TWI759394B - transfer mechanism - Google Patents

transfer mechanism Download PDF

Info

Publication number
TWI759394B
TWI759394B TW107100040A TW107100040A TWI759394B TW I759394 B TWI759394 B TW I759394B TW 107100040 A TW107100040 A TW 107100040A TW 107100040 A TW107100040 A TW 107100040A TW I759394 B TWI759394 B TW I759394B
Authority
TW
Taiwan
Prior art keywords
wafer
outer peripheral
claw
peripheral portion
claw member
Prior art date
Application number
TW107100040A
Other languages
Chinese (zh)
Other versions
TW201830567A (en
Inventor
茶野倫太郎
飯田廣幸
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2017018386A priority Critical patent/JP6811951B2/en
Priority to JP2017-018386 priority
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201830567A publication Critical patent/TW201830567A/en
Application granted granted Critical
Publication of TWI759394B publication Critical patent/TWI759394B/en

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Abstract

[課題]可在不降低晶圓相對於工作夾台的對位精度的情形下,有效率地進行搬送而改善加工產出量。 [解決手段]一種搬送機構,是將晶圓搬送至工作夾台上,並形成下述構成:具備保持晶圓的外周部的複數個爪構件、使複數個爪構件對晶圓的外周部遠離、接近的爪構件作動設備、檢測爪構件作動設備的驅動負載的驅動負載檢測設備、檢測爪構件對晶圓的外周部的抵接位置的位置檢測設備、及控制爪構件作動設備的驅動的控制設備,使控制設備由爪構件作動設備之驅動負載的上升來檢測爪構件與晶圓的外周部的抵接,而使複數個爪構件停止並且將各個爪構件的抵接位置作為晶圓的外周部的外周位置來計算晶圓的中心。[Problem] It is possible to efficiently transfer the wafer without reducing the alignment accuracy of the wafer with respect to the table, thereby improving the processing yield. [Solution] A transfer mechanism for transferring a wafer onto a table, and having a configuration including a plurality of claw members for holding an outer peripheral portion of the wafer, and a plurality of claw members for separating the plurality of claw members from the outer peripheral portion of the wafer , approaching claw member actuating device, drive load detection device for detecting the drive load of the claw member actuating device, position detection device for detecting the contact position of the claw member with the outer peripheral portion of the wafer, and control of the driving of the claw member actuating device A device that detects the contact of the claw members with the outer peripheral portion of the wafer by the claw member actuating the rise of the driving load of the device, stops the plurality of claw members, and uses the contact position of each claw member as the outer circumference of the wafer The peripheral position of the part is used to calculate the center of the wafer.

Description

搬送機構transfer mechanism

發明領域 Field of Invention

本發明是有關於一種保持晶圓的外周部來進行搬送的搬送機構。 The present invention relates to a transfer mechanism for transferring a wafer while holding the outer peripheral portion thereof.

發明背景 Background of the Invention

近年來,隨著電子機器之薄型化及小型化,已要求有將晶圓磨削加工至100μm以下的薄度之作法。以往,在晶圓上為了防止製造步驟中的破裂或灰塵產生,而在晶圓的外周施加有倒角加工。為此,當將晶圓磨削得較薄時,則外周的倒角部分會形成為刀緣(knife-edge)(簷狀)。當晶圓的倒角部分形成為刀緣狀時,會產生從外周發生缺損而導致晶圓破損的問題。為了解決這個問題,已有一種預先將晶圓的倒角部分以切削刀在周方向上去除之後,磨削晶圓之背面的方法被提出(參照例如專利文獻1)。 In recent years, with thinning and miniaturization of electronic equipment, there has been a demand for a method of grinding wafers to a thickness of 100 μm or less. Conventionally, in order to prevent cracking and dust generation in the wafer, the outer periphery of the wafer has been chamfered. For this reason, when the wafer is ground thin, the outer peripheral chamfered portion is formed into a knife-edge (eaves shape). When the chamfered portion of the wafer is formed into a blade edge shape, there is a problem that a chip is generated from the outer periphery and the wafer is broken. In order to solve this problem, there has been proposed a method of grinding the back surface of the wafer after previously removing the chamfered portion of the wafer in the circumferential direction with a cutter (see, for example, Patent Document 1).

又,於以切削刀在周方向上去除晶圓的外周部時,晶圓的中心與工作夾台的旋轉中心不一致時,會無法使晶圓之外周部的去除寬度成為一定。於是,所採用的是一種一邊補正晶圓相對於工作夾台的位置偏移一邊進行切削的方法(參照例如專利文獻2)。在此方法中,是拍攝工作夾台上之晶圓的外周邊緣的3個點,並且將由3個點的座 標位置所計算出之晶圓的中心與工作夾台的旋轉中心之偏移量求出。移動切削刀以補正該偏移量,並且在離晶圓之中心相同的距離上於周方向上切削倒角部。 In addition, when the outer peripheral portion of the wafer is removed in the circumferential direction with a cutting blade, if the center of the wafer does not coincide with the rotation center of the table, the removal width of the outer peripheral portion of the wafer cannot be made constant. Then, a method of cutting the wafer while correcting the positional shift of the wafer with respect to the table has been adopted (for example, refer to Patent Document 2). In this method, 3 points of the peripheral edge of the wafer on the working table are photographed, and the seat of the 3 points will be Calculate the offset between the center of the wafer calculated from the target position and the center of rotation of the table. The cutter is moved to correct the offset, and the chamfered portion is cut in the circumferential direction at the same distance from the center of the wafer.

先前技術文獻 prior art literature 專利文獻 Patent Literature

專利文獻1:日本專利特開2000-173961號公報 Patent Document 1: Japanese Patent Laid-Open No. 2000-173961

專利文獻2:日本專利特開2006-093333號公報 Patent Document 2: Japanese Patent Laid-Open No. 2006-093333

發明概要 Summary of Invention

然而,在專利文獻2所記載的方法中,會有下述問題:要在工作夾台上檢測晶圓之外周邊緣,並計算晶圓與工作夾台之偏移量需要較長的時間,導致加工產出量(throughput)變差。 However, in the method described in Patent Document 2, there is a problem in that it takes a long time to detect the outer peripheral edge of the wafer on the work chuck and calculate the offset between the wafer and the work chuck, resulting in Processing throughput becomes poor.

本發明是有鑒於此點而作成的發明,其目的之1是提供一種搬送機構,該搬送機構可以在不降低晶圓相對於工作夾台的對位精度的情形下,有效率地進行搬送而改善加工產出量。 The present invention has been made in view of this point, and an object of the present invention is to provide a transfer mechanism that can transfer wafers efficiently without reducing the accuracy of wafer alignment with respect to a table. Improve processing output.

本發明之一態樣的搬送機構,是將晶圓搬送至工作夾台上,並具備保持晶圓的外周部的保持設備、及使該保持設備在鉛直方向及水平方向上移動的移動設備,該搬送機構的特徵在於: 該保持設備具備:複數個爪構件,保持晶圓之外周部;爪構件作動設備,在使該複數個爪構件從晶圓的外周部分開的待機位置、及使該複數個爪構件相互地朝半徑方向接近以保持晶圓的外周部的作用位置之間,使該複數個爪構件各自獨立來朝半徑方向作動;驅動負載檢測設備,各自檢測該爪構件作動設備的驅動負載;位置檢測設備,各自檢測各該爪構件之位置;及控制設備,至少控制該爪構件作動設備,該控制設備具備:儲存部,將各個該爪構件抵接於晶圓的外周部時的該爪構件作動設備的驅動負載之值儲存作為閾值;及計算部,當檢測出來自該驅動負載檢測設備之已超出該閾值的驅動負載時即停止,並從藉由該位置檢測設備所檢測出之各個該爪構件的位置來計算晶圓中心位置,被該保持設備所保持的晶圓,是將以該計算部所計算出的該晶圓中心位置定位到工作夾台中心位置而被載置到該工作夾台上。 A transfer mechanism according to one aspect of the present invention transfers the wafer to the table, and includes a holding device for holding the outer peripheral portion of the wafer, and a moving device for moving the holding device in the vertical direction and the horizontal direction, The conveying mechanism is characterized by: The holding device includes a plurality of claw members that hold the outer peripheral portion of the wafer, a claw member actuating device that is in a standby position to separate the plurality of claw members from the outer peripheral portion of the wafer, and that moves the plurality of claw members toward each other. The radial direction is close to maintain between the action positions of the outer peripheral portion of the wafer, so that the plurality of claw members are independently actuated in the radial direction; the driving load detection device detects the driving load of the claw member actuating device; the position detection device, The position of each of the claw members is detected, respectively; and a control device controls at least the claw member actuating device, and the control device includes: a storage portion for the claw member actuating device when each of the claw members is brought into contact with the outer peripheral portion of the wafer. The value of the drive load is stored as a threshold value; and a calculation section stops when detecting a drive load that has exceeded the threshold value from the drive load detection device, and from the position detection device detected by the position detection device of each of the claw members The wafer center position is calculated by the position, and the wafer held by the holding device is placed on the work clamp by positioning the wafer center position calculated by the calculation section to the center position of the work clamp. .

