JP2022160811A - Conveyance deviation detection method - Google Patents

Conveyance deviation detection method Download PDF

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JP2022160811A
JP2022160811A JP2021065257A JP2021065257A JP2022160811A JP 2022160811 A JP2022160811 A JP 2022160811A JP 2021065257 A JP2021065257 A JP 2021065257A JP 2021065257 A JP2021065257 A JP 2021065257A JP 2022160811 A JP2022160811 A JP 2022160811A
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conveying
work
workpiece
coordinates
transport
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諭 宮田
Satoshi Miyata
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2021065257A priority Critical patent/JP2022160811A/en
Priority to KR1020220034685A priority patent/KR20220139230A/en
Priority to TW111110550A priority patent/TW202240750A/en
Priority to CN202210315908.6A priority patent/CN115206854A/en
Publication of JP2022160811A publication Critical patent/JP2022160811A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54426Marks applied to semiconductor devices or parts for alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Controlling Sheets Or Webs (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)

Abstract

To provide a transport deviation amount detection method capable of easily obtaining a transport deviation amount of transport means.SOLUTION: A conveyance deviation amount detection method includes a first coordinate storing step of holding a workpiece on which a mark M is formed on a first table, imaging the workpiece with imaging means, and storing the coordinates of the mark M as X1 and Y1 coordinates, a 180-degree rotation step of conveying and holding the workpiece held on the first table by conveying means to a second table and rotating the second table by 180 degrees, a return step of conveying the workpiece held on the second table by the conveying means to the first table and holding the workpiece, a second coordinate storing step of rotating the first table by 180 degrees and capturing an image of the workpiece with the imaging means, and storing the coordinates of the mark M as X2 and Y2 coordinates, and a conveyance deviation amount calculation step of calculating (X2-X1)/2 as the conveyance deviation amount in the X-axis direction and (Y2-Y1)/2 as the conveyance deviation amount in the Y-axis direction.SELECTED DRAWING: Figure 1

Description

本発明は、第1のテーブルから第2のテーブルにワークを搬送する搬送手段の搬送ズレ量を求める搬送ズレ量検出方法に関する。 TECHNICAL FIELD The present invention relates to a method for detecting a conveyance deviation amount of a conveyance means for conveying a work from a first table to a second table.

IC、LSI等の複数のデバイスが分割予定ラインによって区画され表面に形成されたウエーハは、ダイシング装置によって個々のデバイスチップに分割され、分割された各デバイスチップは携帯電話、パソコン等の電気機器に利用される。 A wafer in which a plurality of devices such as ICs and LSIs are partitioned by dividing lines and formed on the surface is divided into individual device chips by a dicing machine, and each of the divided device chips is applied to electrical equipment such as mobile phones and personal computers. used.

ダイシング装置は、ウエーハを保持するチャックテーブルと、チャックテーブルに保持されたウエーハを切削する切削手段と、チャックテーブルと切削手段とをX軸方向に相対的に加工送りするX軸送り手段と、チャックテーブルと切削手段とをY軸方向に相対的に割り出し送りするY軸送り手段と、チャックテーブルに保持されたウエーハを撮像し切削すべき領域を検出する撮像手段と、切削済みのウエーハを洗浄する洗浄手段と、チャックテーブルから洗浄手段までウエーハを搬送する搬送手段とから概ね構成されていて、ウエーハを高精度に切削することができる(たとえば特許文献1参照)。ダイシング装置の洗浄手段は、ウエーハを保持し回転可能なスピンナーテーブルと、スピンナーテーブルに保持されたウエーハに洗浄液を噴射する洗浄液噴射ノズルとを含む。 The dicing apparatus includes a chuck table for holding a wafer, cutting means for cutting the wafer held by the chuck table, X-axis feeding means for relatively feeding the chuck table and the cutting means in the X-axis direction, and a chuck. Y-axis feeding means for relatively indexing and feeding the table and cutting means in the Y-axis direction; imaging means for imaging the wafer held on the chuck table to detect the area to be cut; and cleaning the cut wafer. It is generally composed of cleaning means and transport means for transporting the wafer from the chuck table to the cleaning means, and can cut the wafer with high accuracy (see, for example, Patent Document 1). The cleaning means of the dicing apparatus includes a rotatable spinner table that holds the wafer, and a cleaning liquid injection nozzle that injects cleaning liquid onto the wafer held on the spinner table.

特開2010-36275号公報JP 2010-36275 A

しかし、ダイシング装置のチャックテーブルの適正な位置に保持されたウエーハを、洗浄手段のスピンナーテーブルの適正な位置まで搬送手段によって搬送することができない場合、スピンナーテーブルの高速回転によってスピンナーテーブルからウエーハが飛散してしまうおそれがある。このため、チャックテーブルからスピンナーテーブルまでの方向および距離を実測して搬送手段の搬送方向および搬送距離を微調整する必要があるが、このような微調整に手間がかかり生産性が悪いという問題がある。 However, if the wafer held at the appropriate position on the chuck table of the dicing machine cannot be transported to the appropriate position on the spinner table of the cleaning means by the transport means, the wafer is scattered from the spinner table due to the high-speed rotation of the spinner table. There is a risk of doing so. Therefore, it is necessary to actually measure the direction and distance from the chuck table to the spinner table and finely adjust the transport direction and transport distance of the transport means. be.

