JPH07147300A - Inner lead bonding unit - Google Patents

Abstract

PURPOSE:To improve the throughput of bonding by a method wherein a plurality of chip receiving stages are provided vertically movable and rotatably, a rotary table provided with a fine adjustment means in X-Y direction, a means that compensates the angle of the chip receiving stage with rotation and that slides it in a vertical direction are provided. CONSTITUTION:A chip receiving stage 3 on which a chip 2 is mounted is provided vertically movably and rotatably with a bearing 4a of the chip receiving stage of an index table 4. Then, when bonding, the chip receiving state 3 is lifted upward with a chip receiving stage rotation angle adjustment mechanism as well as pushing mechanism 6. X-Y compensation is conducted by interlocking 13A and 13B with position compensation signals from a recognition camera 7, image processing unit 19 and a data processing unit 20. The chip receiving stage rotation angle adjustment mechanism as well as pushing mechanism 6 is operated to compensate the angle to perform the bonding with a bonding tool 17, thereby making it possible to improve the bonding throughput.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner lead bonding apparatus, and more particularly to a technique effective when applied to a TAB type bonding apparatus.

[0002]

2. Description of the Related Art A conventional TAB type bonding apparatus is disclosed in, for example, Japanese Patent Application No. 63-261347 (Japanese Patent Application Laid-Open No. Hei 2).
-109346).

In the bonding apparatus, a carrier tape having leads formed on a polyimide or polyester film is sent to a bonding position at a constant pitch by a sprocket wheel or the like via a tension pulley, and is also sent to the bonding position by another means. Bonding is performed with the chip on the chip pedestal.

The bonding process is divided into a supply unit, a position correction unit, a bonding unit and a cleaning unit.

First, in the supply unit for supplying chips to the chip receiving table, the chips are picked up one by one from the wafer on the chip tray or the adhesive sheet by the pickup head and are supplied to the chip receiving table.

In the position correction section, in the chip cradle to which the chips are supplied, an arbitrary two points (diagonal points, etc.) of the inner leads are detected by a lead detection recognition camera such as a CCD, and at the same time, chip recognition is performed. A dedicated camera detects any two points on the chip and corrects the relative position (X, Y, Θ) between the inner lead and the chip in parallel with the movement of the chip to the bonding position, and the IC electrode pad Correct the position with the inner lead.

In the bonding section, the inner leads and the bumps on the chip are pressure-bonded by a heated bonding tool.

After the bonding is completed, the cleaning section cleans the crushed chips on the surface of the chip holder by blowing air.

As described above, the chip pedestal on which the chips are mounted is moved to the above-mentioned four portions to perform the bonding.

[0010]

DISCLOSURE OF THE INVENTION The present inventors have found the following problems as a result of examining the above prior art.

In the bonding in the conventional TAB type bonding apparatus, the chip is moved to the position of each process of the four parts of the supply part, the position correction part, the bonding part, and the cleaning part by one chip holder. As a result, the cycle time of the device becomes long, the production capacity is low, and the throughput is low.

Further, after the bonding is completed, the chip crushed chips on the surface of the chip pedestal are cleaned by blowing air, but this is not enough, and the remaining crushed chips cause chipping and chipping defects during bonding. There was a problem.

An object of the present invention is to provide a technique capable of improving the bonding throughput.

Another object of the present invention is to improve a technique capable of preventing chip cracking and chipping defects during bonding and improving yield.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0016]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

A supply unit for supplying chips to a plurality of chip pedestals mounted on a rotary table driven intermittently, a position adjusting unit for adjusting the positions of the chips, and a bonding unit for bonding the chips to the inner leads. An inner lead bonding apparatus comprising a cleaning unit for cleaning a chip pedestal, comprising a plurality of chip pedestals movably up and down and rotatable, and a rotary table provided with fine adjustment means in the XY directions. There is provided means for correcting the angle of the tip pedestal by rotation and sliding in the vertical direction, and brush cleaning means as the cleaning section.

