JP5090610B2 - フリップチップボンディング用に事前にアンダーフィルを施したはんだバンプウエハの溶剤バニッシング - Google Patents

フリップチップボンディング用に事前にアンダーフィルを施したはんだバンプウエハの溶剤バニッシング Download PDF

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Publication number
JP5090610B2
JP5090610B2 JP2002537050A JP2002537050A JP5090610B2 JP 5090610 B2 JP5090610 B2 JP 5090610B2 JP 2002537050 A JP2002537050 A JP 2002537050A JP 2002537050 A JP2002537050 A JP 2002537050A JP 5090610 B2 JP5090610 B2 JP 5090610B2
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adhesive
chip
bump
bumps
integrated circuit
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Japanese (ja)
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JP2004512684A5 (ko
JP2004512684A (ja
Inventor
ビー． ホガートン，ピーター
ワイ． チェン，ケビン
エー． ガーバー，ジョエル
エル．ディー． ゼンナー，ロバート
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3M Innovative Properties Co
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3M Innovative Properties Co
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Priority claimed from US09/690,600 external-priority patent/US7170185B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP2002537050A 2000-10-17 2001-01-25 フリップチップボンディング用に事前にアンダーフィルを施したはんだバンプウエハの溶剤バニッシング Expired - Fee Related JP5090610B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/690,600 US7170185B1 (en) 1997-12-08 2000-10-17 Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding
US09/690,600 2000-10-17
PCT/US2001/002385 WO2002033750A1 (en) 2000-10-17 2001-01-25 Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchip bonding

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JP2004512684A (ja) 2004-04-22
WO2002033750A1 (en) 2002-04-25
EP1327264A1 (en) 2003-07-16
CN1470068A (zh) 2004-01-21

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