かかる問題は、2個以上のテーブル間でウエーハを搬送する機構を備えた各種処理装置(たとえば、レーザー加工装置、研削装置、検査装置)においても起こり得る。 Such a problem can also occur in various types of processing equipment (for example, laser processing equipment, grinding equipment, inspection equipment) equipped with a mechanism for transporting wafers between two or more tables.

上記事実に鑑みてなされた本発明の課題は、搬送手段の搬送ズレ量を容易に求めることができる搬送ズレ量検出方法を提供することである。 SUMMARY OF THE INVENTION An object of the present invention, which has been devised in view of the above facts, is to provide a method for detecting the amount of deviation in transport that can easily determine the amount of deviation in transport of a transport means.

本発明によれば、上記課題を解決する以下の搬送ズレ量検出方法が提供される。すなわち、回転可能な第1のテーブルと、回転可能な第2のテーブルと、該第1のテーブルから該第2のテーブルまでワークを搬送する搬送手段と、該第1のテーブルに保持されたワークを撮像する撮像手段とを少なくとも備えワークに処理を施す処理装置において、該搬送手段の搬送ズレ量を求める搬送ズレ量検出方法であって、目印が形成されたワークを該第1のテーブルに保持させ該撮像手段で撮像して目印の座標をX1、Y1座標として記憶する第1の座標記憶工程と、該搬送手段によって該第1のテーブルに保持されたワークを該第2のテーブルに搬送して保持させ該第2のテーブルを180度回転させる180度回転工程と、該搬送手段によって該第2のテーブルに保持されたワークを該第1のテーブルに搬送して保持させる戻し工程と、該第1のテーブルを180度回転させてワークを該撮像手段で撮像し、目印の座標をX2、Y2座標として記憶する第2の座標記憶工程と、(X2-X1)/2をX軸方向の搬送ズレ量とし、(Y2-Y1)/2をY軸方向の搬送ズレ量として算出する搬送ズレ量算出工程と、を含む搬送ズレ量検出方法が提供される。 According to the present invention, there is provided the following transport deviation amount detection method for solving the above problems. That is, a rotatable first table, a rotatable second table, conveying means for conveying a work from the first table to the second table, and a work held on the first table. and a processing apparatus for processing a workpiece, the method for detecting a conveyance deviation amount of the conveying means, wherein the workpiece having a mark formed thereon is held on the first table. a first coordinate storing step of capturing an image by the imaging means and storing the coordinates of the mark as X1 and Y1 coordinates; and transporting the workpiece held on the first table to the second table by the transport means. a 180-degree rotation step of rotating the second table by 180 degrees, a return step of conveying the work held on the second table by the conveying means to the first table and holding the work; a second coordinate storing step of rotating the first table by 180 degrees and capturing an image of the workpiece by the imaging means, storing the coordinates of the mark as X2 and Y2 coordinates; A transport deviation amount detection method including a transport deviation amount calculation step of calculating (Y2−Y1)/2 as the transport deviation amount in the Y-axis direction.

好ましくは、(X2-X1)/2と(Y2-Y1)/2とを該搬送手段の移動量に加算して搬送ズレを補正する。 Preferably, (X2-X1)/2 and (Y2-Y1)/2 are added to the movement amount of the conveying means to correct the conveying deviation.

本発明の搬送ズレ量検出方法は、回転可能な第1のテーブルと、回転可能な第2のテーブルと、該第1のテーブルから該第2のテーブルまでワークを搬送する搬送手段と、該第1のテーブルに保持されたワークを撮像する撮像手段とを少なくとも備えワークに処理を施す処理装置において、該搬送手段の搬送ズレ量を求める搬送ズレ量検出方法であって、目印が形成されたワークを該第1のテーブルに保持させ該撮像手段で撮像して目印の座標をX1、Y1座標として記憶する第1の座標記憶工程と、該搬送手段によって該第1のテーブルに保持されたワークを該第2のテーブルに搬送して保持させ該第2のテーブルを180度回転させる180度回転工程と、該搬送手段によって該第2のテーブルに保持されたワークを該第1のテーブルに搬送して保持させる戻し工程と、該第1のテーブルを180度回転させてワークを該撮像手段で撮像し、目印の座標をX2、Y2座標として記憶する第2の座標記憶工程と、(X2-X1)/2をX軸方向の搬送ズレ量とし、(Y2-Y1)/2をY軸方向の搬送ズレ量として算出する搬送ズレ量算出工程と、を含むので、第1のテーブルから第2のテーブルまでの方向および距離を実測する必要がなく、目印の座標のズレから搬送手段の搬送ズレ量を容易に求めることができる。 A conveying deviation amount detection method of the present invention comprises a rotatable first table, a rotatable second table, conveying means for conveying a work from the first table to the second table, and the 1. A conveying displacement amount detection method for obtaining a conveying displacement amount of said conveying means in a processing apparatus having at least an imaging means for picking up an image of a workpiece held on a table and processing the workpiece, the workpiece having a mark formed thereon. is held on the first table, imaged by the imaging means, and the coordinates of the mark are stored as X1 and Y1 coordinates; a 180-degree rotation step of conveying and holding the work to the second table and rotating the second table 180 degrees; and conveying the work held on the second table to the first table by the conveying means. a returning step of rotating the first table by 180 degrees to image the workpiece with the imaging means and storing the coordinates of the mark as X2 and Y2 coordinates; )/2 in the X-axis direction and (Y2-Y1)/2 in the Y-axis direction. It is not necessary to actually measure the direction and distance to the table, and the amount of deviation of the transport means can be easily obtained from the deviation of the coordinates of the mark.