[0018]

According to the above-mentioned means, the supply unit for supplying the chips to the plurality of chip pedestals mounted on the rotary table which is intermittently driven, and the position adjusting unit for adjusting the positions of the chips,
An inner lead bonding apparatus comprising a bonding unit for bonding a chip and an inner lead and a cleaning unit for cleaning a chip receiving base, wherein a plurality of chip receiving bases are provided so as to be vertically movable and rotatable, and XY By providing a rotary table provided with fine adjustment means for the direction and means for correcting the angle by rotating the chip cradle and vertically sliding the chip cradle, the chips are mounted on one chip cradle and the other chip cradle Parallel process processing such as chip position adjustment can be performed.

Therefore, since the chips mounted on the plurality of chip pedestals on the turntable can be simultaneously processed in different steps, the bonding throughput can be improved.

Further, by providing a brush cleaning means as the cleaning section, it is possible to remove the crushed chips of the chips remaining on the chip pedestal, so that cracking and chipping defects of the chips can be prevented at the time of bonding and the yield can be improved. It is possible to improve.

The structure of the present invention will be described below together with embodiments.

In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is for explaining the structure of an inner lead bonding apparatus which is an embodiment of the present invention.

In FIG. 1, 1 is a carrier tape, 2 is a chip, 3 is a chip pedestal, 4 is a rotary table (index table), 5 is an index drive, 6 is a chip pedestal rotation angle adjusting mechanism and push-up mechanism, 7 Is a recognition camera, 8 is a head drive mechanism, 9 is a chip transfer arm,
Reference numeral 10 is a chip tray, 11 is a chip supply mechanism, 12 is a bonding head, 13A and 13B are XY fine adjustment mechanisms, and 14 is a tape guide.

In the inner lead bonding apparatus of this embodiment, as shown in FIG. 1, a supply unit (chip transfer arm 9, chip tray 1) for supplying the chip 2 to the chip receiving base 3.
0, chip supply mechanism 11), and a bonding section (chip cradle pushing up mechanism 6, recognition camera 7, head drive mechanism 8, bonding head 12) for performing bonding,
A position adjusting unit (not shown) for adjusting the position of the chip 2, a cleaning unit (not shown) for cleaning the chip holder 3, and an XY fine adjustment mechanism 1 are also provided.
It is composed of an index table 4 and an index drive 5 which are intermittently driven on the 3A and are divided into four parts.

FIG. 2 is for explaining the above-mentioned bonding portion. In FIG. 2, 1 to 14 are the same as those in FIG. 1, 4 a is a chip pedestal bearing, 15 is an inner lead, 16 is a tape holder, 17
Is a bonding tool, and 18 is a bump.

As shown in FIG. 2, the tip cradle 3 on which the tip 2 is mounted has a structure in which it can be moved up and down and rotated by the tip cradle bearing 4a of the index table 4. As a result, at the time of bonding, the chip pedestal 3 has the chip pedestal rotation angle adjusting mechanism and push-up mechanism 6
By the position correction signals from the recognition camera 7, the image processing device 19 and the data processing device 20 which are mounted on the upper part of the chip 2 by the XY correction and the chip cradle rotation angle. The adjustment mechanism and push-up mechanism 6 is operated to correct θ (angle), and bonding is performed by the bonding tool 17.

FIG. 3 is for explaining the index table 4 described above.

In FIG. 3, 30a, 30b, 30c,
Reference numeral 30d shows a tip positioning claw for roughly adjusting the tip position of the tip position adjusting section. The tip positioning claw is for roughly adjusting the tip position so that the tip is placed within the recognition range of the recognition camera 7.

The index table 4 shown in FIG. 3 is provided with four chip holders 3, and the intermittent rotation is controlled by the index drive 5 shown in FIGS. A chip supply unit, a chip position adjustment unit, a bonding unit, and a cleaning unit are separately arranged around each of the four chip pedestals 3, and a chip supply mechanism 11 is arranged in the chip supply unit. Supply mechanism 11
Is a chip transfer arm 9 from the chip tray 10,
The structure is such that the chip 2 can be supplied.

Chip positioning claws 30a, 30b, 30c and 30d are attached to the chip position adjusting portion, and the structure is such that a driving mechanism (not shown) can be opened and closed according to the chip size.

