TWI394955B - Contact load measuring device and inspection device - Google Patents
Contact load measuring device and inspection device Download PDFInfo
- Publication number
- TWI394955B TWI394955B TW094122155A TW94122155A TWI394955B TW I394955 B TWI394955 B TW I394955B TW 094122155 A TW094122155 A TW 094122155A TW 94122155 A TW94122155 A TW 94122155A TW I394955 B TWI394955 B TW I394955B
- Authority
- TW
- Taiwan
- Prior art keywords
- load
- mounting table
- contact load
- probe
- contact
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims description 48
- 239000000523 sample Substances 0.000 claims description 45
- 230000003028 elevating effect Effects 0.000 claims description 15
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 12
- 238000006073 displacement reaction Methods 0.000 description 11
- 238000001514 detection method Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004226149A JP4809594B2 (ja) | 2004-08-02 | 2004-08-02 | 検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200606439A TW200606439A (en) | 2006-02-16 |
| TWI394955B true TWI394955B (zh) | 2013-05-01 |
Family
ID=35787061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094122155A TWI394955B (zh) | 2004-08-02 | 2005-06-30 | Contact load measuring device and inspection device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7688096B2 (enExample) |
| JP (1) | JP4809594B2 (enExample) |
| KR (2) | KR20080081041A (enExample) |
| TW (1) | TWI394955B (enExample) |
| WO (1) | WO2006013773A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006137733A1 (en) | 2005-06-23 | 2006-12-28 | Keygene N.V. | Strategies for high throughput identification and detection of polymorphisms |
| AU2006295556B2 (en) | 2005-09-29 | 2012-07-05 | Keygene N.V. | High throughput screening of mutagenized populations |
| DK3404114T3 (da) | 2005-12-22 | 2021-06-28 | Keygene Nv | Fremgangsmåde til detektering af AFLP-baseret polymorfisme med højt gennemløb |
| TWI490513B (zh) * | 2006-12-29 | 2015-07-01 | Intest Corp | 用於使負載沿平移軸線平移之負載定位系統以及使負載達到平衡之方法 |
| EP2104862B1 (en) * | 2006-12-29 | 2012-08-08 | inTEST Corporation | Test head positioning system and method |
| KR100901982B1 (ko) * | 2007-07-12 | 2009-06-08 | 주식회사 실트론 | 접착강도 시험장치 |
| KR100936631B1 (ko) * | 2007-11-22 | 2010-01-14 | 주식회사 쎄믹스 | 웨이퍼 프로버의 ｚ축 위치 제어 장치 및 방법 |
| JP4605232B2 (ja) * | 2008-02-21 | 2011-01-05 | 株式会社デンソー | 荷重センサ及びその製造方法 |
| JP4577585B2 (ja) * | 2008-03-22 | 2010-11-10 | 株式会社デンソー | 荷重センサの製造方法 |
| US8519728B2 (en) * | 2008-12-12 | 2013-08-27 | Formfactor, Inc. | Compliance control methods and apparatuses |
| JP5083339B2 (ja) * | 2010-02-04 | 2012-11-28 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法並びに記憶媒体 |
| JP5529769B2 (ja) * | 2011-01-13 | 2014-06-25 | 東京エレクトロン株式会社 | プローブカードの熱的安定化方法及び検査装置 |
| US8963567B2 (en) | 2011-10-31 | 2015-02-24 | International Business Machines Corporation | Pressure sensing and control for semiconductor wafer probing |
| US8901947B2 (en) | 2012-09-28 | 2014-12-02 | Electro Scientific Industries, Inc. | Probe out-of-position sensing for automated test equipment |
