JPH068100Y2 - Wafer transfer push-up device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention relates to a wafer transfer push-up device used for manufacturing a semiconductor device.

When transferring the wafer in the carrier to another container,
A so-called push-up operation of pushing up the wafer from below is performed.

A wafer transfer push-up device as shown in FIG. 3 is used for this push-up operation.

In this apparatus, the push-up plate 2 is moved upward by the air cylinder 1 so that the push-up plate 2 is brought into contact with the lower end of the wafer in a carrier (not shown) to push up the wafer and the air cylinder 1
A sensor 5 for detecting the position of the piston 4 is provided to detect whether or not the push-up plate 2 is pushed up.

Problems to be Solved by the Invention In the conventional wafer transfer push-up device, the push-up plate 2 is formed of a single aluminum plate, stainless steel plate, or the like, and both side edges thereof are edge-processed, and both side edges thereof are processed. A guide roller 6 is provided in the.

However, since "warp" occurs in the push-up plate 2, a large friction is generated between the push-up plate 2 and the guide roller 6 every time the push-up plate 2 moves up and down, so that dust is generated and adheres to the wafer.

Further, when a plurality of push-up plates 2 are arranged, for example, 25, the guide roller 6 corresponding to each push-up plate 25 is provided, but this work is performed manually,
It takes a lot of time and is difficult to place in the correct position.

Therefore, since the push-up plate 2 is not in the correct position, the wafer holder 3 may not come to the predetermined position. Furthermore,
Since the guide roller 6 has a so-called "play" in the play, the push-up plate 2 may not vertically move vertically, and dust due to friction may be generated.

In view of the above circumstances, the present invention aims to prevent the generation of dust and accurately position the wafer holder at a predetermined position.

Means for Solving Problems The present invention is directed to a plurality of side blocks 2 having shaft holes 23.
0 and 21 are arranged in parallel, the vertical shaft 22 is inserted into the axial hole 23 through the guide bearing 24, the upper end of the vertical shaft 23 is inserted into the axial groove 17 of the wafer holder 18, and the lower end thereof is attached. A wafer transfer push-up device fixed to a vertically movable support plate, said side blocks 2 being arranged side by side.
Axial hole 23 for each 0 and 21 and 1 for each wafer holder arranged in parallel
The above object is achieved by a wafer transfer push-up device characterized in that eight axial grooves 17 are formed alternately with respect to the longitudinal direction thereof.

Action When the support plate moves upward due to the drive of the air cylinder,
The vertical shaft also moves in the same direction while being guided by the guide bearing built into the shaft hole of the side block. Then, the wafer holder contacts the lower end of the wafer in the carrier and pushes the wafer upward. Then, the air cylinder is driven to lower the support plate to its original position.

Further, since each shaft hole of the side block is machined at an accurate position, each wafer holder provided at the upper end of each vertical shaft is accurately positioned at a predetermined position.

Embodiment An embodiment of the present invention will be described with reference to the accompanying drawings.
In the figure, 10 is an air cylinder equipped with a sensor 12 for detecting the position of the piston 11, 13 is an exhaust fan, and 14 is a support plate consisting of a removable upper plate 14a and a lower plate 14b. Has an axial groove 15.

Reference numeral 16 is a connecting member, and a shaft groove 17 is formed in the lower portion thereof, and a fitting groove 19 for fitting with the lower portion of the wafer holder 18 is formed in the upper portion thereof.

Reference numerals 20 and 21 denote side blocks that support the vertical shaft 22, and are provided in parallel with each other at intervals in the vertical direction. The side blocks 20 and 21 are provided in FIGS.
As shown in the figure, a plurality of shaft holes 23 are formed at intervals in the longitudinal direction (lateral direction). This interval is adjusted to the size of the wafer pitch.

The plurality of shaft holes 23 are accurately formed by machining, and the shaft holes 23a and 23c and the shaft holes 23b and 23d are formed.
Are alternately formed and are located on different straight lines.

On the vertical straight line passing through the shaft holes 23a to 23d,
A plurality of shaft holes are provided in each case. In this shaft hole 23,
A guide bearing 24 is built in.

The vertical shaft 22 is formed in a cylindrical shape, and the shaft 22 is inserted into the shaft holes 23 of the blocks 20 and 21 via the guide bearing 24, and the lower end thereof is detachably attached to the shaft groove 15 of the upper plate 14a. It is fitted and the upper end thereof is detachably fitted in the shaft groove 17 of the connecting member 16.

The support plate 14 is individually provided corresponding to each wafer holder 18, and is independently driven.

Next, the operation of this embodiment will be described. The lower plate 14b
A support plate 14 is formed by stacking an upper plate 14a on the upper plate 14a.
a in the shaft groove 15 of a, the shaft holes 23 of the side blocks 20 and 21.
The lower end of the vertical shaft 22 inserted into the shaft is fitted, and the upper end is fitted into the shaft groove 17 of the connecting member 16. Then, the wafer holder 18 is inserted into the fitting groove 19 of the connecting member 16.

Next, the exhaust fan 13 is driven to prevent dust from rising near the carrier 27 on the stage 26, and
The air cylinder 10 is driven to move the support plate 14 to the carrier 2
Raise to 7.

When the support plate 14 rises, the vertical shaft 22 slides while being guided by the guide bearing 24, and the wafer holder 1
8 is raised to bring the holder 18 into contact with the wafer 28 as shown by the solid line in FIG.

Then, the holder 18 is further raised to a state 28A indicated by a chain line, and the wafer 28 is held by a wafer chuck (not shown) and transferred to another container.

Next, when the transfer is completed and the wafer 28 is exhausted from the carrier 27, the air cylinder 10 is operated to lower the support plate 14 to the original position.

The sensor 12 detects the position of the piston 11 to detect whether the wafer holder 18 is pushed up.

Effect of the Invention The present invention is configured as described above, and the wafer holder can be accurately positioned at a predetermined position, and the vertical movement performed through the vertical shaft can be smoothly performed without generating dust. You can

Further, since the shaft holes of the side blocks arranged in parallel and the shaft grooves of the wafer holder arranged in parallel are formed alternately with respect to the longitudinal direction thereof, the pitch between the adjacent wafers accommodated in the carrier is Even if the width is narrow, for example, 4.7625 mm, the wafer holders can be arranged in parallel by arranging the vertical axis according to this pitch.

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 and 2 are views showing an embodiment of the present invention. FIG. 1 is a partially sectional plan view, FIG. 2 is a side block plan view, and FIG. [FIG. 6] is a plan view showing a conventional example. 14 ... Support plate, 18 ... Wafer holder, 20, 21 ...
… Side block, 22 …… Vertical axis, 23 …… Shaft hole, 2
4 ... Guide bearing

Claims (1)

[Scope of utility model registration request] 1. A plurality of side blocks (20, 21) having a shaft hole (23) are arranged in parallel, and a vertical shaft (22) is inserted into the shaft hole (23) through a guide bearing (24). A wafer transfer push-up device in which the upper end of the vertical shaft (23) is inserted into the shaft groove (17) of the wafer holder (18), and the lower end of the vertical shaft (23) is fixed to a vertically movable support plate (14). The axial holes (23) of each of the side blocks (20, 21) arranged in parallel and the axial groove (17) of each of the wafer holders (18) arranged in parallel are formed alternately in the longitudinal direction. Characteristic wafer transfer push-up device.