依據此構成,從抵接於晶圓之外周部時的驅動負載來檢測複數個爪構件的位置,並且將各個爪構件的位置作為晶圓之外周位置來計算晶圓的中心位置。然後,設成將晶圓的中心位置定位到工作夾台的中心位置,來將晶圓載置到工作夾台上。由於是利用晶圓的搬送時間來實 施晶圓中心位置的計算處理,所以可以在不降低對位精度的情形下,有效率地對工作夾台搬送晶圓。又,由於是在工作夾台上以晶圓之中心基準來開始進行加工,所以能夠不進行晶圓對工作夾台的重新放置等,以改善加工產出量。 According to this configuration, the positions of the plurality of claw members are detected from the drive load when they contact the outer peripheral portion of the wafer, and the center position of the wafer is calculated using the positions of the respective claw members as the outer peripheral position of the wafer. Then, the center position of the wafer is positioned at the center position of the work chuck, and the wafer is placed on the work chuck. Since the transfer time of the wafer is used to realize the The calculation process of the center position of the wafer is performed, so the wafer can be efficiently transferred to the work chuck without reducing the alignment accuracy. In addition, since the processing is started on the table with the center of the wafer, it is possible to improve the processing yield without relocating the wafer to the table.

依據本發明,因為一邊搬送晶圓一邊計算晶圓中心位置,所以能夠在不降低對位精度的情形下有效率地對工作夾台搬送晶圓,而改善加工產出量。 According to the present invention, since the wafer center position is calculated while the wafer is being transferred, the wafer can be efficiently transferred to the work chuck without lowering the alignment accuracy, thereby improving the processing yield.

1:加工裝置 1: Processing device

11:基台 11: Abutment

12:前面 12: Front

13、14:片匣載台 13, 14: cassette stage

17:開口部 17: Opening

18:防水蓋 18: Waterproof cover

21:多關節型機械人 21: Articulated Robot

22:機械手臂 22: Robotic Arm

23:手部 23: Hands

24、53、58:移動機構 24, 53, 58: Moving Mechanisms

26:定位工作台 26: Positioning the table

27、83:載置銷 27, 83: Mounting pins

31:工作夾台 31: Work clamp table

32:保持面 32: Keep Faces

41:切削機構 41: Cutting mechanism

42:刀片單元 42: Blade unit

43:柱部 43: Pillar

44:刀片單元移動機構 44: Blade unit moving mechanism

45:Y軸工作台 45: Y-axis table

46:Z軸工作台 46: Z-axis table

47:主軸 47: Spindle

48:切削刀 48: Cutter

51、54、57:搬送機構 51, 54, 57: Conveying mechanism

52:保持設備 52: Keep Equipment

55:搬送手臂 55: Transfer arm

61:支撐部 61: Support Department

62:基座板 62: base plate

63:導引件 63: Guide

64:可動塊 64: Movable block

65:爪構件 65: Claw member

66:爪前端 66: Claw front end

67:進給螺桿 67: Feed screw

68:爪構件作動設備 68: Claw member actuating equipment

69:支撐壁 69: Support Wall

71:驅動負載檢測設備 71: Drive load detection equipment

72:位置檢測設備 72: Location detection equipment

73:讀取部 73: Reading Section

74:尺規 74: Ruler

75:控制設備 75: Control equipment

76:儲存部 76: Storage Department

77:計算部 77: Computing Department

81:背面洗淨機構 81: Back cleaning mechanism

82:正面洗淨機構 82: Front cleaning mechanism

84:旋轉刷 84: Rotary Brush

85:旋轉工作台 85: Rotary table

86:夾具部 86: Fixture Department

88:倒角部 88: Chamfer

89:凹口 89: Notch

A1:搬入區 A1: Move-in area

A2:加工區 A2: Processing area

A3:洗淨區 A3: Washing area

C1:搬入用片匣 C1: cassette for loading

C2:搬出用片匣 C2: cassette for unloading

W:晶圓 W: Wafer

X、Y、Z:方向 X, Y, Z: direction

圖1是本實施形態之加工裝置的上表面示意圖。 FIG. 1 is a schematic view of the upper surface of the processing apparatus of the present embodiment.

圖2是本實施形態之搬送機構的側面示意圖。 FIG. 2 is a schematic side view of the conveying mechanism of the present embodiment.

圖3是顯示本實施形態之搬送機構的搬送動作之一例的圖。 FIG. 3 is a diagram showing an example of the conveying operation of the conveying mechanism of the present embodiment.

圖4是顯示本實施形態之切削機構的切削動作之一例的圖。 FIG. 4 is a diagram showing an example of the cutting operation of the cutting mechanism of the present embodiment.

用以實施發明之形態 Form for carrying out the invention

以下,參照附加圖面,說明具備有本實施形態的搬送機構的加工裝置。圖1是本實施形態之加工裝置的上表面示意圖。再者,在以下的說明中,雖然是針對將本發明的搬送機構適用於對晶圓之外周部進行修整(trimming)加工的加工裝置之構成進行說明,但是並不限定於此構成。又,搬送機構亦可用於磨削裝置或雷射加工裝置等之其他的加 工裝置。 Hereinafter, the processing apparatus provided with the conveyance mechanism of this embodiment is demonstrated with reference to attached drawings. FIG. 1 is a schematic view of the upper surface of the processing apparatus of the present embodiment. In addition, in the following description, although it demonstrates the structure which applies the conveyance mechanism of this invention to the processing apparatus which trims the outer peripheral part of a wafer, it is not limited to this structure. In addition, the conveying mechanism can also be used for other processing such as grinding equipment and laser processing equipment. work device.

如圖1所示,加工裝置1為全自動型(full tuo type)的加工裝置,且構成為以全自動方式實施由對圓板狀之晶圓W的搬入處理、切削處理、洗淨處理、搬出處理所構成的一連串的作業。於晶圓W的外周邊緣形成有用於防止製造步驟中的破裂或灰塵產生的倒角部88(參照圖2)。又,於晶圓W的外周部形成有表示結晶方位之凹口89。再者,晶圓W亦可為在半導體基板上形成有半導體元件的半導體晶圓,亦可是在無機材料基板上形成有光元件的光元件晶圓。 As shown in FIG. 1 , the processing apparatus 1 is a full tuo type processing apparatus, and is configured to perform the loading process, cutting process, cleaning process, A series of operations consisting of carry-out processing. A chamfered portion 88 (refer to FIG. 2 ) is formed on the outer peripheral edge of the wafer W for preventing cracking and dust generation in the manufacturing process. In addition, in the outer peripheral portion of the wafer W, a notch 89 indicating the crystal orientation is formed. In addition, the wafer W may be a semiconductor wafer in which semiconductor elements are formed on a semiconductor substrate, or an optical element wafer in which optical elements are formed on an inorganic material substrate.

