Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
  • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Definitions

• the present invention relates to a contact load measuring apparatus and an inspection apparatus for measuring a contact load between an object to be inspected and a probe when an electrical characteristic inspection of the object to be inspected such as a semiconductor wafer is performed.
• This type of inspection apparatus is, for example, a prober that transfers a wafer between a loader chamber that internally carries a wafer that is an object to be inspected, and the loader chamber, and inspects the electrical characteristics of the wafer internally.
• Room The prober chamber is provided with a mounting table that supports the wafer and a lifting mechanism that lifts and lowers the mounting table.
• the prober chamber is provided with a probe disposed above the mounting table and an alignment mechanism for aligning the probe and the wafer.
• the alignment mechanism aligns the wafer on the mounting table and the probe.
• the mounting table is raised by the lifting mechanism, and the wafer and the probe are brought into contact with each other.
• the mounting table is raised by a predetermined overdrive amount, and the wafer and the probe are brought into electrical contact to inspect the electrical characteristics of the wafer.
• the inspection is performed in a state where the wafer and the probe are in contact with each other with a predetermined contact load by overdriving the mounting table.
• This contact load may cause stagnation in the probe card that supports the probe or sink in the mounting table. For this reason, even if the mounting table is raised with a constant overdrive amount, the wafer and the probe are not always in contact with each other with a desired contact load.
• Japanese Laid-Open Patent Publication No. 2003-050271 discloses a probe card characteristic measuring apparatus.
• This device is a special feature of the probe card that supports the probe when the mounting table is raised and the probe is brought into contact with the object to be inspected to inspect the electrical characteristics of the object. It is a device that measures sex.
• This apparatus includes a load sensor that detects a load from the probe card on the mounting table, and a displacement sensor that detects an absolute displacement amount of the probe card. With this configuration, by measuring the absolute displacement of the probe card, it is possible to accurately grasp the relationship between the overdrive amount of the mounting table and the load.
• Japanese Patent Laid-Open No. 2003-168707 discloses a probe device provided with a contact load monitoring device.
• the contact load monitoring device monitors the contact load through the sinking amount of the mounting table caused by the contact load acting on the mounting table from the probe during overdrive.
• a displacement sensor is provided that measures the displacement amount of the distance on the reference surface on the lower surface side of the mounting table as the sinking amount.
• Japanese Patent No. 3128354 discloses an electronic component mounting apparatus.
• This apparatus includes a head mechanism that holds electronic components and a head lifting mechanism that moves the head up and down with respect to a printed board supported by the board lifting mechanism.
• the substrate lifting mechanism is provided with a plurality of support pins for supporting the print substrate. These support pins are provided with force sensors that measure the pressing force received by each support pin when the electronic component is mounted. By controlling the operation of the head lifting mechanism based on the detection signals of these force sensors, the electronic component is pressed onto the printed circuit board with a predetermined pressing force.
• a strain gauge for example, a piezoelectric sensor is used as a force sensor for detecting a pressing force.
• a plurality of force sensors are provided for each of the plurality of support pins, and the pressing force applied to each force sensor is added up.
• the pressing force of the head mechanism must be calculated.
• the force detected by the force sensor is only large enough to mount electronic components on a printed circuit board, so there is little need to consider the effects of deformation of each part.
• the present invention has been made to solve the above problems, and can directly and accurately measure a contact load that does not cause deformation to such an extent that the load sensor affects the inspection.
• a contact load measuring device and an inspection device For the purpose of providing a contact load measuring device and an inspection device!
• the present invention provides a probe for an object to be inspected supported on a mounting table that can be raised and lowered.
• a contact load measuring device including an element is provided.
• this contact load measuring apparatus it is possible to directly and highly accurately measure a contact load that does not cause deformation to such an extent that the load sensor affects the inspection.
• the present invention is an inspection apparatus for inspecting the electrical characteristics of an object to be inspected, a mounting table that supports the test body, a lifting mechanism that lifts and lowers the mounting base, and the lifting mechanism
• a driving device that drives the probe, a probe that contacts the object to be inspected on the mounting table raised by the elevating mechanism driven by the driving device, and a contact load between the object to be inspected and the probe.
• An inspection apparatus including a compression-type piezoelectric element as a load sensor to be detected is provided.
• the contact load is measured directly and with high accuracy while the rigidity is high and the structure is realized, and the load sensor does not cause deformation to the extent that the load sensor affects the inspection. be able to.
