MX2017012200A - Composicion de resina epoxi para la preparacion de articulos para exteriores, y los articulos obtenidos de la misma. - Google Patents

Composicion de resina epoxi para la preparacion de articulos para exteriores, y los articulos obtenidos de la misma.

Info

Publication number
MX2017012200A
MX2017012200A MX2017012200A MX2017012200A MX2017012200A MX 2017012200 A MX2017012200 A MX 2017012200A MX 2017012200 A MX2017012200 A MX 2017012200A MX 2017012200 A MX2017012200 A MX 2017012200A MX 2017012200 A MX2017012200 A MX 2017012200A
Authority
MX
Mexico
Prior art keywords
articles
epoxy resin
resin composition
thermosetting epoxy
preparation
Prior art date
Application number
MX2017012200A
Other languages
English (en)
Inventor
Beisele Christian
Chen Hongyan
Liu Zhijian
HISHIKAWA Satoru
Original Assignee
Huntsman Adv Mat Licensing Switzerland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Licensing Switzerland Gmbh filed Critical Huntsman Adv Mat Licensing Switzerland Gmbh
Publication of MX2017012200A publication Critical patent/MX2017012200A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Civil Engineering (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Insulating Of Coils (AREA)
  • Housings And Mounting Of Transformers (AREA)
  • Organic Insulating Materials (AREA)

Abstract

Una composición de resina epoxi termoendurecible de múltiples componentes que comprende (A) al menos una resina epoxi del tipo de glicidil cicloalifático sin un grupo éster, (B) al menos un agente de curado seleccionado del grupo de amina alifática, amina cicloalifática, y diciandiamida, y (C) al menos un relleno silanizado, la cual, en particular, es adecuada para la fabricación de artículos de sistema de aislamiento externos para ingeniería eléctrica por procesos de moldeo, relleno, encapsulación e impregnación, donde los artículos exhiben buenas propiedades mecánicas, eléctricas y dieléctricas, y pueden ser usados como aislantes bujes, interruptores y transformadores de instrumento.
MX2017012200A 2015-03-26 2016-03-10 Composicion de resina epoxi para la preparacion de articulos para exteriores, y los articulos obtenidos de la misma. MX2017012200A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2015075085 2015-03-26
PCT/EP2016/055162 WO2016150724A1 (en) 2015-03-26 2016-03-10 A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom

Publications (1)

Publication Number Publication Date
MX2017012200A true MX2017012200A (es) 2017-12-15

Family

ID=55589807

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017012200A MX2017012200A (es) 2015-03-26 2016-03-10 Composicion de resina epoxi para la preparacion de articulos para exteriores, y los articulos obtenidos de la misma.

Country Status (13)

Country Link
US (1) US10696820B2 (es)
EP (1) EP3274390B1 (es)
JP (3) JP6824179B2 (es)
KR (1) KR102598118B1 (es)
CN (2) CN117285698A (es)
CA (1) CA2976846C (es)
DK (1) DK3274390T3 (es)
ES (1) ES2883832T3 (es)
HU (1) HUE055642T2 (es)
MX (1) MX2017012200A (es)
PL (1) PL3274390T3 (es)
TW (1) TWI709605B (es)
WO (1) WO2016150724A1 (es)

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CA3090033A1 (en) * 2018-02-15 2020-08-20 Huntsman Advanced Materials Americas Llc Low density epoxy syntactic structural adhesives for automotive applications
KR101986583B1 (ko) * 2018-03-19 2019-06-10 한국신발피혁연구원 기능성 선박 갑판 피복용 열경화성 수지 조성물
CN108503555B (zh) * 2018-05-09 2021-06-29 万华化学集团股份有限公司 4-((4-(二甲氨基)环己基)甲基)环己醇及制备方法和应用
CN111836851A (zh) * 2019-02-14 2020-10-27 亨斯迈先进材料美国有限责任公司 用于汽车应用的低密度环氧复合结构粘合剂
CN109971129A (zh) * 2019-04-04 2019-07-05 义乌市宝讯电子科技有限公司 一种绝缘复合材料及其制备方法
US20220135862A1 (en) * 2019-04-11 2022-05-05 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Curable Two-Component Resin-Based System
CN110320090A (zh) * 2019-07-01 2019-10-11 中航复合材料有限责任公司 一种复合材料加筋壁板轴压试验件的灌封方法
CN112143172A (zh) * 2020-08-31 2020-12-29 南方电网科学研究院有限责任公司 一种具有较低吸水率的绝缘子护套材料及其制备方法

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Also Published As

Publication number Publication date
US10696820B2 (en) 2020-06-30
EP3274390B1 (en) 2021-07-07
JP2021014583A (ja) 2021-02-12
CN107743501A (zh) 2018-02-27
KR102598118B1 (ko) 2023-11-06
EP3274390A1 (en) 2018-01-31
JP7324336B2 (ja) 2023-08-09
CA2976846A1 (en) 2016-09-29
KR20170131368A (ko) 2017-11-29
JP2022116017A (ja) 2022-08-09
TWI709605B (zh) 2020-11-11
DK3274390T3 (da) 2021-08-02
HUE055642T2 (hu) 2021-12-28
US20180118922A1 (en) 2018-05-03
TW201638203A (zh) 2016-11-01
CN117285698A (zh) 2023-12-26
JP2018512474A (ja) 2018-05-17
WO2016150724A1 (en) 2016-09-29
ES2883832T3 (es) 2021-12-09
JP6824179B2 (ja) 2021-02-03
PL3274390T3 (pl) 2021-12-27
CA2976846C (en) 2023-08-01

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