CN115206854A - Conveyance offset amount detection method - Google Patents

Conveyance offset amount detection method Download PDF

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Publication number
CN115206854A
CN115206854A CN202210315908.6A CN202210315908A CN115206854A CN 115206854 A CN115206854 A CN 115206854A CN 202210315908 A CN202210315908 A CN 202210315908A CN 115206854 A CN115206854 A CN 115206854A
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China
Prior art keywords
workpiece
conveyance
unit
conveying
coordinates
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CN202210315908.6A
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Chinese (zh)
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宫田谕
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Disco Corp
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Disco Corp
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Publication of CN115206854A publication Critical patent/CN115206854A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Controlling Sheets Or Webs (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention provides a conveying offset detection method, which can easily obtain the conveying offset of a conveying unit. The method comprises the following steps: a 1 st coordinate storage step of holding the workpiece on which the mark M is formed on a 1 st table, capturing an image by an imaging unit, and storing the coordinates of the mark M as X1 and Y1 coordinates; a 180-degree rotation step of conveying and holding the workpiece held by the 1 st stage to the 2 nd stage by the conveying unit, and rotating the 2 nd stage by 180 degrees; a returning step of conveying and holding the workpiece held by the 2 nd table to the 1 st table by the conveying unit; a 2 nd coordinate storage step of rotating the 1 st table by 180 degrees, shooting the workpiece by a shooting unit, and storing the coordinates of the mark M as X2 and Y2 coordinates; and a conveyance offset amount calculation step of calculating (X2-X1)/2 as a conveyance offset amount in the X-axis direction and (Y2-Y1)/2 as a conveyance offset amount in the Y-axis direction.

Description

Conveyance offset amount detection method
Technical Field
The present invention relates to a conveyance shift amount detection method for determining a conveyance shift amount of a conveyance unit that conveys a workpiece from a 1 st table to a 2 nd table.
Background
A wafer having a plurality of devices such as ICs and LSIs formed on its front surface divided by lines to be divided is divided into device chips by a dicing apparatus, and the divided device chips are used for electronic devices such as mobile phones and personal computers.
The cutting device generally comprises: a chuck table for holding a wafer; a cutting unit for cutting the wafer held by the chuck table; an X-axis feeding unit which relatively feeds the chuck worktable and the cutting unit in the X-axis direction; a Y-axis feeding unit which relatively performs indexing feeding on the chuck worktable and the cutting unit in the Y-axis direction; an imaging unit which images the wafer held by the chuck table and detects a region to be cut; a cleaning unit for cleaning the cut wafer; and a conveying unit that conveys the wafer from the chuck table to the cleaning unit, and the dicing apparatus can cut the wafer with high accuracy (see, for example, patent document 1). The cleaning unit of the cutting device comprises: a rotatable rotary table for holding a wafer; and a cleaning liquid spray nozzle for spraying a cleaning liquid to the wafer held by the spin table.
Patent document 1: japanese laid-open patent publication No. 2010-36275
However, when the wafer held at the proper position of the chuck table of the dicing apparatus cannot be conveyed to the proper position of the rotary table of the cleaning unit by the conveying unit, the wafer may be scattered from the rotary table by the high-speed rotation of the rotary table. Therefore, it is necessary to finely adjust the conveying direction and the conveying distance of the conveying means by actually measuring the direction and the distance from the chuck table to the rotating table, but there are problems as follows: such fine adjustment takes time and effort, and the productivity is poor.
This problem occurs in various processing apparatuses (for example, laser processing apparatuses, grinding apparatuses, and inspection apparatuses) having a mechanism for transporting a wafer between two or more tables.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a conveyance shift amount detection method capable of easily determining a conveyance shift amount of a conveyance unit.