本発明の搬送ズレ量検出方法が実施され得る処理装置の斜視図。FIG. 2 is a perspective view of a processing apparatus in which the method for detecting the amount of deviation in conveyance according to the present invention can be implemented; 目印が形成されたワークの平面図。The top view of the workpiece|work in which the mark was formed. 図1に示す第1・第2のテーブルの模式的平面図。FIG. 2 is a schematic plan view of the first and second tables shown in FIG. 1; 第1の座標記憶工程における第1・第2のテーブルの模式的平面図。FIG. 4 is a schematic plan view of first and second tables in a first coordinate storage step; 搬送手段によって第1のテーブルに保持されたワークを第2のテーブルに搬送して保持させた状態を示す模式的平面図。FIG. 4 is a schematic plan view showing a state in which a workpiece held on the first table is conveyed to and held by a second table by conveying means; 図5に示す状態から第2のテーブルを180度回転させた状態を示す模式的平面図。FIG. 6 is a schematic plan view showing a state in which the second table is rotated 180 degrees from the state shown in FIG. 5; 搬送手段によって第2のテーブルに保持されたワークを第1のテーブルに搬送して保持させた状態を示す模式的平面図。FIG. 4 is a schematic plan view showing a state in which a workpiece held on a second table is conveyed to and held by a first table by conveying means; 図7に示す状態から第1のテーブルを180度回転させた状態を示す模式的平面図。FIG. 8 is a schematic plan view showing a state in which the first table is rotated 180 degrees from the state shown in FIG. 7;

以下、本発明の搬送ズレ量検出方法の好適実施形態について図面を参照しつつ説明する。 Preferred embodiments of the method for detecting the amount of conveyance deviation of the present invention will be described below with reference to the drawings.

まず、本発明の搬送ズレ量検出方法が実施され得る処理装置から説明する。図1に示す処理装置2は、回転可能な第1のテーブル4と、回転可能な第2のテーブル6と、第1のテーブル4から第2のテーブル6までワークを搬送する搬送手段8と、第1のテーブル4に保持されたワークを撮像する撮像手段10とを少なくとも備える。 First, a processing apparatus in which the method for detecting the amount of deviation in conveyance of the present invention can be implemented will be described. The processing apparatus 2 shown in FIG. 1 includes a rotatable first table 4, a rotatable second table 6, a conveying means 8 for conveying a workpiece from the first table 4 to the second table 6, At least an imaging means 10 for imaging the work held on the first table 4 is provided.

円形の第1のテーブル4は、図1に矢印Xで示すX軸方向にX軸搬送手段(図示していない。)によって搬送されると共に、第1のテーブル4の中心C1(図3参照。)を軸心として第1のテーブル用モータ(図示していない。)によって回転されるようになっている。X軸搬送手段は、たとえば、第1のテーブル4に連結されX軸方向に延びるボールねじと、このボールねじを回転させるモータとを有する構成でよい。なお、図1に矢印Yで示すY軸方向はX軸方向に直交する方向であり、X軸方向およびY軸方向が規定するXY平面は実質上水平である。 The circular first table 4 is conveyed by X-axis conveying means (not shown) in the X-axis direction indicated by arrow X in FIG. ) as an axis center by a first table motor (not shown). The X-axis conveying means may have, for example, a ball screw that is connected to the first table 4 and extends in the X-axis direction, and a motor that rotates the ball screw. Note that the Y-axis direction indicated by arrow Y in FIG. 1 is a direction orthogonal to the X-axis direction, and the XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

図1に示すとおり、第1のテーブル4の上端部分には、吸引手段(図示していない。)に接続された多孔質の円形状吸着チャック4aが配置されている。そして、第1のテーブル4は、吸引手段で吸着チャック4aに吸引力を生成することにより、円板状の半導体ウエーハ等のワークW(図2参照。)を吸引保持するようになっている。なお、図示の実施形態の処理装置2は、ワークWに対して切削加工を施すダイシング装置であり、第1のテーブル4は、ワークWに対して切削加工を施す際にワークWを吸引保持する。 As shown in FIG. 1, a porous circular suction chuck 4a connected to suction means (not shown) is arranged on the upper end of the first table 4. As shown in FIG. The first table 4 sucks and holds a workpiece W (see FIG. 2) such as a disk-shaped semiconductor wafer by generating a suction force on the suction chuck 4a with suction means. The processing device 2 of the illustrated embodiment is a dicing device that cuts the work W, and the first table 4 sucks and holds the work W when cutting the work W. .