在加工裝置1中,是於裝置前方設定有搬入區A1、於裝置後方設定有加工區A2、並和搬入區A1及加工區A2相鄰而設定有洗淨區A3。又,在加工裝置1的前面12,以從搬入區A1朝前方突出的方式,設有一對片匣載台13、14。於片匣載台13上載置有已收容有加工前之晶圓W的搬入用片匣C1。於片匣載台14上載置有收容加工後之晶圓W的搬出用片匣C2。片匣載台13是作為加工裝置1之搬入口而發揮功能,片匣載台14是作為加工裝置1之搬出口而發揮功能。 In the processing apparatus 1, a carrying-in area A1 is set in front of the apparatus, a processing area A2 is set in the rear of the apparatus, and a cleaning area A3 is set adjacent to the carrying-in area A1 and the processing area A2. Moreover, on the front surface 12 of the processing apparatus 1, a pair of cassette stages 13 and 14 are provided so that it may protrude forward from the carrying-in area A1. The cassette C1 for carrying in which the wafer W before processing was accommodated is mounted on the cassette stage 13 . On the cassette stage 14, the cassette C2 for carrying out which accommodates the wafer W after processing is mounted. The cassette stage 13 functions as a carry-in port of the processing apparatus 1 , and the cassette stage 14 functions as a carry-out port of the processing apparatus 1 .

於搬入區A1設有相對於搬入用片匣C1及搬出用片匣C2將晶圓W搬出搬入的多關節型機械人21。多關節型機械人21,是在線性馬達式的移動機構24的滑動頭(slide head)上安裝機械手臂22,並且在機械手臂22的前端裝設手部23而構成。多關節型機械人21,是藉由移動機 構24而在X軸方向上移動,並且以伺服馬達等控制機械手臂22的各關節之旋轉,藉此可相對於搬入用片匣C1及搬出用片匣C2而將手部23調整成所期望的位置或姿勢。 The articulated robot 21 which carries out the wafer W with respect to the cassette C1 for carrying in and the cassette C2 for carrying out is provided in the carrying-in area A1. The articulated robot 21 is configured by attaching a robot arm 22 to a slide head of a linear motor-type moving mechanism 24 and attaching a hand 23 to the distal end of the robot arm 22 . The articulated robot 21 is made by moving the machine The mechanism 24 moves in the X-axis direction, and the rotation of each joint of the robot arm 22 is controlled by a servo motor or the like, whereby the hand 23 can be adjusted as desired with respect to the cassette C1 for carrying in and the cassette C2 for carrying out position or posture.

於加工區A2,設有暫置加工前之晶圓W的定位工作台26、及在工作夾台31切削晶圓W正面之外周部的切削機構41。於定位工作台26上突設有複數個載置銷27,並且從下方將晶圓W之外周部支撐於複數個載置銷27上,藉此可在從工作台浮起之狀態下將晶圓W定位。於定位工作台26的後方,設有可在晶圓W之搬入位置和切削位置之間於X軸方向上來回移動的工作夾台31。於基台11上形成有沿著此工作夾台31的移動軌跡在X軸方向上延伸的開口部17。 In the processing area A2, a positioning table 26 for temporarily placing the wafer W before processing, and a cutting mechanism 41 for cutting the outer peripheral portion of the front surface of the wafer W on the table 31 are provided. A plurality of placement pins 27 are protruded from the positioning table 26, and the outer peripheral portion of the wafer W is supported on the plurality of placement pins 27 from below, whereby the wafer can be placed in a state of being floated from the table. Circle W positioning. Behind the positioning table 26, there is provided a work chuck 31 that can move back and forth in the X-axis direction between the wafer W loading position and the cutting position. The base 11 is formed with an opening 17 extending in the X-axis direction along the movement locus of the table 31 .

開口部17是被蛇腹狀的防水蓋18所覆蓋,並且在防水蓋18的下方設有使工作夾台31在X軸方向上來回移動的滾珠螺桿式的工作夾台移動機構(未圖示)。於工作夾台31的表面,是藉由多孔質材而形成有吸附晶圓W的保持面32。保持面32是通過工作夾台31內的流路與吸引源(圖未示)連接,且藉由於保持面32上產生的負壓來吸引保持晶圓W。又,工作夾台31是構成為藉由旋轉機構(未圖示)而可繞著Z軸旋轉。 The opening 17 is covered by an accordion-shaped waterproof cover 18, and a ball screw type work clamp table moving mechanism (not shown) is provided below the waterproof cover 18 to move the work clamp table 31 back and forth in the X-axis direction. . On the surface of the stage 31, a holding surface 32 for attracting the wafer W is formed by a porous material. The holding surface 32 is connected to a suction source (not shown) through a flow channel in the work chuck 31 , and the wafer W is sucked and held by the negative pressure generated on the holding surface 32 . In addition, the table 31 is configured to be rotatable around the Z axis by a rotation mechanism (not shown).

切削機構41是構成為交替地使用一對刀片單元42,以切削工作夾台31上的晶圓W之外周部。切削機構41具有以橫跨開口部17的方式豎立設置於基台11上的門型的柱部43。於柱部43的表面設有使一對刀片單元42 移動的滾珠螺桿式的刀片單元移動機構44。刀片單元移動機構44具有在Y軸方向上移動的一對Y軸工作台45、及相對於各Y軸工作台45而在Z軸方向上移動的Z軸工作台46。刀片單元42是藉由Y軸工作台45及Z軸工作台46而可在Y軸方向及Z軸方向上移動。 The cutting mechanism 41 is configured to use a pair of blade units 42 alternately to cut the outer peripheral portion of the wafer W on the table 31 . The cutting mechanism 41 has a gate-shaped column portion 43 erected on the base 11 so as to straddle the opening portion 17 . A pair of blade units 42 is provided on the surface of the column portion 43 The moving ball screw type blade unit moving mechanism 44 . The blade unit moving mechanism 44 includes a pair of Y-axis tables 45 that move in the Y-axis direction, and a Z-axis table 46 that moves in the Z-axis direction with respect to each Y-axis table 45 . The blade unit 42 is movable in the Y-axis direction and the Z-axis direction by the Y-axis table 45 and the Z-axis table 46 .

刀片單元42是在主軸47的前端裝設圓板狀的切削刀48而構成。藉由在以高速旋轉的切削刀48切入工作夾台31上的晶圓W之倒角部88(參照圖2)的狀態下,使工作夾台31旋轉,可將晶圓W之倒角部88涵蓋全周來進行修整加工。藉由從晶圓W的外周部去除倒角部88,即使在後段的磨削步驟中從背面側將晶圓W磨削至成品厚度為止,也不會有因磨削後所殘留之倒角部88而導致晶圓W的外周部形成為刀緣狀之情形。 The blade unit 42 is configured by attaching a disk-shaped cutting blade 48 to the front end of the main shaft 47 . The chamfered portion of the wafer W can be chamfered by rotating the table 31 with the cutting blade 48 rotating at high speed cutting into the chamfered portion 88 (see FIG. 2 ) of the wafer W on the table 31 . 88 covers the whole week for finishing. By removing the chamfered portion 88 from the outer peripheral portion of the wafer W, even if the wafer W is ground from the back side to the thickness of the finished product in the subsequent grinding step, there is no chamfer remaining after grinding. The outer peripheral portion of the wafer W is formed into a blade edge shape by removing the portion 88 .

在加工區A2中,是藉由夾邊(edge clamp)式的搬送機構51將晶圓W搬入至工作夾台31上,並且藉由夾邊式的搬送機構54將晶圓W從工作夾台31搬出。這種情形下,藉由搬送機構51從定位工作台26拾取加工前的晶圓W,並且藉由線性馬達式的移動機構53將晶圓W搬送至工作夾台31。又,藉由搬送機構54從工作夾台31上拾取加工後的晶圓W,並且藉由以搬送機構54之基端部為中心之旋轉移動來將晶圓W搬送至洗淨區A3。 In the processing area A2 , the wafer W is loaded onto the table 31 by the edge clamp type transfer mechanism 51 , and the wafer W is transferred from the table by the edge clamp type transfer mechanism 54 . 31 to move out. In this case, the wafer W before processing is picked up from the positioning table 26 by the transfer mechanism 51 , and the wafer W is transferred to the table 31 by the linear motor-type moving mechanism 53 . Further, the processed wafer W is picked up from the table 31 by the transfer mechanism 54, and the wafer W is transferred to the cleaning area A3 by rotational movement around the base end of the transfer mechanism 54.

