpiece to be processed by the cutting device shown in Fig. 1 . Fig. 3 is a perspective view of the workpiece shown in Fig. 2 viewed from the back side. Fig. 4 is a perspective view of the work clamp of the cutting device shown in Fig. 1 . Fig. 5 is a cross-sectional view of main parts of the work chuck shown in Fig. 4 .

The cutting device 1 shown in FIG. 1 of Embodiment 1 is a processing device for cutting the workpiece 200 shown in FIGS. 2 and 3 . In Embodiment 1, as shown in FIGS. 2 and 3 , the workpiece 200 to be processed by the cutting device 1 is formed in the shape of a flat plate with a rectangular planar shape. The workpiece 200 has a substrate 201 made of metal, and a plurality of dividing lines 203 are formed in a grid on the front surface 202 of the substrate 201 .

The workpiece 200 has a plurality of regions defined by a plurality of dividing lines 203 , and a wafer (not shown) is placed on the rear surface 204 side of the substrate 201 in each of these regions. The wafer is covered with molding resin 205 laminated on the back surface 204 of the substrate 201 . In Embodiment 1, the workpiece 200 is a so-called resin package substrate in which a chip is embedded with a molding resin 205 .

The workpiece 200 configured as described above is cut along the planned dividing line 203 by the cutting device 1 shown in FIG. 1 , and is divided into individual packaged device wafers 206 . Furthermore, in Embodiment 1, although the workpiece 200 is a resin-encapsulated substrate, in the present invention, it is not limited to a resin-encapsulated substrate, and may be a glass substrate, a ceramic substrate, or the like.

The cutting device 1 shown in FIG. 1 is a processing device that holds a workpiece 200 on a chuck 10 and performs cutting along a plurality of dividing lines 203 . In Embodiment 1, the cutting device 1 is a processing device (so-called jig cutting machine) that directly holds the workpiece 200 to which the dicing tape is not attached on the work chuck 10, and holds the workpiece 200 with A so-called full cut is used to singulate into packaged device wafers 206 .

As shown in FIG. 1 , the cutting device 1 includes a work holder 10, a cutting unit 20, an imaging unit 30, and a control unit 100. The work holder 10 sucks and holds a workpiece 200 on a holding surface 11. While supplying cutting water to the workpiece 200 sucked and held by the work chuck 10 , the cutting blade 21 cuts the dividing line 203 , and the workpiece 200 is divided into a plurality of packaged device wafers 206 . As shown in FIG. 1 , the cutting device 1 is equipped with two cutting units 20 , that is, a dicer with two spindles, which is a so-called facing dual type cutting device.

Moreover, as shown in FIG. 1 , the cutting device 1 includes a first work holder 10 - 1 and a second work holder 10 - 2 as the work holder 10 . In the following, when these are distinguished in this specification, they will be described as the first work chuck 10 - 1 and the second work chuck 10 - 2 , and only the work chuck 10 will be described when they are not distinguished. The configuration of the first chuck 10-1 is equal to the configuration of the second chuck 10-2.

In addition, the cutting device 1 includes a moving unit 40 for relatively moving the cutting unit 20 and the chuck table 10 . The moving unit 40 has: an X-axis moving unit 41, which is a processing feed unit for processing the work clamp table 10 towards the X-axis direction parallel to the horizontal direction; a Y-axis moving unit 42, which is used to make the cutting unit 20 towards the horizontal direction. The indexing feed direction that is parallel to and orthogonal to the X-axis direction is the indexing feed unit that moves in the Y-axis direction; the Z-axis moving unit 43 makes the cutting unit 20 parallel to the X-axis direction and perpendicular to the Y-axis direction The cutting feed direction in the vertical direction is the Z-axis direction; and the rotating moving unit 44 makes the work clamping table 10 rotate around the axis parallel to the Z-axis direction. That is, the moving unit 40 is a unit that relatively moves the chuck table 10 and the cutting unit 20 in the X-axis direction, the Y-axis direction, and the Z-axis direction.