According to the present invention, the following conveyance shift amount detection method is provided to solve the above problems. That is, a conveyance shift amount detection method is provided for determining a conveyance shift amount of a conveyance unit in a processing apparatus for processing a workpiece, the processing apparatus including at least a 1 st rotatable table, a 2 nd rotatable table, the conveyance unit for conveying the workpiece from the 1 st table to the 2 nd table, and an imaging unit for imaging the workpiece held by the 1 st table, the conveyance shift amount detection method including the steps of: a 1 st coordinate storage step of holding the workpiece on which the mark is formed on the 1 st stage, performing imaging by the imaging unit, and storing the coordinates of the mark as X1 and Y1 coordinates; a 180-degree rotation step of conveying and holding the workpiece held by the 1 st table to the 2 nd table by the conveying unit, and rotating the 2 nd table by 180 degrees; a returning step of conveying and holding the workpiece held by the 2 nd table to the 1 st table by the conveying unit; a 2 nd coordinate storing step of rotating the 1 st table by 180 degrees, imaging the workpiece by the imaging unit, and storing coordinates of the mark as X2 and Y2 coordinates; and a conveyance offset amount calculation step of calculating (X2-X1)/2 as a conveyance offset amount in the X-axis direction and (Y2-Y1)/2 as a conveyance offset amount in the Y-axis direction.
Preferably, the conveyance shift is corrected by adding (X2-X1)/2 and (Y2-Y1)/2 to the amount of movement of the conveyance unit.
A conveyance shift amount detection method according to the present invention is a conveyance shift amount detection method for determining a conveyance shift amount of a conveyance unit in a processing apparatus for processing a workpiece, the processing apparatus including at least a 1 st rotatable table, a 2 nd rotatable table, the conveyance unit for conveying the workpiece from the 1 st table to the 2 nd table, and an imaging unit for imaging the workpiece held by the 1 st table, the conveyance shift amount detection method including: a 1 st coordinate storage step of holding the workpiece on which the mark is formed on the 1 st stage, performing imaging by the imaging unit, and storing the coordinates of the mark as X1 and Y1 coordinates; a 180-degree rotation step of conveying and holding the workpiece held by the 1 st stage to the 2 nd stage by the conveying unit, and rotating the 2 nd stage by 180 degrees; a returning step of conveying and holding the workpiece held by the 2 nd table to the 1 st table by the conveying unit; a 2 nd coordinate storage step of rotating the 1 st table by 180 degrees, photographing the workpiece by the photographing unit, and storing coordinates of the mark as X2 and Y2 coordinates; and a conveyance offset amount calculation step of calculating (X2-X1)/2 as a conveyance offset amount in the X-axis direction and (Y2-Y1)/2 as a conveyance offset amount in the Y-axis direction, so that it is not necessary to actually measure the direction and distance from the 1 st table to the 2 nd table, and the conveyance offset amount of the conveyance unit can be easily obtained from the offset of the coordinates of the mark.
Drawings
Fig. 1 is a perspective view of a processing apparatus capable of implementing the conveyance shift amount detection method of the present invention.
Fig. 2 is a top view of a workpiece formed with a mark.
Fig. 3 is a schematic plan view of the 1 st and 2 nd tables shown in fig. 1.
Fig. 4 is a schematic plan view of the 1 st and 2 nd tables in the 1 st coordinate storage step.
Fig. 5 is a schematic plan view showing a state where the workpiece held by the 1 st stage is conveyed to and held by the 2 nd stage by the conveying unit.
Fig. 6 is a schematic plan view showing a state where the 2 nd stage is rotated by 180 degrees from the state shown in fig. 5.
Fig. 7 is a schematic plan view showing a state in which the workpiece held by the 2 nd table is conveyed to and held by the 1 st table by the conveying unit.
Fig. 8 is a schematic plan view showing a state where the 1 st stage is rotated by 180 degrees from the state shown in fig. 7.
Description of the reference symbols
2: a processing device; 4: 1, a workbench; 6: a 2 nd workbench; 8: a conveying unit; 10: a shooting unit; w: and (5) a workpiece.
