JP5078000B2 - 研磨パッド - Google Patents

研磨パッド Download PDF

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Publication number
JP5078000B2
JP5078000B2 JP2007084785A JP2007084785A JP5078000B2 JP 5078000 B2 JP5078000 B2 JP 5078000B2 JP 2007084785 A JP2007084785 A JP 2007084785A JP 2007084785 A JP2007084785 A JP 2007084785A JP 5078000 B2 JP5078000 B2 JP 5078000B2
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JP
Japan
Prior art keywords
isocyanate
polishing
polishing pad
molecular weight
polyurethane foam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007084785A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008238361A (ja
Inventor
良之 中井
淳 数野
毅 木村
哲生 下村
一幸 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Tire Corp
Original Assignee
Toyo Tire and Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire and Rubber Co Ltd filed Critical Toyo Tire and Rubber Co Ltd
Priority to JP2007084785A priority Critical patent/JP5078000B2/ja
Priority to KR1020097012467A priority patent/KR101475766B1/ko
Priority to PCT/JP2008/054583 priority patent/WO2008126611A1/ja
Priority to US12/593,206 priority patent/US8865785B2/en
Priority to CN2008800089056A priority patent/CN101636248B/zh
Priority to TW097109615A priority patent/TW200846381A/zh
Publication of JP2008238361A publication Critical patent/JP2008238361A/ja
Application granted granted Critical
Publication of JP5078000B2 publication Critical patent/JP5078000B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4833—Polyethers containing oxyethylene units
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
    • C08G18/724—Combination of aromatic polyisocyanates with (cyclo)aliphatic polyisocyanates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0025—Foam properties rigid

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polyurethanes Or Polyureas (AREA)
JP2007084785A 2007-03-28 2007-03-28 研磨パッド Active JP5078000B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007084785A JP5078000B2 (ja) 2007-03-28 2007-03-28 研磨パッド
KR1020097012467A KR101475766B1 (ko) 2007-03-28 2008-03-13 연마 패드
PCT/JP2008/054583 WO2008126611A1 (ja) 2007-03-28 2008-03-13 研磨パッド
US12/593,206 US8865785B2 (en) 2007-03-28 2008-03-13 Polishing pad
CN2008800089056A CN101636248B (zh) 2007-03-28 2008-03-13 研磨垫
TW097109615A TW200846381A (en) 2007-03-28 2008-03-19 Polishing pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007084785A JP5078000B2 (ja) 2007-03-28 2007-03-28 研磨パッド

Publications (2)

Publication Number Publication Date
JP2008238361A JP2008238361A (ja) 2008-10-09
JP5078000B2 true JP5078000B2 (ja) 2012-11-21

Family

ID=39863741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007084785A Active JP5078000B2 (ja) 2007-03-28 2007-03-28 研磨パッド

Country Status (6)

Country Link
US (1) US8865785B2 (https=)
JP (1) JP5078000B2 (https=)
KR (1) KR101475766B1 (https=)
CN (1) CN101636248B (https=)
TW (1) TW200846381A (https=)
WO (1) WO2008126611A1 (https=)

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WO2006123559A1 (ja) 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
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JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
CN102152233B (zh) * 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
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JP5629749B2 (ja) * 2012-12-28 2014-11-26 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5661129B2 (ja) * 2013-01-29 2015-01-28 東洋ゴム工業株式会社 研磨パッド
JP2014205215A (ja) * 2013-04-12 2014-10-30 東洋ゴム工業株式会社 研磨パッドの製造方法
CN103333313B (zh) * 2013-06-09 2015-11-18 合肥宏光研磨科技有限公司 一种聚氨酯抛光材料的制造方法
KR102277418B1 (ko) * 2019-05-21 2021-07-14 에스케이씨솔믹스 주식회사 가교 밀도가 향상된 연마패드 및 이의 제조방법
TWI827890B (zh) * 2019-10-23 2024-01-01 南韓商Ｓｋ恩普士股份有限公司 用於研磨墊之組成物及研磨墊
KR102287235B1 (ko) * 2019-10-30 2021-08-06 에스케이씨솔믹스 주식회사 가교도가 조절된 연마패드 및 이의 제조방법
CN113084695B (zh) * 2021-03-12 2022-05-13 安徽禾臣新材料有限公司 一种电子显示屏精抛用缓冲抛光垫及其生产方法
CN117980109A (zh) * 2021-09-27 2024-05-03 株式会社可乐丽 抛光垫
BE1032688B1 (nl) * 2024-06-11 2026-01-22 Soudal Reactieve polyurethaan formuleringen met een laag monomeer gehalte

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US20100048102A1 (en) 2010-02-25
US8865785B2 (en) 2014-10-21

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