The X-axis moving unit 41 is a unit that moves the work holder 10 in the X-axis direction relative to the cutting unit 20 by moving the work holder 10 in the processing feed direction, that is, the X-axis direction together with the rotation movement unit 44 . The X-axis moving unit 41 moves the work holder 10 along the X-axis between the processing area and the loading and unloading area. The aforementioned processing area is where the cutting unit 20 cuts the workpiece 200 held on the work holder 10 The area, the aforementioned loading and unloading area is an area for loading and unloading the workpiece 200 to and from the work chuck 10 . In Embodiment 1, two X-axis moving units 41 are provided in a one-to-one correspondence with the work chuck 10 . The X-axis moving unit 41 covers the processing area and the loading and unloading area to move the corresponding work holder 10 in the X-axis direction.

The Y-axis moving unit 42 moves the cutting unit 20 relatively in the Y-axis direction relative to the cutting unit 20 by moving the cutting unit 20 in the index feed direction, that is, the Y-axis direction. unit. The Z-axis moving unit 43 is a unit that moves the chuck table 10 relative to the cutting unit 20 in the Z-axis direction by moving the cutting unit 20 in the Z-axis direction that is the cutting feed direction.

The rotation movement unit 44 is a unit that moves in the X-axis direction by the X-axis movement unit 41 and rotates the work chuck 10 around an axis parallel to the Z-axis direction. In Embodiment 1, two rotational movement units 44 are provided in a one-to-one correspondence with the work chuck 10 . The rotational movement unit 44 is a unit that rotates the corresponding chuck table 10 around an axis parallel to the Z-axis direction.

The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 all have a known ball screw, a known motor, and a known guide rail. The ball screw is rotated around the axis, and the guide rail supports the chuck table 10 or the cutting unit 20 so as to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction.

As shown in FIG. 4 , the work chuck 10 is formed in a rectangular shape and has a holding surface 11 that holds a workpiece 200 . As shown in FIG. 4 , the work clamp table 10 includes: a main body 12 made of conductive metal and provided on a rotating movement unit 44; and a plate-shaped resin layer 13 made of elastic non-conductive material such as rubber. It is made of resin and is provided on the surface of the main body part 12 .

The planar shapes of the main body portion 12 and the resin layer 13 are formed in a rectangular shape larger than the planar shape of the workpiece 200 . The surface of the main body portion 12 and the surface of the resin layer 13 are formed flat along the horizontal direction. In addition, the surface of the resin layer 13 is the holding surface 11 for holding the workpiece 200 . That is, the holding surface 11 of the chuck table 10 is constituted by the resin layer 13 . Furthermore, as shown in FIG. 5 , the resin layer 13 is fixed to the surface of the main body portion 12 by the adhesive 14 . In this way, the work chuck 10 is formed by laying the resin layer 13 as the holding surface 11 on the metal main body 12 .

The work clamping table 10 is the relief groove 15 for the cutting blade 21 to invade when it is cut and divides the holding surface 11 into a plurality of areas, and each opening in the area of the holding surface 11 divided by the relief groove 15 is used for The suction holes 16 for sucking the workpiece 200 and the packaged device wafer 206 . The relief groove 15 is provided at a position corresponding to the planned dividing line 203 (a position overlapping with the planned dividing line 203 of the workpiece 200 held on the holding surface 11 ) and is recessed from the holding surface 11 . In Embodiment 1, the relief groove 15 penetrates through the resin layer 13 and divides the resin layer 13 for each region.

The suction hole 16 is provided at a position corresponding to the packaged device wafer 206 (that is, a position overlapping with the packaged device wafer 206 of the workpiece 200 held on the holding surface 11 ), and opens in each area of the holding surface 11 . In Embodiment 1, the suction hole 16 and the packaged device wafer 206 correspond to each other in a one-to-one manner. The suction hole 16 is connected to a suction source 19 through a suction path 17 and an on/off valve 18 shown in FIG. 1 .

The chuck 10 sucks and holds the workpiece 200 and the packaged device wafer 206 on the holding surface 11 by sucking the suction hole 16 with the suction source 19 . Moreover, when the work clamp 10 sucks and holds the workpiece 200 and the packaged device wafer 206 on the holding surface 11, there will be a negative pressure from the suction source 19 from the holding surface 11 and the workpiece 200 and the packaged device wafer 206. The gap between the leaks (that is, known as vacuum leaks). In the chuck 10 , static electricity is generated between the holding surface 11 , the workpiece 200 , and the packaged device wafer 206 due to a vacuum leak, and the static electricity is charged.