於洗淨區A3設有洗淨晶圓W之背面的背面洗淨機構81、及洗淨晶圓W之正面的正面洗淨機構82。在背面洗淨機構81中,是在已將晶圓W的外周部支撐於複數 個載置銷83上的狀態下,朝晶圓W之背面噴射洗淨水並藉由旋轉刷84進行背面洗淨。背面洗淨後的晶圓W,是藉由夾邊式的搬送機構57而從背面洗淨機構81被拾取,並且藉由線性馬達式的移動機構58搬送至正面洗淨機構82。正面洗淨機構82,是在以旋轉工作台85之複數個夾具部86保持晶圓W之外周部的狀態下,朝晶圓W噴射洗淨水來進行正面洗淨後,噴附乾燥空氣來進行乾燥。 In the cleaning area A3, a back surface cleaning mechanism 81 for cleaning the back surface of the wafer W and a front surface cleaning mechanism 82 for cleaning the front surface of the wafer W are provided. In the back surface cleaning mechanism 81, the outer peripheral portion of the wafer W is supported by a plurality of In the state where each of the mounting pins 83 is placed on the wafer W, cleaning water is sprayed toward the back surface of the wafer W, and the back surface cleaning is performed by the rotating brush 84 . The wafer W after the backside cleaning is picked up from the backside cleaning mechanism 81 by the chuck-type transfer mechanism 57 and transported to the frontside cleaning mechanism 82 by the linear motor-type moving mechanism 58 . The front cleaning mechanism 82 sprays cleaning water on the wafer W to perform front cleaning in a state in which the outer peripheral portion of the wafer W is held by the plurality of clamp portions 86 of the rotary table 85, and then sprays dry air to clean the front surface. Dry.

將正面洗淨後的晶圓W,藉由多關節型機械人21從旋轉工作台85拾取,並且朝向搬出用片匣C2搬送。在像這樣構成的加工裝置1中,是在定位工作台26和工作夾台31之間、工作夾台31和背面洗淨機構81之間、背面洗淨機構81和正面洗淨機構82之間,各自藉由夾邊式的搬送機構51、54、57來搬送晶圓W。這種情形下,可將各搬送機構51、54、57之3個爪構件65(參照圖2)相對於晶圓W之外周部側面接近至適當位置來保持晶圓W之外周部。 The wafer W whose front surface has been cleaned is picked up from the rotary table 85 by the articulated robot 21 and conveyed toward the unloading cassette C2. In the processing apparatus 1 configured in this way, there are between the positioning table 26 and the work chuck 31 , between the work chuck 31 and the back cleaning mechanism 81 , and between the back cleaning mechanism 81 and the front cleaning mechanism 82 . , and the wafers W are transported by the chuck-type transport mechanisms 51 , 54 , and 57 , respectively. In this case, the outer peripheral portion of the wafer W can be held by approaching the three claw members 65 (see FIG. 2 ) of the respective conveyance mechanisms 51 , 54 , and 57 to an appropriate position with respect to the side surface of the outer peripheral portion of the wafer W.

然而,雖然是以規定之精度將晶圓W定位於定位工作台26之載置銷27上,但是要將晶圓W的中心確實地對準於定位工作台26的中心是困難的。從而,從定位工作台26載置於工作夾台31時,會有晶圓W的中心相對於工作夾台31的中心產生位置偏移的情形。為此,雖然也可考慮從工作夾台31上的晶圓W的拍攝圖像求出中心位置,並將晶圓W重新載置在工作夾台31之作法,但是會因為晶圓W之中心位置的計算或晶圓W之重新載放需要時間而導致加工產出量變差。 However, although the wafer W is positioned on the mounting pins 27 of the positioning table 26 with a predetermined accuracy, it is difficult to accurately align the center of the wafer W with the center of the positioning table 26 . Therefore, when the positioning table 26 is placed on the table 31 , the center of the wafer W may be displaced with respect to the center of the table 31 . For this reason, a method of obtaining the center position from the captured image of the wafer W on the table 31 and placing the wafer W on the table 31 again may be considered. The calculation of the position or the reloading of the wafer W takes time, resulting in poor processing yield.

又,也可考慮一邊藉由附有定心功能的搬送機構進行搬送一邊進行定心以提升加工產出量的構成。然而,貼合晶圓或以樹脂塑模而成之晶圓,會在每1片於外徑或外緣形狀產生偏差而導致從中心位置至外周部的距離並非一定,恐有因將爪構件推壓於晶圓W之外周部而導致破損之疑慮。於是,在本實施形態的搬送機構51、54、57中,是形成為從驅動負載的變化來使各爪構件停止在複數個爪構件抵接於晶圓W之外周部的位置,並將該抵接位置作為晶圓W之外周位置,而邊計算中心位置邊搬送晶圓W。 In addition, a configuration in which centering is performed while being conveyed by a conveying mechanism with a centering function to increase the processing yield can also be considered. However, in the case of laminated wafers or wafers molded with resin, the outer diameter or outer edge shape of each wafer may vary, so that the distance from the center position to the outer peripheral portion is not constant. There is a concern that it is pressed against the outer peripheral portion of the wafer W and may be damaged. Therefore, in the transfer mechanisms 51 , 54 , and 57 of the present embodiment, each claw member is stopped at a position where the plurality of claw members abut on the outer peripheral portion of the wafer W according to the change in the driving load, and the The contact position is the outer peripheral position of the wafer W, and the wafer W is transferred while calculating the center position.

以下,參照圖2,說明搬送機構的詳細構成。圖2是本實施形態之搬送機構的側面示意圖。再者,搬送機構並不限定於圖2所示之構成。搬送機構,只要是可將已保持晶圓之外周部時的爪構件之位置作為晶圓之外周位置來計算中心位置即可,以任何形式構成都可以。在此,針對在定位工作台和工作夾台之間搬送晶圓的搬送機構進行說明。再者,對於在工作夾台與背面洗淨機構之間、背面洗淨機構與正面洗淨機構之間搬送晶圓的搬送機構亦可形成同樣的構成。 Hereinafter, with reference to FIG. 2, the detailed structure of a conveyance mechanism is demonstrated. FIG. 2 is a schematic side view of the conveying mechanism of the present embodiment. In addition, the conveyance mechanism is not limited to the structure shown in FIG. 2. FIG. The transfer mechanism may be configured in any form as long as the position of the claw member when the outer peripheral portion of the wafer is held can be used to calculate the center position as the outer peripheral position of the wafer. Here, the transfer mechanism for transferring the wafer between the positioning table and the chuck table will be described. Furthermore, the same configuration may be employed for the transfer mechanism for transferring the wafer between the table and the back surface cleaning mechanism, and between the back surface cleaning mechanism and the front surface cleaning mechanism.

如圖2所示,搬送機構51是構成為具有保持晶圓W的外周部的夾邊式的保持設備52,並且藉由保持設備52的3個爪構件65來保持晶圓W之外周部。保持設備52是透過支撐部61而被支撐在搬送手臂55的前端側,並且藉由支撐部61而可在鉛直方向上移動,且藉由線性馬達式的移動機構53(參照圖1)而可在水平方向上移動。像這樣,在 本實施形態中,是藉由支撐部61和線性馬達式的移動機構53,而構成使保持設備52在鉛直方向及水平方向上移動的移動設備。 As shown in FIG. 2 , the transfer mechanism 51 is configured to have a clamp-type holding device 52 that holds the outer peripheral portion of the wafer W, and holds the outer peripheral portion of the wafer W by the three claw members 65 of the holding device 52 . The holding device 52 is supported by the front end side of the transfer arm 55 through the support portion 61, and is movable in the vertical direction by the support portion 61, and is movable by the linear motor type moving mechanism 53 (see FIG. 1 ). Move horizontally. like this, in In the present embodiment, the support portion 61 and the linear motor-type moving mechanism 53 constitute a moving device that moves the holding device 52 in the vertical direction and the horizontal direction.

於保持設備52的基座板(base plate)62上,設有朝三個方向延伸的長條狀的導引件63,並且於各導引件63上將可動塊64以可滑動的方式設置。於各可動塊64上各自安裝有爪構件65,且爪構件65是將爪前端66形成為朝向支撐部61側之截面視圖為大致L字形。又,可動塊64是供進給螺桿67螺合,並且於進給螺桿67的一端是連結在基座板62的徑方向內側的爪構件作動設備68,於進給螺桿67的另一端是在基座板62的徑方向外側被支撐壁69所支撐。像這樣,於基座板62上在每個爪構件65設有進給螺桿式的移動機構。 On the base plate 62 of the holding device 52, there are long guide pieces 63 extending in three directions, and on each guide piece 63, a movable block 64 is slidably arranged . A claw member 65 is attached to each movable block 64, and the claw member 65 is formed in a substantially L-shaped cross-sectional view with the claw front end 66 facing the support portion 61 side. In addition, the movable block 64 is screwed to the feed screw 67, one end of the feed screw 67 is a claw member actuating device 68 connected to the inner side in the radial direction of the base plate 62, and the other end of the feed screw 67 is at The radially outer side of the base plate 62 is supported by the support wall 69 . In this way, the base plate 62 is provided with a feed screw type moving mechanism for each claw member 65 .

