JP4960181B2 - 集積回路 - Google Patents
集積回路 Download PDFInfo
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- JP4960181B2 JP4960181B2 JP2007227411A JP2007227411A JP4960181B2 JP 4960181 B2 JP4960181 B2 JP 4960181B2 JP 2007227411 A JP2007227411 A JP 2007227411A JP 2007227411 A JP2007227411 A JP 2007227411A JP 4960181 B2 JP4960181 B2 JP 4960181B2
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- 239000000758 substrate Substances 0.000 claims description 95
- 239000004065 semiconductor Substances 0.000 claims description 36
- 125000006850 spacer group Chemical group 0.000 claims description 29
- 238000005530 etching Methods 0.000 description 24
- 229910052814 silicon oxide Inorganic materials 0.000 description 24
- 239000003990 capacitor Substances 0.000 description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 22
- 229910052581 Si3N4 Inorganic materials 0.000 description 21
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 20
- 238000000151 deposition Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 15
- 229910052799 carbon Inorganic materials 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 238000003860 storage Methods 0.000 description 14
- 230000008021 deposition Effects 0.000 description 13
- 239000011810 insulating material Substances 0.000 description 12
- 239000004020 conductor Substances 0.000 description 7
- 239000007772 electrode material Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000002955 isolation Methods 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 241000293849 Cordylanthus Species 0.000 description 1
- 229910004129 HfSiO Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910021480 group 4 element Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66621—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation using etching to form a recess at the gate location
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/05—Making the transistor
- H10B12/053—Making the transistor the transistor being at least partially in a trench in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Description
本発明は、トランジスタを含む集積回路に関する。
一般的に、ダイナミックランダムアクセスメモリ(DRAM)のメモリセルは、蓄積される情報を示す電荷を蓄積するためのストレージキャパシタと、ストレージキャパシタに接続されるアクセストランジスタとを含んでいる。アクセストランジスタは、第1及び第2のソース/ドレイン領域と、第1及び第2のソース/ドレイン領域間に流れる電流を制御するゲート電極と、第1及び第2のソース/ドレイン領域に接続するチャネルとを含んでいる。このトランジスタは、通常、少なくとも部分的に、半導体基板に形成される。ゲート電極は、ワード線の部分を形成しており、ゲート絶縁層によりチャネルと電気的に絶縁している。対応するワード線を介してアクセストランジスタにアクセスすることにより、ストレージキャパシタに蓄積された情報が読み出される。具体的には、情報は、ビット線接点を介して、対応するビット線に読み出される。
本発明によれば、トランジスタは、半導体基板に形成されており、この基板は、上表面を有する。上記トランジスタは、第1及び第2のソース/ドレイン領域と、上記第1及び第2のソース/ドレイン領域に接続するチャネル領域と、上記チャネルに流れる電流を制御するためのゲート電極とを備え、ゲート電極は、ゲート溝に配されている。上記ゲート溝は、半導体基板の上記基板上表面で規定されており、第1及び第2のソース/ドレイン領域は、少なくとも深さd1で延びている。深さd1は、上記基板の上表面から測定される。上記ゲート電極の上表面は、半導体基板の上表面の下に配されている。上記ゲート電極の上表面は、深さd1未満の深さd2で配されている。深さd2は、上記基板の上表面から測定される。
図1は、本発明の完成したトランジスタの断面図である。
以下、添付した図面を参照して説明する。添付図面は、発明の一部分を構成するものであり、本発明が実施されてもよい具体的な形態を示すものである。この際、「上」、「底」、「前」、「先頭」、「後尾」等といった方向を示す用語が、示される図の配置を参照して用いられる。本発明の実施形態の要素は、多くの異なる配置で配することが可能であるので、上記方向を示す用語は、説明のために用いるものであり、これに限定されない。他の形態が用いられ、構造的または理論的な変更が、本発明の範囲を逸脱しない範囲でなされてもよいことが理解されうる。それゆえ、以下の詳細な説明は、限定した意義として解釈されるものではない。本発明の範囲は、補足した請求項により規定される。
Claims (4)
- トランジスタを含む集積回路であって、
上記トランジスタは、
半導体基板に形成され、かつ該基板上表面に対し深さd1まで延びた、第1及び第2のソース/ドレイン領域と、
上記第1及び第2のソース/ドレイン領域に接続するチャネル領域と、
上記第1及び第2のソース/ドレイン領域間の上記基板上表面で規定されたゲート溝に配された、ゲート電極とを備え、
上記ゲート電極の上表面が、上記基板上表面と深さd1との間に配され、
第1及び第2のソース/ドレイン領域間を延びる直線で規定される第1の方向に対し垂直な断面において、
上記チャネル領域は、フィン様部分を備え、このフィン様部分は、上面及び2つの側面を有するリッジを含んでおり、
上記ゲート電極は、上記リッジの上面及び2つの側面を取り囲み、
さらに、真空スペーサを備え、
上記真空スペーサは、上記ゲート溝の側壁に隣接して配され、上記ゲート電極と半導体基板との間に配置されており、
上記真空スペーサの底面は、d1以下の深さで配されている、集積回路。 - 上記真空スペーサの底面は、上記ゲート電極の上表面の下に配されている請求項1に記載の集積回路。
- 上記真空スペーサの上表面は、上記ゲート電極の上表面と同じ深さに配されている請求項2に記載の集積回路。
- 上記真空スペーサの上表面および上記ゲート電極の上表面と、上記基板上表面との間の領域を満たす絶縁層をさらに備えている請求項3に記載の集積回路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/517,557 | 2006-09-08 | ||
US11/517,557 US7612406B2 (en) | 2006-09-08 | 2006-09-08 | Transistor, memory cell array and method of manufacturing a transistor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008078644A JP2008078644A (ja) | 2008-04-03 |
JP4960181B2 true JP4960181B2 (ja) | 2012-06-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007227411A Expired - Fee Related JP4960181B2 (ja) | 2006-09-08 | 2007-09-03 | 集積回路 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7612406B2 (ja) |
JP (1) | JP4960181B2 (ja) |
CN (1) | CN101140950A (ja) |
DE (1) | DE102006049158B4 (ja) |
TW (1) | TWI358821B (ja) |
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-
2006
- 2006-09-08 US US11/517,557 patent/US7612406B2/en not_active Expired - Fee Related
- 2006-10-18 DE DE102006049158A patent/DE102006049158B4/de not_active Expired - Fee Related
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2007
- 2007-08-27 TW TW096131743A patent/TWI358821B/zh not_active IP Right Cessation
- 2007-09-03 JP JP2007227411A patent/JP4960181B2/ja not_active Expired - Fee Related
- 2007-09-07 US US11/851,510 patent/US7763514B2/en not_active Expired - Fee Related
- 2007-09-07 CN CN200710146079.9A patent/CN101140950A/zh active Pending
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US20080061320A1 (en) | 2008-03-13 |
JP2008078644A (ja) | 2008-04-03 |
US7612406B2 (en) | 2009-11-03 |
US20080061322A1 (en) | 2008-03-13 |
US7763514B2 (en) | 2010-07-27 |
DE102006049158B4 (de) | 2008-07-03 |
DE102006049158A1 (de) | 2008-04-03 |
TW200818468A (en) | 2008-04-16 |
TWI358821B (en) | 2012-02-21 |
CN101140950A (zh) | 2008-03-12 |
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