• the compression type piezoelectric element as the load sensor can detect the contact load as a vibration waveform.
• the inspection apparatus further includes a reverse phase generator that generates a reverse phase signal that is an electric signal having a waveform opposite in phase to the vibration waveform, and the drive device includes the reverse phase generator. It is preferable that the elevating mechanism is driven based on the reverse phase signal generated by the phase generator.
• the load sensor is preferably preloaded.
• FIG. 1 is a schematic diagram showing an embodiment of an inspection apparatus according to the present invention.
• FIG. 2 is an enlarged cross-sectional view showing a main part of the contact load measuring apparatus shown in FIG.
• FIG. 3a is a graph showing the contact load obtained by the measuring apparatus shown in FIG.
• FIG. 3b is a graph showing an enlarged portion B of FIG. 3a.
• FIG. 4 is a schematic view showing another embodiment of the inspection apparatus of the present invention.
• An inspection apparatus 10 shown in FIG. 1 includes a semiconductor wafer as an object to be inspected, and a columnar mounting table 11 on which W can be moved up and down. Further, an elevating mechanism 12 that elevates the mounting table 11 and a drive device 24 that drives the elevating mechanism 12 are provided. Above the mounting table 11, a probe card 13 having a probe 13A is arranged.
• This inspection device 10 has a relatively high rigidity in structure, and under the control of a control device (not shown), the probe 13A is brought into electrical contact with Ueno and W to electrically connect the Ueno and W. It is configured to perform characteristic inspection.
• the mounting table 11 is installed on, for example, an XY stage (not shown).
• the XY stage is a stage that can move in the X and Y directions orthogonal to each other in the horizontal plane, and is mounted via an alignment mechanism (not shown) while moving in the X and Y directions under the control of the control device.
• the wafer W on the table 11 and the probe 13A on the probe card 13 are aligned in the horizontal direction.
• the elevating mechanism 12 raises the mounting table 11 until it reaches a predetermined overdrive amount with respect to the probe 13A, thereby bringing the wafer W and the probe 13A into contact with each other with a predetermined contact load (needle pressure). Configured to perform electrical characteristics inspection of W ing.
• the elevating mechanism 12 has a ball screw 12C disposed concentrically with the mounting table 11.
• the ball screw 12C is connected to the lower center of a cylindrical body 12A attached to the lower surface of the mounting table 11 via a connecting member 12B.
• a bearing body 12D that rotatably supports the ball screw 12C and a bottomed cylindrical support body 12E surrounding the cylindrical body 12A are provided.
• a guide mechanism 12F that guides the cylindrical body 12A so as to be movable up and down within the support body 12E is provided.
• the mounting table 11 is mounted on the XY stage via a cylindrical body 12A and a support body 12E.
• the elevating mechanism 12 is configured to elevate the mounting table 11 on the XY stage by the rotation of the ball screw 12C.
• the inspection device 10 includes a contact load measuring device 20.
• the measuring device 20 includes a load sensor 21, an amplifier (for example, a charge amplifier) 22 connected to the sensor 21, and a display device 25 connected to the amplifier 22.
• an amplifier for example, a charge amplifier
• the load sensor 21 is provided between the bearing body 12D and the support body 12E in the elevating mechanism 12, and is configured to detect a contact load as a vibration waveform.
• the load sensor 21 includes a compression type piezoelectric element (for example, a crystal element).
• the load sensor 21 is hardly deformed even when subjected to a large contact load, and has high rigidity so as not to cause a measurement error that does not cause the mounting table 11 to sink.
• the load sensor 21 generates an electric charge proportional to the acceleration based on the contact load.
• the amplifier 22 converts the detection signal of the load sensor 21 into a voltage signal and amplifies the voltage signal, and the amplified voltage signal is displayed on the display device 25.
• the inspection apparatus 10 includes a negative phase generator (for example, a negative phase amplifier) 23 connected to the amplifier 22 and the driving device 24.
• This negative phase generator 23 is based on the voltage signal from the amplifier 22! / ⁇ , and the negative phase signal (the negative phase voltage signal) ) Is generated.
• the driving device 24 rotationally drives the ball screw 12C of the elevating mechanism 12 based on the negative phase signal generated by the negative phase generator 23.
• the mounting table 11 can be raised by the elevating mechanism 12. First, the wafer W on the mounting table 11 and the probe 13A come into contact with each other. When a contact load acts between the wafer W and the probe 13A by further raising the mounting table 11 (overdrive), the contact load is transferred from the mounting table 11 to the load sensor 21 via the lifting mechanism 12. Directly transmitted.
• the load sensor 21 includes an upper plate (in this embodiment, a bearing body 12D) 21A and a lower plate 21B (in this embodiment, the bottom wall portion of the support 12E). It is placed between. Then, the load sensor 21 is preloaded so as to receive a predetermined pressure by a preload bolt 21C for fastening the upper plate 21A and the lower plate 21B. By preloading in this way, it is possible to avoid a region with poor linearity at low load and to perform high-accuracy measurement using a region with good linearity.
• the load sensor 21 is constituted by the compression-type piezoelectric element preloaded as described above, it can detect not only the pressing force but also the tensile force. As shown in Fig. 3a, when the mounting table 11 is overdriven during the inspection of the wafer W and the contact load is increased with time, the contact load repeatedly increases and decreases as shown in Fig. 3b. As shown, this vibration waveform can be detected by the load sensor 21.