In the bonding portion, a push-up mechanism 6 having a structure in which a portion in contact with the upper chip receiving base 3 is rotatable, as shown in FIG.
The tip cradle 3 is slid upward and a tip angle correction operation is performed. Further, a tape guide 14 that guides the carrier tape 1 and a tape holder 16 that clamps the carrier tape 1 are arranged above the chip receiving table 3, and a bonding head 12 is installed above the carrier tape 1.
The bonding head 12 is mounted on a head drive mechanism 8 that can be finely adjusted in the X, Y, and Z directions, and a bonding tool 17 that moves up and down and a position recognition camera 7 are independently mounted. An image processing device 19 and a data processing device 20 are connected to 7.

A rotating brush (not shown) is attached to the upper portion of the cleaning unit and has a structure for brushing the surface of the chip holder 3.

FIG. 4 is a view for explaining the structure of a portion of the above-mentioned tip cradle rotation angle adjusting mechanism / push-up mechanism 6 that comes into contact with the cradle 3. As shown in FIG. 4, the contact portions of the tip cradle 3 and the tip cradle rotation angle adjusting mechanism / push-up mechanism 6 are rotatable. This allows
With the tip cradle 3 pushed up from below, it is possible to finely adjust the rotation angle by the tip cradle rotation angle adjusting mechanism and pushing up mechanism 6.

Next, the operation of the inner lead bonding apparatus will be described.

First, in the chip supply section, the chips 2 are transferred one by one from the chip tray 10 by the chip transfer arm 9.
The chips are transferred onto the chip pedestal 3 on the index table 4 and sucked by vacuum. After that, the chip pedestal 3 on which the chips are mounted is moved to the chip position adjusting unit by the intermittent rotation operation of the index drive 5. This operation is 1
Repeated every cycle.

In the chip position adjusting section, the chip positioning claws 30a to 30d operate to position the chip 2 (coarse adjustment). On the other hand, the carrier tape 1 set in a tape loader (not shown) is sent to a bonding position at a constant pitch via a tension pulley (not shown), a sprocket wheel, and the like. Here, a plurality of points of the inner lead on the tape are detected by a recognition camera 7 such as a CCD to recognize the position of the inner lead.

Next, the index table 4 is intermittently driven so that the chip 2 comes under the recognition camera 7. Subsequently, the tip cradle 3 is lifted up to a prescribed height by the tip cradle rotation angle adjusting mechanism and push-up mechanism 6 and then stopped. Here, the recognition camera 7 detects two points on the chip,
The XY fine movement tables 13A and 13B are operated to correct the relative position (X, Y) with the inner lead, and at the same time, the tip cradle rotation angle adjusting mechanism and the push-up mechanism 6 are used to correct the Θ of the tip cradle 3. By doing so, the electrode pads on the chip 2 and the inner leads are aligned with each other, and the inner leads corresponding to the pads are accurately positioned.

After that, the bonding head 12 is driven to position the bonding tool 17 right above the chip 2 and the heated bonding. By applying a preset load with the tool 11, the inner lead and the chip 2
The upper bump 18 is pressure-bonded. At this time, when the vacuum suction of the chip cradle 3 is released and the bonding tool 17 rises, the chip 2 separates from the chip cradle 3, and at the same time, the XY fine adjustment mechanisms 13A and 13B and the chip cradle rotation angle. The adjustment mechanism and push-up mechanism 6 are returned to their original positions.

Then, the index table 4 is continued.
Is intermittently driven to move the chip pedestal 3 to which the bonding is completed to the cleaning unit, and the surface of the chip pedestal 3 is brushed by a rotating brush (not shown).
The attached silicon debris is removed and collected in an exhaust duct (not shown).

With the above operation as one cycle, by repeating this operation, the bonding operation is repeated one after another, and when the set number of bondings are completed, the bonding operation is temporarily stopped and the tool cleaning operation is started.

In the tool cleaning, the bonding tool 17 is moved to a grindstone or a wire brush on a cleaning stage (not shown) through the bonding head 12 to carry out the tool cleaning for a set time and then return to the above-mentioned bonding cycle. It is a thing.

