JP5184250B2 - Cutting equipment - Google Patents

Description

  The present invention relates to a cutting apparatus including a chuck table that holds a workpiece, and a cutting unit that cuts the workpiece held on the chuck table.

  A semiconductor wafer formed in a region where a plurality of devices such as IC, LSI, etc. are partitioned by a line to be divided is divided into individual devices by a cutting machine equipped with a cutting blade, and the divided devices are mobile phones and personal computers. It is used for electrical equipment.

  The cutting blade is composed of a base having a mounting hole (opening) formed in the center, and a cutting blade formed on the outer periphery of the base. When chipping occurs, it is replaced with a new cutting blade.

  The cutting means includes a spindle unit that rotationally drives the spindle, a cutting blade, a boss portion in which a mounting hole formed in the base of the cutting blade is mounted, and a fixed flange that supports the base of the cutting blade. A blade mount fixed to the spindle, and a fixing nut that is screwed into a male screw formed at the tip of the boss portion of the blade mount and fixed by sandwiching the base of the cutting blade with a fixing flange of the blade mount The cutting blade is detachable (see, for example, JP-A-9-314465).

When removing the cutting blade from the blade mount, it is necessary to first remove the fixing nut from the boss portion (mounting shaft) of the blade mount, and then remove the cutting blade from the blade mount. Conversely, when the cutting blade is mounted on the blade mount, the cutting blade is mounted on the blade mount, and then a fixing nut is screwed onto the boss portion of the blade mount.
JP-A-9-314465

  As described above, the cutting blade is attached to the spindle by screwing the fixing nut into the boss portion of the blade mount. When the mounting hole formed in the base of the cutting blade is attached to the boss portion of the blade mount, The amount of deviation that occurs is less than 5 μm, but the amount of deviation between the center of the fixed nut and the center of the boss when the fixed nut is screwed into the boss of the blade mount and the cutting blade is fixed is the maximum. There is a problem that the wheel balance is lost due to the deviation between the center of the fixing nut and the center of the boss portion, and the cutting blade vibrates and high-precision cutting cannot be performed.

  The present invention has been made in view of these points, and an object of the present invention is to provide a cutting device capable of fixing a cutting blade by screwing onto a boss portion of a blade mount so that the center of a fixing nut is not displaced. Is to provide.

  According to the present invention, there is provided a cutting apparatus comprising a chuck table for holding a workpiece and a cutting means for cutting the workpiece held on the chuck table, the cutting means rotationally driving a spindle. A spindle unit, a boss portion formed with an external thread on the outer periphery, a fixing flange formed integrally with the boss portion, a blade mount fixed to the spindle, and a boss portion of the blade mount at the center A cutting blade formed on a base having an attachment hole inserted into the base, and a cutting blade formed on an outer periphery of the base, and attached so as to abut on a fixed flange of the blade mount; and Fixing by screwing into a male screw formed on a boss portion and clamping the base of the cutting blade with the fixing flange of the blade mount An annular groove that surrounds the mounting hole is formed in the base of the cutting blade, and an annular fitting that fits an inner peripheral surface of the annular groove is formed in the fixing nut A cutting device is provided in which protrusions are formed.

  Preferably, an annular elastic member is disposed on the outer periphery of the annular fitting protrusion of the fixing nut. In the cutting apparatus of the present invention, the cutting blade is attached to and detached from the blade mount in a state where the annular fitting protrusion of the fixing nut is fitted to the inner peripheral surface of the annular groove of the cutting blade.

  According to the present invention, the cutting blade is mounted on the blade mount and fixed by the fixing nut in a state where the annular fitting protrusion of the fixing nut is fitted in the annular groove of the cutting blade. The amount of deviation from the center of the boss portion depends on the amount of deviation between the center of the cutting blade and the center of the boss portion of the blade mount.

  Therefore, with the amount of deviation between the center of the fixing nut and the center of the boss of the blade mount reduced, the fixing nut is screwed onto the end of the boss of the blade mount to fix the cutting blade to the blade mount. Can do.

  In addition, the cutting device is configured so that the cutting blade can be attached to and detached from the blade mount in a state where the fixing nut and the cutting blade are integrated by fitting the annular fitting protrusion of the fixing nut into the annular groove of the cutting blade. The cutting blade and the fixing nut can be easily attached and detached.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, an appearance of a cutting device (dicing device) 2 capable of dicing a semiconductor wafer and dividing it into individual chips (devices) is shown.

  On the front side of the cutting device 2, there is provided operating means 4 for an operator to input instructions to the device such as machining conditions. In the upper part of the apparatus, there is provided a display means 6 such as a CRT for displaying a guidance screen for an operator and an image taken by an imaging means described later.

  As shown in FIG. 2, on the surface of the wafer W to be diced, the first street S1 and the second street S2 are formed orthogonally, and the first street S1 and the second street S2 A plurality of devices D are partitioned and formed on the wafer W.

  The wafer W is attached to a dicing tape T that is an adhesive tape, and the outer peripheral edge of the dicing tape T is attached to an annular frame F. As a result, the wafer W is supported by the frame F via the dicing tape T, and a plurality of wafers (for example, 25 sheets) are accommodated in the wafer cassette 8 shown in FIG. The wafer cassette 8 is placed on a cassette elevator 9 that can move up and down.

  Behind the wafer cassette 8, a loading / unloading means 10 for unloading the wafer W before cutting from the wafer cassette 8 and loading the wafer after cutting into the wafer cassette 8 is disposed. Between the wafer cassette 8 and the loading / unloading means 10, a temporary placement area 12, which is an area on which a wafer to be carried in / out, is temporarily placed, is provided. Positioning means 14 for positioning at a certain position is provided.

  In the vicinity of the temporary placement area 12, transport means 16 having a turning arm that sucks and transports the frame F integrated with the wafer W is disposed, and the wafer W carried to the temporary placement area 12 is It is attracted by the transport means 16 and transported onto the chuck table 18 and is sucked by the chuck table 18, and is held on the chuck table 18 by fixing the frame F by a plurality of fixing means 19.

  The chuck table 18 is configured to be rotatable and reciprocally movable in the X-axis direction. Above the movement path of the chuck table 18 in the X-axis direction, an alignment unit 20 that detects a street to be cut of the wafer W is provided. It is arranged.

  The alignment unit 20 includes an imaging unit 22 that images the surface of the wafer W, and can detect a street to be cut by a process such as pattern matching based on an image acquired by imaging. The image acquired by the imaging unit 22 is displayed on the display unit 6.

  On the left side of the alignment means 20, a cutting means 24 for cutting the wafer W held on the chuck table 18 is disposed. The cutting means 24 is configured integrally with the alignment means 20, and both move together in the Y-axis direction and the Z-axis direction.

  The cutting means 24 is configured by attaching a cutting blade 28 to the tip of a rotatable spindle 26 and is movable in the Y-axis direction and the Z-axis direction. The cutting blade 28 is located on the extended line of the imaging means 22 in the X-axis direction.

  Referring to FIG. 3, an exploded perspective view of the cutting means 24 is shown. FIG. 4 is a perspective view of the cutting means 24. Reference numeral 25 denotes a spindle housing of the cutting means 24, in which a spindle 26 that is rotationally driven by a servo motor (not shown) is rotatably accommodated. The cutting blade 28 is an electroformed blade, and has a cutting edge 28a formed by dispersing diamond abrasive grains in a nickel base material on the outer peripheral portion thereof.

  A blade cover 30 covers the cutting blade 28, and a cutting water nozzle 32 extending along the side surface of the cutting blade 28 is attached thereto. Cutting water is supplied to the cutting water nozzle 32 through the pipe 34. The blade cover 30 has screw holes 36 and 38.

  Reference numeral 50 denotes a blade detection block for detecting wear or chipping of the cutting blade 28. The blade detection block 50 is inserted into the screw hole 38 of the blade cover 30 by inserting a screw 54 into the round hole 52. Attached to the blade cover 30. The blade detection block 50 includes an adjustment screw 55 that adjusts the positions of the light emitting unit and the light receiving unit of the blade sensor.

  A detachable cover 40 has a cutting water nozzle 42 that extends along the side surface of the cutting blade 28 when attached to the blade cover 30. The cutting water is supplied to the cutting water nozzle 42 via the pipe 44.

  The detachable cover 40 is fixed to the blade cover 30 by inserting the screw 48 into the round hole 46 of the detachable cover 40 and screwing it into the screw hole 36 of the blade cover 30. As a result, the upper half of the cutting blade 28 is covered with the blade cover 30 and the detachable cover 40 as shown in FIG.

  Referring to FIG. 5, an exploded perspective view showing the relationship between the spindle 26 and the blade mount 58 attached to the spindle 26 is shown. Reference numeral 27 denotes a spindle unit of the cutting means 24 composed of a spindle 26 and a servo boater (not shown) that rotationally drives the spindle 26, and is housed in a spindle housing 25. The spindle 26 has a tapered portion 26a and a small distal end portion 26b, and a male screw 56 is formed on the small distal end portion 26b.

  A blade mount 58 includes a boss portion (mounting shaft) 60 and a fixed flange 62 formed integrally with the boss portion 60, and a male screw 64 is formed on the boss portion 60. Further, the blade mount 58 has a mounting hole 65.

  In the blade mount 58, the mounting hole 65 is inserted into the tip small-diameter portion 26b and the tapered portion 26a of the spindle 26, and the nut 66 is screwed into the male screw 56 to be tightened, as shown in FIG. It is attached to the tip of

  Referring to FIG. 6, a perspective view of the cutting blade 28 of the embodiment of the present invention is shown. The cutting blade 28 has a circular base 68 having a hub 70, a cutting edge 28 a formed on the outer periphery of the circular base 68, and a mounting hole 72. The cutting blade 28 further has an annular groove (annular recess) 74 formed so as to surround the mounting hole 72.

  Referring to FIG. 7, a fixing nut 76 for fixing the cutting blade 28 to the blade mount 58 is shown. 7A is a perspective view of the fixing nut 76, and FIG. 7B is a rear perspective view of the fixing nut 76. FIG.

