MY161359A - Epoxy resin composition and semiconductor sealing material using same - Google Patents

Epoxy resin composition and semiconductor sealing material using same

Info

Publication number
MY161359A
MY161359A MYPI2013002887A MYPI2013002887A MY161359A MY 161359 A MY161359 A MY 161359A MY PI2013002887 A MYPI2013002887 A MY PI2013002887A MY PI2013002887 A MYPI2013002887 A MY PI2013002887A MY 161359 A MY161359 A MY 161359A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
mass
content
diglycidyl ether
Prior art date
Application number
MYPI2013002887A
Inventor
Yohei Hosono
Hiroki Homma
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of MY161359A publication Critical patent/MY161359A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

THE PRESENT INVENTION PROVIDES AN EPOXY RESIN COMPOSITION WHICH HAS A LOW VISCOSITY, IS CAPABLE OF CURING AT A LOW TEMPERATURE IN A SHORT TIME PERIOD, HAS EXCELLENT HEAT RESISTANCE, VOLTAGE RESISTANCE, ELECTRICAL INSULATING PROPERTIES, MOISTURE RESISTANCE, MECHANICAL STRENGTH AND ADHESIVENESS, HAS EXCELLENT SOLDER BALL REINFORCING PROPERTIES AT THE TIME OF SEALING, AND HAS A LONG POT LIFE; AND A SEMICONDUCTOR SEALING MATERIAL USING THE EPOXY RESIN COMPOSITION. THE PRESENT INVENTION PROVIDES AN EPOXY RESIN COMPOSITION COMPRISING: (A) AN EPOXY RESIN, (B) 1,4- CYCLOHEXARIEDIMETHANOL DIGLYCIDYL ETHER, (C) AN IMIDAZOLE-BASED LATENT CURING AGENT, AND (D) A PHENOLIC RESIN, WHEREIN THE CONTENT OF THE (B) 1,4-CYCLOHEXANEDIMETHANOL DIGLYCIDYL ETHER RELATIVE TO THE TOTAL MASS OF THE (A) EPOXY RESIN AND THE (B) 1,4-CYCLOHEXANEDIMETHANOL DIGLYCIDYL ETHER IS 0.5% TO 80% BY MASS, THE CONTENT OF THE (C) IMIDAZOLE-BASED LATENT CURING AGENT RELATIVE TO THE TOTAL MASS OF ALL COMPONENTS OF THE EPOXY RESIN COMPOSITION IS 5% TO 25% BY MASS, AND THE CONTENT OF THE (D) PHENOLIC RESIN RELATIVE TO THE TOTAL MASS OF ALL THE COMPONENTS OF THE EPOXY RESIN COMPOSITION IS 0.5% TO 25% BY MASS.
MYPI2013002887A 2011-02-03 2011-08-02 Epoxy resin composition and semiconductor sealing material using same MY161359A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011021363A JP4965715B1 (en) 2011-02-03 2011-02-03 Epoxy resin composition and semiconductor sealing material using the same

Publications (1)

Publication Number Publication Date
MY161359A true MY161359A (en) 2017-04-14

Family

ID=46602309

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013002887A MY161359A (en) 2011-02-03 2011-08-02 Epoxy resin composition and semiconductor sealing material using same

Country Status (6)

Country Link
JP (1) JP4965715B1 (en)
KR (1) KR101819264B1 (en)
CN (1) CN103328530B (en)
MY (1) MY161359A (en)
TW (1) TWI547520B (en)
WO (1) WO2012105072A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6013906B2 (en) * 2012-12-27 2016-10-25 ナミックス株式会社 Liquid epoxy resin composition
KR20150109322A (en) * 2013-01-17 2015-10-01 세키스이가가쿠 고교가부시키가이샤 Curable composition for electronic component, connection structure, and method for producing connection structure
JP5758463B2 (en) * 2013-03-26 2015-08-05 太陽インキ製造株式会社 Epoxy resin composition, hole filling composition, and printed wiring board using the same
JP6340174B2 (en) * 2013-07-30 2018-06-06 ハリマ化成株式会社 Conductive paste
CN104513455B (en) * 2013-09-26 2017-01-11 常州市迪波电子材料有限公司 Waterproof encapsulating material used in temperature sensors
JP2015209516A (en) * 2014-04-28 2015-11-24 株式会社クラレ Curable composition, and cured product
WO2015173906A1 (en) 2014-05-14 2015-11-19 三菱電機株式会社 Method for manufacturing semiconductor device
EP3225660B1 (en) * 2014-11-26 2019-05-15 KYOCERA Corporation Resin composition for semiconductor encapsulation and semiconductor device
JP6754741B2 (en) 2017-09-07 2020-09-16 信越化学工業株式会社 Semiconductor laminates, methods for manufacturing semiconductor laminates, and methods for manufacturing semiconductor devices
JP6800115B2 (en) 2017-09-07 2020-12-16 信越化学工業株式会社 Resin composition, resin film, semiconductor laminate, semiconductor laminate manufacturing method and semiconductor device manufacturing method
CN107739598B (en) * 2017-10-31 2021-01-26 南昌航空大学 Permanent epoxy resin cementing agent
KR20220063596A (en) 2020-11-10 2022-05-17 한국전기연구원 Organic-nonorganic hybrid liquid insulating materials and their manufacturing method
CN113045864A (en) * 2021-04-26 2021-06-29 上海方乾科技有限公司 Halogen-free flame-retardant epoxy resin containing naphthalene ring structure and preparation method thereof
CN113265211A (en) * 2021-05-13 2021-08-17 苏州震坤科技有限公司 Encapsulation resin for reducing encapsulation delamination and encapsulation method thereof
JP2022175617A (en) * 2021-05-14 2022-11-25 住友化学株式会社 Epoxy resin composition and cured material thereof
TW202330702A (en) 2021-11-19 2023-08-01 日商納美仕有限公司 Curable resin composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3454437B2 (en) * 1992-10-02 2003-10-06 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション One-part epoxy resin adhesive composition with low viscosity and no solvent
JP3340882B2 (en) * 1995-05-02 2002-11-05 日東電工株式会社 Epoxy resin composition for encapsulating semiconductor element and resin-encapsulated semiconductor device
EP2154170B1 (en) * 2004-12-16 2013-02-13 Daicel Chemical Industries, Ltd. Thermosetting epoxy resin compositions and use thereof
CN101313006A (en) * 2005-11-25 2008-11-26 日立化成工业株式会社 Liquid resin composition for electronic parts and electronic parts device
JP2007204669A (en) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp Curing agent for epoxy resin, having specific small particle diameter particle size distribution and epoxy resin composition
JP2007246713A (en) * 2006-03-16 2007-09-27 Sumitomo Bakelite Co Ltd One-pack type epoxy resin composition
JP4752565B2 (en) * 2006-03-27 2011-08-17 大日本印刷株式会社 Electronic pen form manufacturing method
JP5101860B2 (en) * 2006-10-26 2012-12-19 パナソニック株式会社 Epoxy resin composition and semiconductor device
JP5556133B2 (en) * 2009-03-31 2014-07-23 日立化成株式会社 Liquid resin composition for electronic components and electronic component device

Also Published As

Publication number Publication date
JP2012158730A (en) 2012-08-23
CN103328530A (en) 2013-09-25
TW201233725A (en) 2012-08-16
WO2012105072A1 (en) 2012-08-09
JP4965715B1 (en) 2012-07-04
TWI547520B (en) 2016-09-01
CN103328530B (en) 2016-01-13
KR20140009296A (en) 2014-01-22
KR101819264B1 (en) 2018-01-16

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