図示の実施形態の第2のテーブル6は、切削加工が施され切削屑が付着しているワークWを洗浄する際に、ワークWを吸引保持するスピンナーテーブルである。円形の第2のテーブル6は、第2のテーブル6の中心C2(図3参照。)を軸心として第2のテーブル用モータ(図示していない。)によって回転されるようになっている。 The second table 6 of the illustrated embodiment is a spinner table that sucks and holds the work W when the work W that has been subjected to cutting processing and has cutting chips adhering thereto is cleaned. The circular second table 6 is rotated around the center C2 (see FIG. 3) of the second table 6 by a second table motor (not shown).

図1に示すとおり、第2のテーブル6の上端部分には、第1のテーブル4と同様に、吸引手段(図示していない。)に接続された多孔質の円形状吸着チャック6aが配置されている。そして、第2のテーブル6においても、吸引手段で吸着チャック6aに吸引力を生成することにより、ワークWを吸引保持する。また、ワークWを吸引保持した第2のテーブル6を回転させながら、洗浄液噴射ノズル(図示していない。)からワークWに対して洗浄液を噴射することにより、ワークWを洗浄することができる。 As shown in FIG. 1, on the upper end of the second table 6, similarly to the first table 4, a porous circular suction chuck 6a connected to suction means (not shown) is arranged. ing. Also in the second table 6, the workpiece W is sucked and held by generating a suction force on the suction chuck 6a by the suction means. Further, the work W can be cleaned by injecting the cleaning liquid from a cleaning liquid injection nozzle (not shown) to the work W while rotating the second table 6 holding the work W by suction.

図示の実施形態の搬送手段8は、第1のテーブル4に保持されたワークWをX軸方向に搬送する上記X軸搬送手段と、第1のテーブル4に保持されたワークWを保持して昇降させると共にY軸方向に搬送するY軸搬送手段11とを含む。 The conveying means 8 of the illustrated embodiment includes the X-axis conveying means for conveying the work W held on the first table 4 in the X-axis direction, and the work W held on the first table 4. and a Y-axis transport means 11 for lifting and transporting in the Y-axis direction.

Y軸搬送手段11は、Y軸方向に移動自在なアーム12と、アーム12をY軸方向に移動させるアーム移動手段(図示していない。)と、アーム12の先端下面に装着されたブラケット片14と、ブラケット片14の下面に固定されたH形状のプレート16と、プレート16の下面に配置された複数の吸引パッド18とを含む。アーム移動手段は、たとえば、アーム12に連結されY軸方向に延びるボールねじと、このボールねじを回転させるモータとを有する構成でよい。ブラケット片14は、エアシリンダ等の適宜のアクチュエータによって上下方向に伸縮自在に構成されている。また、各吸引パッド18は、吸引手段(図示していない。)に接続されている。 The Y-axis conveying means 11 includes an arm 12 movable in the Y-axis direction, an arm moving means (not shown) for moving the arm 12 in the Y-axis direction, and a bracket piece attached to the lower surface of the tip of the arm 12. 14 , an H-shaped plate 16 fixed to the lower surface of the bracket piece 14 , and a plurality of suction pads 18 arranged on the lower surface of the plate 16 . The arm moving means may have, for example, a ball screw connected to the arm 12 and extending in the Y-axis direction, and a motor for rotating the ball screw. The bracket piece 14 is vertically extendable by an appropriate actuator such as an air cylinder. Each suction pad 18 is also connected to suction means (not shown).

搬送手段8においては、X軸搬送手段で所定の搬送開始位置に第1のテーブル4を位置づけた後、Y軸搬送手段11の吸引パッド18で第1のテーブル4上のワークWを吸引保持して、第1のテーブル4からワークWを受け取る。そして、ワークWを受け取ったY軸搬送手段11は、アーム12およびブラケット片14を移動させて、第1のテーブル4から第2のテーブル6にワークWを搬送するようになっている。 In the transport means 8, after the first table 4 is positioned at a predetermined transport start position by the X-axis transport means, the suction pad 18 of the Y-axis transport means 11 sucks and holds the work W on the first table 4. to receive the workpiece W from the first table 4 . After receiving the work W, the Y-axis transfer means 11 moves the arm 12 and the bracket piece 14 to transfer the work W from the first table 4 to the second table 6 .