In addition, each work clamping table 10-1, 10-2 moves in the X-axis direction together with the rotation movement unit 44 by the X-axis movement unit 41, and rotates around and parallel to the Z-axis direction by the rotation movement unit 44. axis of rotation. In Embodiment 1, one work clamp table 10 - 1 , 10 - 2 is provided on the corresponding rotary movement unit 44 .

The cutting unit 20 is a processing unit for cutting the workpiece 200 held by the work chuck 10 . Each of the cutting units 20 is provided relatively and freely movable in the Y-axis direction with respect to the work chuck 10 by the Y-axis moving unit 42 , and is relatively and freely movable in the Z-axis direction by the Z-axis moving unit 43 . ground setting.

As shown in FIG. 1 , the cutting unit 20 is installed on the door-shaped support frame 3 erected from the device body 2 through the Y-axis moving unit 42 and the Z-axis moving unit 43 . In the cutting unit 20 , the Y-axis moving unit 42 and the Z-axis moving unit 43 enable the cutting insert 21 to be positioned at an arbitrary position on the holding surface 11 of the chuck table 10 .

The cutting unit 20 is a unit for cutting the workpiece 200 by installing the cutting blades 21 on the main shaft 23 . As shown in FIG. 1 , the cutting unit 20 has a cutting blade 21 for cutting the workpiece 200 held by the work holder 10, and moves in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 42 and the Z-axis moving unit 43 The main shaft housing 22 is freely movable in the Z-axis direction, and the main shaft is provided on the main shaft housing 22 in a rotatable manner around the axis and is rotated by a motor not shown in the figure, and the cutting blade 21 is installed on the front end of the main shaft. 23. A cutting water supply nozzle for supplying cutting water to the cutting blade 21.

In Embodiment 1, the cutting insert 21 is a combination of an annular circular base and an annular cutting edge arranged on the outer peripheral edge of the circular base to cut the workpiece 200. The hub blade (hub blade). The cutting edge is made of diamond or CBN (cubic boron nitride, Cubic Boron Nitride) abrasive grains, and a bonding material (bonding material) with fixed abrasive grains such as metal or resin, and is formed into a ring shape with a constant thickness. Furthermore, in the present invention, the cutting blade 21 may also be a so-called washer blade constituted only by a cutting edge.

The photographing unit 30 has been configured to move integrally with the cutting unit 20 . The imaging unit 30 includes an imaging element for imaging a region to be divided of the workpiece 200 held on the chuck 10 before cutting. The imaging element may be, for example, a CCD (Charge-Coupled Device, Charge-Coupled Device) imaging element or a CMOS (Complementary Metal Oxide Semiconductor, Complementary MOS) imaging element. The photographing unit 30 photographs the workpiece 200 held on the work clamp 10 to obtain images for calibration etc., and outputs the obtained images to the control unit 100, wherein the aforementioned calibration is performed Alignment between workpiece 200 and cutting insert 21 .

In addition, the cutting device 1 is provided with an unillustrated X-axis direction position detection unit, an unillustrated Y-axis direction position detection unit, and a Z-axis direction position detection unit. The X-axis direction position detection unit is used to detect the work chuck 10 The position in the X-axis direction of the above-mentioned Y-axis direction position detection unit is used to detect the position of the Y-axis direction of the cutting unit 20, and the aforementioned Z-axis direction position detection unit is used to detect the position of the Z-axis direction of the cutting unit 20. The position detection unit in the X-axis direction and the position detection unit in the Y-axis direction may be constituted by a linear scale parallel to the X-axis direction or the Y-axis direction, and a reading head. The position detection unit in the Z-axis direction detects the position of the cutting unit 20 in the Z-axis direction by using the pulse of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit and the Z-axis direction position detection unit will output the positions of the work clamp 10 in the X-axis direction, the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100 . Furthermore, in Embodiment 1, the positions of the chuck table 10 and the cutting unit 20 of the cutting device 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are based on a previously determined origin position (not shown). The location of the benchmark is determined.

