TWI741500B - Substrate processing apparatus and method of transporting object to be processed in substrate processing apparatus - Google Patents

Abstract

The present invention memorizes the position information indicating the transfer destination of the substrate and the positions of a plurality of transfer sources in the hand control part. For each of the plurality of transfer sources, the correction information related to the transfer of the substrate to the transfer destination is memorized in the hand control section. The correction information is used to offset the deviation between the target position and the actual arrival position of the substrate when the substrate is assumed to be transferred from each transfer source to the transfer destination based on the position information. When the substrate is transferred from one transfer source to the transfer destination, the substrate is transferred to the target location of the transfer destination based on the correction information corresponding to one transfer source and the location information of the transfer destination.

Description

Substrate processing apparatus and method for conveying objects in the substrate processing apparatus

The present invention relates to a substrate processing apparatus that performs predetermined processing on a substrate and a method for conveying an object in the substrate processing apparatus.

In the past, in order to provide substrates for FPD (Flat Panel Display) used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, Various substrates such as magneto-optical disk substrates, photomask substrates, ceramic substrates, and solar cell substrates are subjected to various treatments, and substrate processing equipment is used.

In the substrate processing apparatus, for example, one substrate is continuously processed in a plurality of processing units. Therefore, in the substrate processing apparatus, a conveying device for conveying the substrate between a plurality of processing units is provided.

In the substrate processing apparatus described in Patent Document 1, when the transfer robot transfers the substrate, the transfer robot is controlled so that the direction of the final rotation motion of the arm holding the substrate becomes a predetermined fixed direction. Thereby, the decrease in positioning accuracy can be suppressed.

[Patent Document 1] Japanese Patent Laid-Open No. 2017-92246

[The problem to be solved by the invention]

When an object such as a substrate is to be transported from any one of a plurality of transport sources in the substrate processing apparatus to a desired transport destination, it is ideal to reduce the arrival position of the object at the transport destination by simple control Offset in the earth.

The object of the present invention is to provide a substrate processing apparatus and a method of transporting an object in the substrate processing apparatus that can transport an object simply and accurately. [Technical means to solve the problem]

(1) The substrate processing apparatus of one aspect of the present invention is a substrate processing device that performs prescribed processing on substrates, and includes: a conveying device that transfers objects related to processing from any one of a plurality of conveying sources to a conveying destination Target position conveyance; a memory unit that memorizes conveyance control information for each of the plural conveyance sources. The conveyance control information is used to offset the assumption that the object is transferred from the plural conveyance sources to each of the plural conveyance sources based on the target information representing the target position. The deviation between the target position and the actual arrival position of the object caused by the situation of the transfer destination; and the control unit, when the object is transferred from one of the multiple transfer sources to the transfer destination, the control unit uses The conveying device is controlled in a manner that, based on the conveying control information corresponding to one conveying source among the plural conveying control information memorized in the storage unit, the object is conveyed from one conveying source to the target position of the conveying destination.

In this substrate processing apparatus, the transport control information is stored in the memory unit for each of the plurality of transport sources. When transporting the object from one transport source to the transport destination, the object is transported from one transport source to the destination location of the transport destination based on the transport control information corresponding to one transport source stored in the memory.

In this case, based on the target information indicating the target position of the transfer destination, the target position and the target object are generated when the target is transferred from each of the multiple transfer sources to the transfer destination by the transfer device. The deviation of the actual arrival position is offset. Thereby, the actual arrival position of the object when the object is transported from each of the plurality of transport sources to the transport destination based on the transport control information coincides with the target position. Therefore, objects related to substrate processing can be transported simply and with high accuracy.

(2) It is also possible that the object is a substrate, the plurality of transfer sources are a plurality of first support parts that support the substrate, and the transfer destination is a second support part that supports the substrate.

In this case, the substrate can be transported from any one of the plurality of first supporting parts to the second supporting part with high accuracy.

(3) The second support part may be configured to be able to hold the substrate in a horizontal posture and to be able to rotate.

In this case, various processes can be performed on the substrate rotated by the second support portion with high accuracy.

(4) The substrate processing apparatus may further include: a holding part configured to hold and rotate the substrate in a horizontal posture; a plurality of nozzles, etc., to supply a predetermined processing liquid to the substrate held by the holding part; and A plurality of nozzle accommodating parts, which are configured to be capable of accommodating a plurality of nozzles; and the object is any one of a plurality of nozzles, the plural conveying sources are plural nozzle accommodating parts, and the conveying destination is the substrate held by the holding part The position above.

In this case, the nozzle accommodated in any one of the plurality of nozzle accommodating parts can be transported to a position above the substrate held by the holding part with high accuracy. Thereby, the processing liquid can be supplied with high precision to the substrate rotated by the holding portion.

(5) It can also be that each of the plural conveying control information is the correction information of the target information corresponding to the offset. When the object is conveyed from one of the plural conveying sources to the conveying destination, the control unit is as follows The method controls the conveying device, that is, correcting the target information of the conveying destination based on the correction information corresponding to a conveying source stored in the memory unit, and moving the object from a conveying source to a conveying destination based on the corrected target information To the target location. In this case, the object can be transported easily and with high accuracy based on the correction information.

(6) It is also possible that each of the plurality of transport control information is new target information obtained based on the offset correction target information. When the object is transported from one of the plurality of transport sources to the transport destination, the control unit The conveying device is controlled in such a way that the object is conveyed from a conveying source to a target position of a conveying destination based on the new target information corresponding to a conveying source stored in the memory unit. In this case, based on the new target information, the object can be transported easily and with high accuracy.

(7) A method of transporting objects in a substrate processing apparatus of another aspect of the present invention is a method of transporting objects related to processing in a substrate processing apparatus that performs predetermined processing on substrates, and includes the following steps: Each of the plurality of transfer sources stores the transfer control information in the memory portion, and the transfer control information is used to offset the target information assumed to be based on the target position indicating the transfer destination, and the object is transferred from the plurality of transfer sources by the transfer device The deviation between the target position and the actual arrival position of the object when each person is transported to the transfer destination; and when the object is transferred from one of the multiple transfer sources to the transfer destination, the following method The conveying device performs control, that is, based on the conveying control information corresponding to one conveying source among the plural conveying control information memorized in the memory unit, the object is conveyed from one conveying source to the target position of the conveying destination.