撮像手段10は、X軸搬送手段によって所定の撮像位置に位置づけられた第1のテーブル4上のワークWを撮像するようになっている。この撮像手段10によって撮像された画像データは、処理装置2の制御手段(図示していない。)に送られる。 The imaging means 10 is adapted to image the work W on the first table 4 positioned at a predetermined imaging position by the X-axis conveying means. Image data captured by the imaging means 10 is sent to control means (not shown) of the processing device 2 .

コンピュータから構成される制御手段は、制御プログラムに従って演算処理する中央処理装置(CPU)と、制御プログラム等を格納するリードオンリメモリ(ROM)と、演算結果等を格納する読み書き可能なランダムアクセスメモリ(RAM)とを含む。そして、制御手段においては、撮像手段10から送られた画像データに対して画像解析を実行するようになっており、たとえば、ワークWに形成された目印M(図2参照。)のX座標およびY座標を取得して記憶する。また、制御手段は、処理装置2の作動を制御するようになっており、一例としては、あらかじめ制御手段に入力された条件に応じて搬送手段8の移動量を制御する。 The control means composed of a computer includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores control programs and the like, and a readable and writable random access memory that stores arithmetic results and the like ( RAM). The control means executes image analysis on the image data sent from the imaging means 10. For example, the X coordinate and the X coordinate of the mark M (see FIG. 2) formed on the work W Get and store the Y coordinate. Further, the control means controls the operation of the processing device 2, and as an example, controls the amount of movement of the conveying means 8 in accordance with conditions input in advance to the control means.

図1に示すとおり、処理装置2は、さらに、第1のテーブル4に保持されたワークWを切削する切削手段20と、複数のワークWを収容したカセット22が置かれる昇降自在なカセット台24と、カセット22から加工前のワークWを引き出し、仮置きテーブル26まで搬出すると共に仮置きテーブル26に位置づけられた加工済みのワークWをカセット22に搬入する搬出入手段28と、カセット22から仮置きテーブル26に搬出された加工前のワークWを第1のテーブル4に移動させる移動手段30とを備える。 As shown in FIG. 1, the processing apparatus 2 further includes a cutting means 20 for cutting the workpiece W held on the first table 4, and a vertically movable cassette table 24 on which a cassette 22 containing a plurality of workpieces W is placed. a loading/unloading means 28 that pulls out the pre-processed work W from the cassette 22, carries it out to the temporary placement table 26, and loads the processed work W positioned on the temporary placement table 26 into the cassette 22; A moving means 30 for moving the unprocessed work W carried out to the placing table 26 to the first table 4 is provided.

次に、上述の処理装置2において、搬送手段8の搬送ズレ量を求める搬送ズレ量検出方法を説明する。図示の実施形態では、まず、目印Mが形成されたワークWを第1のテーブル4に保持させ撮像手段10で撮像して目印Mの座標をX1、Y1座標として記憶する第1の座標記憶工程を実施する。 Next, a method for detecting the amount of conveyance deviation of the conveying means 8 in the processing apparatus 2 described above will be described. In the illustrated embodiment, first, a first coordinate storing step is performed in which the workpiece W on which the mark M is formed is held on the first table 4, is imaged by the imaging means 10, and the coordinates of the mark M are stored as X1 and Y1 coordinates. to implement.

第1の座標記憶工程では、まず、目印Mが形成された面を上に向けた状態で、第1のテーブル4にワークWを載せる。次いで、X軸搬送手段によって第1のテーブル4を移動させ、所定の撮像位置に第1のテーブル4を位置づけ、第1のテーブル4に保持されたワークWを撮像手段10で撮像する。そして、撮像手段10で撮像した画像に対して制御手段によって画像解析を実行し、目印Mの座標をX1、Y1座標として取得して記憶する(図4参照。)。 In the first coordinate storage step, first, the workpiece W is placed on the first table 4 with the surface on which the mark M is formed facing upward. Next, the first table 4 is moved by the X-axis conveying means, the first table 4 is positioned at a predetermined imaging position, and the workpiece W held on the first table 4 is imaged by the imaging means 10 . Then, image analysis is performed by the control means on the image captured by the imaging means 10, and the coordinates of the mark M are obtained and stored as X1 and Y1 coordinates (see FIG. 4).

第1の座標記憶工程を実施した後、搬送手段8によって第1のテーブル4に保持されたワークWを第2のテーブル6に搬送して保持させ第2のテーブル6を180度回転させる180度回転工程を実施する。 After carrying out the first coordinate storing step, the work W held on the first table 4 is carried by the carrying means 8 to the second table 6 and held there, and the second table 6 is rotated 180 degrees. A rotation process is performed.

