SG11201900926XA - Ring for electrode - Google Patents
Ring for electrodeInfo
- Publication number
- SG11201900926XA SG11201900926XA SG11201900926XA SG11201900926XA SG11201900926XA SG 11201900926X A SG11201900926X A SG 11201900926XA SG 11201900926X A SG11201900926X A SG 11201900926XA SG 11201900926X A SG11201900926X A SG 11201900926XA SG 11201900926X A SG11201900926X A SG 11201900926XA
- Authority
- SG
- Singapore
- Prior art keywords
- ring
- electrode
- joining
- silicon members
- joining part
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 229910052810 boron oxide Inorganic materials 0.000 abstract 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Analytical Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Motor Or Generator Current Collectors (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Catalysts (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
A ring for an electrode includes three or more silicon members (38) having an arc shape and a joining part joining the silicon members (38). The joining part contains boron oxide.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016153986A JP6146839B1 (en) | 2016-08-04 | 2016-08-04 | Ring for electrode |
PCT/JP2017/027559 WO2018025780A1 (en) | 2016-08-04 | 2017-07-28 | Ring for electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201900926XA true SG11201900926XA (en) | 2019-02-27 |
Family
ID=59061204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201900926XA SG11201900926XA (en) | 2016-08-04 | 2017-07-28 | Ring for electrode |
Country Status (8)
Country | Link |
---|---|
US (1) | US11380525B2 (en) |
EP (1) | EP3496134B1 (en) |
JP (1) | JP6146839B1 (en) |
KR (1) | KR102378968B1 (en) |
CN (1) | CN109564869B (en) |
SG (1) | SG11201900926XA (en) |
TW (1) | TWI743158B (en) |
WO (1) | WO2018025780A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6146840B1 (en) * | 2016-08-04 | 2017-06-14 | 日本新工芯技株式会社 | Electrode plate |
CN111863578B (en) * | 2019-04-28 | 2023-06-16 | 中微半导体设备(上海)股份有限公司 | Plasma processing equipment |
KR102549935B1 (en) * | 2021-04-28 | 2023-06-30 | 주식회사 월덱스 | Multi-body limited ring for plasma etching equipment |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB918143A (en) * | 1960-07-18 | 1963-02-13 | M O Valve Co Ltd | Improvements in or relating to the formation of flanges on glass tubes |
KR930010973B1 (en) * | 1990-07-31 | 1993-11-18 | 삼성전자 주식회사 | Manufacturing method of silicon-on-insulator wafer |
JP3462458B2 (en) * | 1995-01-13 | 2003-11-05 | 日本碍子株式会社 | High pressure discharge lamp and manufacturing method thereof |
JP3511233B2 (en) * | 1999-09-30 | 2004-03-29 | 富士通株式会社 | Silicon lens |
JP2001324660A (en) * | 2000-05-16 | 2001-11-22 | Sony Corp | Focus ring attaching structure for optical equipment |
JP3393118B2 (en) | 2000-12-21 | 2003-04-07 | 株式会社半導体先端テクノロジーズ | Plasma etching apparatus and method of manufacturing semiconductor device |
JP2003100713A (en) * | 2001-09-26 | 2003-04-04 | Kawasaki Microelectronics Kk | Cover for plasma electrode |
US7083694B2 (en) | 2003-04-23 | 2006-08-01 | Integrated Materials, Inc. | Adhesive of a silicon and silica composite particularly useful for joining silicon parts |
US7074693B2 (en) * | 2003-06-24 | 2006-07-11 | Integrated Materials, Inc. | Plasma spraying for joining silicon parts |
JP4905855B2 (en) * | 2007-03-29 | 2012-03-28 | 三菱マテリアル株式会社 | Focus ring and shield ring for plasma etching |
JP2008300425A (en) * | 2007-05-29 | 2008-12-11 | Union Material Kk | Bonding method of silicon crystals, and silicon crystal product |
JP5046859B2 (en) * | 2007-10-30 | 2012-10-10 | 京セラ株式会社 | Bonded body, adsorbing member, adsorbing apparatus and processing apparatus |
JP2009290087A (en) * | 2008-05-30 | 2009-12-10 | Tokyo Electron Ltd | Focus ring, and plasma processing apparatus |
JP5100617B2 (en) * | 2008-11-07 | 2012-12-19 | 東京エレクトロン株式会社 | Ring-shaped member and manufacturing method thereof |
JP2011003730A (en) * | 2009-06-18 | 2011-01-06 | Mitsubishi Materials Corp | Silicon ring for plasma treatment apparatus |
JP5618505B2 (en) * | 2009-07-30 | 2014-11-05 | テクノクオーツ株式会社 | Recycling method of quartz glass member |
JP5727798B2 (en) * | 2010-07-23 | 2015-06-03 | アルプス電気株式会社 | MEMS sensor |
JP5719599B2 (en) | 2011-01-07 | 2015-05-20 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP5949760B2 (en) * | 2011-05-27 | 2016-07-13 | 株式会社ニコン | CaF2 polycrystal, focus ring, plasma processing apparatus, and method for producing CaF2 polycrystal |
JP5893516B2 (en) * | 2012-06-22 | 2016-03-23 | 東京エレクトロン株式会社 | Processing apparatus for processing object and mounting table for processing object |
JP5978105B2 (en) * | 2012-11-08 | 2016-08-24 | 株式会社東芝 | Silicon carbide ceramic joined body and method for producing silicon carbide ceramic joined body |
DE102013003401A1 (en) * | 2013-02-28 | 2014-08-28 | Klinger Ag | Flat gasket for flange connections |
JP2015065024A (en) * | 2013-09-25 | 2015-04-09 | 株式会社ニコン | Plasma processing apparatus, plasma processing method and ring member |
JP5615454B1 (en) * | 2014-02-25 | 2014-10-29 | コバレントマテリアル株式会社 | Focus ring |
US20170056994A1 (en) * | 2015-08-28 | 2017-03-02 | Lam Research Corporation | Liquid phase bonding of a silicon or silicon carbide component to another silicon or silicon carbide component |
-
2016
- 2016-08-04 JP JP2016153986A patent/JP6146839B1/en active Active
-
2017
- 2017-07-28 KR KR1020197005344A patent/KR102378968B1/en active IP Right Grant
- 2017-07-28 EP EP17836885.8A patent/EP3496134B1/en active Active
- 2017-07-28 WO PCT/JP2017/027559 patent/WO2018025780A1/en unknown
- 2017-07-28 CN CN201780047690.8A patent/CN109564869B/en active Active
- 2017-07-28 US US16/322,951 patent/US11380525B2/en active Active
- 2017-07-28 SG SG11201900926XA patent/SG11201900926XA/en unknown
- 2017-08-04 TW TW106126328A patent/TWI743158B/en active
Also Published As
Publication number | Publication date |
---|---|
JP2018022801A (en) | 2018-02-08 |
TW201807751A (en) | 2018-03-01 |
TWI743158B (en) | 2021-10-21 |
WO2018025780A1 (en) | 2018-02-08 |
US11380525B2 (en) | 2022-07-05 |
CN109564869A (en) | 2019-04-02 |
EP3496134B1 (en) | 2021-05-26 |
EP3496134A4 (en) | 2020-03-18 |
EP3496134A1 (en) | 2019-06-12 |
CN109564869B (en) | 2024-01-30 |
JP6146839B1 (en) | 2017-06-14 |
KR20190034578A (en) | 2019-04-02 |
US20190164728A1 (en) | 2019-05-30 |
KR102378968B1 (en) | 2022-03-24 |
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