JP6948873B2 - 測定器を較正する方法、及び、ケース - Google Patents
測定器を較正する方法、及び、ケース Download PDFInfo
- Publication number
- JP6948873B2 JP6948873B2 JP2017148031A JP2017148031A JP6948873B2 JP 6948873 B2 JP6948873 B2 JP 6948873B2 JP 2017148031 A JP2017148031 A JP 2017148031A JP 2017148031 A JP2017148031 A JP 2017148031A JP 6948873 B2 JP6948873 B2 JP 6948873B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor electrodes
- measuring instrument
- reference planes
- sensor
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
- G01D18/001—Calibrating encoders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24564—Measurements of electric or magnetic variables, e.g. voltage, current, frequency
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
Description
Claims (13)
- ケースを用いて測定器を較正する方法であって、
前記測定器は、
円盤状のベース基板と、
前記ベース基板に設けられた複数のセンサ電極と、
前記複数のセンサ電極に高周波信号を与えるように設けられた高周波発振器と、
前記複数のセンサ電極における電位に応じた複数の検出値から、複数の関数を用いて、前記複数のセンサ電極それぞれの静電容量を表す複数の測定値をそれぞれ算出するように構成された演算部と、を有し、
前記ケースは、
前記測定器をその中に収容するよう構成されたケース本体と、
前記ケース本体内に収容された前記測定器の並進移動を規制するよう設けられた規制部と、
前記複数のセンサ電極にそれぞれ対面可能であるように前記ケース本体内に設けられた複数の第1の基準面と、
を有し、
該方法は、
前記規制部によって前記測定器の並進移動が規制され、前記複数のセンサ電極に前記複数の第1の基準面がそれぞれ対面しており、前記複数のセンサ電極に前記高周波信号が与えられている状態で、前記複数の検出値である複数の第1の検出値を取得する工程と、
前記複数の関数における係数を較正する工程であり、前記複数の第1の検出値から算出される前記複数の測定値である複数の第1の測定値が第1の所定値となるように前記複数の関数における係数を較正する、該工程と、を含む方法。 - 前記測定器は、
前記複数のセンサ電極をそれぞれ囲むように設けられた複数のガード電極と、
前記複数のセンサ電極と前記高周波発振器との間で接続された複数の可変インピーダンス回路と、
を更に有し、
前記高周波発振器は前記複数のガード電極に前記高周波信号を更に与えるように設けられており、
前記複数の検出値の各々は、前記複数のセンサ電極のうち一つのセンサ電極の電位と前記複数のガード電極のうち該一つのセンサ電極を囲む一つのガード電極の電位との間の電位差に応じた値であり、
該方法は、前記高周波信号が前記複数のセンサ電極及び前記複数のガード電極に与えられており、且つ、前記ケース本体内において前記複数のセンサ電極の前方に前記複数の検出値がゼロとなるべき空間が設けられている状態で、前記複数の検出値がゼロになるように前記複数の可変インピーダンス回路のインピーダンスを調整する工程を更に含む、請求項1に記載の方法。 - 前記複数のセンサ電極は、前記ベース基板のエッジに沿って設けられており、
前記複数の第1の基準面は、前記複数のセンサ電極に対面可能であるように周方向に配列されている、請求項1又は2に記載の方法。 - 前記複数のセンサ電極は、前記ベース基板の底面に沿って周方向に配列されており、
前記複数の第1の基準面は、前記複数のセンサ電極に対面可能であるように周方向に配列されている、請求項1又は2に記載の方法。 - 前記ケースは、前記複数の第1の基準面とは異なる複数の第2の基準面を更に有し、
前記複数の第2の基準面は、該複数の第2の基準面がそれぞれ前記複数のセンサ電極と対面しているときの該複数のセンサ電極それぞれの静電容量が、前記複数の第1の基準面がそれぞれ前記複数のセンサ電極と対面しているときの該複数のセンサ電極それぞれの静電容量と異なるように、設けられており、
該方法は、前記規制部によって前記測定器の並進移動が規制され、前記複数のセンサ電極に前記複数の第2の基準面がそれぞれ対面しており、前記複数のセンサ電極に前記高周波信号が与えられている状態で、前記複数の検出値である複数の第2の検出値を取得する工程を更に含み、
前記複数の関数における係数を較正する前記工程において、前記複数の第1の測定値がそれぞれ前記第1の所定値となり、前記複数の第2の検出値から算出される前記複数の測定値である複数の第2の測定値が第2の所定値となるように、前記複数の関数における前記係数が較正される、請求項1又は2に記載の方法。 - 前記複数のセンサ電極は、前記ベース基板のエッジに沿って設けられており、
前記複数の第1の基準面及び前記複数の第2の基準面は、前記複数のセンサ電極に対面可能であるように周方向に沿って交互に配列されている、請求項5に記載の方法。 - 前記複数のセンサ電極は、前記ベース基板の底面に沿って周方向に配列されており、
前記複数の第1の基準面及び前記複数の第2の基準面は、前記複数のセンサ電極に対面可能であるように周方向に沿って交互に配列されている、請求項5に記載の方法。 - 前記ケースは、前記ケース本体内を排気装置に接続する排気ポートを更に有し、
前記ケース本体内の空間を排気する工程を更に含む、
請求項1〜7の何れか一項に記載の方法。 - 前記測定器は、バッテリー、及び、該バッテリーに接続された給電端子を更に備え、
前記ケースは、給電のためのコネクタを更に備え、
前記ケース本体内に前記測定器が収容されている状態で、前記給電端子と前記コネクタが電気的に接続される、請求項1〜8の何れか一項に記載の方法。 - 測定器の較正に用いられるケースであって、該測定器は、略円盤形状を有し、且つ、複数のセンサ電極を有し、複数のセンサ電極それぞれの静電容量を表す複数の測定値を取得するよう構成されており、
前記測定器をその中に収容するよう構成されたケース本体と、
前記ケース本体内に収容された前記測定器の並進移動を規制するよう設けられた規制部と、
前記複数のセンサ電極にそれぞれ対面可能であるように前記ケース本体内に設けられた複数の第1の基準面と、を備える、ケース。 - 前記複数の第1の基準面は、周方向に配列されている、請求項10に記載のケース。
- 前記複数の第1の基準面とは異なる複数の第2の基準面を更に有し、
前記複数の第2の基準面は、前記複数のセンサ電極にそれぞれ対面可能であるように前記ケース本体内に設けられており、