180度回転工程では、まず、X軸搬送手段によって第1のテーブル4を移動させ、所定の搬送開始位置に第1のテーブル4を位置づける。第1のテーブル4を搬送開始位置に位置づけたら、Y軸搬送手段11のアーム12およびブラケット片14を作動させ、吸引パッド18を第1のテーブル4上のワークWの上面に密着させる。次いで、各吸引パッド18でワークWを吸引保持すると共に、第1のテーブル4の吸引力を解除する。 In the 180-degree rotation step, the first table 4 is first moved by the X-axis transport means and positioned at a predetermined transport start position. After positioning the first table 4 at the transfer start position, the arm 12 and the bracket piece 14 of the Y-axis transfer means 11 are operated to bring the suction pad 18 into close contact with the upper surface of the work W on the first table 4 . Next, each suction pad 18 sucks and holds the work W, and the suction force of the first table 4 is released.

次いで、Y軸搬送手段11のアーム12およびブラケット片14を作動させることにより、第1のテーブル4から第2のテーブル6にワークWを搬送し、ワークWの下面を第2のテーブル6の上面に接触させる。次いで、第2のテーブル6によってワークWを吸引保持すると共に、吸引パッド18の吸引力を解除する。このようにして、Y軸搬送手段11から第2のテーブル6にワークWを受け渡す(図5参照。)。そして、第2のテーブル6にワークWを受け渡したら、第2のテーブル用モータを作動させ、図6に示すとおり、ワークWを吸引保持した第2のテーブル6を180度回転させる。 Next, by operating the arm 12 and the bracket piece 14 of the Y-axis transfer means 11 , the work W is transferred from the first table 4 to the second table 6 , and the lower surface of the work W is transferred to the upper surface of the second table 6 . come into contact with Next, the workpiece W is held by suction by the second table 6, and the suction force of the suction pad 18 is released. In this way, the work W is transferred from the Y-axis transfer means 11 to the second table 6 (see FIG. 5). After transferring the work W to the second table 6, the second table motor is operated to rotate the second table 6 sucking and holding the work W by 180 degrees as shown in FIG.

180度回転工程を実施した後、搬送手段8によって第2のテーブル6に保持されたワークWを第1のテーブル4に搬送して保持させる戻し工程を実施する。 After performing the 180-degree rotation step, the return step of transporting the work W held on the second table 6 by the transport means 8 to the first table 4 and holding it there is performed.

戻し工程では、まず、Y軸搬送手段11の吸引パッド18を第2のテーブル6上のワークWの上面に密着させ、各吸引パッド18でワークWを吸引保持すると共に、第2のテーブル6の吸引力を解除する。次いで、アーム12およびブラケット片14を作動させることにより、第2のテーブル6から第1のテーブル4にワークWを搬送し、ワークWの下面を第1のテーブル4の上面に接触させる。そして、図7に示すとおり、第1のテーブル4によってワークWを吸引保持すると共に、吸引パッド18の吸引力を解除する。このようにして、第2のテーブル6から第1のテーブル4にワークWを戻す。 In the return process, first, the suction pads 18 of the Y-axis conveying means 11 are brought into close contact with the upper surface of the work W on the second table 6 , and the work W is held by suction with each suction pad 18 . release the attraction. Next, by operating the arm 12 and the bracket piece 14 , the workpiece W is conveyed from the second table 6 to the first table 4 and the lower surface of the workpiece W is brought into contact with the upper surface of the first table 4 . Then, as shown in FIG. 7, the workpiece W is held by suction by the first table 4, and the suction force of the suction pad 18 is released. Thus, the work W is returned from the second table 6 to the first table 4.例文帳に追加

戻し工程を実施した後、第1のテーブル4を180度回転させてワークWを撮像手段10で撮像し、目印Mの座標をX2、Y2座標として記憶する第2の座標記憶工程を実施する。 After the return process is performed, the first table 4 is rotated 180 degrees, the image of the workpiece W is imaged by the imaging means 10, and the coordinates of the mark M are stored as X2 and Y2 coordinates in the second coordinate storage process.

第2の座標記憶工程では、まず、図8に示すとおり、第1のテーブル用モータを作動させ、ワークWを吸引保持した第1のテーブル4を180度回転させる。次いで、X軸搬送手段によって第1のテーブル4を移動させ、所定の撮像位置に第1のテーブル4を位置づけ、第1のテーブル4に保持されたワークWを撮像手段10で撮像する。そして、撮像手段10で撮像した画像に対して制御手段によって画像解析を実行し、目印Mの座標をX2、Y2座標として取得して記憶する(図8参照。)。 In the second coordinate storage step, first, as shown in FIG. 8, the first table motor is operated to rotate the first table 4 sucking and holding the workpiece W by 180 degrees. Next, the first table 4 is moved by the X-axis conveying means, the first table 4 is positioned at a predetermined imaging position, and the workpiece W held on the first table 4 is imaged by the imaging means 10 . Then, image analysis is performed by the control means on the image captured by the imaging means 10, and the coordinates of the mark M are obtained and stored as X2 and Y2 coordinates (see FIG. 8).