爪構件作動設備68,是以所謂的伺服馬達所構成,並且將爪構件65的現在位置、現在速度、驅動負載(轉矩(torque))輸出至後述之控制設備75來進行伺服控制。藉由爪構件作動設備68旋轉進給螺桿67,以讓可動塊64一邊被導引件63所導引一邊活動。此時,設於各可動塊64的各爪構件65,是在待機位置與作用位置之間各自朝半徑方向獨立移動,該待機位置是從晶圓W之外周部分開的位置,該作用位置是相互地在半徑方向上相接近而保持晶圓W之外周部的位置。藉由各可動塊64相接近而將晶圓W載放於爪構件65的爪前端66,可將晶圓W之外周部保持在保持設備52。 The claw member actuating device 68 is constituted by a so-called servo motor, and performs servo control by outputting the current position, current speed, and driving load (torque) of the claw member 65 to a control device 75 to be described later. The feed screw 67 is rotated by the claw member actuating device 68 , so that the movable block 64 moves while being guided by the guide member 63 . At this time, each claw member 65 provided on each movable block 64 moves independently in the radial direction between a standby position, which is a position separated from the outer periphery of the wafer W, and an acting position, which is a position that is separated from the outer periphery of the wafer W. The positions of the outer peripheral portions of the wafers W are kept close to each other in the radial direction. When the movable blocks 64 approach each other and the wafer W is placed on the claw tips 66 of the claw members 65 , the outer peripheral portion of the wafer W can be held in the holding device 52 .

於爪構件作動設備68上設有驅動負載檢測設備71,該驅動負載檢測設備71是檢測各自驅動爪構件65時的驅動負載。驅動負載檢測設備71,是以例如伺服馬達的專用驅動器的轉矩檢測功能所構成,以對爪構件65與晶圓W之外周部的接觸所造成的驅動負載之增加進行檢測。又,爪構件65的移動位置,是各自藉由位置檢測設備72而檢測。位置檢測設備72,是例如線性尺規(linear scale),且以設於可動塊64之讀取部73讀取沿著導引件63的尺規74之刻度,藉此檢測爪構件65的移動位置。驅動負載檢測設備71及位置檢測設備72的輸出結果是輸出至控制設備75。 The claw member actuating device 68 is provided with a drive load detection device 71 which detects the drive load when each of the claw members 65 is driven. The drive load detection device 71 is constituted by a torque detection function of a dedicated driver such as a servo motor, and detects an increase in the drive load due to the contact of the claw member 65 with the outer peripheral portion of the wafer W. In addition, the movement position of the claw member 65 is detected by the position detection apparatus 72, respectively. The position detection device 72 is, for example, a linear scale, and the reading section 73 provided in the movable block 64 reads the scale of the scale 74 along the guide 63 , thereby detecting the movement of the claw member 65 Location. The output results of the drive load detection device 71 and the position detection device 72 are output to the control device 75 .

控制設備75,是由來自爪構件作動設備68、驅動負載檢測設備71、位置檢測設備72的各種資訊來控制爪構件65的移動。又,控制設備75是由執行各種處理的處理器(processor)或記憶體(memory)等所構成。記憶體可因應其用途而由ROM(唯讀記憶體,Read Only Memory)、RAM(隨機存取記憶體,Random Access Memory)等之一個或複數個儲存媒體所構成。於記憶體中,除了爪構件作動設備68的伺服控制的程式以外,還儲存有晶圓W之中心位置的計算程式。再者,位置檢測設備72,亦可利用設於爪構件作動設備68的編碼器(encoder)來構成而取代線性尺規。 The control device 75 controls the movement of the claw member 65 by various information from the claw member actuating device 68 , the drive load detection device 71 , and the position detection device 72 . In addition, the control device 75 is constituted by a processor, a memory, or the like that executes various kinds of processing. The memory can be composed of one or a plurality of storage media such as ROM (Read Only Memory), RAM (Random Access Memory), etc. according to its purpose. In the memory, in addition to the program for servo control of the claw member actuating device 68, a program for calculating the center position of the wafer W is also stored. Furthermore, the position detection device 72 may be constituted by an encoder provided in the claw member actuating device 68 instead of the linear ruler.

又,於控制設備75中,設有儲存部76與計算部77,該儲存部76是儲存用以判定爪構件65對晶圓W的 外周部的抵接之閾值,該計算部77是從爪構件65的抵接位置來計算晶圓W之中心位置。於儲存部76中,是事前將爪構件65抵接於晶圓W之外周部時的爪構件作動設備68的驅動負載之值儲存作為閾值。在從驅動負載檢測設備71檢測到超出閾值之驅動負載時,會將以位置檢測設備72所檢測出的爪構件65的位置輸入到計算部77。又,可藉由控制設備75來停止爪構件65之移動,以防止爪構件65對晶圓W的外周部的推入。 In addition, the control device 75 is provided with a storage unit 76 and a calculation unit 77 , and the storage unit 76 stores information for determining the relationship between the claw members 65 and the wafer W. For the contact threshold of the outer peripheral portion, the calculation unit 77 calculates the center position of the wafer W from the contact position of the claw members 65 . In the storage unit 76 , the value of the driving load of the claw member actuating device 68 when the claw member 65 abuts on the outer peripheral portion of the wafer W is stored as a threshold value in advance. When the drive load exceeding the threshold value is detected from the drive load detection device 71 , the position of the claw member 65 detected by the position detection device 72 is input to the calculation unit 77 . In addition, the movement of the claw members 65 can be stopped by the control device 75 to prevent the claw members 65 from pushing into the outer peripheral portion of the wafer W. As shown in FIG.

更詳細而言,不會有各爪構件65推壓晶圓W的外周部之情形,而可將各爪構件65在接觸於晶圓W的外周部之時間點上停止。從而,可在不藉由各爪構件65將晶圓W定心的情形下,以相對於保持設備52不使晶圓W的中心產生位置偏移的狀態保持。由於即使從晶圓W之中心至外周的距離產生有偏差,仍可讓爪構件65因應於晶圓W之偏差而停止在適當的位置,所以不會有晶圓W過度地被爪構件65推入的情形,而可確實地防止晶圓W的破損。 In more detail, each claw member 65 does not press the outer peripheral portion of the wafer W, and each claw member 65 can be stopped at the point of contact with the outer peripheral portion of the wafer W. Therefore, the wafer W can be held in a state in which the center of the wafer W is not displaced relative to the holding device 52 without centering the wafer W by the respective claw members 65 . Even if there is a deviation in the distance from the center of the wafer W to the outer circumference, the claw member 65 can be stopped at an appropriate position according to the deviation of the wafer W, so that the wafer W will not be pushed by the claw member 65 excessively. In this case, the wafer W can be reliably prevented from being damaged.

並且,在計算部77中是從位置檢測設備72所檢測出之爪構件65的位置來計算晶圓W之中心位置。具體來說,是將3個爪構件65之爪前端66的抵接位置作為晶圓W之外周部的3個點,並設定在已於保持設備52上設定的平面座標系統上。然後,在晶圓W之外周部的3個點的座標之中,由連結2個點的座標的各弦之垂直平分線的交點來計算晶圓W之中心位置。再者,亦可在晶圓W的外周部的3個點的座標之中,由對至少通過2個點之晶圓W的外周 部的法線的交點來計算晶圓W之中心位置。 In addition, the calculation unit 77 calculates the center position of the wafer W from the position of the claw member 65 detected by the position detection device 72 . Specifically, the contact positions of the claw tips 66 of the three claw members 65 are set as three points on the outer periphery of the wafer W, and are set on the plane coordinate system set on the holding device 52 . Then, among the coordinates of the three points on the outer periphery of the wafer W, the center position of the wafer W is calculated from the intersection of the vertical bisectors of the chords connecting the coordinates of the two points. Furthermore, among the coordinates of the three points on the outer peripheral portion of the wafer W, it is also possible to determine the coordinates of the outer periphery of the wafer W passing through at least two points. The center position of the wafer W is calculated by the intersection of the normal lines of the parts.