  The fixing nut 76 has an internal thread 78 threadedly engaged with the male thread 64 of the blade mount 58 on the inner periphery thereof, and an annular fitting protrusion 80 that fits into the annular groove 74 of the cutting blade 28. FIG. 7C shows a state in which an O-ring 82 is attached to the outer periphery of the annular fitting protrusion 80.

  As shown in FIG. 8A, the annular fitting protrusion 80 of the fixing nut 76 is fitted into the annular groove 74 of the cutting blade 28, and the fixing nut 76 is integrated with the cutting blade 28. Then, the cutting blade 28 integrated with the fixing nut 76 is mounted on the boss 60 of the blade mount 58, and the fixing nut 76 is screwed onto the male screw 64 of the boss 60 to be tightened. Is sandwiched between the fixing flange 62 and the fixing nut 76 of the blade mount 58, and the cutting blade 28 is attached to the blade mount 58.

  When the fixing nut 76 is screwed onto the male screw 64 and tightened, the fixing nut 76 and the blade 28 are both rotated at the beginning. However, since the friction between the cutting blade 28 and the blade mount 58 increases during the tightening, cutting is performed. The blade 28 is not rotated, but only the fixing nut 76 is rotated and tightened. FIG. 8B shows a state where the cutting blade 28 is mounted on the blade mount 58.

  Referring to FIG. 9, the annular fitting protrusion 80 of the fixing nut 76 is fitted into the annular groove 74 of the cutting blade 28, and the cutting blade 28 in which the fixing nut 76 is integrated is attached to the blade mount 58. A longitudinal sectional view of the state is shown.

  According to the above-described embodiment, in a state where the annular fitting protrusion 80 of the fixing nut 76 is fitted into the annular groove 74 of the cutting blade 28 and the fixing nut 76 is integrated with the cutting blade 28, the fixing nut 76 is the blade. The male screw 64 of the mount 58 is screwed and tightened. Therefore, the amount of deviation between the center of the fixing nut 76 and the center of the boss 60 of the blade mount 58 depends on the amount of deviation between the center of the cutting blade 28 and the center of the blade mount 58.

  Accordingly, in a state in which the deviation between the center of the fixing nut 76 and the center of the boss 60 of the blade mount 58 is reduced, the fixing nut 76 is screwed onto the end of the boss 60 of the blade mount 58 so that the cutting blade 28 is attached. It can be fixed to the blade mount 58. As a result, the wheel balance can be properly maintained, and the vibration of the cutting blade is suppressed, so that the workpiece can be cut with high accuracy. Moreover, since the fixing nut 76 and the cutting blade 28 can be attached to and detached from the blade mount 58, the attachment and detachment are facilitated.

It is an external appearance perspective view of a cutting device. It is a perspective view which shows the wafer integrated with the flame | frame. It is a disassembled perspective view of a cutting means (cutting unit). It is a perspective view of a cutting means. It is a disassembled perspective view which shows the relationship between a spindle and the blade mount which should be fixed to a spindle. It is a perspective view of the cutting blade concerning an embodiment. 7A is a perspective view of the fixing nut, FIG. 7B is a rear perspective view of the fixing nut, and FIG. 7C is a perspective view of the fixing nut with an O-ring attached to an annular fitting protrusion. . FIG. 8A is an exploded perspective view of a state in which a cutting blade integrated with a fixing nut is attached to the blade mount, and FIG. 8B is a perspective view of a state in which the cutting blade is attached to the blade mount. It is a longitudinal cross-sectional view of the state where the cutting blade integrated with the fixing nut is mounted on the blade mount.

Explanation of symbols

2 Cutting device 18 Chuck table 24 Cutting means 26 Spindle 28 Cutting blade 28a Cutting blade 58 Blade mount 60 Boss part (mounting shaft)
64 Male screw 68 Base 72 Mounting hole 74 Annular groove 76 Fixing nut 80 Annular fitting protrusion 82 O-ring

Claims (3)

A cutting device comprising a chuck table for holding a workpiece and a cutting means for cutting the workpiece held on the chuck table,
The cutting means includes a spindle unit that rotationally drives a spindle;
A blade mount fixed to the spindle, including a boss portion formed with a male screw on the outer periphery, and a fixing flange formed integrally with the boss portion;
It is composed of a base having a mounting hole to be inserted into the boss part of the blade mount at the center part, and a cutting blade formed on the outer periphery of the base, and is mounted so as to contact the fixed flange of the blade mount. Cutting blades,
A fixing nut that is screwed into a male screw formed on a boss portion of the blade mount and clamps and fixes the base of the cutting blade with the fixing flange of the blade mount;
An annular groove surrounding the mounting hole is formed on the base of the cutting blade, and an annular fitting protrusion is formed on the fixing nut to be fitted to the inner peripheral surface of the annular groove. A cutting device characterized.   The cutting apparatus according to claim 1, wherein an annular elastic member is disposed on an outer periphery of the annular fitting protrusion of the fixing nut.   The cutting blade is attached to and detached from the blade mount in a state where the annular fitting protrusion of the fixing nut is fitted to the inner peripheral surface of the annular groove of the cutting blade. Cutting equipment.

Images