In addition, the cutting device 1 further includes a static electricity suppression unit 50 that suppresses static electricity generated by a vacuum leak in the gap between the resin layer 13, that is, the holding surface 11, the workpiece 200, and the packaged device wafer 206. . In Embodiment 1, the static electricity suppression unit 50 is the water supply unit 51 , and the water supply unit 51 electrically connects the main body 12 and the resin layer 13 with the supplied water 52 . Furthermore, the water 52 supplied by the static electricity suppressing unit 50 of the cutting device 1 according to Embodiment 1, that is, the water supply unit 51, is preferably water having a resistivity value lower than that of pure water.

In Embodiment 1, the water supply unit 51 is provided in a one-to-one correspondence with the work chuck 10 , and supplies water 52 to the holding surface 11 of the corresponding work chuck 10 . In Embodiment 1, the water supply unit 51 can be supplied with water 52 from a water supply source not shown. The water supply unit 51 is a pipe extending along the Y-axis direction, and is fixed to the device main body 2 . The water supply part 51 is arranged so that the discharge port which discharges the supplied water 52 faces the holding surface 11, and is arrange|positioned at intervals in the longitudinal direction. The water supply part 51 can pass the work chuck 10 moved by the X-axis moving unit 41 below. The water supply unit 51 spouts water 52 from the discharge port, and passes the chuck table 10 moved in the X-axis direction by the X-axis moving unit 41 below, thereby supplying the water 52 to the holding surface 11, and by The supplied water 52 electrically connects the main body 12 and the resin layer 13 to discharge static electricity generated by the vacuum leak to the main body 12 .

In addition, the cutting device 1 is provided with a transfer unit 60 (shown in FIG. 7 ). The transfer unit 60 carries the workpiece 200 before cutting onto the holding surface 11 of the work holder 10, and transfers the holding surface after cutting. The packaged device wafer 206 on the holding surface 11 is carried out from the holding surface 11 .

The control unit 100 is a unit that individually controls each of the above-mentioned units of the cutting device 1 so that the cutting device 1 performs a machining operation on the workpiece 200 . Furthermore, the control unit 100 is a computer having a computing processing device, a memory device and an input/output interface device, the aforementioned computing processing device has a microprocessor such as a CPU (central processing unit, central processing unit), and the aforementioned memory device has a ROM ( Memory such as read only memory (read only memory) or RAM (random access memory, random access memory). The arithmetic processing device of the control unit 100 is to allow the arithmetic processing device to perform arithmetic processing according to the computer program stored in the memory device, and output the control signal for controlling the cutting device 1 to the above-mentioned cutting device 1 through the input-output interface device. constituent elements.

In addition, the control unit 100 is connected to a display unit and an input unit. The display unit is composed of a liquid crystal display device that displays the status of processing operations or images. The input unit can be used when the operator registers processing conditions, etc. use. The input unit may be constituted by at least one of a touch panel provided on the display unit, and an external input device such as a keyboard.

Next, the machining operation of the cutting device 1 having the aforementioned configuration will be described. Fig. 6 is a front view schematically showing a state in which a workpiece being sucked and held by the first chuck of the cutting device shown in Fig. 1 is being cut. Fig. 7 is a front view schematically showing a state in which a workpiece is carried into a second chuck of the cutting device shown in Fig. 6 . Fig. 8 is a side view schematically showing a state in which a workpiece held by suction and held by a first chuck of the cutting device shown in Fig. 1 is being cut. Fig. 9 is a side view schematically showing a second chuck of the cutting device shown in Fig. 8 that suctions and holds a workpiece.

In the cutting device 1 configured as described above, an operator can operate an input unit and the like to set machining conditions to the control unit 100 . The cutting device 1 starts the machining operation after the control unit 100 receives an instruction to start the machining operation from an operator or the like.