| JP6137994B2 (ja) * | 2013-08-28 | 2017-05-31 | 東京エレクトロン株式会社 | デバイス検査方法 |
| CN103745943B (zh) * | 2014-01-29 | 2016-05-25 | 上海华力微电子有限公司 | 表面颗粒检测仪量测平台 |
| KR101975386B1 (ko) | 2018-01-08 | 2019-09-10 | 주식회사 한화 | 관성 이동체를 구비한 제품용 검사 장치 및 이를 이용한 관성 이동체를 구비한 제품의 검사 방법 |
| JP7374682B2 (ja) * | 2019-09-17 | 2023-11-07 | 株式会社国際電気セミコンダクターサービス | 抵抗率測定器、半導体装置の製造方法および抵抗率測定方法 |
| CN113624605B (zh) * | 2021-08-16 | 2024-06-11 | 陕西大工旭航电磁科技有限公司 | 基于电磁力加载的中应变率实验装置 |
| CN119043561A (zh) * | 2024-09-26 | 2024-11-29 | 宸光(常州)新材料科技有限公司 | 水压检测装置及检测方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10150081A (ja) * | 1996-11-15 | 1998-06-02 | Tokyo Seimitsu Co Ltd | プロービング方法およびプローバ |
| US6286374B1 (en) * | 1998-11-09 | 2001-09-11 | Nsk Ltd. | Preload measuring apparatus of rolling bearing |
| US6501289B1 (en) * | 1999-03-11 | 2002-12-31 | Tokyo Electron Limited | Inspection stage including a plurality of Z shafts, and inspection apparatus |
| US6650135B1 (en) * | 2000-06-29 | 2003-11-18 | Motorola, Inc. | Measurement chuck having piezoelectric elements and method |
| TW200403440A (en) * | 2002-08-23 | 2004-03-01 | Tokyo Electron Ltd | Probe apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358204A (ja) * | 2000-06-15 | 2001-12-26 | Tokyo Electron Ltd | 検査ステージ |
| JP4782953B2 (ja) | 2001-08-06 | 2011-09-28 | 東京エレクトロン株式会社 | プローブカード特性測定装置、プローブ装置及びプローブ方法 |
| JP4827339B2 (ja) * | 2001-08-29 | 2011-11-30 | 帝国ピストンリング株式会社 | 摩擦力測定装置 |
| JP2003168707A (ja) * | 2001-11-30 | 2003-06-13 | Tokyo Electron Ltd | プローブ装置 |
| JP2003185704A (ja) * | 2001-12-17 | 2003-07-03 | Seiko Epson Corp | 電極検査装置 |
| US7068056B1 (en) * | 2005-07-18 | 2006-06-27 | Texas Instruments Incorporated | System and method for the probing of a wafer |
-
2004
- 2004-08-02 JP JP2004226149A patent/JP4809594B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-30 TW TW094122155A patent/TWI394955B/zh active
- 2005-07-28 KR KR1020087017213A patent/KR20080081041A/ko not_active Ceased
- 2005-07-28 US US11/659,085 patent/US7688096B2/en active Active
- 2005-07-28 WO PCT/JP2005/013826 patent/WO2006013773A1/ja not_active Ceased
- 2005-07-28 KR KR1020077002635A patent/KR20070028611A/ko not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10150081A (ja) * | 1996-11-15 | 1998-06-02 | Tokyo Seimitsu Co Ltd | プロービング方法およびプローバ |
| US6286374B1 (en) * | 1998-11-09 | 2001-09-11 | Nsk Ltd. | Preload measuring apparatus of rolling bearing |
| US6501289B1 (en) * | 1999-03-11 | 2002-12-31 | Tokyo Electron Limited | Inspection stage including a plurality of Z shafts, and inspection apparatus |
| US6650135B1 (en) * | 2000-06-29 | 2003-11-18 | Motorola, Inc. | Measurement chuck having piezoelectric elements and method |
| TW200403440A (en) * | 2002-08-23 | 2004-03-01 | Tokyo Electron Ltd | Probe apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070028611A (ko) | 2007-03-12 |
| US7688096B2 (en) | 2010-03-30 |
| JP2006047025A (ja) | 2006-02-16 |
| JP4809594B2 (ja) | 2011-11-09 |
| US20090039903A1 (en) | 2009-02-12 |
| TW200606439A (en) | 2006-02-16 |
| WO2006013773A1 (ja) | 2006-02-09 |
| KR20080081041A (ko) | 2008-09-05 |
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