KR100793503B1 - 비공성 구상 실리카 및 그의 제조 방법 - Google Patents

비공성 구상 실리카 및 그의 제조 방법 Download PDF

Info

Publication number
KR100793503B1
KR100793503B1 KR1020037004365A KR20037004365A KR100793503B1 KR 100793503 B1 KR100793503 B1 KR 100793503B1 KR 1020037004365 A KR1020037004365 A KR 1020037004365A KR 20037004365 A KR20037004365 A KR 20037004365A KR 100793503 B1 KR100793503 B1 KR 100793503B1
Authority
KR
South Korea
Prior art keywords
spherical silica
particles
silica gel
silica
particle diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020037004365A
Other languages
English (en)
Korean (ko)
Other versions
KR20030055270A (ko
Inventor
우네하라야스히로
니시다마사시
미야카와데루오
Original Assignee
미츠비시 레이온 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미츠비시 레이온 가부시키가이샤 filed Critical 미츠비시 레이온 가부시키가이샤
Publication of KR20030055270A publication Critical patent/KR20030055270A/ko
Application granted granted Critical
Publication of KR100793503B1 publication Critical patent/KR100793503B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/126Preparation of silica of undetermined type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/187Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates
    • C01B33/193Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates of aqueous solutions of silicates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/30Particle morphology extending in three dimensions
    • C01P2004/32Spheres
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/51Particles with a specific particle size distribution
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/64Nanometer sized, i.e. from 1-100 nanometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/22Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Compounds (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020037004365A 2000-09-27 2001-09-26 비공성 구상 실리카 및 그의 제조 방법 Expired - Fee Related KR100793503B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00293643 2000-09-27
JP2000293643 2000-09-27
JP2000373580 2000-12-07
JPJP-P-2000-00373580 2000-12-07
PCT/JP2001/008389 WO2002026626A1 (en) 2000-09-27 2001-09-26 Non-porous spherical silica and method for production thereof

Publications (2)

Publication Number Publication Date
KR20030055270A KR20030055270A (ko) 2003-07-02
KR100793503B1 true KR100793503B1 (ko) 2008-01-14

Family

ID=26600798

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037004365A Expired - Fee Related KR100793503B1 (ko) 2000-09-27 2001-09-26 비공성 구상 실리카 및 그의 제조 방법

Country Status (5)

Country Link
US (1) US7070748B2 (enExample)
JP (1) JP4875281B2 (enExample)
KR (1) KR100793503B1 (enExample)
TW (1) TWI293946B (enExample)
WO (1) WO2002026626A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE0403139D0 (sv) * 2004-12-23 2004-12-23 Nanoxis Ab Device and use thereof
US20110130265A1 (en) * 2005-03-01 2011-06-02 Masafumi Mizuguchi Synthetic silica glass molded body, method of molding the same, and method of inspecting synthetic silica glass molded body
KR100651243B1 (ko) * 2005-03-04 2006-11-30 (주) 에스오씨 구형 실리카의 제조 방법
KR100759841B1 (ko) * 2005-10-12 2007-09-18 요업기술원 구형 실리카 나노 입자의 제조방법
JP2010069231A (ja) * 2008-09-22 2010-04-02 Fujifilm Corp 撮像装置及び内視鏡
SG195543A1 (en) * 2008-10-10 2013-12-30 Sumitomo Bakelite Co Semiconductor device
JP5648640B2 (ja) * 2010-01-07 2015-01-07 三菱マテリアル株式会社 合成非晶質シリカ粉末
JP5912249B2 (ja) * 2010-12-28 2016-04-27 日揮触媒化成株式会社 半導体装置実装用ペ−スト
JP5698087B2 (ja) * 2011-07-14 2015-04-08 株式会社トクヤマ 無機酸化物粉体
JP2016040393A (ja) * 2015-12-28 2016-03-24 日立化成株式会社 液状エポキシ樹脂組成物及び電子部品装置
US10508040B2 (en) 2016-01-25 2019-12-17 King Abdullah University Of Science And Technology Methods of making silica nanoparticles, propellants, and safety devices
JP6233441B2 (ja) * 2016-04-15 2017-11-22 日立化成株式会社 液状エポキシ樹脂組成物及び電子部品装置
JP6388680B2 (ja) * 2017-03-11 2018-09-12 日揮触媒化成株式会社 半導体装置実装用ダイアタッチペーストの製造方法
GB201715949D0 (en) 2017-10-02 2017-11-15 Glaxosmithkline Consumer Healthcare (Uk) Ip Ltd Novel composition
WO2020100952A1 (ja) * 2018-11-13 2020-05-22 日鉄ケミカル&マテリアル株式会社 半導体封止材用シリカ球状粒子
US11964874B2 (en) 2020-06-09 2024-04-23 Agilent Technologies, Inc. Etched non-porous particles and method of producing thereof
WO2023178210A1 (en) * 2022-03-16 2023-09-21 W.R. Grace & Co.-Conn Process for producing porous spherical silica gel particles
US20250256264A1 (en) * 2022-04-13 2025-08-14 King Abdullah University Of Science And Technology Ammonia carrier and methods for storing and releasing of ammonia