• the load sensor 21 includes a crystal element as a compression type piezoelectric element, for example, it is possible to obtain a detection load having excellent linearity with respect to contact load and excellent resolution with no hysteresis. Further, such a load sensor 21 has a simple structure, excellent mounting properties, small force, and high rigidity, so that the influence of the sinking amount of the mounting table 11 can be greatly suppressed.
• the driving device 24 includes a motor that rotates the ball screw 12C of the elevating mechanism 12, and a driver circuit that drives the motor. Then, the driver circuit drives the motor based on the negative phase signal from the negative phase generator 23, so that the mounting table 11 is provided with vibration having a reverse phase waveform with respect to the vibration waveform of the contact load. As a result, the vibration of the mounting table 11 is attenuated, and the mounting table 11 can be stopped and stabilized in a short time, thereby increasing the inspection throughput.
• a wafer W which is an object to be inspected, is mounted on the mounting table 11.
• the mounting table 11 is X- While moving through the Y table, the alignment mechanism aligns the wafer w with the probe 13A of the probe force mode 13. After the alignment, the mounting table 11 moves through the XY table, so that the wafer W reaches just below the probe card 13. In this state, the mounting table 11 is raised by the lifting mechanism 12 driven by the driving device 24.
• the Ueno, W and the probe 13A come into contact as shown in FIG.
• a contact load starts to be generated between the wafer W and the probe 13A.
• This contact load is directly applied to the load sensor 21 through the cylinder 12A, the connecting member 12B, the ball screw 12C, and the bearing body 12D of the elevating mechanism 12.
• the load sensor 21 sequentially detects the contact load due to overdrive, and the result is displayed on the display device 25 via the amplifier 22 as shown in FIG. 3a.
• the contact load increases and the amount of overdrive of the mounting table 11 approaches a predetermined value
• the mounting table 11 rising through the ball screw 12C slightly vibrates.
• the load sensor 21 detects this slight vibration as a vibration waveform as shown in FIG. 3b.
• the highly rigid load sensor 21 that detects the contact load between Ueno, W, the probe, and 13A as a vibration waveform is provided, the load is increased by the contact load. It is possible to measure the contact load directly and with high accuracy without causing the sensor to deform so as to affect the inspection.
• the driving device 24 drives the lifting mechanism 12 based on the negative phase signal generated by the negative phase generator 23, the vibration of the mounting table 11 It is possible to stabilize and stabilize the mounting table 11 in a short time. This can increase the inspection output.
• the drive device 24 is directly connected using the signal from the load sensor 21. Since it is controlled, the lifting mechanism 12 can be quickly controlled. As a result, the mounting table 11 can be stopped and stabilized in a shorter time.
• the load sensor 21 since the load sensor 21 is preloaded, the linearity at the time of low load is poor and the region can be eliminated. The linearity is excellent and the region is used for high accuracy. Can be measured.
• FIG. 4 shows an inspection apparatus according to another embodiment of the present invention.
• the inspection device 10 shown in FIG. 4 is configured to once transmit the detection signal of the load sensor 21 converted and amplified by the amplifier 22 to the controller 14 and to control the drive device 24 via the controller 14. It is a thing.
• Other configurations are substantially the same as those of the above-described embodiment shown in FIGS.
• the controller 14 of the present embodiment includes, for example, the negative phase generator 23 of FIG. 1, and controls the driver circuit of the driving device 24 by the negative phase signal generated by the negative phase generator 23.
• the drive device 24 is controlled based on the signal from the load sensor 21. Compared with the above embodiment in which the device 24 is directly controlled, quick control becomes difficult. In other respects, this embodiment can achieve the same effects as those of the above-described embodiment.
• the present invention is not limited to the above embodiment.
• a piezoelectric element other than the crystal element for example, a piezoelectric element having a conventionally known ceramic force such as lead zirconate titanate or lead zirconate can be used.
• the wafer W is described as an example of the inspection object, but the present invention can also be applied to an inspection object such as a liquid crystal substrate.

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• Engineering & Computer Science (AREA)
• General Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)
• Tests Of Electronic Circuits (AREA)
• Measuring Leads Or Probes (AREA)

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Applications Claiming Priority (2)

Publications (1)

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Cited By (3)

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Citations (3)

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• 2004
  • 2004-08-02 JP JP2004226149A patent/JP4809594B2/ja not_active Expired - Fee Related
• 2005
  • 2005-06-30 TW TW094122155A patent/TWI394955B/zh active
  • 2005-07-28 KR KR1020087017213A patent/KR20080081041A/ko not_active Ceased
  • 2005-07-28 US US11/659,085 patent/US7688096B2/en active Active
  • 2005-07-28 WO PCT/JP2005/013826 patent/WO2006013773A1/ja not_active Ceased
  • 2005-07-28 KR KR1020077002635A patent/KR20070028611A/ko not_active Ceased

Patent Citations (3)

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