JP4782870B2 - 硬化体、シート状成形体、積層板及び多層積層板 - Google Patents

硬化体、シート状成形体、積層板及び多層積層板 Download PDF

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Publication number
JP4782870B2
JP4782870B2 JP2009531681A JP2009531681A JP4782870B2 JP 4782870 B2 JP4782870 B2 JP 4782870B2 JP 2009531681 A JP2009531681 A JP 2009531681A JP 2009531681 A JP2009531681 A JP 2009531681A JP 4782870 B2 JP4782870 B2 JP 4782870B2
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epoxy resin
cured
resin composition
silica
compound
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JPWO2010013741A1 (ja
Inventor
信弘 後藤
克 瓶子
英寛 出口
剛之 小林
淳之介 村上
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
JP2009531681A 2008-07-31 2009-07-29 硬化体、シート状成形体、積層板及び多層積層板 Active JP4782870B2 (ja)

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JP2009531681A JP4782870B2 (ja) 2008-07-31 2009-07-29 硬化体、シート状成形体、積層板及び多層積層板

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JP2008198036 2008-07-31
JP2008198036 2008-07-31
PCT/JP2009/063477 WO2010013741A1 (ja) 2008-07-31 2009-07-29 エポキシ樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板
JP2009531681A JP4782870B2 (ja) 2008-07-31 2009-07-29 硬化体、シート状成形体、積層板及び多層積層板

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JPWO2010013741A1 JPWO2010013741A1 (ja) 2012-01-12

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US (2) US20110189432A1 (OSRAM)
JP (2) JP4782870B2 (OSRAM)
KR (1) KR101383434B1 (OSRAM)
CN (2) CN103232682B (OSRAM)
TW (1) TW201012860A (OSRAM)
WO (1) WO2010013741A1 (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140124792A (ko) 2012-01-23 2014-10-27 아지노모토 가부시키가이샤 수지 조성물
US8912279B2 (en) 2011-05-27 2014-12-16 Ajinomoto Co., Inc. Resin composition

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101148225B1 (ko) * 2008-09-01 2012-05-21 세키스이가가쿠 고교가부시키가이샤 적층체의 제조 방법
WO2010035452A1 (ja) * 2008-09-24 2010-04-01 積水化学工業株式会社 樹脂組成物、硬化体及び積層体
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