第2の座標記憶工程を実施した後、(X2-X1)/2をX軸方向の搬送ズレ量とし、(Y2-Y1)/2をY軸方向の搬送ズレ量として算出する搬送ズレ量算出工程を実施する。図示の実施形態では、搬送ズレ量の算出は制御手段によって行う。 After performing the second coordinate storage step, (X2-X1)/2 is the amount of transport deviation in the X-axis direction, and (Y2-Y1)/2 is the amount of transport deviation in the Y-axis direction. Carry out the process. In the illustrated embodiment, the calculation of the transport deviation amount is performed by the control means.

図示の実施形態では、上述のとおり、第1のテーブル4から第2にテーブル6に搬送したワークWを第2のテーブル6において180度回転させると共に、第2のテーブル6から第1のテーブル4に搬送した(戻した)ワークWを第1のテーブル4において180度回転させているので、搬送手段8による搬送ズレがある場合には、搬送前の目印Mの座標(X1、Y1)と搬送後の目印Mの座標(X2、Y2)との距離が、搬送手段8の搬送ズレ量の2倍となる。このため、(X2-X1)/2および(Y2-Y1)/2の演算を実行することにより、X軸方向およびY軸方向のそれぞれの搬送ズレ量を求めることができる。なお、搬送手段8による搬送ズレがない場合には、搬送前の目印Mの座標(X1、Y1)と搬送後の目印Mの座標(X2、Y2)とが一致する。 In the illustrated embodiment, as described above, the workpiece W conveyed from the first table 4 to the second table 6 is rotated by 180 degrees on the second table 6, and is transferred from the second table 6 to the first table 4. Since the work W conveyed (returned) to the first table 4 is rotated 180 degrees on the first table 4, if there is a conveyance deviation due to the conveyance means 8, the coordinates (X1, Y1) of the mark M before conveyance and the conveyance The distance from the coordinates (X2, Y2) of the subsequent mark M is twice the amount of displacement of the conveying means 8 . Therefore, by executing the calculations of (X2-X1)/2 and (Y2-Y1)/2, it is possible to obtain the amounts of transport deviation in the X-axis direction and the Y-axis direction. If there is no transport deviation by the transport means 8, the coordinates (X1, Y1) of the mark M before transport and the coordinates (X2, Y2) of the mark M after transport match.

搬送ズレ量算出工程を実施した後は、(X2-X1)/2と(Y2-Y1)/2とを搬送手段8の移動量に加算して搬送ズレを補正するのが好ましい。図示の実施形態においては、第1のテーブル4から第2のテーブル6にワークWを搬送する際、X軸搬送手段がワークWをX軸方向に搬送し、Y軸搬送手段11がワークWをY軸方向および上下方向に搬送することから、X軸方向の搬送ズレ量をX軸搬送手段の移動量に加算し、Y軸方向の搬送ズレ量をY軸搬送手段11の移動量に加算する。これによって、第1のテーブル4から第2のテーブル6にワークWを搬送した際に搬送ズレが発生するのを防止することができ、第2のテーブル6の適正な位置にワークWを載せることができる。 It is preferable to add (X2-X1)/2 and (Y2-Y1)/2 to the amount of movement of the transport means 8 to correct the transport deviation after performing the transport deviation calculation step. In the illustrated embodiment, when the work W is transported from the first table 4 to the second table 6, the X-axis transport means transports the work W in the X-axis direction, and the Y-axis transport means 11 transports the work W. Since the sheet is conveyed in the Y-axis direction and the vertical direction, the amount of conveyance deviation in the X-axis direction is added to the amount of movement of the X-axis conveyance means, and the amount of conveyance deviation in the Y-axis direction is added to the amount of movement of the Y-axis conveyance means 11. . As a result, the work W can be prevented from being displaced when the work W is transferred from the first table 4 to the second table 6, and the work W can be placed at an appropriate position on the second table 6. can be done.

以上のとおりであり、図示の実施形態においては、目印Mが形成されたワークWを第1のテーブル4に保持させ撮像手段10で撮像して目印Mの座標をX1、Y1座標として記憶する第1の座標記憶工程と、搬送手段8によって第1のテーブル4に保持されたワークWを第2のテーブル6に搬送して保持させ第2のテーブル6を180度回転させる180度回転工程と、搬送手段8によって第2のテーブル6に保持されたワークWを第1のテーブル4に搬送して保持させる戻し工程と、第1のテーブル4を180度回転させてワークWを撮像手段10で撮像し、目印Mの座標をX2、Y2座標として記憶する第2の座標記憶工程と、(X2-X1)/2をX軸方向の搬送ズレ量とし、(Y2-Y1)/2をY軸方向の搬送ズレ量として算出する搬送ズレ量算出工程とを含むので、搬送手段8の搬送ズレ量を容易に求めることができる。 As described above, in the illustrated embodiment, the workpiece W on which the mark M is formed is held on the first table 4 and imaged by the imaging means 10, and the coordinates of the mark M are stored as the X1 and Y1 coordinates. 1 coordinate storage step, a 180-degree rotation step in which the workpiece W held on the first table 4 is conveyed to and held by the second table 6 by the conveying means 8, and the second table 6 is rotated 180 degrees; A returning process of conveying the workpiece W held on the second table 6 by the conveying means 8 to the first table 4 and holding it there, and rotating the first table 4 by 180 degrees and imaging the workpiece W with the imaging means 10. a second coordinate storage step of storing the coordinates of the mark M as X2 and Y2 coordinates; , the amount of conveyance deviation of the conveying means 8 can be easily obtained.