When starting the machining operation, the control unit 100 of the cutting device 1 controls the transfer unit 60 to place the molded resin 205 of the workpiece 200 on the holding surface 11 of the first chuck 10-1 in the loading and unloading area. During the machining operation, the cutting device 1 opens the on-off valve 18 to attract and hold the molded resin 205 of the workpiece 200 on the holding surface 11 of the first chuck 10-1, and rotate the spindle 23 around the axis , and supply cutting water to the cutting blade 21. In the cutting device 1, the control unit 100 will control the moving unit 40 to move the first work clamping table 10-1 from the loading and unloading area toward the processing area to the bottom of the imaging unit 30, and the imaging unit 30 will hold the first clamping table 10-1 on the suction unit. The workpiece 200 of the work clamp 10-1 is photographed to perform calibration.

In the processing operation, the cutting device 1 is that the control unit 100 controls the moving unit 40 etc. according to the processing conditions, and as shown in FIG. The workpiece 200 of the clamping table 10-1 moves relatively along the planned dividing line 203, and the cutting blade 21 cuts toward the planned dividing line 203 of the workpiece 200 until it enters the relief groove 15, so as to suck and hold the workpiece 200. The workpiece 200 of the first work holder 10-1 is cut.

In addition, in the processing operation, the control unit 100 of the cutting device 1 will perform: in the cutting process of the workpiece 200 that has been sucked and held on the first work holder 10-1, the workpiece 200 connected to the second work holder 10-1 will be connected to the second work holder 10-1. 2, the on-off valve 18 is closed, and as shown in Figure 6, while controlling the moving unit 40 to move the second work clamp table 10-2 in the electrostatic suppression part 50, that is, under the water supply part 51, it moves from the water supply part 51 to the first water supply part 51. 2 Water 52 is supplied to the holding surface 11 of the chuck table 10-2. As shown in FIG. 7 , the supplied water 52 can cover the holding surface 11 of the second chuck 10 - 2 by surface tension or the like, thereby electrically connecting the resin layer 13 and the main body 12 .

During the processing operation, when the control unit 100 of the cutting device 1 is in the process of cutting the workpiece 200 that has been sucked and held on the first chuck 10-1, as shown in FIG. 2. After the work chuck 10-2 is positioned in the loading and unloading area, the transfer unit 60 is controlled to place the molded resin 205 of the workpiece 200 on the holding surface 11 of the second working chuck 10-2 in the loading and unloading area. During the machining operation, the cutting device 1 opens the on-off valve 18 to suck and hold the molding resin 205 of the workpiece 200 on the holding surface 11 of the second chuck 10-2. At this time, the resin layer 13 and the main body 12 can be electrically connected by the water 52, and the static electricity generated on the holding surface 11 of the second work clamp 10-2 due to a vacuum leak will be discharged to the main body 12 and suppressed. .

During the machining operation, the control unit 100 of the cutting device 1 will suck and hold the workpiece 200 held on the first work holder 10-1 as shown in FIG. 8 , as shown in FIG. The second chuck table 10-2 holding the workpiece 200 is positioned in the loading and unloading area and stands by. In this way, the transfer unit 60 will carry the workpiece 200 into the second work holder 10-2 when the workpiece 200 attracted and held by the first work holder 10-1 is being cut, and let the workpiece 200 held The workpiece 200 on the second chuck table 10-2 is in a state of being sucked and held before cutting in the loading and unloading area.

The cutting device 1 cuts the planned dividing line 203 of the workpiece 200 sucked and held on the first chuck 10 - 1 according to the processing conditions, and divides the workpiece 200 into individual packaged device wafers 206 . After cutting all the planned division lines 203 of the workpiece 200 sucked and held on the first work chuck 10-1 to divide it into packaged device wafers 206, the cutting device 1 will place the first work chuck 10-1 1 Move from the processing area to the loading and unloading area. In addition, the cutting device 1 moves the second chuck table 10-2 from the loading and unloading area toward the processing area to move the second chucking table 10-2 to the bottom of the imaging unit 30, and the imaging unit 30 sucks and holds the second chucking table 10-2. The workpiece 200 is photographed on the second chuck 10-2 to perform calibration, and the cutting blades 21 of both cutting units 20 are cut toward the planned dividing line 203 of the workpiece 200 until the cutting blades 21 enter To the relief groove 15, the workpiece 200 that has been sucked and held in the second work chuck 10-2 is cut.

