JP4875281B2 - 非孔性球状シリカ及びその製造方法 - Google Patents

非孔性球状シリカ及びその製造方法 Download PDF

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Publication number
JP4875281B2
JP4875281B2 JP2002530416A JP2002530416A JP4875281B2 JP 4875281 B2 JP4875281 B2 JP 4875281B2 JP 2002530416 A JP2002530416 A JP 2002530416A JP 2002530416 A JP2002530416 A JP 2002530416A JP 4875281 B2 JP4875281 B2 JP 4875281B2
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JP
Japan
Prior art keywords
particle size
spherical silica
silica gel
firing
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2002530416A
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English (en)
Japanese (ja)
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JPWO2002026626A1 (ja
Inventor
康裕 溶原
正史 西田
輝男 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mitsubishi Chemical Corp, Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Chemical Corp
Priority to JP2002530416A priority Critical patent/JP4875281B2/ja
Publication of JPWO2002026626A1 publication Critical patent/JPWO2002026626A1/ja
Application granted granted Critical
Publication of JP4875281B2 publication Critical patent/JP4875281B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/126—Preparation of silica of undetermined type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/187—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates
    • C01B33/193—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates of aqueous solutions of silicates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Silicon Compounds (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2002530416A 2000-09-27 2001-09-26 非孔性球状シリカ及びその製造方法 Expired - Fee Related JP4875281B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002530416A JP4875281B2 (ja) 2000-09-27 2001-09-26 非孔性球状シリカ及びその製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000293643 2000-09-27
JP2000293643 2000-09-27
JP2000373580 2000-12-07
JP2000373580 2000-12-07
PCT/JP2001/008389 WO2002026626A1 (en) 2000-09-27 2001-09-26 Non-porous spherical silica and method for production thereof
JP2002530416A JP4875281B2 (ja) 2000-09-27 2001-09-26 非孔性球状シリカ及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2002026626A1 JPWO2002026626A1 (ja) 2004-02-05
JP4875281B2 true JP4875281B2 (ja) 2012-02-15

Family

ID=26600798

Family Applications (1)

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JP2002530416A Expired - Fee Related JP4875281B2 (ja) 2000-09-27 2001-09-26 非孔性球状シリカ及びその製造方法

Country Status (5)

Country Link
US (1) US7070748B2 (enExample)
JP (1) JP4875281B2 (enExample)
KR (1) KR100793503B1 (enExample)
TW (1) TWI293946B (enExample)
WO (1) WO2002026626A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE0403139D0 (sv) * 2004-12-23 2004-12-23 Nanoxis Ab Device and use thereof
EP1854769B1 (en) 2005-03-01 2012-01-25 Nikon Corporation Method of molding a synthetic quartz glass molded body
KR100651243B1 (ko) * 2005-03-04 2006-11-30 (주) 에스오씨 구형 실리카의 제조 방법
KR100759841B1 (ko) * 2005-10-12 2007-09-18 요업기술원 구형 실리카 나노 입자의 제조방법
JP2010069231A (ja) * 2008-09-22 2010-04-02 Fujifilm Corp 撮像装置及び内視鏡
JP5532258B2 (ja) * 2008-10-10 2014-06-25 住友ベークライト株式会社 半導体装置
WO2011083683A1 (ja) * 2010-01-07 2011-07-14 三菱マテリアル株式会社 合成非晶質シリカ粉末
JP5912249B2 (ja) * 2010-12-28 2016-04-27 日揮触媒化成株式会社 半導体装置実装用ペ−スト
JP5698087B2 (ja) * 2011-07-14 2015-04-08 株式会社トクヤマ 無機酸化物粉体
JP2016040393A (ja) * 2015-12-28 2016-03-24 日立化成株式会社 液状エポキシ樹脂組成物及び電子部品装置
WO2017130115A1 (en) * 2016-01-25 2017-08-03 King Abdullah University Of Science And Technology Methods of making silica nanoparticles, propellants, and safety devices
JP6233441B2 (ja) * 2016-04-15 2017-11-22 日立化成株式会社 液状エポキシ樹脂組成物及び電子部品装置
JP6388680B2 (ja) * 2017-03-11 2018-09-12 日揮触媒化成株式会社 半導体装置実装用ダイアタッチペーストの製造方法
GB201715949D0 (en) 2017-10-02 2017-11-15 Glaxosmithkline Consumer Healthcare (Uk) Ip Ltd Novel composition
SG11202104995TA (en) 2018-11-13 2021-06-29 Nippon Steel Chemical & Material Co Ltd Silica spherical particles for semiconductor sealing material
US11964874B2 (en) 2020-06-09 2024-04-23 Agilent Technologies, Inc. Etched non-porous particles and method of producing thereof
JP2025508226A (ja) * 2022-03-16 2025-03-21 ダブリュー・アール・グレース・アンド・カンパニー－コーン 多孔質の球状シリカゲル粒子を生産する方法
US20250256264A1 (en) * 2022-04-13 2025-08-14 King Abdullah University Of Science And Technology Ammonia carrier and methods for storing and releasing of ammonia

