JP5156784B2 - プリント配線板用銅箔及びそれを用いた積層体 - Google Patents

プリント配線板用銅箔及びそれを用いた積層体 Download PDF

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Publication number
JP5156784B2
JP5156784B2 JP2010077964A JP2010077964A JP5156784B2 JP 5156784 B2 JP5156784 B2 JP 5156784B2 JP 2010077964 A JP2010077964 A JP 2010077964A JP 2010077964 A JP2010077964 A JP 2010077964A JP 5156784 B2 JP5156784 B2 JP 5156784B2
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JP
Japan
Prior art keywords
copper foil
copper
printed wiring
etching
coating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010077964A
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English (en)
Japanese (ja)
Other versions
JP2011210996A (ja
Inventor
秀樹 古澤
美里 中願寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2010077964A priority Critical patent/JP5156784B2/ja
Priority to CN201180016688.7A priority patent/CN102812786B/zh
Priority to KR1020127027718A priority patent/KR101375426B1/ko
Priority to TW100110724A priority patent/TWI423742B/zh
Priority to PCT/JP2011/057892 priority patent/WO2011122643A1/ja
Publication of JP2011210996A publication Critical patent/JP2011210996A/ja
Application granted granted Critical
Publication of JP5156784B2 publication Critical patent/JP5156784B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • ing And Chemical Polishing (AREA)
  • Physical Vapour Deposition (AREA)
JP2010077964A 2010-03-30 2010-03-30 プリント配線板用銅箔及びそれを用いた積層体 Active JP5156784B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010077964A JP5156784B2 (ja) 2010-03-30 2010-03-30 プリント配線板用銅箔及びそれを用いた積層体
CN201180016688.7A CN102812786B (zh) 2010-03-30 2011-03-29 印刷布线板用铜箔以及使用该铜箔的层叠体
KR1020127027718A KR101375426B1 (ko) 2010-03-30 2011-03-29 프린트 배선판용 동박 및 그것을 사용한 적층체
TW100110724A TWI423742B (zh) 2010-03-30 2011-03-29 Printed wiring board with copper foil and the use of its layered body
PCT/JP2011/057892 WO2011122643A1 (ja) 2010-03-30 2011-03-29 プリント配線板用銅箔及びそれを用いた積層体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010077964A JP5156784B2 (ja) 2010-03-30 2010-03-30 プリント配線板用銅箔及びそれを用いた積層体

Publications (2)

Publication Number Publication Date
JP2011210996A JP2011210996A (ja) 2011-10-20
JP5156784B2 true JP5156784B2 (ja) 2013-03-06

Family

ID=44712338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010077964A Active JP5156784B2 (ja) 2010-03-30 2010-03-30 プリント配線板用銅箔及びそれを用いた積層体

Country Status (5)

Country Link
JP (1) JP5156784B2 (ko)
KR (1) KR101375426B1 (ko)
CN (1) CN102812786B (ko)
TW (1) TWI423742B (ko)
WO (1) WO2011122643A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229851A (ja) * 2012-03-30 2013-11-07 Tdk Corp 高周波伝送線路、アンテナ及び電子回路基板
CN106164327B (zh) * 2014-09-19 2018-01-30 三井金属矿业株式会社 表面处理铜箔及其制造方法、印刷电路板用覆铜层叠板、以及印刷电路板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338619A (en) * 1991-05-16 1994-08-16 Fukuda Metal Foil And Powder Co., Ltd. Copper foil for printed circuits and method of producing same
CN1111567A (zh) * 1993-12-28 1995-11-15 日本电解株式会社 敷铜箔层压板，多层印刷电路板及其处理方法
JPH07314603A (ja) * 1993-12-28 1995-12-05 Nippon Denkai Kk 銅張積層体、多層プリント回路板及びそれらの処理方法
JPH08309918A (ja) * 1995-05-22 1996-11-26 Nippon Denkai Kk 銅張積層板とそれを用いたプリント回路板およびこれらの製法
JPH0974273A (ja) * 1995-06-27 1997-03-18 Nippon Denkai Kk プリント回路用銅張積層板とその接着剤
JP2001111201A (ja) 1999-10-14 2001-04-20 Matsushita Electric Ind Co Ltd 配線板の製造方法およびそれを用いて製造された配線板
JP4486196B2 (ja) * 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法
CN1212753C (zh) * 2001-06-19 2005-07-27 华通电脑股份有限公司 在有纤基板上形成高密度超细线路的方法
JP2005101398A (ja) * 2003-09-26 2005-04-14 Mitsui Mining & Smelting Co Ltd 銀系被覆層付銅箔及びその銀系被覆層付銅箔を用いた銅張積層板
WO2009034764A1 (ja) * 2007-09-10 2009-03-19 Sumitomo Metal Mining Co., Ltd. プリント配線基板の製造方法および該製造方法により得られたプリント配線基板
JP2009176889A (ja) * 2008-01-23 2009-08-06 Hitachi Chem Co Ltd 多層プリント配線板用絶縁樹脂組成物、支持体付き絶縁フィルム、多層プリント配線板及びその製造方法
JP5307117B2 (ja) * 2008-03-04 2013-10-02 日本ペイント株式会社 銅の表面処理剤および表面処理方法

Also Published As

Publication number Publication date
CN102812786A (zh) 2012-12-05
TWI423742B (zh) 2014-01-11
KR101375426B1 (ko) 2014-03-17
CN102812786B (zh) 2015-09-30
TW201212741A (en) 2012-03-16
KR20130021370A (ko) 2013-03-05
WO2011122643A1 (ja) 2011-10-06
JP2011210996A (ja) 2011-10-20

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