In the method of conveying an object in the substrate processing apparatus, the conveying control information is memorized in the memory unit for each of the plural conveying sources. When the object is transferred from one transfer source to the transfer destination, the object is transferred from one transfer source to the target position of the transfer destination based on the transfer control information corresponding to one transfer source stored in the storage unit.

In this case, based on the target information indicating the target position of the transfer destination, the target position and the target object are generated when the target is transferred from each of the multiple transfer sources to the transfer destination by the transfer device. The deviation of the actual arrival position is offset. Thereby, the actual arrival position of the object when the object is transported from each of the plurality of transport sources to the transport destination based on the transport control information coincides with the target position. Therefore, objects related to substrate processing can be transported simply and with high accuracy.

(8) It can also be that each of the plural conveying control information is the correction information of the target information corresponding to the offset, and the step of controlling the conveying device is the conveying of the object from one of the plural conveying sources to the conveying source When the destination is transported, the transport device is controlled in the following way, that is, the target information of the transport destination is corrected based on the correction information corresponding to a transfer source stored in the memory unit, and the target information is changed based on the corrected target information. Transport from a transport source to the destination of the transport destination. In this case, the object can be transported easily and with high accuracy based on the correction information.

(9) It is also possible that each of the plural conveying control information is new target information obtained based on the offset correction target information, and the step of controlling the conveying device is from one of the plural conveying sources to the conveying destination When the object is transported locally, the transport device is controlled in such a way that the object is transported from one transport source to the destination location of the transport destination based on the new destination information corresponding to one transport source stored in the memory. In this case, based on the new target information, the object can be transported easily and with high accuracy. [Effects of Invention]

According to the present invention, objects related to processing in a substrate processing apparatus can be transported simply and accurately.

Hereinafter, a substrate processing apparatus and a method of conveying an object in the substrate processing apparatus according to an embodiment of the present invention will be described using drawings. In the following description, the substrate refers to the FPD (Flat Panel Display) substrate, semiconductor substrate, optical disk substrate, magnetic disk substrate, magneto-optical disk used in liquid crystal display devices or organic EL (Electro Luminescence) display devices. Substrates, substrates for photomasks, ceramic substrates, substrates for solar cells, etc.

[1] Structure and operation of substrate processing equipment FIG. 1 is a schematic plan view of a substrate processing apparatus 100 according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus 100 includes two blocks B1 and B2. As shown by the arrow in FIG. 1, regarding the substrate processing apparatus 100, an XY coordinate system with an X axis and a Y axis is defined. In this example, the X axis and Y axis are orthogonal to each other in the horizontal plane. The blocks B1 and B2 are arranged adjacent to each other in the Y-axis direction.

The block B1 includes the carry-in and carry-out unit 110. In the carry-in and carry-out section 110, a plurality of carrier placing sections, transfer devices, and control devices (not shown) are provided. The transfer device provided in the carry-in and carry-out portion 110 is between the plurality of carriers placed on the plurality of carrier placing portions and the following substrate transport device 200 installed in the block B2 to perform the transfer of the substrate W. In addition, the control device provided in the carry-in and carry-out unit 110 controls the operation of each unit provided in the substrate processing apparatus 100.

The block B2 includes a coating processing unit 120, a heat treatment unit 130, and a conveying unit 140. The coating processing part 120 and the heat treatment part 130 are provided so as to face each other with the conveying part 140 interposed therebetween in the X-axis direction.

The coating processing unit 120 includes a plurality of (three in this example) rotating chucks D1, D2, D3, a plurality of (three in this example) cups cp, and a liquid supply device 300. The rotating chucks D1, D2, D3 are arranged in the Y direction. Each of the rotating chucks D1, D2, and D3 is configured to suck and hold the center of the lower surface of the substrate W, and to rotate the sucked substrate W in a horizontal posture. A plurality of cups cp are arranged to surround the rotating chucks D1, D2, and D3, respectively. In the substrate processing apparatus 100, the coordinates (the coordinates of the XY coordinate system) representing the positions p1, p2, and p3 of the rotation centers of the rotary chucks D1 to D3 are predetermined as position information.

The liquid supply device 300 includes a plurality of nozzles nz, the nozzle transport device 10 and the nozzle control unit 390. Based on the control of the nozzle control unit 390, the nozzle conveying device 10 conveys one nozzle nz of a plurality of nozzles nz to a position above the substrate W rotated by any one of the rotary chucks D1 to D3. In this state, the resist liquid is supplied to the substrate W from one nozzle nz. Thereby, a resist film is formed on the upper surface of the untreated substrate W (coating treatment). The resist liquid supplied to the substrate W is received by the cup cp and then recovered.

The heat treatment unit 130 includes a plurality of (4 in this example) heat treatment units TU1 to TU4. A plurality of heat treatment units TU1 to TU4 are arranged in an arrangement in the Y-axis direction. Each of the heat treatment units TU1 to TU4 heats the substrate W that has been coated in the coating treatment section 120 before and after the coating treatment. In addition, each of the heat treatment units TU1 to TU4 has support parts S1 to S4, and the support parts S1 to S4 are used to receive the substrate W before the heat treatment from the substrate transport device 200 described below, and deliver the heat treatment substrate W to the substrate Conveying device 200. Regarding the substrate processing apparatus 100, the coordinates (the coordinates of the XY coordinate system) indicating the positions p11, p12, p13, and p14 of the centers of the support parts S1, S2, S3, and S4 are predetermined as position information.

The transport unit 140 includes a substrate transport device 200 and a hand control unit 290. The substrate transfer device 200 has a moving member 210 and hands h1 and h2. The moving member 210 is configured to be able to rise and fall, to be movable in a horizontal plane, and to be able to rotate in a horizontal plane. In addition, each of the hands h1 and h2 is configured to be able to suck and hold the substrate W, and to be supported so as to advance and retreat from the moving member 210. The substrate conveying device 200 further has a plurality of driving mechanisms not shown. The hand control unit 290 controls each drive mechanism. Thereby, the moving member 210 rises and falls, moves in the horizontal plane, and rotates in the horizontal plane. In addition, each of the hands h1 and h2 advances and retreats from the moving member 210.

