CN102812786A - 印刷布线板用铜箔以及使用该铜箔的层叠体 - Google Patents
印刷布线板用铜箔以及使用该铜箔的层叠体 Download PDFInfo
- Publication number
- CN102812786A CN102812786A CN2011800166887A CN201180016688A CN102812786A CN 102812786 A CN102812786 A CN 102812786A CN 2011800166887 A CN2011800166887 A CN 2011800166887A CN 201180016688 A CN201180016688 A CN 201180016688A CN 102812786 A CN102812786 A CN 102812786A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- copper
- wiring board
- coating
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 128
- 239000011889 copper foil Substances 0.000 title claims abstract description 92
- 238000005530 etching Methods 0.000 claims abstract description 62
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 38
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000010931 gold Substances 0.000 claims abstract description 21
- 229910052737 gold Inorganic materials 0.000 claims abstract description 20
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 20
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims description 45
- 238000000576 coating method Methods 0.000 claims description 45
- 239000010949 copper Substances 0.000 claims description 33
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 229920005989 resin Chemical class 0.000 claims description 23
- 239000011347 resin Chemical class 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 21
- 229920001721 polyimide Polymers 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 6
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims 1
- 239000011295 pitch Substances 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 description 11
- 238000004544 sputter deposition Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000007788 roughening Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000000205 computational method Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229920006259 thermoplastic polyimide Polymers 0.000 description 2
- WBHAUHHMPXBZCQ-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound COC1=CC=CC(C)=C1O WBHAUHHMPXBZCQ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000006166 lysate Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NICDRCVJGXLKSF-UHFFFAOYSA-N nitric acid;trihydrochloride Chemical compound Cl.Cl.Cl.O[N+]([O-])=O NICDRCVJGXLKSF-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- ing And Chemical Polishing (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010077964A JP5156784B2 (ja) | 2010-03-30 | 2010-03-30 | プリント配線板用銅箔及びそれを用いた積層体 |
JP2010-077964 | 2010-03-30 | ||
PCT/JP2011/057892 WO2011122643A1 (ja) | 2010-03-30 | 2011-03-29 | プリント配線板用銅箔及びそれを用いた積層体 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102812786A true CN102812786A (zh) | 2012-12-05 |
CN102812786B CN102812786B (zh) | 2015-09-30 |
Family
ID=44712338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180016688.7A Expired - Fee Related CN102812786B (zh) | 2010-03-30 | 2011-03-29 | 印刷布线板用铜箔以及使用该铜箔的层叠体 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5156784B2 (zh) |
KR (1) | KR101375426B1 (zh) |
CN (1) | CN102812786B (zh) |
TW (1) | TWI423742B (zh) |
WO (1) | WO2011122643A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106164327A (zh) * | 2014-09-19 | 2016-11-23 | 三井金属矿业株式会社 | 表面处理铜箔及其制造方法、印刷电路板用覆铜层叠板、以及印刷电路板 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013229851A (ja) * | 2012-03-30 | 2013-11-07 | Tdk Corp | 高周波伝送線路、アンテナ及び電子回路基板 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5338619A (en) * | 1991-05-16 | 1994-08-16 | Fukuda Metal Foil And Powder Co., Ltd. | Copper foil for printed circuits and method of producing same |
CN1111567A (zh) * | 1993-12-28 | 1995-11-15 | 日本电解株式会社 | 敷铜箔层压板,多层印刷电路板及其处理方法 |
CN1346309A (zh) * | 1999-12-08 | 2002-04-24 | 揖斐电株式会社 | 敷铜层叠板和印刷布线板用电路基板及其制造方法 |
CN1392758A (zh) * | 2001-06-19 | 2003-01-22 | 华通电脑股份有限公司 | 在有纤基板上形成高密度超细线路的方法 |
JP2005101398A (ja) * | 2003-09-26 | 2005-04-14 | Mitsui Mining & Smelting Co Ltd | 銀系被覆層付銅箔及びその銀系被覆層付銅箔を用いた銅張積層板 |
JP2009176889A (ja) * | 2008-01-23 | 2009-08-06 | Hitachi Chem Co Ltd | 多層プリント配線板用絶縁樹脂組成物、支持体付き絶縁フィルム、多層プリント配線板及びその製造方法 |
CN101690429A (zh) * | 2007-09-10 | 2010-03-31 | 住友金属矿山株式会社 | 印刷布线基板的制造方法及由该制造方法所得的印刷布线基板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07314603A (ja) * | 1993-12-28 | 1995-12-05 | Nippon Denkai Kk | 銅張積層体、多層プリント回路板及びそれらの処理方法 |
JPH08309918A (ja) * | 1995-05-22 | 1996-11-26 | Nippon Denkai Kk | 銅張積層板とそれを用いたプリント回路板およびこれらの製法 |
JPH0974273A (ja) * | 1995-06-27 | 1997-03-18 | Nippon Denkai Kk | プリント回路用銅張積層板とその接着剤 |
JP2001111201A (ja) | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 配線板の製造方法およびそれを用いて製造された配線板 |
JP5307117B2 (ja) * | 2008-03-04 | 2013-10-02 | 日本ペイント株式会社 | 銅の表面処理剤および表面処理方法 |
-
2010
- 2010-03-30 JP JP2010077964A patent/JP5156784B2/ja active Active
-
2011
- 2011-03-29 WO PCT/JP2011/057892 patent/WO2011122643A1/ja active Application Filing
- 2011-03-29 KR KR1020127027718A patent/KR101375426B1/ko not_active IP Right Cessation
- 2011-03-29 CN CN201180016688.7A patent/CN102812786B/zh not_active Expired - Fee Related
- 2011-03-29 TW TW100110724A patent/TWI423742B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5338619A (en) * | 1991-05-16 | 1994-08-16 | Fukuda Metal Foil And Powder Co., Ltd. | Copper foil for printed circuits and method of producing same |
CN1111567A (zh) * | 1993-12-28 | 1995-11-15 | 日本电解株式会社 | 敷铜箔层压板,多层印刷电路板及其处理方法 |
CN1346309A (zh) * | 1999-12-08 | 2002-04-24 | 揖斐电株式会社 | 敷铜层叠板和印刷布线板用电路基板及其制造方法 |
CN1392758A (zh) * | 2001-06-19 | 2003-01-22 | 华通电脑股份有限公司 | 在有纤基板上形成高密度超细线路的方法 |
JP2005101398A (ja) * | 2003-09-26 | 2005-04-14 | Mitsui Mining & Smelting Co Ltd | 銀系被覆層付銅箔及びその銀系被覆層付銅箔を用いた銅張積層板 |
CN101690429A (zh) * | 2007-09-10 | 2010-03-31 | 住友金属矿山株式会社 | 印刷布线基板的制造方法及由该制造方法所得的印刷布线基板 |
JP2009176889A (ja) * | 2008-01-23 | 2009-08-06 | Hitachi Chem Co Ltd | 多層プリント配線板用絶縁樹脂組成物、支持体付き絶縁フィルム、多層プリント配線板及びその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106164327A (zh) * | 2014-09-19 | 2016-11-23 | 三井金属矿业株式会社 | 表面处理铜箔及其制造方法、印刷电路板用覆铜层叠板、以及印刷电路板 |
US10645809B2 (en) | 2014-09-19 | 2020-05-05 | Mitsui Mining & Smelting Co., Ltd. | Surface-treated copper foil, method for producing same, copper-clad laminate for printed wiring board, and printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
CN102812786B (zh) | 2015-09-30 |
TW201212741A (en) | 2012-03-16 |
KR20130021370A (ko) | 2013-03-05 |
WO2011122643A1 (ja) | 2011-10-06 |
TWI423742B (zh) | 2014-01-11 |
JP5156784B2 (ja) | 2013-03-06 |
KR101375426B1 (ko) | 2014-03-17 |
JP2011210996A (ja) | 2011-10-20 |
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