JP4809594B2 - 検査装置 - Google Patents

検査装置 Download PDF

Info

Publication number
JP4809594B2
JP4809594B2 JP2004226149A JP2004226149A JP4809594B2 JP 4809594 B2 JP4809594 B2 JP 4809594B2 JP 2004226149 A JP2004226149 A JP 2004226149A JP 2004226149 A JP2004226149 A JP 2004226149A JP 4809594 B2 JP4809594 B2 JP 4809594B2
Authority
JP
Japan
Prior art keywords
mounting table
load
contact load
inspection apparatus
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004226149A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006047025A (ja
JP2006047025A5 (enExample
Inventor
勇 猪股
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004226149A priority Critical patent/JP4809594B2/ja
Priority to TW094122155A priority patent/TWI394955B/zh
Priority to US11/659,085 priority patent/US7688096B2/en
Priority to KR1020087017213A priority patent/KR20080081041A/ko
Priority to KR1020077002635A priority patent/KR20070028611A/ko
Priority to PCT/JP2005/013826 priority patent/WO2006013773A1/ja
Publication of JP2006047025A publication Critical patent/JP2006047025A/ja
Publication of JP2006047025A5 publication Critical patent/JP2006047025A5/ja
Application granted granted Critical
Publication of JP4809594B2 publication Critical patent/JP4809594B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
JP2004226149A 2004-08-02 2004-08-02 検査装置 Expired - Fee Related JP4809594B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004226149A JP4809594B2 (ja) 2004-08-02 2004-08-02 検査装置
TW094122155A TWI394955B (zh) 2004-08-02 2005-06-30 Contact load measuring device and inspection device
KR1020087017213A KR20080081041A (ko) 2004-08-02 2005-07-28 접촉 하중 측정 장치 및 검사 장치
KR1020077002635A KR20070028611A (ko) 2004-08-02 2005-07-28 접촉 하중 측정 장치 및 검사 장치
US11/659,085 US7688096B2 (en) 2004-08-02 2005-07-28 Contact load measuring apparatus and inspecting apparatus
PCT/JP2005/013826 WO2006013773A1 (ja) 2004-08-02 2005-07-28 接触荷重測定装置および検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004226149A JP4809594B2 (ja) 2004-08-02 2004-08-02 検査装置

Publications (3)

Publication Number Publication Date
JP2006047025A JP2006047025A (ja) 2006-02-16
JP2006047025A5 JP2006047025A5 (enExample) 2008-08-21
JP4809594B2 true JP4809594B2 (ja) 2011-11-09

Family

ID=35787061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004226149A Expired - Fee Related JP4809594B2 (ja) 2004-08-02 2004-08-02 検査装置

Country Status (5)