In the above-mentioned substrate processing apparatus 100, the carrier containing the unprocessed substrate W is placed on the carrier stage (carrying in of the substrate W) of the carry-in/out unit 110. The plurality of substrates W contained in the carrier are sequentially delivered to the substrate conveying device 200 of block B2. In block B2, the substrate transport device 200 transports the substrate W between the coating processing section 120 and the thermal processing section 130. In this way, coating treatment and heat treatment are performed on the substrate W. The processed substrate W is transferred from the substrate transfer device 200 to the transfer device of the block B1, and is stored in the carrier. After that, the carrier containing the processed substrate W is transported to the outside of the substrate processing apparatus 100.

[2] Board transfer device 200 and hand control unit 290 The plurality of driving mechanisms of the substrate conveying device 200 are provided with a plurality of power transmission members such as gears, pulleys, and belts. There is a backlash between a plurality of power transmission members. In addition, due to the power transmission member, a difference (hysteresis error) occurs in the amount of movement or the amount of deformation corresponding to the direction of power transmission. The existence of backlash and hysteresis error peculiar to such a mechanical structure reduces the accuracy of the substrate W with respect to the substrate transport device 200.

FIGS. 2 to 5 are diagrams for explaining the decrease in transfer accuracy caused by the mechanical structure of the substrate transfer device 200. Here, it is assumed that the substrate transfer device 200 is taught in advance to accurately transfer the substrate W supported by the support portion S1 to the spin chuck D1.

As shown in FIG. 2, the substrate W supported by the supporting part S1 is transferred to the rotary chuck D1. In this case, the substrate transfer device 200 receives the substrate W from the position p11 based on the position information "p11 (-100, 250)" of the support part S1 as the transfer source. Thereafter, the substrate transfer device 200 transfers the substrate W so that the center of the substrate W approaches the position p1 based on the position information "p1(100, 300)" of the rotary chuck D1 as the transfer destination. As a result, the center of the substrate W reaches the position p1 accurately. In the example of FIG. 2, the coordinates of the arrival position of the substrate W are (100, 300).

Moreover, as shown in FIG. 3, the board|substrate W supported by the support part S2 is conveyed to the spin chuck D1. In this case, the substrate transfer device 200 receives the substrate W from the position p12 based on the position information "p12 (-100, 350)" of the support part S2 as the transfer source. Thereafter, the substrate transfer device 200 transfers the substrate W so that the center of the substrate W approaches the position p1 based on the position information "p1(100, 300)" of the rotary chuck D1 as the transfer destination. As a result, the center of the substrate W reaches a position shifted from the position p1. In the example of Fig. 3, the coordinates of the arrival position of the substrate W are (99, 299), and the deviation (sx, sy) of the arrival position relative to the target position of the transfer destination on the XY coordinates is (-1, -1) ).

Moreover, as shown in FIG. 4, the board|substrate W supported by the support part S3 is conveyed to the spin chuck D1. In this case, the substrate transfer device 200 receives the substrate W from the position p13 based on the position information "p13 (-100, 450)" of the support part S3 as the transfer source. Thereafter, the substrate transfer device 200 transfers the substrate W so that the center of the substrate W approaches the position p1 based on the position information "p1(100, 300)" of the rotary chuck D1 as the transfer destination. As a result, the center of the substrate W reaches a position shifted from the position p1. In the example of Fig. 4, the coordinates of the arrival position of the substrate W are (98, 299), and the deviation (sx, sy) of the arrival position relative to the target position of the transfer destination on the XY coordinates is (-2, -1) ).

Furthermore, as shown in FIG. 5, the board|substrate W supported by the support part S4 is conveyed to the spin chuck D1. In this case, the substrate transfer device 200 receives the substrate W from the position p14 based on the position information "p14 (-100, 550)" of the support part S4 as the transfer source. Thereafter, the substrate transfer device 200 transfers the substrate W so that the center of the substrate W approaches the position p1 based on the position information "p1(100, 300)" of the rotary chuck D1 as the transfer destination. As a result, the center of the substrate W reaches a position shifted from the position p1. In the example of Fig. 5, the coordinates of the arrival position of the substrate W are (98, 297), and the deviation (sx, sy) of the arrival position relative to the target position of the transfer destination on the XY coordinates is (-2, -3) ).

As described above, when there are multiple transfer sources with respect to one transfer destination, even if the substrate W is accurately transferred from one of the multiple transfer sources to one transfer destination, it may not be able to be transferred from the other transfer source. The source accurately transports the substrate W to a transport destination. Deviations caused by the mechanical structure of the substrate transfer device 200 occur at the actual arrival positions corresponding to the plurality of transfer sources, respectively.

Therefore, in this embodiment, correction information is generated in advance for the transfer destination that requires accurate positioning, and the correction information is used to offset the target generated when the substrate W is assumed to be transferred from each transfer source to the transfer destination. The position, the deviation from the actual arrival position of the substrate W.

In the example of FIG. 2, the actual arrival position of the substrate W is consistent with the target position. Therefore, the correction information corresponding to the support part S1 is expressed as (0, 0) in the XY coordinate system as those that do not need to be corrected (refer to FIG. 6 below).

In the example of FIG. 3, the actual arrival position of the substrate W is offset (-1, -1) in the XY coordinate system relative to the target position. In order to offset the offset, it is only necessary to offset (+1, +1) the coordinates of the position information of the position p1 as the target position. Therefore, the correction information corresponding to the support part S2 is expressed as (+1, +1) in the XY coordinate system (refer to FIG. 6 below).

In the example of FIG. 4, the actual arrival position of the substrate W is offset (-2, -1) in the XY coordinate system relative to the target position. In order to offset the offset, it is only necessary to offset (+2, +1) the coordinates of the position information of the position p1 as the target position. Therefore, the correction information corresponding to the support part S3 is expressed as (+2, +1) in the XY coordinate system (refer to FIG. 6 below).

In the example of FIG. 5, the actual arrival position of the substrate W is offset (-2, -3) in the XY coordinate system relative to the target position. In order to offset the offset, it is only necessary to offset (+2, +3) the coordinates of the position information of the position p1 as the target position. Therefore, the correction information corresponding to the support part S4 is expressed as (+2, +3) in the XY coordinate system (refer to FIG. 6 below).