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279944A (en) * 1993-06-29 1995-01-18 Nitto Chemical Industry Co Ltd High-purity spherical silica and process for producing same
JP2000063630A (ja) * 1998-08-21 2000-02-29 Nippon Chem Ind Co Ltd 微細球状シリカ及び液状封止樹脂組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6287409A (ja) * 1985-09-09 1987-04-21 Tama Kagaku Kogyo Kk 合成シリカの製造方法
JPS62176928A (ja) 1986-01-29 1987-08-03 Mitsubishi Metal Corp 石英ガラス粉末の製造方法
GB8729614D0 (en) 1987-12-18 1988-02-03 Beecham Group Plc Novel compounds
JPH01230421A (ja) * 1988-03-11 1989-09-13 Nippon Shokubai Kagaku Kogyo Co Ltd 多孔質球状シリカ微粒子
JPH02296711A (ja) 1989-05-12 1990-12-07 Shin Etsu Chem Co Ltd 球状シリカ微粒子およびその製造方法
JP2530225B2 (ja) 1989-07-21 1996-09-04 信越石英株式会社 Si単結晶引上用ルツボの製造方法
JP2941359B2 (ja) 1990-05-29 1999-08-25 水澤化学工業株式会社 分散性に優れた非晶質シリカ系填料
JPH0437693A (ja) * 1990-05-31 1992-02-07 Idemitsu Petrochem Co Ltd ダイヤモンドの合成方法
SE470424B (sv) * 1992-07-15 1994-02-21 Volvo Flygmotor Ab Förfarande för framställning av keramiska blandoxidmaterial
JP3782866B2 (ja) * 1997-05-22 2006-06-07 水澤化学工業株式会社 破砕法によるシリカゲル粒子、その製法及びその用途
DE69934153T2 (de) * 1998-02-02 2007-09-20 Shin-Etsu Chemical Co., Ltd. Verfahren zur Montage von Flip-Chip-Halbleiterbauelementen
JP4043103B2 (ja) 1998-06-17 2008-02-06 日本化学工業株式会社 溶融球状シリカ及びその製造方法
US20030069347A1 (en) * 2001-09-28 2003-04-10 Hideki Oishi Calcined silica particle and manufacturing method of same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279944A (en) * 1993-06-29 1995-01-18 Nitto Chemical Industry Co Ltd High-purity spherical silica and process for producing same
JP2000063630A (ja) * 1998-08-21 2000-02-29 Nippon Chem Ind Co Ltd 微細球状シリカ及び液状封止樹脂組成物

Also Published As

Publication number Publication date
TWI293946B (enExample) 2008-03-01
WO2002026626A1 (en) 2002-04-04
KR20030055270A (ko) 2003-07-02
JP4875281B2 (ja) 2012-02-15
US20030190276A1 (en) 2003-10-09
JPWO2002026626A1 (ja) 2004-02-05
US7070748B2 (en) 2006-07-04

Similar Documents

Publication Publication Date Title
KR100793503B1 (ko) 비공성 구상 실리카 및 그의 제조 방법
CN111629998B (zh) 熔融球状二氧化硅粉末及其制造方法
KR100279083B1 (ko) 고순도 구형 실리카 및 그의 제조방법
KR20120125232A (ko) 합성 비정질 실리카 분말 및 그 제조 방법
JP4043103B2 (ja) 溶融球状シリカ及びその製造方法
JP6440551B2 (ja) シリカ粒子の製造方法
JP2003238141A (ja) 表面改質球状シリカ及びその製造方法、並びに半導体封止用樹脂組成物
JP7629088B2 (ja) シリカ粉末及びその製造方法
JP2001199719A (ja) 球状アルミナ粉末の製造方法
JP2004010420A (ja) 高純度非磁性金属酸化物粉末及びその製造方法
JP4691321B2 (ja) 高純度酸化ケイ素粉末の製造方法
CN109694078A (zh) 一种氟晶云母的制备方法及其在二维晶体制备中的应用
JP2005054131A (ja) 吸着性シリカ充填材及びその製造方法並びに封止用樹脂組成物
JP4006220B2 (ja) 表面改質球状シリカ、その製造方法及び半導体封止材用樹脂組成物
JP2005119884A (ja) 非孔性球状シリカ及びその製造方法
JP5116968B2 (ja) 球状アルミナ粉末の製造方法
JP2003277044A (ja) 球状シリカの製造方法
WO2022210260A1 (ja) 球状無機質粉末及び液状封止材
JP2004182479A (ja) 表面改質球状シリカ及びその製造方法、並びに半導体封止用樹脂組成物
JP2004292250A (ja) 表面改質球状シリカ及びその製造方法及び半導体封止用樹脂組成物
EP4299510A1 (en) Metal oxide powder, and method for producing same
JP4036722B2 (ja) 高純度球状シリカ
JP2005054129A (ja) 吸着性シリカ充填材及びその製造方法並びに封止用樹脂組成物。
JP2005054130A (ja) 吸着性シリカ充填材及びその製造方法並びに封止用樹脂組成物
JP2007261860A (ja) ガラス粉末およびその製法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

G170 Re-publication after modification of scope of protection [patent]
PG1701 Publication of correction

St.27 status event code: A-5-5-P10-P19-oth-PG1701

Patent document republication publication date: 20080411

Republication note text: Request for Correction Notice (Document Request)

Gazette number: 1007935030000

Gazette reference publication date: 20080114

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20121227

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20131218

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20141230

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20151217

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20161220

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20180104

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20180104