During the machining operation, the cutting device 1 controls the transfer unit 60 to move the workpiece 200 sucked and held in the second work chuck 10-2 from the first work chuck positioned in the loading and unloading area during the cutting process. The holding surface 11 of 10-1 carries out the packaged device wafer 206 which is the processed object 200 after cutting. During the processing operation, the cutting device 1 controls the movement unit 40 while the first work holder 10-1 is statically suppressed during the cutting process of the workpiece 200 held by the second work holder 10-2. The water supply part 50, that is, the water supply part 51, moves under the water supply part 51 toward the holding surface 11 of the first work clamp table 11 while supplying water 52, and the first work clamp table 10-1 is moved by controlling the moving unit 40. After being positioned in the loading and unloading area, the conveying unit 60 is controlled to carry the workpiece 200 before cutting into the first work clamping table 10-1, and the workpiece held in the second working clamping table 10-2 is sucked During the cutting process at 200, the first chuck table 10-1 that sucks and holds the workpiece 200 before cutting is positioned in the loading and unloading area and stands by.

In this way, the transfer unit 60 transfers the workpiece 200 sucked and held by the second chuck 10-2 to the workpiece 200 sucked and held by the first chuck 10-1 after cutting. The object 200, that is, the packaged device wafer 206 is carried out, and the processed object 200 before cutting is carried in, so that the processed object 200 that has been held on the first work clamp table 10-1 is carried out in the loading and unloading area before cutting. Standby in the state of attracting and holding. In this way, when the workpiece 200 attracted and held by one of the work chucks 10-1 and 10-2 is being cut, the transfer unit 60 will attract and hold the workpiece 200 after cutting by the other. The workpiece 200 is carried out and the workpiece 200 before cutting is carried in, and the workpiece 200 is kept on standby in a state of being attracted and held by the other before cutting. In this way, the cutting device 1 alternately cuts the workpiece 200 sucked and held on the first chuck 10-1 and the workpiece 200 sucked and held on the second chuck 10-2. The workpiece 200 is divided into packaged device wafers 206 one by one.

The cutting device 1 according to Embodiment 1 described above includes a static electricity suppression unit 50 that suppresses static electricity generated due to vacuum leaks. The static electricity suppression unit 50 is a water supply unit 51 that supplies water 52 such that the resin layer 13 and the metal main body 12 are electrically connected. As a result, the cutting device 1 can exert the effect that even slight static electricity generated on the holding surface 11 of the work chuck 10 due to a vacuum leak can be suppressed by the static electricity suppressing part 50, that is, the water supply part 51, and the static electricity can be suppressed. Electrostatic damage to the workpiece 200 is reduced.

[Embodiment 2] A cutting device according to Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 10 is a cross-sectional view of main parts of a chuck of a cutting device according to Embodiment 2. In addition, in FIG. 10, the same part as Embodiment 1 is attached|subjected with the same code|symbol, and description is abbreviate|omitted.

The cutting device 1 of the second embodiment is the same as that of the first embodiment except that the structure of the static electricity suppression unit 50 is different. The resin layer 13-2 shown in FIG. 10 of the chuck 10 of the cutting device 1 according to the second embodiment is conductive by mixing conductive substances such as carbon particles into elastic resin such as rubber. In addition, the adhesive 14-2 shown in FIG. 10 of the chuck 10 of the cutting device 1 according to the second embodiment has conductivity by mixing conductive substances such as carbon particles into the resin. Therefore, the resin layer 13-2 is electrically connected to the main body 12 through the adhesive 14-2.

In this way, in Embodiment 2, the static electricity suppressing part 50 is the resin layer 13 with conductivity, and the work clamp 10 uses the adhesive 14-2 with conductivity to fix the resin layer 13-2 with conductivity to the metal surface. The body portion 12 of the system.

The cutting device 1 according to the second embodiment is provided with a static electricity suppression unit 50 for suppressing static electricity generated due to a vacuum leak. The static electricity suppression part 50 is the conductive resin layer 13 of the work clamp 10 . As a result, the cutting device 1 can use the static electricity suppressing part 50, that is, the resin layer 13, to exert the following effects: even the slight static electricity generated on the holding surface 11 of the work chuck 10 due to a vacuum leak can be suppressed, and the static electricity can be reduced. The object to be processed 200 is destroyed by static electricity.

In addition, this invention is not limited to the said embodiment. That is, various modifications and implementations are possible without departing from the gist of the present invention.

1: Cutting device 2: Device body 3: Support frame 10: Work clamp table 10-1: The first work clamp 10-2: The second work clamp 11: keep the surface 12: Main body 13: resin layer 13-2: Resin layer (static suppression part) 14,14-2: Adhesive 15: Retraction groove 16: Attraction hole 17: Attraction Road 18: switch valve 19: Source of Attraction 20: Cutting unit 21: Cutting blade 22: Spindle housing 23: Spindle 30: Shooting unit 40: mobile unit 41: X-axis moving unit 42: Y-axis mobile unit 43: Z-axis mobile unit 44:Rotate mobile unit 50: Static suppression department 51: Water supply department 52: water 60: Transfer unit 100: control unit 200: processed object 201: Substrate 202: front 203: Divide scheduled line 204: back 205: molding resin 206: Package device wafer X, Y, Z: direction

Fig. 1 is a perspective view showing a configuration example of a cutting device according to the first embodiment. Fig. 2 is a perspective view showing an example of a workpiece to be processed by the cutting device shown in Fig. 1 . Fig. 3 is a perspective view of the workpiece shown in Fig. 2 viewed from the back side. Fig. 4 is a perspective view of the work clamp of the cutting device shown in Fig. 1 . Fig. 5 is a cross-sectional view of main parts of the work chuck shown in Fig. 4 . Fig. 6 is a front view schematically showing a state in which a workpiece being sucked and held by the first chuck of the cutting device shown in Fig. 1 is being cut. Fig. 7 is a front view schematically showing a state in which a workpiece is carried into a second chuck of the cutting device shown in Fig. 6 . Fig. 8 is a side view schematically showing a state in which a workpiece held by suction and held by a first chuck of the cutting device shown in Fig. 1 is being cut. Fig. 9 is a side view schematically showing a second chuck of the cutting device shown in Fig. 8 that suctions and holds a workpiece. Fig. 10 is a cross-sectional view of main parts of a chuck of a cutting device according to Embodiment 2.

1: Cutting device

2: Device body

3: Support frame

10: Work clamp table

10-1: The first work clamp

10-2: The second work clamp

11: keep the surface

17: Attraction Road

18: switch valve

19: Source of Attraction

20: Cutting unit

21: Cutting blade

22: Spindle housing

23: Spindle

30: Shooting unit

40: mobile unit

41: X-axis moving unit

42: Y-axis mobile unit

43: Z-axis mobile unit

44:Rotate mobile unit

50: Static suppression department

51: Water supply department

52: water

100: control unit

X, Y, Z: direction

Claims (5)

A cutting device comprising: The cutting unit installs the cutting blade on the main shaft to cut the workpiece; In the work clamping table, the holding surface is divided into a plurality of areas by the relief groove of the cutting insert, and the suction hole for attracting and holding the workpiece is opened in the area of the holding surface; and moving the unit so that the cutting unit moves relative to the work clamp, The cutting device further includes a static electricity suppressing portion that suppresses static electricity generated by a vacuum leak in a gap between the holding surface of the work chuck and the workpiece. The cutting device according to claim 1, wherein the work clamp is formed by laying a resin layer as the holding surface on the metal body, The static electricity suppression part is a water supply part, and the water supply part electrically connects the main body part and the resin layer with the supplied water. The cutting device according to claim 1, wherein the work clamp is formed by laying a resin layer as the holding surface on the metal body, The static electricity suppression part is the resin layer having conductivity. The cutting device according to claim 3, wherein the resin layer is fixed to the metal main body with a conductive adhesive. The cutting device according to any one of claims 1 to 4, wherein the work holder has a first work holder and a second work holder, and the transfer unit is processing the workpiece attracted and held by one of the work holders During the middle, the processed workpiece is unloaded from the other work chuck and the unprocessed workpiece is loaded in, and the processed workpiece is held in a state of being sucked and held before processing.

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