SG11201906676XA - Electrostatic substrate holder - Google Patents

Electrostatic substrate holder

Info

Publication number
SG11201906676XA
SG11201906676XA SG11201906676XA SG11201906676XA SG11201906676XA SG 11201906676X A SG11201906676X A SG 11201906676XA SG 11201906676X A SG11201906676X A SG 11201906676XA SG 11201906676X A SG11201906676X A SG 11201906676XA SG 11201906676X A SG11201906676X A SG 11201906676XA
Authority
SG
Singapore
Prior art keywords
substrate holder
electrostatic substrate
electrostatic
holder
substrate
Prior art date
Application number
SG11201906676XA
Inventor
Christoph Flötgen
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201906676XA publication Critical patent/SG11201906676XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Electrostatic substrate holder An electrostatic substrate holder is suggested for accommodating and holding a substrate. Figure 1.
SG11201906676XA 2017-03-09 2017-03-09 Electrostatic substrate holder SG11201906676XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/055608 WO2018162070A1 (en) 2017-03-09 2017-03-09 Electrostatic substrate retainer

Publications (1)

Publication Number Publication Date
SG11201906676XA true SG11201906676XA (en) 2019-08-27

Family

ID=58266617

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201906676XA SG11201906676XA (en) 2017-03-09 2017-03-09 Electrostatic substrate holder

Country Status (8)

Country Link
US (1) US11270902B2 (en)
EP (1) EP3593379B1 (en)
JP (1) JP6985399B2 (en)
KR (1) KR102371870B1 (en)
CN (1) CN110431659B (en)
SG (1) SG11201906676XA (en)
TW (1) TWI700771B (en)
WO (1) WO2018162070A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11240411B2 (en) * 2019-06-26 2022-02-01 Magna Electronics Inc. Vehicular camera with controlled camera focus
US11579400B2 (en) 2019-10-08 2023-02-14 Magna Electronics Inc. Vehicular camera with adhesive disposed between non-axially opposed surfaces of the lens barrel and PCB structure
US11635672B2 (en) 2020-06-08 2023-04-25 Magna Electronics Inc. Vehicular camera assembly process using welding to secure lens relative to camera image plane

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US5982986A (en) * 1995-02-03 1999-11-09 Applied Materials, Inc. Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
JP3419204B2 (en) * 1995-06-13 2003-06-23 日新電機株式会社 Rotating part current transmission mechanism
TW298660B (en) * 1995-06-13 1997-02-21 Nisshin Denki Kk
US5790365A (en) * 1996-07-31 1998-08-04 Applied Materials, Inc. Method and apparatus for releasing a workpiece from and electrostatic chuck
JP4386983B2 (en) * 1998-02-25 2009-12-16 キヤノンアネルバ株式会社 Substrate processing apparatus, multi-chamber substrate processing apparatus, and electronic device manufacturing method
JP3437520B2 (en) * 2000-03-01 2003-08-18 キヤノン株式会社 Electrostatic actuator driving mechanism, electrostatic actuator driving method, and electrostatic actuator, rotation stage, and polygon mirror using the same
JP4745556B2 (en) * 2001-08-20 2011-08-10 キヤノン株式会社 Positioning apparatus, exposure apparatus, and device manufacturing method
JP3688243B2 (en) 2002-02-18 2005-08-24 株式会社日立国際電気 Semiconductor manufacturing equipment
JP3748559B2 (en) * 2003-06-30 2006-02-22 キヤノン株式会社 Stage apparatus, exposure apparatus, charged beam drawing apparatus, device manufacturing method, substrate potential measuring method, and electrostatic chuck
JP4368739B2 (en) * 2004-05-21 2009-11-18 アルプス電気株式会社 Electrostatic suction drive device
JP4395752B2 (en) 2004-12-22 2010-01-13 日本精工株式会社 Rotation holding device
KR101153118B1 (en) * 2005-10-12 2012-06-07 파나소닉 주식회사 Plasma processing apparatus and plasma processing method
US7511935B2 (en) * 2006-02-27 2009-03-31 Applied Materials, Israel, Ltd. Electrostatic chuck and method of its manufacture
JP4768699B2 (en) 2006-11-30 2011-09-07 キヤノンアネルバ株式会社 Power introduction apparatus and film forming method
US7898204B2 (en) * 2007-01-05 2011-03-01 Active Precision, Inc. High-speed substrate manipulator
JP5505305B2 (en) * 2008-08-08 2014-05-28 旭硝子株式会社 Substrate holding device, substrate holding method, and laminated glass manufacturing method
DE102009018156A1 (en) 2009-04-21 2010-11-18 Ev Group Gmbh Apparatus and method for separating a substrate from a carrier substrate
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US20110102761A1 (en) * 2009-09-28 2011-05-05 Nikon Corporation Stage apparatus, exposure apparatus, and device fabricating method
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WO2012011149A1 (en) 2010-07-21 2012-01-26 キヤノンアネルバ株式会社 Power input device and vacuum processing apparatus using power input device
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JP5994306B2 (en) 2012-03-15 2016-09-21 ソニー株式会社 Information processing apparatus, information processing system, and program
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EP2752870A1 (en) * 2013-01-04 2014-07-09 Süss Microtec Lithography GmbH Chuck, in particular for use in a mask aligner
KR101489074B1 (en) * 2013-07-01 2015-02-04 주식회사 야스 Electrostatic floating substrate transportation system applied for cluster equipment
US9853579B2 (en) * 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck
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Also Published As

Publication number Publication date
CN110431659B (en) 2023-11-24
EP3593379B1 (en) 2023-08-16
JP2020511776A (en) 2020-04-16
KR102371870B1 (en) 2022-03-07
WO2018162070A1 (en) 2018-09-13
US11270902B2 (en) 2022-03-08
EP3593379A1 (en) 2020-01-15
TWI700771B (en) 2020-08-01
KR20190120180A (en) 2019-10-23
JP6985399B2 (en) 2021-12-22
TW201842621A (en) 2018-12-01
CN110431659A (en) 2019-11-08
US20190355606A1 (en) 2019-11-21

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