Detailed Description
Hereinafter, a preferred embodiment of the conveyance shift amount detection method according to the present invention will be described with reference to the drawings.
First, a processing apparatus capable of implementing the conveyance shift amount detection method of the present invention will be described. The processing apparatus 2 shown in fig. 1 includes at least: a 1 st rotatable table 4; a 2 nd rotatable table 6; a conveying unit 8 for conveying the workpiece from the 1 st station 4 to the 2 nd station 6; and an imaging unit 10 for imaging the workpiece held by the 1 st stage 4.
The circular 1 st table 4 is transported in the X-axis direction indicated by an arrow X in fig. 1 by an X-axis transport unit (not shown), and is rotated around the center C1 (see fig. 3) of the 1 st table 4 by a 1 st table motor (not shown). The X-axis transfer unit may include: a ball screw connected to the 1 st table 4 and extending in the X-axis direction; and a motor that rotates the ball screw. In fig. 1, the Y-axis direction indicated by the arrow Y is a direction perpendicular to the X-axis direction, and the XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.
As shown in fig. 1, a porous circular suction chuck 4a connected to a suction unit (not shown) is disposed at an upper end portion of the 1 st stage 4. The 1 st stage 4 generates a suction force on the suction chuck 4a by the suction unit, thereby sucking and holding a workpiece W (see fig. 2) such as a disc-shaped semiconductor wafer. The processing apparatus 2 of the illustrated embodiment is a cutting apparatus that performs cutting processing on the workpiece W, and the 1 st table 4 sucks and holds the workpiece W when performing cutting processing on the workpiece W.
The 2 nd table 6 of the illustrated embodiment is a rotary table that sucks and holds the workpiece W when cleaning the workpiece W to which the cutting chips have been adhered by the cutting process. The circular 2 nd table 6 is rotated around the center C2 (see fig. 3) of the 2 nd table 6 by a 2 nd table motor (not shown).
As shown in fig. 1, a porous circular suction chuck 6a connected to a suction means (not shown) is disposed at the upper end portion of the 2 nd table 6, as in the 1 st table 4. In the 2 nd table 6, too, the suction unit generates a suction force on the suction chuck 6a, thereby sucking and holding the workpiece W. The workpiece W can be cleaned by spraying a cleaning liquid from a cleaning liquid spray nozzle (not shown) while rotating the 2 nd table 6 that sucks and holds the workpiece W.
The carrying unit 8 of the illustrated embodiment includes: the X-axis conveying unit that conveys the workpiece W held by the 1 st stage 4 in the X-axis direction; and a Y-axis conveying unit 11 that holds and moves up and down the workpiece W held by the 1 st table 4 and conveys the workpiece W in the Y-axis direction.
The Y-axis transfer unit 11 includes: an arm 12 movable in the Y-axis direction; an arm moving unit (not shown) for moving the arm 12 in the Y-axis direction; a bracket piece 14 mounted on the lower surface of the front end of the arm 12; an H-shaped plate 16 fixed to the lower surface of the carrier sheet 14; and a plurality of suction pads 18 disposed on the lower surface of the plate 16. The arm moving unit may be configured to include, for example: a ball screw connected to the arm 12 and extending in the Y-axis direction; and a motor that rotates the ball screw. The bracket piece 14 is configured to be vertically extendable and retractable by an appropriate actuator such as an air cylinder. Further, each suction pad 18 is connected to a suction unit (not shown).
In the conveying unit 8, after the 1 st table 4 is positioned at a predetermined conveyance start position by the X-axis conveying unit, the workpiece W on the 1 st table 4 is sucked and held by the suction pad 18 of the Y-axis conveying unit 11, and the workpiece W is received from the 1 st table 4. Then, the Y-axis transfer unit 11 that has received the workpiece W transfers the workpiece W from the 1 st stage 4 to the 2 nd stage 6 by moving the arm 12 and the carrier piece 14.