The above-mentioned correction information is stored in the hand control section 290 as conveyance control information. When the substrate W is transferred from each transfer source to the above-mentioned transfer destination, the substrate transfer device 200 is controlled in such a way that based on the correction information corresponding to the transfer source among the plurality of memorized correction information, The substrate W is transferred from the transfer source to the target position of the transfer destination.

FIG. 6 is a block diagram showing an example of the functional configuration of the hand control unit 290 of FIG. 1. The hand control unit 290 includes a substrate position detection unit 291, a storage unit 292, and a transport control unit 293. The hand control unit 290 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and a memory device. The CPU executes the computer program stored in a storage medium such as a ROM or a memory device to realize the function of each component of the hand control unit 290. Furthermore, part or all of the constituent elements of the hand control unit 290 may also be realized by hardware such as an electronic circuit.

In the substrate transfer device 200 of FIG. 1, a plurality of sensors (not shown) are provided for detecting multiple parts of the substrate W in the hands h1, h2 when the substrate W is received by the hands h1, h2 (For example, plural parts of the outer peripheral end). The substrate position detection unit 291 detects the center position of the substrate W in the hands h1 and h2 based on the outputs of the plurality of sensors.

In the memory portion 292, the position information indicating the positions of the rotation centers of the rotary chucks D1 to D3 p1, p2, and p3, and the positions p11, p12, p13, and p14 of the supporting portions S1, S2, S3, and S4 are stored. Location information.

In the substrate processing apparatus 100 of FIG. 1, it is required to accurately position the center of the substrate W on the rotation center of the rotating chuck D1, D2, D3. Therefore, in the memory part 292, the above-mentioned correction information is memorized for each of the support parts S1 to S4 which are the plural conveyance sources of the substrate W when the rotary chuck D1 is the conveyance destination. In addition, in the storage unit 292, the above-mentioned correction information is memorized for each of the support units S1 to S4 that are the plural transport sources of the substrate W when the rotary chuck D2 is the transport destination. Furthermore, in the memory part 292, the above-mentioned correction information is memorized for each of the support parts S1 to S4 which are the plural conveyance sources of the substrate W when the rotary chuck D3 is the conveyance destination.

The correction information corresponding to each transfer destination of the substrate W can be generated by controlling the substrate transfer device 200 based on the position information to transfer the substrate W from each transfer source to the transfer destination, and measure The deviation between the actual arrival position and the target position. Alternatively, it may be generated by measuring the deviation between the plural arrival positions of the substrate W caused by the respective conveyance of the substrate W from the plural conveyance sources to one conveyance destination.

The deviation between the plurality of arrival positions of the substrate W, which occurs when the substrate W is transferred from the plurality of transfer sources to one transfer destination, can be measured, for example, as follows. First, by controlling the substrate transfer device 200 based on position information, the substrate W on which the resist film is formed is transferred from each transfer source to a rotating chuck as a transfer destination. Next, while the substrate W is rotated by a rotating chuck, while the solvent is supplied from a fixed nozzle, the film formed on the periphery of the substrate W is removed (edge cut). At this time, if the center of the substrate W is shifted from the rotation center of the spin chuck, the width in the radial direction (edge cutting width) of the area where the film is removed changes in the circumferential direction of the substrate W. Therefore, the eccentric amount of the edge cut width of the substrate W is measured as the deviation between the plural arrival positions.

In addition to the above examples, the deviation between the arrival positions of the substrate W caused by the respective transfer sources of the substrate W to one transfer destination can be measured, for example, as follows. First, at a transfer destination, the substrate W is accurately placed on the rotating chuck. In this state, the hand that does not hold the substrate W is moved from the position of one of the plurality of transfer sources to one transfer destination. In addition, the substrate W on the rotating chuck is received by the one hand. Thereafter, the substrate position detection unit 291 is used to detect the center position of the substrate W in the hand. This operation is repeated for each transfer source. In this way, it is possible to obtain a plurality of detection results of the position of the center of the substrate W in the hand in a manner corresponding to the plurality of transport sources, respectively. Therefore, the difference between the acquired detection results (the deviation between the plurality of detection positions) is measured as the deviation between the plurality of arrival positions.

In the example of Fig. 6, with respect to the rotary chuck D1 as the conveying destination, the correction information corresponding to the supporting parts S1, S2, S3, and S4 as the plural conveying sources are (0, 0), (+1, +1), (+2, +1) and (+2, +3). In addition, with respect to the rotary chuck D2 as the transfer destination, the correction information corresponding to the support parts S1, S2, S3, and S4 as the plural transfer sources are (0, 0), (-1, +1), ( 0, -1) and (+1, -2). Furthermore, with respect to the rotary chuck D3 as the transfer destination, the correction information corresponding to the support parts S1, S2, S3, and S4 as the plural transfer sources are (0, 0), (-1, +2), ( 0, +2) and (+2, +3).

The transport control unit 293 responds to commands from the control device of the carry-in/out unit 110, for example, to control the substrate transport device 200 to transport the substrate W from the designated transport source to the designated transport destination. At this time, the transport control unit 293 controls the substrate transport device 200 based on the position information and the correction information stored in the storage unit 292. Thereby, the substrate W is accurately transported to the target position of the transport destination.

Furthermore, when there is no correction information corresponding to the designated transport destination in the storage section 292, the transport control unit 293 controls the substrate transport apparatus 200 based on the position information. For example, in the memory part 292 of FIG. 6, there is no correction information with the support part S1 as the transfer destination. In this case, when the transfer control unit 293 transfers the substrate W from any one of the rotary chucks D1 to D3 to the support part S1, it controls the substrate transfer device 200 only based on the position information of the support part S1.

[3] Nozzle transport device 10 and nozzle control unit 390 FIG. 7 is a plan view of the coating processing unit 120 for explaining the structure of the nozzle conveying device 10 of FIG. 1. As shown in FIG. 7, the nozzle conveying device 10 of the liquid supply device 300 is installed on the side of the rotating chucks D1, D2, D3 in the X direction. The nozzle conveying device 10 has a base 19. The pedestal portion 19 extends in the Y direction so as to be adjacent to the three rotating chucks D1, D2, and D3. The pedestal 19 is provided with a linear guide 18 extending linearly in the longitudinal direction (the direction parallel to the Y-axis).