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62176928A (ja) * 1986-01-29 1987-08-03 Mitsubishi Metal Corp 石英ガラス粉末の製造方法
JPH0769617A (ja) * 1993-06-29 1995-03-14 Nitto Chem Ind Co Ltd 高純度球状シリカおよびその製造方法
JP2530225B2 (ja) * 1989-07-21 1996-09-04 信越石英株式会社 Ｓｉ単結晶引上用ルツボの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6287409A (ja) * 1985-09-09 1987-04-21 Tama Kagaku Kogyo Kk 合成シリカの製造方法
GB8729614D0 (en) 1987-12-18 1988-02-03 Beecham Group Plc Novel compounds
JPH01230421A (ja) 1988-03-11 1989-09-13 Nippon Shokubai Kagaku Kogyo Co Ltd 多孔質球状シリカ微粒子
JPH02296711A (ja) 1989-05-12 1990-12-07 Shin Etsu Chem Co Ltd 球状シリカ微粒子およびその製造方法
JP2941359B2 (ja) 1990-05-29 1999-08-25 水澤化学工業株式会社 分散性に優れた非晶質シリカ系填料
JPH0437693A (ja) * 1990-05-31 1992-02-07 Idemitsu Petrochem Co Ltd ダイヤモンドの合成方法
SE470424B (sv) 1992-07-15 1994-02-21 Volvo Flygmotor Ab Förfarande för framställning av keramiska blandoxidmaterial
JP3782866B2 (ja) * 1997-05-22 2006-06-07 水澤化学工業株式会社 破砕法によるシリカゲル粒子、その製法及びその用途
DE69934153T2 (de) * 1998-02-02 2007-09-20 Shin-Etsu Chemical Co., Ltd. Verfahren zur Montage von Flip-Chip-Halbleiterbauelementen
JP4043103B2 (ja) 1998-06-17 2008-02-06 日本化学工業株式会社 溶融球状シリカ及びその製造方法
JP2000063630A (ja) * 1998-08-21 2000-02-29 Nippon Chem Ind Co Ltd 微細球状シリカ及び液状封止樹脂組成物
US20030069347A1 (en) * 2001-09-28 2003-04-10 Hideki Oishi Calcined silica particle and manufacturing method of same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62176928A (ja) * 1986-01-29 1987-08-03 Mitsubishi Metal Corp 石英ガラス粉末の製造方法
JP2530225B2 (ja) * 1989-07-21 1996-09-04 信越石英株式会社 Ｓｉ単結晶引上用ルツボの製造方法
JPH0769617A (ja) * 1993-06-29 1995-03-14 Nitto Chem Ind Co Ltd 高純度球状シリカおよびその製造方法

Also Published As

Publication number Publication date
TWI293946B (enExample) 2008-03-01
WO2002026626A1 (en) 2002-04-04
US20030190276A1 (en) 2003-10-09
KR20030055270A (ko) 2003-07-02
KR100793503B1 (ko) 2008-01-14
US7070748B2 (en) 2006-07-04
JPWO2002026626A1 (ja) 2004-02-05

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