The imaging unit 10 images the workpiece W on the 1 st table 4 positioned at a predetermined imaging position by the X-axis conveying unit. The image data captured by the imaging unit 10 is transmitted to a control unit (not shown) of the processing device 2.
The control unit constituted by a computer includes: a Central Processing Unit (CPU) that performs arithmetic processing in accordance with a control program; a Read Only Memory (ROM) that stores a control program and the like; and a readable and writable Random Access Memory (RAM) that stores operation results and the like. Then, the control unit performs image analysis on the image data transmitted from the imaging unit 10, and acquires and stores, for example, X coordinates and Y coordinates of a mark M (see fig. 2) formed on the workpiece W. The control means controls the operation of the processing device 2, and controls the movement amount of the conveying means 8, for example, based on a condition input to the control means in advance.
As shown in fig. 1, the processing apparatus 2 further includes: a cutting unit 20 that cuts the workpiece W held by the 1 st table 4; a cassette table 24 which is vertically movable and on which a cassette 22 accommodating a plurality of works W is placed; a carrying-in and out unit 28 that pulls out the workpiece W before machining from the cassette 22, carries out the workpiece W to the temporary placement table 26, and carries in the workpiece W after machining positioned on the temporary placement table 26 to the cassette 22; and a moving unit 30 that moves the workpiece W before processing, which is carried out from the cassette 22 to the temporary placement table 26, to the 1 st table 4.
Next, a conveyance shift amount detection method for determining a conveyance shift amount of the conveyance unit 8 in the processing apparatus 2 will be described. In the illustrated embodiment, first, the 1 st coordinate storing step is performed, in which the workpiece W on which the mark M is formed is held on the 1 st stage 4 and imaged by the imaging unit 10, and the coordinates of the mark M are stored as X1 and Y1 coordinates.
In the 1 st coordinate storage step, first, the workpiece W is placed on the 1 st table 4 with the surface on which the mark M is formed facing upward. Next, the 1 st table 4 is moved by the X-axis conveying means, the 1 st table 4 is positioned at a predetermined imaging position, and the workpiece W held by the 1 st table 4 is imaged by the imaging means 10. Then, the control unit performs image analysis on the image captured by the imaging unit 10, and acquires and stores the coordinates of the mark M as X1 and Y1 coordinates (see fig. 4).
After the 1 st coordinate storing step is performed, a 180-degree rotation step is performed: the workpiece W held by the 1 st stage 4 is conveyed to and held by the 2 nd stage 6 by the conveying unit 8, and the 2 nd stage 6 is rotated by 180 degrees.
In the 180-degree rotation step, the 1 st table 4 is first moved by the X-axis conveying unit, and the 1 st table 4 is positioned at a predetermined conveyance start position. When the 1 st table 4 is positioned at the conveyance start position, the arm 12 and the carrier sheet 14 of the Y-axis conveyance unit 11 are operated, and the suction pad 18 is brought into close contact with the upper surface of the workpiece W on the 1 st table 4. Next, the suction pad 18 suctions and holds the workpiece W, and the suction force of the 1 st table 4 is released.
Then, the arm 12 and the carrier sheet 14 of the Y-axis transfer unit 11 are operated to transfer the workpiece W from the 1 st stage 4 to the 2 nd stage 6, and the lower surface of the workpiece W is brought into contact with the upper surface of the 2 nd stage 6. Next, the workpiece W is sucked and held by the 2 nd table 6, and the suction force of the suction pad 18 is released. In this way, the workpiece W is delivered from the Y-axis transfer unit 11 to the 2 nd table 6 (see fig. 5). When the workpiece W is transferred to the 2 nd table 6, the 2 nd table motor is operated to rotate the 2 nd table 6 which holds the workpiece W by suction by 180 degrees as shown in fig. 6.