當計算出晶圓W之中心位置時,是將晶圓W在工作夾台31上載置成將晶圓W之中心位置定位在工作夾台31(參照圖4A)的中心位置。由於可在晶圓W的搬送中計算中心位置,所以能夠有效率對工作夾台31搬送晶圓W。又,由於使晶圓W之中心與工作夾台31之旋轉中心一致,所以能夠在根據計算部77所計算之晶圓W之中心位置而不進行邊緣校準的情形下,精度良好地將切削刀48(參照圖4B)定位到晶圓W的倒角部88。 When the center position of the wafer W is calculated, the wafer W is placed on the table 31 so that the center position of the wafer W is positioned at the center of the table 31 (see FIG. 4A ). Since the center position can be calculated during the transfer of the wafer W, the wafer W can be efficiently transferred to the table 31 . In addition, since the center of the wafer W is aligned with the rotation center of the table 31, the cutting tool can be accurately adjusted without performing edge alignment based on the center position of the wafer W calculated by the calculation unit 77. 48 (refer to FIG. 4B ) is positioned to the chamfered portion 88 of the wafer W.

接著,參照圖3及圖4,說明搬送機構的搬送動作及切削機構的切削動作。圖3是顯示本實施形態之搬送機構的搬送動作之一例的圖。圖4是顯示本實施形態之切削機構的切削動作之一例的圖。再者,在圖3中,雖然是針對定位工作台和工作夾台之間的搬送動作進行說明,但工作夾台和背面洗淨機構之間、背面洗淨機構和正面洗淨機構之間的由搬送機構進行的搬送動作也是同樣。 Next, the conveyance operation of the conveyance mechanism and the cutting operation of the cutting mechanism will be described with reference to FIGS. 3 and 4 . FIG. 3 is a diagram showing an example of the conveying operation of the conveying mechanism of the present embodiment. FIG. 4 is a diagram showing an example of the cutting operation of the cutting mechanism of the present embodiment. In addition, in FIG. 3, although the transfer operation between the positioning table and the work clamp table is described, the operation between the work clamp table and the back cleaning mechanism, and between the back cleaning mechanism and the front cleaning mechanism. The same applies to the conveyance operation by the conveyance mechanism.

如圖3A所示,將晶圓W載置在定位工作台26之載置銷27上,並且將保持設備52定位在定位工作台26的上方。此時,晶圓W是從下方被載置銷27所支撐,藉此在定位工作台26、晶圓W和工作台之間空出有間隙。又,保持設備52的各爪構件65各自定位在待機位置,並且各爪構件65的爪前端66比晶圓W之外周部更朝徑方向外側分開。又,在將保持設備52之中心定位在定位工作台26之中心的狀態下,將保持設備52下降來接近於定位工作台26。 As shown in FIG. 3A , the wafer W is placed on the placement pins 27 of the positioning table 26 , and the holding device 52 is positioned above the positioning table 26 . At this time, the wafer W is supported by the mounting pins 27 from below, thereby leaving a gap between the positioning table 26 , the wafer W, and the table. Further, each claw member 65 of the holding device 52 is positioned at the standby position, and the claw tip 66 of each claw member 65 is spaced radially outward from the outer peripheral portion of the wafer W. As shown in FIG. Moreover, in a state where the center of the holding device 52 is positioned at the center of the positioning table 26 , the holding device 52 is lowered to approach the positioning table 26 .

如圖3B所示,當藉由保持設備52之下降而將各爪構件65的爪前端66定位在晶圓W之下側時,可藉由各爪構件作動設備68將各爪構件65朝向晶圓W個別地移動。此時,藉由驅動負載檢測設備71檢測爪構件作動設備68的驅動負載,且將驅動負載檢測設備71的檢測結果輸出至控制設備75來監視驅動負載的變化。當驅動負載檢測設備71的檢測結果超出已儲存於儲存部76的閾值時,會判定為爪構件65的爪前端66已經移動至抵接於晶圓W的外周部的作用位置,並停止爪構件作動設備68。 As shown in FIG. 3B , when the claw front ends 66 of the claw members 65 are positioned on the lower side of the wafer W by the lowering of the holding device 52 , the claw members 65 can be moved toward the wafer by the claw member actuating devices 68 . The circles W move individually. At this time, the change in the drive load is monitored by the drive load detection device 71 detecting the drive load of the claw member actuating device 68 and outputting the detection result of the drive load detection device 71 to the control device 75 . When the detection result of the drive load detection device 71 exceeds the threshold value stored in the storage unit 76 , it is determined that the claw tip 66 of the claw member 65 has moved to the action position abutting on the outer peripheral portion of the wafer W, and the claw member is stopped. Actuation device 68.

在此作用位置上,是讓複數個爪構件65的爪前端66進入晶圓W的外周部之下側,並且藉由各爪構件65從下側支撐晶圓W之外周部背面。爪構件65的爪前端66的上表面,由於是以朝向前端並變低的方式傾斜,所以可藉由晶圓W之外周部接抵於爪前端66之斜面而防止晶圓W的破損。又,由於將複數個爪構件65相對於晶圓W的外周部個別地接近,所以不論晶圓W之外徑的大小或偏差,都能夠相對於晶圓W的外周部將各爪構件65調整至適當的位置。 At this action position, the claw front ends 66 of the plurality of claw members 65 enter into the lower side of the outer peripheral portion of the wafer W, and each claw member 65 supports the back surface of the outer peripheral portion of the wafer W from the lower side. Since the upper surface of the claw tip 66 of the claw member 65 is inclined so as to be lowered toward the tip, the wafer W can be prevented from being damaged by contacting the outer peripheral portion of the wafer W with the inclined surface of the claw tip 66 . In addition, since the plurality of claw members 65 are individually approached with respect to the outer peripheral portion of the wafer W, the respective claw members 65 can be adjusted relative to the outer peripheral portion of the wafer W regardless of the size or variation of the outer diameter of the wafer W. to the appropriate location.

如圖3C所示,當將各爪構件65定位在作用位置時,是將晶圓W之外周部掛在各爪構件65之爪前端66,而將晶圓W之外周部保持在保持設備52上。晶圓W是以被保持設備52所保持的狀態而從定位工作台26的載置銷27被拿起,並朝向工作夾台31(參照圖4A)搬送。又,將爪構件65的爪前端66的抵接位置作為晶圓W之外周部的3個 點,並設定於保持設備52的平面座標系統。然後,在將晶圓W搬送至工作夾台31的期間,藉由計算部77從晶圓W之外周部的3個點的座標來計算晶圓W的中心位置。 As shown in FIG. 3C , when each claw member 65 is positioned at the action position, the outer peripheral portion of the wafer W is hooked on the claw front end 66 of each claw member 65 , and the outer peripheral portion of the wafer W is held by the holding device 52 . superior. The wafer W is picked up from the mounting pins 27 of the positioning table 26 in a state held by the holding device 52, and is conveyed toward the table 31 (see FIG. 4A ). In addition, let the contact positions of the claw tips 66 of the claw members 65 be three of the outer peripheral parts of the wafer W point and set to the plane coordinate system of the holding device 52 . Then, while the wafer W is being transferred to the table 31 , the center position of the wafer W is calculated from the coordinates of three points on the outer periphery of the wafer W by the calculation unit 77 .

如圖4A所示,當將保持設備52定位到工作夾台31的上方時,可將已保持在保持設備52之晶圓W的中心位置定位到工作夾台31的中心位置。然後,藉由使保持設備52往正下方下降,以將載放於各爪構件65之爪前端66的晶圓W改放到工作夾台31的保持面32。像這樣,因為是設成從爪構件作動設備68的驅動負載的上升來檢測爪構件65的位置資訊、亦即晶圓W的外周部之座標,所以能夠在搬送中計算晶圓W的中心位置。據此,能夠減少零件數量並且縮短作業時間。 As shown in FIG. 4A , when the holding apparatus 52 is positioned above the work chuck 31 , the center position of the wafer W held in the holding apparatus 52 can be positioned to the center of the work chuck 31 . Then, by lowering the holding device 52 directly below, the wafer W placed on the claw tip 66 of each claw member 65 is moved to the holding surface 32 of the table 31 . In this way, since the position information of the claw member 65, that is, the coordinates of the outer peripheral portion of the wafer W is detected from the rise of the driving load of the claw member actuating device 68, the center position of the wafer W can be calculated during the transfer. . Accordingly, the number of parts can be reduced and the work time can be shortened.