On the pedestal portion 19, a movement support portion 12 capable of moving in the Y direction along the linear guide 18 is provided. The mobile support unit 12 supports a standby pot 11 having a plurality of (six in this example) standby units sb. In the plurality of standby portions sb of the standby tank 11, a plurality of (six in this example) nozzle nz front ends are accommodated. To each nozzle nz, a pipe extending from a resist liquid supply system (not shown) is connected. The resist liquid supply system is installed so that the resist liquid can be supplied to each nozzle nz.

The movement support part 12 further supports the arm 13 and enables it to move in the Y direction. The arm 13 extends in the X direction from a position above the standby slot 11 to a position above the one rotating chuck when the moving support portion 12 is adjacent to any one of the rotating chucks D1 to D3. The arm 13 is provided with a nozzle holding portion 14 that can move in the X direction. The nozzle holding portion 14 is configured to be able to hold the nozzle nz.

The nozzle conveying device 10 further includes a drive mechanism (not shown) that moves the movement support portion 12 in the Y direction, a drive mechanism (not shown) that moves the arm 13 in the Y direction, and a drive mechanism that moves the nozzle holding portion 14 in the X direction. The drive mechanism not shown in the figure. By operating the plurality of driving mechanisms based on the control of the nozzle control unit 390, one of the plurality of nozzles nz is placed above the standby slot 11 and any one of the three rotating chucks D1 to D3 Transfer between locations.

Here, the standby tank 11 moves between three positions in the Y direction so as to be adjacent to the rotating chucks D1, D2, and D3 holding the substrate W to be processed, respectively. Regarding the substrate processing apparatus 100, the coordinates in the Y direction respectively indicating the positions of the plurality of standby portions sb in which the standby grooves 11 are arranged are predetermined as position information.

FIG. 8 is a plan view for explaining the plural positions of the plural standby portions sb in which the standby tank 11 is arranged in the coating processing portion 120 of FIG. 7. In FIG. 8, the state of the standby slot 11 when it is adjacent to the rotary chuck D1 is shown by a solid line. The state of the standby slot 11 when it is adjacent to the rotary chuck D2 is indicated by a single-dot chain line. The state of the standby slot 11 when it is adjacent to the rotary chuck D3 is indicated by a dotted line.

As shown in FIG. 8, the standby slot 11 moves between three positions in the Y direction. In this example, the coordinates (coordinates of the XY coordinate system) representing the positions p21, p22, p23, p24, p25, and p26 of the plurality of standby portions sb in the standby slot 11 adjacent to the rotary chuck D1 are specified in advance Is location information. In addition, the coordinates (coordinates of the XY coordinate system) representing the positions p27, p28, p29, p30, p31, and p32 of the plurality of standby portions sb in the standby slot 11 when the rotary chuck D2 is adjacent to the rotary chuck D2 are specified as position information in advance . Furthermore, the coordinates (coordinates of the XY coordinate system) representing the positions p33, p34, p35, p36, p37, and p38 of the plurality of standby portions sb in the standby groove 11 when adjacent to the rotary chuck D3 are specified as the position information in advance .

During the coating process of the substrate W, the nozzle nz must be accurately positioned above the center of rotation of the rotating chuck that holds the substrate W. However, the nozzle conveying device 10 has a plurality of driving mechanisms as described above. Therefore, if only the position information of the rotary chucks D1 to D3 is used for conveying the nozzle nz, the conveying accuracy will decrease due to the mechanical structure of the nozzle conveying device 10.

Therefore, in the nozzle control unit 390, in order to suppress the drop in the conveying accuracy due to the mechanical configuration of the nozzle conveying device 10, the same control as the above-mentioned example of the substrate conveying device 200 is performed.

FIG. 9 is a block diagram showing an example of the functional configuration of the nozzle control unit 390 in FIG. 1. The nozzle control unit 390 includes a storage unit 391 and a transport control unit 392. The nozzle control unit 390 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and a memory device. The function of each component of the nozzle control unit 390 is realized by the CPU executing the computer program stored in the storage medium such as ROM or memory device. Furthermore, part or all of the components of the nozzle control unit 390 may be realized by hardware such as an electronic circuit.

In the storage unit 391, the position information indicating the positions of the rotation centers of the plurality of rotating chucks D1, D2, D3, p1, p2, and p3, is stored in the same manner as in the example of FIG. 6. In addition, the position information indicating the positions p21 to p38 of the plurality of standby parts sb is stored. In addition, for each of the plural positions p21 to p38 that are the plural conveying sources of the nozzle nz when the rotary chuck D1 is the conveying destination, the correction information is memorized to offset the offset generated at the conveying destination. In addition, for each of the plural positions p21 to p38 that become the plural conveying sources of the nozzle nz when the rotary chuck D2 is the conveying destination, the correction information is memorized to offset the offset generated at the conveying destination. Furthermore, for each of the plural positions p21 to p38 that become the plural conveying sources of the nozzle nz when the rotary chuck D3 is the conveying destination, the correction information is memorized to offset the offset generated at the conveying destination.

The correction information corresponding to each conveying destination of the nozzle nz can be generated by controlling the nozzle conveying device 10 based on the position information to convey the nozzle nz from each conveying source to the conveying destination, and measuring The deviation between the actual arrival position and the target position. For example, the origin position of the nozzle nz is defined in the coating processing unit 120, and teaching is performed in such a manner that one nozzle nz is accurately moved from the origin position to a transfer destination. Thereafter, based on the position information, the deviation between the one nozzle nz and the one transport destination when one nozzle nz moves from each transport source (a plurality of positions p21 to p38) to one transport destination is measured. In this way, the correction information can be accurately generated based on the measured deviation.

In the example of FIG. 9, the correction information corresponding to the positions p21, p22, and p23 of the standby portion sb as the plural conveying sources for the rotary chuck D1 as the conveying destination is (0, 0), (+2) , -1) and (-2, +2). In addition, regarding the rotary chuck D2 as the transfer destination, the correction information corresponding to the positions p21, p22, and p23 of the standby portion sb as the plural transfer sources are (0, 0), (-1, +1), and (-2, 0).

For example, the transport control unit 392 responds to commands from the control device of the carry-in/out unit 110 to control the nozzle transport device 10 by transporting any one of the plurality of nozzles nz from the specified transport source to the specified transport destination. At this time, the transport control unit 392 controls the nozzle transport device 10 based on the position information and the correction information stored in the storage unit 391. Thereby, the nozzle nz is accurately conveyed to the target position of the conveying destination.

In addition, the transport control unit 392 controls the nozzle transport device 10 based on the position information when there is no correction information corresponding to the designated transport destination in the storage unit 391. For example, in the storage unit 391 of FIG. 9, there is no correction information that uses the position p21 of the standby unit sb as the transfer destination. In this case, when the conveyance control unit 293 conveys the nozzle nz to the position p21 from a position above any one of the rotary chucks D1 to D3, it controls the substrate conveying device 200 only based on the position information of the position p21.

[4] Object transport control As described above, the hand control unit 290 controls the substrate transport device 200 in order to transport the substrate W as the object. In addition, the nozzle control unit 390 controls the nozzle conveying device 10 in order to convey the nozzle nz as the object. These control systems are basically the same except for the difference in objects. Therefore, a series of control performed by the hand control unit 290 and the nozzle control unit 390 is referred to as object conveyance control.

While referring to the flowchart, the object conveying control will be explained. Fig. 10 is a flowchart of object conveyance control. In the following description, the substrate W and the nozzle nz are collectively referred to as an object. In addition, the storage units 292 and 391 in FIGS. 6 and 9 are collectively referred to as a storage unit, and the transport control units 293 and 392 in FIGS. 6 and 9 are collectively referred to as a transport control unit. Furthermore, the substrate transfer device 200 and the nozzle transfer device 10 are collectively referred to as a transfer device. The object transport control is started in response to an object transport instruction from the control device of the carry-in/out unit 110, for example.

When the object transportation control is started, the transportation control unit acquires the position information of the transportation source and the transportation destination from the storage unit based on the object transportation instruction (step S11). Next, the conveyance control unit controls the conveyance device to receive the object based on the acquired position information of the conveyance source (step S12).

If the object is received by the transport device, the transport control unit determines whether there is correction information corresponding to the transport destination in the storage unit (step S13). When there is correction information corresponding to the transfer destination, the transfer control unit corrects the location information of the transfer destination based on the correction information about the transfer source of the received object (step S14). After that, the conveyance control unit conveys the object to the target position of the conveyance destination based on the corrected position information (step S15). In the above step S13, when there is no correction information corresponding to the transport destination, the transport control unit transports the object to the transport destination based on the location information of the transport destination (step S16). After the processing of step S15 or step S16, the object transport control ends.

[5] Effect (a) In the substrate processing apparatus 100 described above, the correction information related to the transfer of the substrate W to the transfer destination is stored in the memory 292 of the hand control unit 290 for each of the plural transfer sources. When the substrate W is transferred from one transfer source to the transfer destination, the substrate W is transferred to the destination of the transfer destination based on the correction information corresponding to one transfer source and the location information of the transfer destination stored in the memory part 292 Location.

In this case, the target position generated when the substrate W is transferred from each of the plurality of transfer sources to the transfer destination by controlling the substrate transfer device 200 based on the location information of the transfer destination, and The deviation of the actual arrival position of the substrate W is offset. Thereby, the actual arrival position of the substrate W when the substrate W is transferred from each of the plurality of transfer sources to the transfer destination based on the correction information coincides with the target position. Therefore, the substrate W can be transported with simple and high accuracy.

As a result, by setting the rotation center of the rotary chucks D1 to D3 as the transfer destination, various processes can be performed on the substrate W held by the respective rotary chucks D1 to D3 with high accuracy.

(b) In the above-mentioned substrate processing apparatus 100, the correction information related to the conveyance of the nozzle nz is memorized in the memory unit 391 of the nozzle control unit 390 for each of the plural conveyance sources. During the transfer of the nozzle nz from a transfer source to a transfer destination, the nozzle nz is transferred to the destination of the transfer destination based on the correction information corresponding to a transfer source and the position information of the transfer destination stored in the memory unit 391 Location.

In this case, it is assumed that the nozzle nz is transferred from each of the plural transfer sources to the transfer destination by controlling the nozzle transfer device 10 based on the location information of the transfer destination, and the target position generated when The deviation of the actual arrival position of the nozzle nz is offset. Thereby, the actual arrival position of the nozzle nz when the nozzle nz is transported from each of the plurality of transport sources to the transport destination based on the correction information coincides with the target position. Therefore, the nozzle nz can be conveyed with simple and high precision.

As a result, by setting the rotation centers of the rotary chucks D1 to D3 as the transfer destination, it is possible to supply the resist liquid to the substrate W held by the respective rotary chucks D1 to D3 with high accuracy.

[6] An example of the method of generating correction information The correction information stored in the storage unit 292 in FIG. 6 can also be generated in the following manner, for example. An example of the process of generating correction information with the rotary chuck D1 as the transfer destination will be described.

First, from a plurality of transfer sources with the rotary chuck D1 as the transfer destination, one transfer source is determined as the reference transfer source. In addition, the substrate transfer device 200 is controlled to receive the substrate W with the hand h1 based on the position information of the reference transfer source. At this time, the position of the center of the substrate W in the hand h1 detected by the substrate position detection unit 291 of FIG. 6 is recorded as the first hand position.

Next, the substrate transfer device 200 is controlled in such a way that the substrate W received from the reference transfer source is accurately transferred to the target position of the transfer destination and placed on the rotary chuck D1. In addition, the correction information on the reference transport source is set to (0, 0).

After that, the substrate transfer device 200 is controlled so that the empty hand h1 is moved to another transfer source other than the reference transfer source. From the empty hand h1 in the state of another transfer source, the substrate transfer device 200 is controlled by using the hand h1 to receive the substrate W supported by the rotating chuck D1 based on the position information of the rotating chuck D1. At this time, the position of the center of the substrate W in the hand h1 detected by the substrate position detection unit 291 of FIG. 6 is recorded as the second hand position.

