JP4813765B2 - ワイヤレス基板状センサ - Google Patents
ワイヤレス基板状センサ Download PDFInfo
- Publication number
- JP4813765B2 JP4813765B2 JP2003566489A JP2003566489A JP4813765B2 JP 4813765 B2 JP4813765 B2 JP 4813765B2 JP 2003566489 A JP2003566489 A JP 2003566489A JP 2003566489 A JP2003566489 A JP 2003566489A JP 4813765 B2 JP4813765 B2 JP 4813765B2
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- JP
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- Prior art keywords
- sensor
- substrate
- image
- target
- wireless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Description
このマーク点のカメラ画像内の位置(x,y)は、斜視変換(perspective transformation)から算出できる。
ただし、kは撮像装置の視界に関する定数である。
y・(Cz+u・Az+v・Bz)=k・(Cy+u・Ay+v・By)
または、
k=y*Pz/Py
Cx、Cy、Cz、Ax、Ay、Az、Bx、By、およびBz
(2)画像内の基準マーク点を認識するため、ブロブ分析(blob analysis)などの標準的な画像処理法を使う。
(3)成分の9番目が1.0だと仮定して、位置ベクトルの8つの成分を得るために前記の演算を使う。
(4)Aの長さを算出し、その長さで全成分を割り算して、ベクトルA、B、Cの正確な値を算出する。
(5)撮像装置のレンズ以外の基準点に関連した位置が記録できるよう、方向ベクトルAとBの結果値を回転角度に変換し、Cにオフセット値を加える。前記の技法は解決策の1つであって、本発明の精神や範囲を逸脱することなく2次元画像を使った平面の画像の認識方法の採用も可能である。
102……ロボット
104……システム部品モジュール
106、108、110……ウェハ
112……センサ
114……基準目標物
116……エンドエフェクタ
117……目標物
118……ワイヤレス基板状センサ
120……中央センサ部
122……外周部
Claims (8)
- ワイヤレス基板状センサであって、
実際の基板と同様に変形する基板状のハウジングと、
センサに電力を供給するように構成された電力供給部と、
目標物の画像を撮影するように構成されたエリアアレイ素子からなる撮像装置と、
前記画像を処理し、センサの位置に対する目標物の位置に関するデータを獲得するために、前記撮像装置に接続されたプロセッサと、
前記データを外部装置へ無線で伝送するため、前記プロセッサに接続されたワイヤレス通信モジュールとを具備し、
前記電力供給部、前記撮像装置、前記プロセッサ及びワイヤレス通信モジュールは、前記基板状のハウジングに搭載されていることを特徴とするワイヤレス基板状センサ。 - 前記センサの位置に対する前記目標物の位置に関するデータは、少なくとも自由度3のものである請求項1のセンサ。
- 前記センサの位置に対する前記目標物の位置に関するデータは、少なくとも自由度6のものである請求項1のセンサ。
- 前記画像が、該画像内のパターンを検出するために解析される請求項1のセンサ。
- 前記センサが、該画像内の事前に限定された2つのパターン間の距離を測定するように構成された請求項1のセンサ。
- さらに、前記画像を表示するために、前記センサに操作可能に接続された表示装置を含む請求項1のセンサ。
- 前記外部装置が半導体処理システムを調整するために用いられる表示装置である請求項1のセンサ。
- 前記表示装置が前記画像上に前記調整を補助する直線状のガイドを表示する請求項7のセンサ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35455102P | 2002-02-06 | 2002-02-06 | |
US60/354,551 | 2002-02-06 | ||
US10/356,684 | 2003-01-31 | ||
US10/356,684 US7289230B2 (en) | 2002-02-06 | 2003-01-31 | Wireless substrate-like sensor |
PCT/US2003/003247 WO2003067183A2 (en) | 2002-02-06 | 2003-02-04 | Wireless substrate-like sensor |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005521926A JP2005521926A (ja) | 2005-07-21 |
JP2005521926A5 JP2005521926A5 (ja) | 2006-03-23 |
JP4813765B2 true JP4813765B2 (ja) | 2011-11-09 |
Family
ID=27737463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003566489A Expired - Lifetime JP4813765B2 (ja) | 2002-02-06 | 2003-02-04 | ワイヤレス基板状センサ |
Country Status (4)
Country | Link |
---|---|
US (3) | US7289230B2 (ja) |
JP (1) | JP4813765B2 (ja) |
KR (1) | KR100936085B1 (ja) |
WO (1) | WO2003067183A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11037810B2 (en) | 2017-12-06 | 2021-06-15 | Tokyo Electron Limited | Teaching method |
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US11037810B2 (en) | 2017-12-06 | 2021-06-15 | Tokyo Electron Limited | Teaching method |
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US7289230B2 (en) | 2007-10-30 |
KR20040093710A (ko) | 2004-11-08 |
US20060151606A1 (en) | 2006-07-13 |
US20060171561A1 (en) | 2006-08-03 |
WO2003067183A3 (en) | 2004-05-13 |
WO2003067183A2 (en) | 2003-08-14 |
US7456977B2 (en) | 2008-11-25 |
US20030223057A1 (en) | 2003-12-04 |
US7283255B2 (en) | 2007-10-16 |
JP2005521926A (ja) | 2005-07-21 |
KR100936085B1 (ko) | 2010-01-12 |
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