如圖4B所示,當將晶圓W保持在工作夾台31上時,是將切削刀48定位在晶圓W的外周的倒角部88。當以切削刀48切入晶圓W之外周部時,可旋轉工作夾台31以涵蓋全周來切削晶圓W之外周部。此時,因為工作夾台31和晶圓W之中心一致,所以能夠以該中心為基準來定位切削刀48。據此,可以在不進行邊緣校準的情形下,開始進行對晶圓W的修整加工,而提升加工產出量。 As shown in FIG. 4B , when the wafer W is held on the table 31 , the cutting blade 48 is positioned on the chamfered portion 88 of the outer periphery of the wafer W. As shown in FIG. When the outer peripheral portion of the wafer W is cut with the cutting blade 48 , the table 31 can be rotated to cover the entire circumference to cut the outer peripheral portion of the wafer W. As shown in FIG. At this time, since the center of the table 31 and the wafer W coincide, the cutting blade 48 can be positioned with the center as a reference. Accordingly, the trimming process on the wafer W can be started without performing edge alignment, thereby increasing the processing yield.

如以上,根據本實施形態的搬送機構51,可由抵接於晶圓W的外周部時的驅動負載來檢測複數個爪構件65的位置,而將各爪構件65的位置作為晶圓W之外周位置來計算晶圓W的中心位置。然後,可在工作夾台31上將晶圓W載置成使晶圓W的中心位置定位到工作夾台31的 中心位置。由於是利用晶圓W的搬送時間來實施晶圓W的中心位置的計算處理,所以能夠在不降低對位精度的情形下,有效率地對工作夾台31搬送晶圓W。又,由於是在工作夾台31上以晶圓W之中心基準來開始進行加工,所以能夠不進行晶圓W對工作夾台31的重新放置等,以改善加工產出量。 As described above, according to the transfer mechanism 51 of the present embodiment, the positions of the plurality of claw members 65 can be detected by the driving load when the outer peripheral portion of the wafer W is in contact, and the position of each claw member 65 can be regarded as the outer circumference of the wafer W. position to calculate the center position of wafer W. Then, the wafer W can be placed on the work chuck 31 so that the center position of the wafer W is positioned to the position of the work chuck 31 . Central location. Since the calculation process of the center position of the wafer W is performed using the transfer time of the wafer W, the wafer W can be efficiently transferred to the table 31 without lowering the alignment accuracy. In addition, since the processing is started on the table 31 based on the center of the wafer W, repositioning of the wafer W on the table 31 and the like can be omitted, thereby improving the processing yield.

再者,在本實施形態中雖然是針對邊緣修整裝置的搬送機構進行說明,但是並不限定於此構成。本發明的搬送機構也可適用於對工件進行加工之其他的加工裝置。只要是例如會實施工件搬送的加工裝置即可,亦可適用於切削裝置、磨削裝置、研磨裝置、雷射加工裝置、電漿蝕刻裝置、及組合這些而成的群集(cluster)裝置等之其他的加工裝置的搬送機構。 In addition, although this embodiment demonstrated the conveyance mechanism of an edge trimming apparatus, it is not limited to this structure. The conveying mechanism of the present invention can also be applied to other processing apparatuses for processing workpieces. For example, as long as it is a processing apparatus that can carry out workpiece conveyance, it can be applied to a cutting apparatus, a grinding apparatus, a polishing apparatus, a laser processing apparatus, a plasma etching apparatus, a cluster apparatus formed by combining these, and the like. Conveying mechanism of other processing equipment.

又,加工對象的工件,亦可因應於加工的種類,而使用例如半導體元件晶圓、光元件晶圓、封裝基板、半導體基板、無機材料基板、氧化物晶圓、未燒結陶瓷基板、壓電基板等之各種工件。作為半導體元件晶圓,亦可使用元件形成後之矽晶圓或化合物半導體晶圓。作為光元件晶圓,亦可使用元件形成後之藍寶石晶圓或碳化矽晶圓。又,作為封裝基板亦可使用CSP(晶片尺寸封裝,Chip Size Package)基板,且亦可使用矽或砷化鎵等作為半導體基板,亦可使用藍寶石、陶瓷、玻璃等作為無機材料基板。此外,作為氧化物晶圓,而使用元件形成後或元件形成前的鉭酸鋰、鈮酸鋰亦可。 In addition, depending on the type of processing, the workpiece to be processed may be, for example, semiconductor element wafers, optical element wafers, package substrates, semiconductor substrates, inorganic material substrates, oxide wafers, green ceramic substrates, piezoelectric substrates, etc. Various workpieces such as substrates. As the semiconductor element wafer, a silicon wafer or a compound semiconductor wafer after element formation can also be used. As an optical element wafer, a sapphire wafer or a silicon carbide wafer after element formation can also be used. Further, CSP (Chip Size Package) substrates may be used as package substrates, silicon, gallium arsenide, etc. may be used as semiconductor substrates, and sapphire, ceramics, glass, etc. may be used as inorganic material substrates. Further, as the oxide wafer, lithium tantalate or lithium niobate may be used after element formation or before element formation.

又,在本實施形態中,雖然是將伺服馬達例示作為爪構件作動設備,但是並不限定於此構成。爪構件作動設備,只要是能夠使爪構件移動到從晶圓的外周部分開之待機位置與保持晶圓的外周部之作用位置之構成即可,以其他致動器(actuator)所構成亦可。又,驅動負載檢測設備亦可不是伺服馬達的驅動器,而是以轉矩檢測器來實現。 In addition, in the present embodiment, the servo motor is exemplified as the claw member actuating device, but it is not limited to this configuration. The claw member actuating device may be constituted by other actuators as long as it can move the claw member to a standby position separated from the outer peripheral portion of the wafer and an action position to hold the outer peripheral portion of the wafer. . In addition, the drive load detection device may not be a driver of a servo motor, but may be implemented by a torque detector.

又,本實施形態中,雖然是作成保持設備具有3個爪構件的構成,但是並不限定於此構成。保持設備,只要具有保持晶圓的外周部的複數個爪構件即可,亦可具有4個以上的爪構件。又,爪構件只要是能保持晶圓之形狀即可,並未特別限定爪構件的形狀。 In addition, in the present embodiment, although the holding device has a configuration in which three claw members are provided, it is not limited to this configuration. The holding device may have a plurality of claw members for holding the outer peripheral portion of the wafer, and may include four or more claw members. In addition, the shape of the claw member is not particularly limited as long as the claw member can hold the shape of the wafer.

又,雖然說明了本實施形態及變形例,但是作為本發明的其他實施形態,亦可為將上述實施形態及變形例整體或部分地組合而成的形態。 In addition, although the present embodiment and the modified examples have been described, as other embodiments of the present invention, the above-described embodiments and modified examples may be combined in whole or in part.

又,本發明之實施形態並不限定於上述之實施形態及變形例,且亦可在不脫離本發明之技術思想的主旨的範圍內進行各種變更、置換、變形。此外,若能經由技術之進步或衍生之其他技術而以其他的方式來實現本發明之技術思想的話,亦可使用該方法來實施。因此,申請專利範圍涵蓋了可包含在本發明之技術思想範圍內的所有的實施形態。 In addition, the embodiment of the present invention is not limited to the above-described embodiment and modification examples, and various changes, substitutions, and deformations can be made within the scope not departing from the spirit of the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used to implement. Therefore, the scope of the patent application covers all the embodiments that can be included in the technical idea of the present invention.

又,在本實施形態中,雖然是針對將本發明適用於邊緣修整裝置的搬送機構之構成來說明,但也可適 用於能夠檢測搬送對象之中心位置以提升搬送效率的其他裝置之搬送機構上。 In addition, in the present embodiment, the present invention is described with respect to the configuration of the conveying mechanism of the edge trimming device, but it may be adapted It is used in the conveying mechanism of other devices that can detect the center position of the conveyed object to improve the conveying efficiency.