前記複数の第1の基準面と前記ケース本体内において前記測定器が配置される領域の中心軸線との間の距離は、前記複数の第2の基準面と該中心軸線との間の距離と異なっており、
前記複数の第1の基準面と前記複数の第2の基準面とは周方向に沿って交互に配列されている、請求項10又は11に記載のケース。 - 前記ケースは、前記ケース本体内の空間に接続された排気ポートを更に有する、請求項10〜12の何れか一項に記載のケース。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017148031A JP6948873B2 (ja) | 2017-07-31 | 2017-07-31 | 測定器を較正する方法、及び、ケース |
US16/045,910 US10837810B2 (en) | 2017-07-31 | 2018-07-26 | Method for calibrating measuring device and case used in the calibration method |
TW107125983A TWI794259B (zh) | 2017-07-31 | 2018-07-27 | 校正測量器之方法及箱 |
CN201810842703.7A CN109324303B (zh) | 2017-07-31 | 2018-07-27 | 对测定器进行校准的方法和箱体 |
KR1020180088373A KR102636225B1 (ko) | 2017-07-31 | 2018-07-30 | 측정기를 교정하는 방법 및 케이스 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017148031A JP6948873B2 (ja) | 2017-07-31 | 2017-07-31 | 測定器を較正する方法、及び、ケース |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019027944A JP2019027944A (ja) | 2019-02-21 |
JP2019027944A5 JP2019027944A5 (ja) | 2020-07-16 |
JP6948873B2 true JP6948873B2 (ja) | 2021-10-13 |
Family
ID=65038540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017148031A Active JP6948873B2 (ja) | 2017-07-31 | 2017-07-31 | 測定器を較正する方法、及び、ケース |
Country Status (5)
Country | Link |
---|---|
US (1) | US10837810B2 (ja) |
JP (1) | JP6948873B2 (ja) |
KR (1) | KR102636225B1 (ja) |
CN (1) | CN109324303B (ja) |
TW (1) | TWI794259B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11468590B2 (en) * | 2018-04-24 | 2022-10-11 | Cyberoptics Corporation | Wireless substrate-like teaching sensor for semiconductor processing |
US10782157B2 (en) * | 2018-06-26 | 2020-09-22 | Faurecia Automotive Seating, Llc | Analog signal conditioning with diagnostics for capacitive sensor elements |
JP7038621B2 (ja) * | 2018-07-20 | 2022-03-18 | 東京エレクトロン株式会社 | 位置測定装置および位置測定方法 |
CN111421226B (zh) * | 2019-07-09 | 2022-06-07 | 济南邦德激光股份有限公司 | 一种基于激光切管设备的管材识别方法及装置 |
CN111261565B (zh) * | 2020-01-21 | 2023-11-14 | 北京北方华创微电子装备有限公司 | 一种半导体设备及其晶圆传输腔室和晶圆传输方法 |
JP7418241B2 (ja) * | 2020-02-27 | 2024-01-19 | 東京エレクトロン株式会社 | 位置決め装置、処理システム及び位置決め方法 |
TWI741715B (zh) * | 2020-08-03 | 2021-10-01 | 矽品精密工業股份有限公司 | 承載裝置 |
KR102584512B1 (ko) | 2020-12-31 | 2023-10-05 | 세메스 주식회사 | 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5432457A (en) * | 1994-01-28 | 1995-07-11 | Northrop Grumman Corporation | Capacitive disk probe |
TW364951B (en) * | 1996-11-25 | 1999-07-21 | Nohken Co Ltd | Electrostatic capacitor inspection apparatus |
JP4249448B2 (ja) * | 2001-09-06 | 2009-04-02 | 東京エレクトロン株式会社 | 容量計の校正方法、校正用標準容量ボックス、静電容量の測定方法、容量測定用ボックス及び容量計 |
CN100474551C (zh) * | 2006-08-23 | 2009-04-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 定位校准装置及定位校准系统 |
JP2008241642A (ja) * | 2007-03-29 | 2008-10-09 | Dainippon Screen Mfg Co Ltd | 表面電位計 |
JP4956328B2 (ja) | 2007-08-24 | 2012-06-20 | 東京エレクトロン株式会社 | 搬送アームの移動位置の調整方法及び位置検出用治具 |
WO2009147385A2 (en) * | 2008-06-05 | 2009-12-10 | Oxford Rf Sensors Limited | Position sensor |
US9245786B2 (en) * | 2011-06-02 | 2016-01-26 | Applied Materials, Inc. | Apparatus and methods for positioning a substrate using capacitive sensors |
DE102011078369B4 (de) | 2011-06-29 | 2013-02-28 | Ident Technology Ag | Kapazitive Sensoreinrichtung sowie Verfahren zum Kalibrieren einer kapazitiven Sensoreinrichtung |