The difference between the position of the first hand and the position of the second hand is equivalent to the transfer error that occurs when the substrate W is transferred from the reference transfer source to the transfer destination, and the difference when the substrate W is transferred from another transfer source to the transfer destination. The difference of the resulting conveying error. Therefore, based on the difference between the position of the first hand and the position of the second hand, correction information about another transfer source with the rotary chuck D1 as the transfer destination is generated.

[7] Other embodiments (a) In the above embodiment, the memory 292 stores correction information for correcting the location information of the specific transfer destination to accurately transfer the substrate W to the specific transfer destination, but the present invention is not limited to this. For example, in the storage unit 292, instead of the correction information, the corrected position information obtained by correcting the position information of the specific transfer destination may be stored, so that the substrate W can be accurately transferred to the specific transfer destination.

11 is a block diagram showing an example of the hand control unit 290 in which the corrected position information is stored in the memory unit 292 of the substrate transfer device 200. As shown in FIG. The block diagram of FIG. 11 corresponds to the block diagram of FIG. 6.

In the memory part 292 of FIG. 11, for each of the support parts S1 to S4 that become the plural transfer sources of the substrate W when the rotary chuck D1 is the transfer destination, the memory has been corrected with the correction information of FIG. 6 The location information. In addition, in the memory portion 292, for each of the support portions S1 to S4 that become the multiple transfer sources of the substrate W when the rotary chuck D2 is the transfer destination, the memory has been corrected with the correction information in FIG. 6 Location information. Furthermore, in the memory portion 292, for each of the support portions S1 to S4 that are the multiple transfer sources of the substrate W when the rotary chuck D3 is the transfer destination, the data corrected by the correction information in FIG. 6 is memorized Location information. In this case, in the object transport control of FIG. 10, the processing of step S14 is omitted.

(b) In the above embodiment, the correction information for correcting the position information of the specific transfer destination is stored in the memory 391 so that the substrate W and the nozzle nz can be accurately transferred to the specific transfer destination. However, the present invention It is not limited to this. For example, the memory unit 391 may replace the above-mentioned correction information, and store the corrected position information obtained by correcting the position information of the specific conveying destination, so as to accurately convey the nozzle nz to the specific conveying destination.

FIG. 12 is a block diagram of the nozzle control unit 390 showing an example of the corrected position information stored in the storage unit 391 of the liquid supply device 300. The block diagram of FIG. 13 corresponds to the block diagram of FIG. 9.

In the memory unit 391 of FIG. 12, for each of the plural positions p21 to p38 that become the plural conveying sources of the nozzle nz when the rotary chuck D1 is the conveying destination, the correction information of Fig. 9 is memorized. Passed location information. In addition, for each of the plural positions p21 to p38 that become the plural conveying sources of the nozzle nz when the rotary chuck D2 is the conveying destination, the position information corrected by the correction information of FIG. 9 is memorized. Furthermore, for each of the plural positions p21 to p38 that become the plural conveying sources of the nozzle nz when the rotary chuck D3 is the conveying destination, the position information corrected by the correction information of FIG. 9 is memorized. In this case, in the object transport control of FIG. 10, the processing of step S14 is omitted.

(c) In the above embodiment, the substrate transfer device 200 that transfers the substrate W is controlled by the hand control unit 290 provided in the transfer unit 140, but the substrate transfer device 200 may also be controlled by the control device of the transfer unit 110.

In addition, in the above-mentioned embodiment, the nozzle conveying device 10 of the conveying nozzle nz is controlled by the nozzle control section 390 provided in the coating processing section 120, but the nozzle conveying device 10 may also be controlled by the control device of the conveying and unloading section 110.

(d) In the above-mentioned embodiment, the case where the XY coordinate system is defined in the substrate processing apparatus 100 has been described. However, in the substrate processing apparatus 100, in addition to the X axis and the Y axis, it is defined and further has a relationship with the X axis. The XYZ coordinate system of the Z axis orthogonal to the Y axis. Therefore, in the Z-axis direction (up and down direction), the object can be transported to the accurate height position of the transport destination by performing the object transport control based on the correction information.

(e) In the above-mentioned embodiment, the plural nozzles nz provided in the coating processing section 120 are used to supply the resist liquid to the substrate W, but the present invention is not limited to this. The plurality of nozzles nz can also be used to supply other processing liquids such as a cleaning liquid or a developing liquid to the substrate W, for example.

[8] Correspondence between the constituent elements of the technical plan and the elements of the implementation form Hereinafter, an example of the correspondence between each component of the technical solution and each element of the embodiment will be described. In the above embodiment, the substrate W and the nozzle nz are examples of objects, the substrate transfer device 200 and the nozzle transfer device 10 are examples of transfer devices, and the positions of the rotation centers of the rotating chucks D1, D2, D3 are p1, p2, p3 It is an example of the target position, and the position information of the rotating chuck D1, D2, D3 is an example of the target information.

In addition, the plural support parts S1 to S4 are examples of plural first support parts, each of the rotary chucks D1 to D3 is an example of the second support part and the holding part, and the plural standby parts sb of the standby tank 11 are plural An example of the nozzle housing part, the position information and correction information and the corrected position information in other embodiments are examples of conveyance control information, the memory parts 292 and 391 are examples of the memory part, and the conveyance control part 293 and the conveyance control part 392 are examples. In the example of the control unit, the revised position information in other embodiments is an example of new target information.

As each constituent element of the technical solution, various other elements having the configuration or function described in the technical solution can also be used.