產業上之可利用性 industrial availability

如以上所說明,本發明具有下述效果:能夠在不降低晶圓相對於工作夾台的對位精度的情形下有效率地進行搬送,而改善加工產出量,特別是對於搬送以樹脂塑模而成之晶圓或貼合晶圓等的搬送機構是有用的。 As described above, the present invention has the following effects: the wafer can be transferred efficiently without lowering the alignment accuracy of the wafer with respect to the work table, thereby improving the processing yield, especially for the transfer of resin-molded wafers. A transfer mechanism such as a molded wafer or a bonded wafer is useful.

26‧‧‧定位工作台 26‧‧‧Positioning table

27‧‧‧載置銷 27‧‧‧Mounting pins

51‧‧‧搬送機構 51‧‧‧Conveying mechanism

52‧‧‧保持設備 52‧‧‧Maintaining equipment

65‧‧‧爪構件 65‧‧‧Claw components

66‧‧‧爪前端 66‧‧‧Front end of claw

68‧‧‧爪構件作動設備 68‧‧‧Claw member actuating equipment

71‧‧‧驅動負載檢測設備 71‧‧‧Drive load detection equipment

72‧‧‧位置檢測設備 72‧‧‧Location detection equipment

75‧‧‧控制設備 75‧‧‧Control equipment

76‧‧‧儲存部 76‧‧‧Storage

77‧‧‧計算部 77‧‧‧Department of Computing

88‧‧‧倒角部 88‧‧‧Chamfered

W‧‧‧晶圓 W‧‧‧Wafer

Claims (1)

一種搬送機構,是將晶圓搬送至工作夾台上,並具備保持晶圓的外周部的保持設備、及使該保持設備在鉛直方向及水平方向上移動的移動設備,該搬送機構的特徵在於: 該保持設備具備: 複數個爪構件,保持晶圓的外周部; 爪構件作動設備,在使該複數個爪構件從晶圓的外周部分開的待機位置、及使該複數個爪構件相互地朝半徑方向接近以保持晶圓的外周部的作用位置之間,使該複數個爪構件各自獨立來朝半徑方向作動; 驅動負載檢測設備,各自檢測該爪構件作動設備的驅動負載; 位置檢測設備,各自檢測各該爪構件之位置;及 控制設備,至少控制該爪構件作動設備, 該控制設備具備: 儲存部,將各個該爪構件抵接於晶圓的外周部時的該爪構件作動設備的驅動負載之值儲存作為閾值;及 計算部,當檢測出來自該驅動負載檢測設備之已超出該閾值的驅動負載時即停止,並從藉由該位置檢測設備所檢測出之各個該爪構件的位置來計算晶圓中心位置, 被該保持設備所保持的晶圓,是將以該計算部所計算出的該晶圓中心位置定位到工作夾台中心位置而被載置到該工作夾台上。A transfer mechanism that transfers a wafer to a work chuck and includes a holding device that holds an outer peripheral portion of the wafer, and a moving device that moves the holding device in a vertical direction and a horizontal direction, the transfer mechanism is characterized by: : The holding device includes: a plurality of claw members that hold the outer peripheral portion of the wafer; a claw member actuating device that is in a standby position for separating the plurality of claw members from the outer peripheral portion of the wafer, and the plurality of claw members mutually Approaching in the radial direction so as to hold between the action positions of the outer peripheral portion of the wafer, the plurality of claw members are independently actuated in the radial direction; a driving load detection device detects the driving load of the claw member actuating device, respectively; a position detection device , respectively detecting the position of each of the claw members; and a control device for controlling at least the claw member actuating device, the control device comprising: a storage portion for the claw member actuating device when each of the claw members is abutted against the outer peripheral portion of the wafer The value of the driving load is stored as a threshold value; and the calculation section stops when detecting a driving load that has exceeded the threshold value from the driving load detecting device, and selects each of the claw members detected by the position detecting device. The wafer center position is calculated from the position of the holding device, and the wafer held by the holding device is placed on the work clamp by positioning the wafer center position calculated by the calculation section to the center position of the work clamp. superior.
TW107100040A 2017-02-03 2018-01-02 transfer mechanism TWI759394B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017018386A JP6811951B2 (en) 2017-02-03 2017-02-03 Transport mechanism
JP2017-018386 2017-02-03

Publications (2)

Publication Number Publication Date
TW201830567A TW201830567A (en) 2018-08-16
TWI759394B true TWI759394B (en) 2022-04-01

Family

ID=63076535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107100040A TWI759394B (en) 2017-02-03 2018-01-02 transfer mechanism

Country Status (4)

Country Link
JP (1) JP6811951B2 (en)
KR (1) KR102272440B1 (en)
CN (1) CN108389810A (en)
TW (1) TWI759394B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130211571A1 (en) * 2012-02-09 2013-08-15 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
TW201351558A (en) * 2012-02-06 2013-12-16 Nitto Denko Corp Substrate transport method and substrate transport apparatus
JP2015216191A (en) * 2014-05-09 2015-12-03 株式会社ディスコ Transfer device
TW201701389A (en) * 2015-03-19 2017-01-01 東京威力科創股份有限公司 Substrate processing apparatus, substrate processing method and storage medium

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3515917B2 (en) 1998-12-01 2004-04-05 シャープ株式会社 Method for manufacturing semiconductor device
JP4547524B2 (en) 2000-12-05 2010-09-22 川崎重工業株式会社 Work processing method, work processing apparatus and robot
JP2006093333A (en) 2004-09-22 2006-04-06 Disco Abrasive Syst Ltd Cutting method
JP2010021257A (en) * 2008-07-09 2010-01-28 Hitachi High-Tech Control Systems Corp Wafer alignment device and wafer transfer device using the same
JP5449239B2 (en) * 2010-05-12 2014-03-19 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and storage medium storing program
JP6120791B2 (en) * 2014-03-13 2017-04-26 東京エレクトロン株式会社 Peeling method, program, computer storage medium, peeling apparatus and peeling system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201351558A (en) * 2012-02-06 2013-12-16 Nitto Denko Corp Substrate transport method and substrate transport apparatus
US20130211571A1 (en) * 2012-02-09 2013-08-15 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP2013165119A (en) * 2012-02-09 2013-08-22 Tokyo Electron Ltd Substrate processing apparatus and method
JP2015216191A (en) * 2014-05-09 2015-12-03 株式会社ディスコ Transfer device
TW201701389A (en) * 2015-03-19 2017-01-01 東京威力科創股份有限公司 Substrate processing apparatus, substrate processing method and storage medium

Also Published As

Publication number Publication date
JP2018125481A (en) 2018-08-09
JP6811951B2 (en) 2021-01-13
TW201830567A (en) 2018-08-16
CN108389810A (en) 2018-08-10
KR20200067251A (en) 2020-06-12
KR102272440B1 (en) 2021-07-01

Similar Documents

Publication Publication Date Title
TWI730211B (en) Processing device
JP5065637B2 (en) Wafer processing method
JP5619559B2 (en) Processing equipment
JP5180557B2 (en) Processing equipment
JP2010186863A (en) Aligning mechanism, working device and aligning method
JP2010199227A (en) Grinding device
JP2009170501A (en) Cutting apparatus
JP2022075811A (en) Processing device, processing method, and computer storage medium
JP6415349B2 (en) Wafer alignment method
JP2020203358A (en) Cutting apparatus and replacement method
TWI759394B (en) transfer mechanism
JP2007301690A (en) Polishing device
JP6074154B2 (en) Processing equipment
JP4105905B2 (en) Cutting blade monitoring device for cutting equipment
JP5261125B2 (en) How to detect the chuck table origin height position
JP6301728B2 (en) Transport device
JP2009302369A (en) Method and apparatus for processing plate-like object
JP3222726U (en) Cutting equipment
JP6246566B2 (en) Dressing method
JP2014075439A (en) Processing apparatus
JP2012076198A (en) Processing apparatus
JP2021186922A (en) Processing method for workpiece
JP6489961B2 (en) Grinding equipment
JP2021074787A (en) Machining device
JP2014223708A (en) Processing device