JP4827556B2 - 積層型半導体パッケージ - Google Patents

積層型半導体パッケージ Download PDF

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Publication number
JP4827556B2
JP4827556B2 JP2006050593A JP2006050593A JP4827556B2 JP 4827556 B2 JP4827556 B2 JP 4827556B2 JP 2006050593 A JP2006050593 A JP 2006050593A JP 2006050593 A JP2006050593 A JP 2006050593A JP 4827556 B2 JP4827556 B2 JP 4827556B2
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JP
Japan
Prior art keywords
layer
solder ball
semiconductor package
ball group
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006050593A
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English (en)
Japanese (ja)
Other versions
JP2006295136A (ja
JP2006295136A5 (enExample
Inventor
浩史 近藤
徹 逢坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006050593A priority Critical patent/JP4827556B2/ja
Priority to US11/378,685 priority patent/US7851900B2/en
Publication of JP2006295136A publication Critical patent/JP2006295136A/ja
Publication of JP2006295136A5 publication Critical patent/JP2006295136A5/ja
Application granted granted Critical
Publication of JP4827556B2 publication Critical patent/JP4827556B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP2006050593A 2005-03-18 2006-02-27 積層型半導体パッケージ Expired - Fee Related JP4827556B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006050593A JP4827556B2 (ja) 2005-03-18 2006-02-27 積層型半導体パッケージ
US11/378,685 US7851900B2 (en) 2005-03-18 2006-03-17 Stacked semiconductor package

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005079878 2005-03-18
JP2005079878 2005-03-18
JP2006050593A JP4827556B2 (ja) 2005-03-18 2006-02-27 積層型半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2006295136A JP2006295136A (ja) 2006-10-26
JP2006295136A5 JP2006295136A5 (enExample) 2009-04-16
JP4827556B2 true JP4827556B2 (ja) 2011-11-30

Family

ID=37009436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006050593A Expired - Fee Related JP4827556B2 (ja) 2005-03-18 2006-02-27 積層型半導体パッケージ

Country Status (2)

Country Link
US (1) US7851900B2 (enExample)
JP (1) JP4827556B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8686827B2 (en) 2010-04-08 2014-04-01 Hitachi Metals, Ltd. PTC element and heating-element module