After the 180-degree rotation step, a return step is performed: the workpiece W held by the 2 nd table 6 is conveyed to and held by the 1 st table 4 by the conveying unit 8.
In the returning step, first, the suction pads 18 of the Y-axis conveyance unit 11 are brought into close contact with the upper surface of the workpiece W on the 2 nd table 6, and the workpiece W is sucked and held by the suction pads 18 and the suction force of the 2 nd table 6 is released. Next, the arm 12 and the carrier piece 14 are operated to convey the workpiece W from the 2 nd stage 6 to the 1 st stage 4, and the lower surface of the workpiece W is brought into contact with the upper surface of the 1 st stage 4. As shown in fig. 7, the workpiece W is sucked and held by the 1 st table 4, and the suction force of the suction pad 18 is released. Thus, the workpiece W is returned from the 2 nd table 6 to the 1 st table 4.
After the return step, a 2 nd coordinate storage step is performed: the 1 st stage 4 is rotated by 180 degrees, the workpiece W is imaged by the imaging unit 10, and the coordinates of the mark M are stored as X2 and Y2 coordinates.
In the 2 nd coordinate storing step, first, as shown in fig. 8, the 1 st table motor is operated to rotate the 1 st table 4 which holds the workpiece W by suction by 180 degrees. Next, the 1 st table 4 is moved by the X-axis conveying means, the 1 st table 4 is positioned at a predetermined imaging position, and the workpiece W held by the 1 st table 4 is imaged by the imaging means 10. Then, the control unit performs image analysis on the image captured by the imaging unit 10, and acquires and stores the coordinates of the mark M as X2 and Y2 coordinates (see fig. 8).
After the 2 nd coordinate storage step is performed, a conveyance shift amount calculation step is performed: the amount of conveyance shift in the X-axis direction was calculated as (X2-X1)/2 and the amount of conveyance shift in the Y-axis direction was calculated as (Y2-Y1)/2. In the illustrated embodiment, the control means calculates the conveyance shift amount.
In the illustrated embodiment, as described above, since the workpiece W conveyed from the 1 st table 4 to the 2 nd table 6 is rotated by 180 degrees in the 2 nd table 6 and the workpiece W conveyed (returned) from the 2 nd table 6 to the 1 st table 4 is rotated by 180 degrees in the 1 st table 4, when there is conveyance deviation of the conveying unit 8, the distance between the coordinates (X1, Y1) of the mark M before conveyance and the coordinates (X2, Y2) of the mark M after conveyance becomes 2 times the conveyance deviation amount of the conveying unit 8. Therefore, by performing the calculation of (X2-X1)/2 and (Y2-Y1)/2, the conveyance shift amount in each of the X-axis direction and the Y-axis direction can be obtained. In addition, when there is no conveyance shift of the conveyance unit 8, the coordinates (X1, Y1) of the mark M before conveyance match the coordinates (X2, Y2) of the mark M after conveyance.
After the conveyance shift amount calculating step, it is preferable to correct the conveyance shift by adding (X2-X1)/2 and (Y2-Y1)/2 to the movement amount of the conveyance unit 8. In the illustrated embodiment, when the workpiece W is conveyed from the 1 st table 4 to the 2 nd table 6, the X-axis conveying unit conveys the workpiece W in the X-axis direction, and the Y-axis conveying unit 11 conveys the workpiece W in the Y-axis direction and the vertical direction, so that the conveying offset amount in the X-axis direction is added to the movement amount of the X-axis conveying unit, and the conveying offset amount in the Y-axis direction is added to the movement amount of the Y-axis conveying unit 11. This prevents conveyance deviation from occurring when the workpiece W is conveyed from the 1 st table 4 to the 2 nd table 6, and the workpiece W can be placed on an appropriate position of the 2 nd table 6.