なお、X軸方向およびY軸方向の搬送ズレ量については、図示の実施形態とは反対に(X1-X2)/2、(Y1-Y2)/2としてもよい。X1とX2の差の半分、およびY1とY2の差の半分が搬送ズレ量であり、算出された数値の符号が正(プラス)であるか、あるいは負(マイナス)であるかは、搬送ズレが生じている方向を示すものだからである。 Contrary to the illustrated embodiment, the amounts of transport deviation in the X-axis direction and the Y-axis direction may be (X1-X2)/2 and (Y1-Y2)/2. A half of the difference between X1 and X2 and a half of the difference between Y1 and Y2 are the amount of misalignment. This is because it indicates the direction in which the

また、図示の実施形態では、ワークWに切削加工を施すダイシング装置として処理装置2が構成されている例を説明したが、本発明は、2個以上のテーブル間で半導体ウエーハ等のワークを搬送する搬送手段を備えるものであればよく、ワークにレーザー加工を施すレーザー加工装置、ワークに研削加工を施す研削装置、ワークを検査する検査装置を含む各種の処理装置に置いて実施され得る。 Further, in the illustrated embodiment, an example in which the processing device 2 is configured as a dicing device for cutting the work W has been described. It can be carried out by placing it in various processing devices including a laser processing device that performs laser processing on the work, a grinding device that performs grinding processing on the work, and an inspection device that inspects the work.

2:処理装置
4:第1のテーブル
6:第2のテーブル
8:搬送手段
10:撮像手段
W:ワーク
2: Processing device 4: First table 6: Second table 8: Conveying means 10: Imaging means W: Work

Claims (2)

回転可能な第1のテーブルと、回転可能な第2のテーブルと、該第1のテーブルから該第2のテーブルまでワークを搬送する搬送手段と、該第1のテーブルに保持されたワークを撮像する撮像手段とを少なくとも備えワークに処理を施す処理装置において、該搬送手段の搬送ズレ量を求める搬送ズレ量検出方法であって、
目印が形成されたワークを該第1のテーブルに保持させ該撮像手段で撮像して目印の座標をX1、Y1座標として記憶する第1の座標記憶工程と、
該搬送手段によって該第1のテーブルに保持されたワークを該第2のテーブルに搬送して保持させ該第2のテーブルを180度回転させる180度回転工程と、
該搬送手段によって該第2のテーブルに保持されたワークを該第1のテーブルに搬送して保持させる戻し工程と、
該第1のテーブルを180度回転させてワークを該撮像手段で撮像し、目印の座標をX2、Y2座標として記憶する第2の座標記憶工程と、
(X2-X1)/2をX軸方向の搬送ズレ量とし、(Y2-Y1)/2をY軸方向の搬送ズレ量として算出する搬送ズレ量算出工程と、
を含む搬送ズレ量検出方法。
A rotatable first table, a rotatable second table, conveying means for conveying a work from the first table to the second table, and an image of the work held on the first table A conveying deviation amount detection method for obtaining a conveying deviation amount of said conveying means in a processing apparatus for processing a workpiece, comprising at least an imaging means for
a first coordinate storing step of holding the work on which the mark is formed on the first table, imaging the work with the imaging means, and storing the coordinates of the mark as X1 and Y1 coordinates;
a 180-degree rotation step of conveying and holding the workpiece held on the first table by the conveying means to the second table and rotating the second table by 180 degrees;
a return step of conveying the workpiece held on the second table by the conveying means to the first table and holding the work;
a second coordinate storing step of rotating the first table by 180 degrees and capturing an image of the workpiece with the imaging means, and storing the coordinates of the mark as X2 and Y2 coordinates;
a transport deviation amount calculation step of calculating (X2-X1)/2 as the transport deviation amount in the X-axis direction and (Y2-Y1)/2 as the transport deviation amount in the Y-axis direction;
A conveying deviation amount detection method including.
(X2-X1)/2と(Y2-Y1)/2とを該搬送手段の移動量に加算して搬送ズレを補正する請求項1記載の搬送ズレ量検出方法。 2. The method of detecting a conveying deviation amount according to claim 1, wherein (X2-X1)/2 and (Y2-Y1)/2 are added to the moving amount of said conveying means to correct the conveying deviation.
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TW111110550A TW202240750A (en) 2021-04-07 2022-03-22 Transport deviation amount detection method capable of easily obtaining the transport deviation amount of a transport unit
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