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US7659623B2 (en) * 2005-04-11 2010-02-09 Elpida Memory, Inc. Semiconductor device having improved wiring
US7545029B2 (en) * 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies
US7772708B2 (en) * 2006-08-31 2010-08-10 Intel Corporation Stacking integrated circuit dies
JP2008141059A (ja) * 2006-12-04 2008-06-19 Nec Electronics Corp 半導体装置
WO2008149508A1 (ja) * 2007-05-31 2008-12-11 Sanyo Electric Co., Ltd. 半導体モジュールおよび携帯機器
US7692946B2 (en) * 2007-06-29 2010-04-06 Intel Corporation Memory array on more than one die
JP2009206230A (ja) * 2008-02-27 2009-09-10 Kyocera Corp 積層型半導体パッケージ
US20090289101A1 (en) * 2008-05-23 2009-11-26 Yong Du Method for ball grid array (bga) solder attach for surface mount
US10251273B2 (en) * 2008-09-08 2019-04-02 Intel Corporation Mainboard assembly including a package overlying a die directly attached to the mainboard
US8531043B2 (en) * 2008-09-23 2013-09-10 Stats Chippac Ltd. Planar encapsulation and mold cavity package in package system
JP5543094B2 (ja) * 2008-10-10 2014-07-09 ピーエスフォー ルクスコ エスエイアールエル 低ノイズ半導体パッケージ
JP2010192680A (ja) * 2009-02-18 2010-09-02 Elpida Memory Inc 半導体装置
US8125066B1 (en) * 2009-07-13 2012-02-28 Altera Corporation Package on package configurations with embedded solder balls and interposal layer
KR20110088234A (ko) * 2010-01-28 2011-08-03 삼성전자주식회사 적층 반도체 패키지의 제조 방법
KR101685501B1 (ko) * 2010-03-31 2016-12-12 삼성전자 주식회사 패키지 온 패키지
KR101683825B1 (ko) * 2010-04-20 2016-12-07 해성디에스 주식회사 반도체 패키지용 회로 기판의 제조 방법
KR101652831B1 (ko) 2010-06-11 2016-08-31 삼성전자주식회사 열적 특성을 개선하는 패키지 온 패키지
DE102010055627A1 (de) * 2010-12-22 2012-06-28 Epcos Ag Elektrisches Modul zur Aufnahme durch Bestückungsautomaten mittels Erzeugung eines Vakuums
US10163877B2 (en) * 2011-11-07 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. System in package process flow
US8422171B1 (en) 2012-02-24 2013-04-16 Western Digital Technologies, Inc. Disk drive head stack assembly having a laminar flexible printed circuit with a conductive bump extending to a second conductive layer
US9331054B2 (en) * 2013-03-14 2016-05-03 Mediatek Inc. Semiconductor package assembly with decoupling capacitor
CN104051450B (zh) * 2013-03-14 2017-08-01 联发科技股份有限公司 半导体封装
US9016552B2 (en) * 2013-03-15 2015-04-28 Sanmina Corporation Method for forming interposers and stacked memory devices
US9515060B2 (en) 2013-03-20 2016-12-06 Infineon Technologies Austria Ag Multi-chip semiconductor power device
JP6325920B2 (ja) * 2014-07-02 2018-05-16 日本放送協会 高精細撮像素子用パッケージ
KR102287396B1 (ko) 2014-10-21 2021-08-06 삼성전자주식회사 시스템 온 패키지 모듈과 이를 포함하는 모바일 컴퓨팅 장치
US10340199B2 (en) * 2014-11-20 2019-07-02 Mediatek Inc. Packaging substrate with block-type via and semiconductor packages having the same
KR102324628B1 (ko) 2015-07-24 2021-11-10 삼성전자주식회사 솔리드 스테이트 드라이브 패키지 및 이를 포함하는 데이터 저장 시스템
CN108353505B (zh) * 2015-11-13 2021-11-30 英特尔公司 包括衬底桥的电子组件
DE102016211652A1 (de) * 2016-06-28 2017-12-28 Zf Friedrichshafen Ag Leiterplattenanordnung, Wechselrichter und Kraftfahrzeugantriebsystem mit einer solchen Leiterplattenanordnung
CN107340573B (zh) * 2017-08-25 2019-06-21 西安电子科技大学 叠层光电互联印制板及其实现方法
WO2019123995A1 (ja) * 2017-12-20 2019-06-27 株式会社村田製作所 電子部品
US10971450B2 (en) * 2019-01-17 2021-04-06 Avago Technologies International Sales Pte. Limited Hexagonally arranged connection patterns for high-density device packaging
KR102392784B1 (ko) * 2019-12-03 2022-05-09 (주)에이티세미콘 멀티칩 반도체 패키지
US20240332266A1 (en) * 2023-03-27 2024-10-03 Mediatek Inc. Semiconductor device

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JPS60100443A (ja) * 1984-10-15 1985-06-04 Hitachi Ltd 半導体装置の実装構造
JP3316409B2 (ja) * 1997-03-13 2002-08-19 ローム株式会社 複数のｉｃチップを備えた半導体装置の構造
JPH11214576A (ja) * 1998-01-29 1999-08-06 Nhk Spring Co Ltd 半導体チップ搭載用パッケージ
JP3645136B2 (ja) * 1999-06-22 2005-05-11 三菱電機株式会社 電子回路パッケージ及び実装ボード
JP3798597B2 (ja) * 1999-11-30 2006-07-19 富士通株式会社 半導体装置
JP3917344B2 (ja) * 2000-03-27 2007-05-23 株式会社東芝 半導体装置及び半導体装置の実装方法
JP3434775B2 (ja) * 2000-04-12 2003-08-11 埼玉日本電気株式会社 裏面電極型電気部品の実装方法および統合ランド
US6448506B1 (en) * 2000-12-28 2002-09-10 Amkor Technology, Inc. Semiconductor package and circuit board for making the package
JP2002217356A (ja) * 2001-01-19 2002-08-02 Nec Corp 半導体装置及びその製造方法
JP3670625B2 (ja) * 2001-06-13 2005-07-13 松下電器産業株式会社 半導体装置およびその製造方法
JP2004179232A (ja) * 2002-11-25 2004-06-24 Seiko Epson Corp 半導体装置及びその製造方法並びに電子機器
JP4168331B2 (ja) 2003-02-21 2008-10-22 ソニー株式会社 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8686827B2 (en) 2010-04-08 2014-04-01 Hitachi Metals, Ltd. PTC element and heating-element module

Also Published As

Publication number Publication date
US20060208348A1 (en) 2006-09-21
JP2006295136A (ja) 2006-10-26
US7851900B2 (en) 2010-12-14

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