As described above, the illustrated embodiment includes the following steps: a 1 st coordinate storage step of holding the workpiece W on which the mark M is formed on the 1 st stage 4, performing imaging by the imaging unit 10, and storing the coordinates of the mark M as X1 and Y1 coordinates; a 180-degree rotation step of conveying and holding the workpiece W held by the 1 st table 4 to the 2 nd table 6 by the conveying unit 8, and rotating the 2 nd table 6 by 180 degrees; a returning step of conveying and holding the workpiece W held by the 2 nd table 6 to the 1 st table 4 by the conveying unit 8; a 2 nd coordinate storage step of rotating the 1 st table 4 by 180 degrees, imaging the workpiece W by the imaging unit 10, and storing the coordinates of the mark M as X2 and Y2 coordinates; and a conveyance shift amount calculation step of calculating (X2-X1)/2 as a conveyance shift amount in the X-axis direction and (Y2-Y1)/2 as a conveyance shift amount in the Y-axis direction, so that the conveyance shift amount of the conveyance unit 8 can be easily obtained.
In addition, as for the amount of conveyance shift in the X-axis direction and the Y-axis direction, (X1-X2)/2, (Y1-Y2)/2 may be employed, contrary to the illustrated embodiment. This is because half of the difference between X1 and X2 and half of the difference between Y1 and Y2 are the amount of conveyance shift, and the sign of the calculated value is positive (+) or negative (-) indicating the direction in which the conveyance shift occurs.
In the illustrated embodiment, the processing apparatus 2 is described as an example of a dicing apparatus for cutting a workpiece W, but the present invention may be applied to various processing apparatuses including a laser processing apparatus for laser processing a workpiece, a grinding apparatus for grinding a workpiece, and an inspection apparatus for inspecting a workpiece, as long as the processing apparatus includes a conveying unit for conveying a workpiece such as a semiconductor wafer between two or more tables.

Claims (2)

1. A conveyance shift amount detection method for determining a conveyance shift amount of a conveyance unit in a processing apparatus for processing a workpiece, the processing apparatus having at least a 1 st rotatable table, a 2 nd rotatable table, the conveyance unit for conveying the workpiece from the 1 st table to the 2 nd table, and an imaging unit for imaging the workpiece held by the 1 st table,
the conveyance shift amount detection method includes the steps of:
a 1 st coordinate storage step of holding the workpiece on which the mark is formed on the 1 st stage, performing imaging by the imaging unit, and storing the coordinates of the mark as X1 and Y1 coordinates;
a 180-degree rotation step of conveying and holding the workpiece held by the 1 st table to the 2 nd table by the conveying unit, and rotating the 2 nd table by 180 degrees;
a returning step of conveying and holding the workpiece held by the 2 nd table to the 1 st table by the conveying unit;
a 2 nd coordinate storage step of rotating the 1 st table by 180 degrees, photographing the workpiece by the photographing unit, and storing coordinates of the mark as X2 and Y2 coordinates; and
and a conveyance offset amount calculation step of calculating (X2-X1)/2 as a conveyance offset amount in the X-axis direction and (Y2-Y1)/2 as a conveyance offset amount in the Y-axis direction.
2. The conveyance shift amount detection method according to claim 1,
the conveying offset is corrected by adding (X2-X1)/2 and (Y2-Y1)/2 to the moving amount of the conveying unit.
CN202210315908.6A 2021-04-07 2022-03-29 Conveyance offset amount detection method Pending CN115206854A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-065257 2021-04-07
JP2021065257A JP2022160811A (en) 2021-04-07 2021-04-07 Conveyance deviation detection method

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Publication Number Publication Date
CN115206854A true CN115206854A (en) 2022-10-18

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KR (1) KR20220139230A (en)
CN (1) CN115206854A (en)
TW (1) TW202240750A (en)

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Publication number Priority date Publication date Assignee Title
JP5184250B2 (en) 2008-08-01 2013-04-17 株式会社ディスコ Cutting equipment

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TW202240750A (en) 2022-10-16
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