Although the case of the TAB type gang bonding has been described above, as another embodiment,
If the bonding head 12 is changed to one compatible with single point bonding, it can also be applied to single point bonding.

Further, in this embodiment, the number of divisions of the index table is four, but it is possible to increase or decrease the number of divisions.
Of course.

Therefore, a supply unit for supplying chips to a plurality of chip pedestals mounted on a rotary table driven intermittently, a position adjusting unit for adjusting the positions of the chips, and a bonding unit for bonding the chips to the inner leads. And a cleaning unit for cleaning the chip pedestal, which is a rotary table having a plurality of chip pedestals movably up and down and rotatable, and a fine adjustment unit in the XY directions. When,
By providing a means for correcting the angle of the chip pedestal by rotating and vertically sliding the chip pedestal, one chip pedestal mounts the chip and the other chip pedestal adjusts the chip position in parallel. Since the processing can be performed, it is possible to improve the bonding throughput.

Further, by providing the brush cleaning means as the cleaning section, it is possible to remove the crushed chips of the chips remaining on the chip pedestal. Therefore, cracking and chipping defects of the chips can be prevented at the time of bonding, and the yield is improved. It becomes possible to do.

As described above, the inventions made by the present inventor are
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

[0048]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

A supply unit for supplying chips to a plurality of chip pedestals mounted on a rotary table driven intermittently, a position adjusting unit for adjusting the positions of the chips, and a bonding unit for bonding the chips to the inner leads. An inner lead bonding apparatus comprising a cleaning unit for cleaning a chip pedestal, comprising a plurality of chip pedestals movably up and down and rotatable, and a rotary table provided with fine adjustment means in the XY directions. By providing a means for correcting the angle of the chip pedestal by rotating and vertically sliding the chip pedestal, one chip pedestal mounts the chip and the other chip pedestal adjusts the chip position in parallel. Because it can be processed
It is possible to improve the bonding throughput.

Further, by providing a brush cleaning means as the cleaning unit, it is possible to remove crushed chips of the chips remaining on the chip pedestal, so that cracking and chipping defects of the chips can be prevented during bonding and the yield is improved. It becomes possible to do.

[Brief description of drawings]

FIG. 1 is a diagram for explaining the configuration of an inner lead bonding apparatus that is an embodiment of the present invention.

FIG. 2 is a diagram for explaining a bonding portion shown in FIG.

FIG. 3 is a diagram for explaining an index table 4 shown in FIG.

4 is a diagram for explaining a configuration of a portion of the tip pedestal rotation angle adjustment mechanism / push-up mechanism 6 shown in FIG. 2 that comes into contact with the pedestal 3;

[Explanation of symbols]

1 ... Carrier tape, 2 ... Chip, 3 ... Chip cradle,
4 ... Rotation table (index table), 4a ... Tip cradle bearing, 5 ... Index drive (4 divisions), 6 ... Tip cradle rotation angle adjusting mechanism and push-up mechanism, 7 ... Recognition camera, 8 ... Head drive mechanism, 9 ... Chip transfer arm, 10 ... Chip tray, 11 ... Chip supply mechanism, 12 ... Bonding head, 13A, 13B ... X-
Y fine adjustment mechanism, 14 ... Tape guide, 15 ... Inner lead, 16 ... Tape holder, 17 ... Bonding tool, 18 ... Bump, 19 ... Image processing device, 20 ... Data processing device, 30a-30d ... Chip positioning claw.

Claims (1)

[Claims] 1. A supply unit that supplies chips to a plurality of chip pedestals mounted on a rotary table that is driven intermittently, a position adjustment unit that adjusts the positions of the chips, and a bonding unit that performs bonding between the chips and inner leads. And an inner lead bonding apparatus comprising a cleaning unit for cleaning the chip pedestal, wherein a plurality of chip pedestals are provided so as to be vertically movable and rotatable, and XY
Inner lead bonding, which is provided with a rotary table provided with a direction fine adjustment means, a means for correcting the angle of the chip receiving base by rotating, and a means for sliding the chip up and down, and brush cleaning means as the cleaning section. apparatus.