JP7161236B2 - 半導体処理のための無線基板状ティーチングセンサ - Google Patents
半導体処理のための無線基板状ティーチングセンサ Download PDFInfo
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- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
- B25J9/163—Programme controls characterised by the control loop learning, adaptive, model based, rule based expert control
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- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
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- G—PHYSICS
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
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- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
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- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Description
ほとんどすべての現代の電子機器は、集積回路を使用する。これらの集積回路は、半導体処理施設で半導体材料、例えば、シリコンを使用して生産される。半導体は、一般的に、処理されて数百または数千の集積回路にされる潜在力がある丸い薄型ウェーハの形態で提供される。
Claims (14)
- 搬送座標をロボット基板ハンドリングシステムにティーチングするための無線基板状センサであって、センサが、:
ロボット基板ハンドリングシステムによってハンドリングされる基板のようなサイズおよび形状のベース部と;
ベース部に連結された電子機器ハウジングと;
電子機器ハウジング内に配置され、センサの構成要素に電力供給するように構成された電源モジュールと;
ベース部のエッジの近くに配置された少なくとも一つのエッジカメラであって、無線基板状センサの少なくとも一つのエッジカメラの視野内の半導体ウェーハを受け取るように構成されたプロセスチャックのエッジを撮像する視野を有する、少なくとも一つのエッジカメラと;
無線基板状センサとプロセスチャックとの間のレンジの示度を提供するために、ベース部に対して取り付けられ、コントローラに動作可能に連結された測距装置と;
少なくとも一つのエッジカメラおよび測距装置に連結され、 電子機器ハウジング内に配置されたコントローラであって、少なくとも一つのエッジカメラから画像を取得し、プロセスチャックのエッジの少なくとも一つの画像およびレンジの示度に基づいてプロセスチャックの場所を決定するように構成されたコントローラであり、少なくとも一つの画像およびレンジの示度に基づいてプロセスチャックの範囲補正(X、Y)された場所を決定し、ロボット基板ハンドリングシステムに決定された位置をティーチするためにプロセスチャックの範囲補正された場所をロボット基板ハンドリングシステムに送信するように構成されるコントローラとを含む、
無線基板状センサ。 - ベース部の中央領域に配置され、無線基板状センサの下に位置付けられた対象物の中央部分を撮像するように構成された追加のカメラをさらに含む、請求項1記載の無線基板状センサ。
- エッジが 丸いエッジである、請求項1記載の無線基板状センサ。
- 無線基板状センサの先端および傾斜を測定するために、コントローラに動作可能に連結された傾斜/先端センサをさらに含む、請求項1記載の無線基板状センサ。
- カメラ画像からXY座標を正確に報告するために、コントローラがレンジの示度および傾斜の測定を利用するように構成される、請求項4記載の無線基板状センサ。
- 少なくとも一つのエッジカメラが四つのエッジカメラを包含し、各々がベース部のエッジに接近して配置される、請求項1記載の無線基板状センサ。
- ベース部に対して少なくとも一つのエッジカメラに接近して取り付けられた構造化イルミネータをさらに含み、構造化イルミネータが少なくとも一つのエッジカメラの視野内に構造化照明を発生させるように構成される、請求項1記載の無線基板状センサ。
- 無線基板状センサが少なくとも四つのエッジカメラと、各それぞれのエッジカメラに接近して配置される構造化イルミネータを含む、請求項7記載の無線基板状センサ。
- 構造化照明がドット、円、プラス記号、複数の平行線、XおよびYの少なくとも一つの方向に正弦的に変動する強度パターン、菱形形状および碁盤目状からなる群より選択される形態である、請求項7記載の無線基板状センサ。
- 構造化照明に基づいて見かけのレンジを校正するために、構造化照明が校正動作を可能にするように構成される、請求項7記載の無線基板状センサ。
- コントローラがエッジカメラと構造化イルミネータの各ペアに対して校正動作を実施するように構成される、請求項10記載の無線基板状センサ。
- 対象物の中央開口を撮像しようと試み、プロセスチャックの中央開口を撮像する試みが失敗した場合、少なくとも一つのエッジカメラを選択的に係合するために、コントローラがセンサベースの中心に接近してカメラを採用するように構成される、請求項1記載の無線基板状センサ。
- 半導体処理ツールのロボットマニピュレータによって保持されたセンサに対する半導体処理ツールのプロセスチャックの位置を測定する方法であって、方法が、:
少なくとも一つのエッジ検出カメラおよびレンジセンサを有するセンサを提供する工程と;
少なくとも一つのエッジ検出カメラにプロセスチャックの丸い外表面の少なくとも一つの画像を取得させる工程と;
レンジセンサにプロセスチャックまでのレンジを検出させる工程と;
プロセスチャックの丸い外表面の少なくとも一つの画像を解析することおよび検出されたレンジに基づいてプロセスチャックの中心の位置を計算する工程と;
プロセスチャックの中心の計算された位置をロボットマニピュレータのコントローラに通信する工程と、
を含む方法。 - 半導体処理ツールのロボットマニピュレータによって保持されたセンサに対する半導体処理ツール内のプロセスチャックの位置を測定する方法であって、方法が:
少なくとも一つのエッジ検出カメラおよびレンジセンサを有するセンサを提供する工程と;
少なくとも一つのエッジ検出カメラに少なくとも一つのカメラの視野内に位置付けられたプロセスチャックのアライメントマークの少なくとも一つの画像を取得させる工程と;
レンジセンサにプロセスチャックまでのレンジを検出させる工程と;
アライメントマークの少なくとも一つの画像および検出されたレンジに基づいてプロセスチャックのアライメントマークの位置を計算する工程と;
計算された位置をロボットマニピュレータのコントローラに通信する工程と
を含む方法。
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US201862661944P | 2018-04-24 | 2018-04-24 | |
US62/661,944 | 2018-04-24 | ||
US16/389,354 | 2019-04-19 | ||
US16/389,354 US11468590B2 (en) | 2018-04-24 | 2019-04-19 | Wireless substrate-like teaching sensor for semiconductor processing |
PCT/US2019/028464 WO2019209688A1 (en) | 2018-04-24 | 2019-04-22 | Wireless substrate-like teaching sensor for semiconductor processing |
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CN (1) | CN112534555A (ja) |
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US11295975B2 (en) * | 2019-09-13 | 2022-04-05 | Brooks Automation Us, Llc | Method and apparatus for substrate alignment |
CN111403318B (zh) * | 2020-03-19 | 2023-05-16 | 北京北方华创微电子装备有限公司 | 工艺腔室内晶圆状态的检测方法及装置 |
US11263755B2 (en) * | 2020-07-17 | 2022-03-01 | Nanya Technology Corporation | Alert device and alert method thereof |
JP2022047442A (ja) * | 2020-09-11 | 2022-03-24 | パナソニックIpマネジメント株式会社 | 情報処理方法及び情報処理装置 |
US11284018B1 (en) * | 2020-09-15 | 2022-03-22 | Applied Materials, Inc. | Smart camera substrate |
US11538702B2 (en) * | 2021-01-04 | 2022-12-27 | Adaptive Plasma Technology Corp. | Apparatus for monitoring an exchanging process of a semiconductor part and a method for the same |
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CN112534555A (zh) | 2021-03-19 |
KR102439438B1 (ko) | 2022-09-01 |
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TWI739093B (zh) | 2021-09-11 |
JP2021521651A (ja) | 2021-08-26 |
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TW202004950A (zh) | 2020-01-16 |
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