Country Link
US (1) US7688096B2 (enExample)
JP (1) JP4809594B2 (enExample)
KR (2) KR20080081041A (enExample)
TW (1) TWI394955B (enExample)
WO (1) WO2006013773A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006137733A1 (en) 2005-06-23 2006-12-28 Keygene N.V. Strategies for high throughput identification and detection of polymorphisms
AU2006295556B2 (en) 2005-09-29 2012-07-05 Keygene N.V. High throughput screening of mutagenized populations
DK3404114T3 (da) 2005-12-22 2021-06-28 Keygene Nv Fremgangsmåde til detektering af AFLP-baseret polymorfisme med højt gennemløb
TWI490513B (zh) * 2006-12-29 2015-07-01 Intest Corp 用於使負載沿平移軸線平移之負載定位系統以及使負載達到平衡之方法
EP2104862B1 (en) * 2006-12-29 2012-08-08 inTEST Corporation Test head positioning system and method
KR100901982B1 (ko) * 2007-07-12 2009-06-08 주식회사 실트론 접착강도 시험장치
KR100936631B1 (ko) * 2007-11-22 2010-01-14 주식회사 쎄믹스 웨이퍼 프로버의 ｚ축 위치 제어 장치 및 방법
JP4605232B2 (ja) * 2008-02-21 2011-01-05 株式会社デンソー 荷重センサ及びその製造方法
JP4577585B2 (ja) * 2008-03-22 2010-11-10 株式会社デンソー 荷重センサの製造方法
US8519728B2 (en) * 2008-12-12 2013-08-27 Formfactor, Inc. Compliance control methods and apparatuses
JP5083339B2 (ja) * 2010-02-04 2012-11-28 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法並びに記憶媒体
JP5529769B2 (ja) * 2011-01-13 2014-06-25 東京エレクトロン株式会社 プローブカードの熱的安定化方法及び検査装置
US8963567B2 (en) 2011-10-31 2015-02-24 International Business Machines Corporation Pressure sensing and control for semiconductor wafer probing
US8901947B2 (en) 2012-09-28 2014-12-02 Electro Scientific Industries, Inc. Probe out-of-position sensing for automated test equipment
JP6137994B2 (ja) * 2013-08-28 2017-05-31 東京エレクトロン株式会社 デバイス検査方法
CN103745943B (zh) * 2014-01-29 2016-05-25 上海华力微电子有限公司 表面颗粒检测仪量测平台
KR101975386B1 (ko) 2018-01-08 2019-09-10 주식회사 한화 관성 이동체를 구비한 제품용 검사 장치 및 이를 이용한 관성 이동체를 구비한 제품의 검사 방법
JP7374682B2 (ja) * 2019-09-17 2023-11-07 株式会社国際電気セミコンダクターサービス 抵抗率測定器、半導体装置の製造方法および抵抗率測定方法
CN113624605B (zh) * 2021-08-16 2024-06-11 陕西大工旭航电磁科技有限公司 基于电磁力加载的中应变率实验装置
CN119043561A (zh) * 2024-09-26 2024-11-29 宸光(常州)新材料科技有限公司 水压检测装置及检测方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328148B2 (ja) * 1996-11-15 2002-09-24 株式会社東京精密 プロービング方法およびプローバ
JP4009801B2 (ja) * 1998-11-09 2007-11-21 日本精工株式会社 転がり軸受の予圧量測定装置
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
US6650135B1 (en) * 2000-06-29 2003-11-18 Motorola, Inc. Measurement chuck having piezoelectric elements and method
JP2001358204A (ja) * 2000-06-15 2001-12-26 Tokyo Electron Ltd 検査ステージ
JP4782953B2 (ja) 2001-08-06 2011-09-28 東京エレクトロン株式会社 プローブカード特性測定装置、プローブ装置及びプローブ方法
JP4827339B2 (ja) * 2001-08-29 2011-11-30 帝国ピストンリング株式会社 摩擦力測定装置
JP2003168707A (ja) * 2001-11-30 2003-06-13 Tokyo Electron Ltd プローブ装置
JP2003185704A (ja) * 2001-12-17 2003-07-03 Seiko Epson Corp 電極検査装置
JP4357813B2 (ja) * 2002-08-23 2009-11-04 東京エレクトロン株式会社 プローブ装置及びプローブ方法
US7068056B1 (en) * 2005-07-18 2006-06-27 Texas Instruments Incorporated System and method for the probing of a wafer

Also Published As

Publication number Publication date
KR20070028611A (ko) 2007-03-12
US7688096B2 (en) 2010-03-30
JP2006047025A (ja) 2006-02-16
TWI394955B (zh) 2013-05-01
US20090039903A1 (en) 2009-02-12
TW200606439A (en) 2006-02-16
WO2006013773A1 (ja) 2006-02-09
KR20080081041A (ko) 2008-09-05

Similar Documents

Publication Publication Date Title
JP4809594B2 (ja) 検査装置
JP2008243861A (ja) 検査装置及び検査方法
KR100936631B1 (ko) 웨이퍼 프로버의 ｚ축 위치 제어 장치 및 방법
US7825675B2 (en) Method and apparatus for providing active compliance in a probe card assembly
KR100562845B1 (ko) 프로브 장치 및 프로브 방법
JPWO2008053929A1 (ja) 微小構造体の検査装置、微小構造体の検査方法及び基板保持装置
WO2007089543A2 (en) Active probe contact array management
US20090128171A1 (en) Microstructure Probe Card, and Microstructure Inspecting Device, Method, and Computer Program
JP2003050271A (ja) プローブカード特性測定装置、プローブ装置及びプローブ方法
JP4218816B2 (ja) 針荷重測定方法、検査方法及び検査装置
JP4684805B2 (ja) プローブ装置及び被検査体とプローブとの接触圧の調整方法
JP2006019537A (ja) プローブ装置
JP2627393B2 (ja) 表示パネル用プローバ
JP2005283231A (ja) 半導体部品の検査装置および検査方法
KR102892971B1 (ko) 비접촉식 오엘이디 어레이 기판 테스트용 프로브 유닛
JP7581021B2 (ja) プローバの消費電力低減方法及びプローバ
Andersson et al. Impact of bending speed and setup on flex cracks in multilayer ceramic capacitors
JP2010210465A (ja) 荷重検出センサおよび荷重検出センサの製造方法
KR101176932B1 (ko) 반도체 칩 검사용 프로브 카드의 수평 조절 장치

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070802

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070802

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101026

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101221

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110816

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110819

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140826

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4809594

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees