JP5116268B2 - 積層型半導体装置およびその製造方法 - Google Patents

積層型半導体装置およびその製造方法 Download PDF

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Publication number
JP5116268B2
JP5116268B2 JP2006224310A JP2006224310A JP5116268B2 JP 5116268 B2 JP5116268 B2 JP 5116268B2 JP 2006224310 A JP2006224310 A JP 2006224310A JP 2006224310 A JP2006224310 A JP 2006224310A JP 5116268 B2 JP5116268 B2 JP 5116268B2
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Prior art keywords
semiconductor device
layer
thermosetting resin
stacked
solder
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Expired - Fee Related
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JP2006224310A
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Japanese (ja)
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JP2007096278A5 (enExample
JP2007096278A (ja
Inventor
岳洋 鈴木
靖 竹内
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Canon Inc
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Canon Inc
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Priority to JP2006224310A priority Critical patent/JP5116268B2/ja
Priority to US11/468,181 priority patent/US20070045788A1/en
Publication of JP2007096278A publication Critical patent/JP2007096278A/ja
Priority to US12/501,939 priority patent/US7863101B2/en
Publication of JP2007096278A5 publication Critical patent/JP2007096278A5/ja
Priority to US12/958,584 priority patent/US20110084405A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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US11/468,181 US20070045788A1 (en) 2005-08-31 2006-08-29 Stacking semiconductor device and production method thereof
US12/501,939 US7863101B2 (en) 2005-08-31 2009-07-13 Stacking semiconductor device and production method thereof
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