US9146207B2 (en) * | 2012-01-10 | 2015-09-29 | Hzo, Inc. | Methods, apparatuses and systems for sensing exposure of electronic devices to moisture |
KR101356774B1 (ko) * | 2012-03-12 | 2014-01-27 | 최성훈 | 보정 지그 장치 |
US9425112B2 (en) * | 2012-06-07 | 2016-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Calibration kits for RF passive devices |
WO2014057843A1 (ja) * | 2012-10-11 | 2014-04-17 | 株式会社クリエイティブ テクノロジー | ワーク保持装置及びこれを用いたワークの横ずれ検出方法 |
EP3092503A4 (en) * | 2014-01-08 | 2017-03-15 | HzO, Inc. | Methods, apparatuses and systems for sensing exposure of electronic devices to moisture |
CN105097601A (zh) * | 2014-04-17 | 2015-11-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 晶片校准装置以及半导体加工设备 |
DE112015005942T5 (de) * | 2015-01-13 | 2017-10-19 | Sumitomo Riko Company Limited | Kapazitätsmessvorrichtung, kapazitätstypartige Flachsensoreinrichtung und kapazitätstypartige Flüssigkeitspegeldetektionseinrichtung |
US9903739B2 (en) | 2015-06-11 | 2018-02-27 | Tokyo Electron Limited | Sensor chip for electrostatic capacitance measurement and measuring device having the same |
JP6537433B2 (ja) * | 2015-06-11 | 2019-07-03 | 東京エレクトロン株式会社 | 静電容量測定用のセンサチップ及び同センサチップを備えた測定器 |
-
2017
- 2017-07-31 JP JP2017148031A patent/JP6948873B2/ja active Active
-
2018
- 2018-07-26 US US16/045,910 patent/US10837810B2/en active Active
- 2018-07-27 CN CN201810842703.7A patent/CN109324303B/zh active Active
- 2018-07-27 TW TW107125983A patent/TWI794259B/zh active
- 2018-07-30 KR KR1020180088373A patent/KR102636225B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201913135A (zh) | 2019-04-01 |
JP2019027944A (ja) | 2019-02-21 |
CN109324303A (zh) | 2019-02-12 |
US20190033103A1 (en) | 2019-01-31 |
CN109324303B (zh) | 2021-05-28 |
KR20190013634A (ko) | 2019-02-11 |
TWI794259B (zh) | 2023-03-01 |
KR102636225B1 (ko) | 2024-02-13 |
US10837810B2 (en) | 2020-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6948873B2 (ja) | 測定器を較正する方法、及び、ケース | |
TWI781253B (zh) | 獲得測量器之偏離量的方法以及校正處理系統之搬送位置資料的方法 | |
KR20170142905A (ko) | 정전 용량 측정용 측정기, 및 측정기를 이용하여 처리 시스템에 있어서의 반송 위치 데이터를 교정하는 방법 | |
TWI794563B (zh) | 搬送方法及搬送系統 | |
JP7037964B2 (ja) | 測定器、及びフォーカスリングを検査するためのシステムの動作方法 | |
JP6832207B2 (ja) | 静電容量測定用の測定器 | |
JP7029983B2 (ja) | 測定器及び測定器のずれ量を求める方法 | |
US20230204643A1 (en) | Measuring instrument and measuring method | |
JP2022107401A (ja) | 測定器及び測定方法 | |
JP2020190539A (ja) | 測定器及び測定方法 | |
JP2024036972A (ja) | 測定方法 | |
JP2022068582A (ja) | 搬送位置データの較正方法 | |
TW202346855A (zh) | 測定方法、測定器及測定系統 | |
JP2023121729A (ja) | 測定方法、測定器及び測定システム | |
KR20240033648A (ko) | 측정 방법, 측정 시스템 및 측정기 | |
CN116626397A (zh) | 测定方法、测定器及测定系统 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200528 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200528 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210405 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210511 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210514 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210824 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210921 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6948873 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |