CN1270375C - 集成电路芯片与电路基片的连接方法及其应用 - Google Patents

集成电路芯片与电路基片的连接方法及其应用 Download PDF

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Publication number
CN1270375C
CN1270375C CNB018173675A CN01817367A CN1270375C CN 1270375 C CN1270375 C CN 1270375C CN B018173675 A CNB018173675 A CN B018173675A CN 01817367 A CN01817367 A CN 01817367A CN 1270375 C CN1270375 C CN 1270375C
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adhesive
chip
projection
integrated circuit
conductivity
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Chinese (zh)
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CN1470068A (zh
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P·B·霍格通
K·Y·陈
J·A·格伯
R·L·D·泽纳
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3M Innovative Properties Co
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3M Innovative Properties Co
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Priority claimed from US09/690,600 external-priority patent/US7170185B1/en
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
CNB018173675A 2000-10-17 2001-01-25 集成电路芯片与电路基片的连接方法及其应用 Expired - Fee Related CN1270375C (zh)

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US09/690,600 US7170185B1 (en) 1997-12-08 2000-10-17 Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding
US09/690,600 2000-10-17

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CN1470068A (zh) 2004-01-21
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JP5090610B2 (ja) 2012-12-05
KR20030060913A (ko) 2003-07-16
WO2002033750A1 (en) 2002-04-25

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