10: Nozzle conveying device 11: Standby slot 12: Mobile Support Department 13: arm 14: Nozzle holding part 18: Linear guide 19: Pedestal 100: Substrate processing device 110: Move in and out department 120: Coating Processing Department 130: Heat Treatment Department 140: Transport Department 200: substrate transfer device 210: Moving component 290: Hand Control 291: Board position detection section 292: Memory Department 293: Conveyance Control Department 300: Liquid supply device 390: Nozzle Control Department 391: Memory Department 392: Conveyance Control Department B1: block B2: block cp: cup D1: Rotating chuck D2: Rotating chuck D3: Rotating chuck h1: hand h2: hand nz: nozzle p1: location p2: location p3: location p11: location p12: location p13: location p14: location p21～p38: position S1: Support Department S2: Support Department S3: Support Department S4: Support Department sb: standby part TU1～TU4: Heat treatment unit W: substrate

Fig. 1 is a schematic plan view showing a substrate processing apparatus according to an embodiment of the present invention. Fig. 2 is a diagram for explaining the decrease in conveying accuracy caused by the mechanical structure of the substrate conveying device. Fig. 3 is a diagram for explaining the decrease in conveying accuracy caused by the mechanical structure of the substrate conveying device. Fig. 4 is a diagram for explaining the decrease in conveying accuracy caused by the mechanical structure of the substrate conveying device. Fig. 5 is a diagram for explaining the decrease in conveying accuracy caused by the mechanical structure of the substrate conveying device. Fig. 6 is a block diagram showing an example of the functional configuration of the hand control unit of Fig. 1; Fig. 7 is a plan view of a coating processing section for explaining the configuration of the nozzle conveying device of Fig. 1. Fig. 8 is a plan view for explaining a plurality of positions of a plurality of standby portions in which standby grooves are arranged in the coating processing portion of Fig. 7; Fig. 9 is a block diagram showing an example of the functional configuration of the nozzle control unit of Fig. 1; Fig. 10 is a flowchart of object conveyance control. FIG. 11 is a block diagram showing an example of the hand control unit storing corrected position information in the memory unit of the substrate transfer device. FIG. 12 is a block diagram showing an example of the nozzle control unit in which the corrected position information is stored in the memory unit of the liquid supply device.

10: Nozzle conveying device

100: Substrate processing device

110: Move in and out department

120: Coating Processing Department

130: Heat Treatment Department

140: Transport Department

200: substrate transfer device

210: Moving component

290: Hand Control

300: Liquid supply device

390: Nozzle Control Department

B1: block

B2: block

cp: cup

D1: Rotating chuck

D2: Rotating chuck

D3: Rotating chuck

h1: hand

h2: hand

nz: nozzle

p1: location

p2: location

p3: location

p11: location

p12: location

p13: location

p14: location

S1: Support Department

S2: Support Department

S3: Support Department

S4: Support Department

TU1~TU4: heat treatment unit

W: substrate

Claims (9)

A substrate processing device that performs prescribed processing on substrates and is provided with: a conveying device that conveys an object related to the above processing from any one of a plurality of conveying sources to a target position of a conveying destination; memory Section, which memorizes transport control information for each of the plurality of transport sources before the transport device performs the transport operation of the object, and the transport control information is used to offset the assumption that it is based on the target information representing the target position. The deviation between the target position and the actual arrival position of the target when the object is transported from each of the plurality of transport sources to the transport destination; and the control unit, between the plurality of transport sources When a transport source transports the object to the transport destination, the control unit controls the transport device in the following manner, that is, based on which of the plurality of transport control information stored in the storage unit corresponds to the one transport source The transport control information transports the object from the one transport source to the target position of the transport destination. The substrate processing apparatus of claim 1, wherein the object is a substrate, the plurality of transport sources are a plurality of first support parts supporting the substrate, and the transport destination is a second support part supporting the substrate. The substrate processing apparatus according to claim 2, wherein the second support portion is configured to be able to hold the substrate in a horizontal posture and to be able to rotate. The substrate processing apparatus according to claim 1, further comprising: a holding portion configured to hold and rotate the substrate in a horizontal posture; a plurality of nozzles that supply a predetermined processing liquid to the substrate held by the holding portion; And a plurality of nozzle accommodating portions, which are configured to be capable of accommodating the plurality of nozzles; and the object is any one of the plurality of nozzles, the plurality of conveying sources are the plurality of nozzle accommodating portions, and the conveying destination is The position above the substrate held by the holding portion. For example, the substrate processing apparatus of any one of claim 1 to 4, wherein each of the plurality of transport control information is the correction information of the above-mentioned target information corresponding to the above-mentioned offset, in the direction from one of the above-mentioned transport sources to When the object is transported by the transport destination, the control unit controls the transport device in such a manner that the target information of the transport destination is corrected based on the correction information corresponding to the one transport source stored in the storage unit , Based on the corrected target information, the object is transferred from the one transfer source to the target position of the transfer destination. For example, the substrate processing apparatus of any one of claims 1 to 4, wherein each of the plurality of transport control information is new target information obtained by correcting the above target information based on the above offset, and is transported from one of the above plurality of transport sources When the source transports the object to the transport destination, the control unit controls the transport device in such a way that based on the new target information corresponding to the one transport source stored in the storage unit, the object is transferred It is transported from the one transport source to the target position of the transport destination. A method for conveying an object in a substrate processing apparatus, which is a method for conveying an object related to the above-mentioned processing in a substrate processing apparatus that performs predetermined processing on a substrate, and includes the following steps: Before the transfer operation, the transfer control information is stored in the memory for each of the above-mentioned plural transfer sources. The transfer control information is used to offset the target information assumed to be based on the target position indicating the transfer destination. The deviation between the target position and the actual arrival position of the target when the object is transported from each of the plurality of transport sources to the transport destination; When the object is transported by the transport destination, the transport device is controlled in such a way that based on the transport control information corresponding to the one transport source among the plurality of transport control information stored in the storage unit, the object is The object is transported from the one transport source to the destination location of the transport destination. For example, the method of transporting the object in the substrate processing apparatus of claim 7, wherein each of the plurality of transport control information is the correction information of the above-mentioned target information corresponding to the above-mentioned offset, and the step of controlling the transporting apparatus is from the above-mentioned plurality of When one of the transport sources transports the object to the transport destination, the transport device is controlled in the following manner, that is, the transport is corrected based on the correction information stored in the memory unit corresponding to the one transport source The target information of the destination, based on the corrected target information, transports the object from the one transport source to the target position of the transport destination. For example, the method for conveying an object in a substrate processing apparatus of claim 7, wherein each of the plural conveying control information is new target information obtained by correcting the target information based on the offset, The step of controlling the conveying device is that when the object is conveyed from one of the plural conveying sources to the conveying destination, the conveying device is controlled in the following manner, that is, based on the memory in the memory unit With the new target information corresponding to the one transport source, the object is transported from the one transport source to the destination position of the transport destination.

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