MX357409B - Composiciones curables. - Google Patents

Composiciones curables.

Info

Publication number
MX357409B
MX357409B MX2014011753A MX2014011753A MX357409B MX 357409 B MX357409 B MX 357409B MX 2014011753 A MX2014011753 A MX 2014011753A MX 2014011753 A MX2014011753 A MX 2014011753A MX 357409 B MX357409 B MX 357409B
Authority
MX
Mexico
Prior art keywords
epoxy resin
curable
curable compositions
accelerator
insulator
Prior art date
Application number
MX2014011753A
Other languages
English (en)
Other versions
MX2014011753A (es
Inventor
Zhang Yi
Ji Minglei
Li Yongjiang
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2014011753A publication Critical patent/MX2014011753A/es
Publication of MX357409B publication Critical patent/MX357409B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

Una formulación de resina epoxi curable útil para hacer un aislador de un aparamenta aislado en gas de alta tensión, la formulación curable incluye (A) una composición de resina epoxi que comprende una mezcla de: (A1) al menos una resina epoxi sólida, (A2) al menos una resina epoxi novolaca, y (A3) al menos una resina epoxi cicloalifática; (B) al menos un endurecedor anhídrido; (C) al menos un relleno; y (D) opcionalmente, al menos un catalizador o al menos un acelerador.
MX2014011753A 2012-03-29 2012-03-29 Composiciones curables. MX357409B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/073232 WO2013143097A1 (en) 2012-03-29 2012-03-29 Curable compositions

Publications (2)

Publication Number Publication Date
MX2014011753A MX2014011753A (es) 2014-11-26
MX357409B true MX357409B (es) 2018-07-09

Family

ID=49258086

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014011753A MX357409B (es) 2012-03-29 2012-03-29 Composiciones curables.

Country Status (7)

Country Link
US (1) US20150011681A1 (es)
EP (1) EP2831172B1 (es)
KR (1) KR20140127356A (es)
CN (1) CN104245837B (es)
MX (1) MX357409B (es)
RU (1) RU2607746C2 (es)
WO (1) WO2013143097A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190071536A1 (en) * 2016-03-15 2019-03-07 Huntsman Advanced Materials Licensing (Switzerland) Gmbh A Process for the Preparation of Insulation Systems for Electrical Engineering, the Articles Obtained Therefrom and the Use Thereof
DE102018125567A1 (de) * 2018-10-16 2020-04-16 Bayerische Motoren Werke Aktiengesellschaft Spule sowie stromerregte Synchronmaschine
FR3091406B1 (fr) * 2018-12-31 2021-01-15 Centre National De Recherche Scient Cnrs Matériau pour l’isolation électrique et procédé de fabrication

Family Cites Families (23)

* Cited by examiner, † Cited by third party
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US4127695A (en) * 1975-10-07 1978-11-28 Matsushita Electric Industrial Co., Ltd. Method of insulating electromagnetic coils
DE2708359C3 (de) * 1977-02-23 1980-07-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Innenraum-Hochspannungsschaltanlage
US4113791A (en) * 1977-03-03 1978-09-12 Westinghouse Electric Corp. Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators
GB2099041B (en) * 1981-05-22 1984-10-10 Shell Int Research Method of placing and consolidating a mass of particulate material and composition for use in carrying out said method
JPH02103220A (ja) 1988-10-12 1990-04-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JP2755666B2 (ja) 1988-12-23 1998-05-20 住友ベークライト株式会社 エポキシ樹脂組成物
JPH03200858A (ja) * 1989-12-28 1991-09-02 Hitachi Chem Co Ltd エポキシ樹脂組成物および絶縁構造物の製造法
JPH03247619A (ja) 1990-02-27 1991-11-05 Hitachi Chem Co Ltd エポキシ樹脂組成物および絶縁構造物の製造法
JP3182959B2 (ja) * 1993-02-04 2001-07-03 株式会社明電舎 含浸用樹脂組成物
US6040397A (en) * 1997-11-28 2000-03-21 Lockheed Martin Corporation Extremely low viscosity matrix epoxy suffusion resin system
EP1172408A1 (de) * 2000-07-14 2002-01-16 Abb Research Ltd. Volumenmodifizierte Vergussmassen auf der Basis polymerer Matrixharze
US6888086B2 (en) * 2002-09-30 2005-05-03 Cooper Technologies Company Solid dielectric encapsulated interrupter
TWI298734B (en) * 2004-09-22 2008-07-11 Ind Tech Res Inst Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof
US7008981B2 (en) * 2003-12-23 2006-03-07 Industrial Technology Reserarch Institute Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof
US7271206B2 (en) * 2003-12-23 2007-09-18 Industrial Technology Research Institute Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof
KR101235529B1 (ko) * 2004-12-16 2013-02-21 가부시끼가이샤 다이셀 열경화성 에폭시 수지 조성물 및 그의 용도
CN1908063A (zh) * 2005-08-01 2007-02-07 财团法人工业技术研究院 具挠曲性、高耐热性的高介电有机/无机混成材料组成物及其硬化物
EP2070984A1 (en) * 2007-12-12 2009-06-17 Hexion Specialty Chemicals Research Belgium S.A. Epoxy-phenolic resins co-dispersions
DE102009007392A1 (de) * 2009-01-29 2010-08-05 Siemens Aktiengesellschaft Tränkharzsystem für Isolierstoffe in Schaltanlagen
EP2230267B1 (en) 2009-03-20 2014-08-13 ABB Research Ltd. Method of producing a curable epoxy resin composition
JP5185890B2 (ja) 2009-06-17 2013-04-17 株式会社日立産機システム 高電圧電気機器用絶縁注型樹脂及びこれを用いた高電圧電気機器
US8173745B2 (en) * 2009-12-16 2012-05-08 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
DE102010019723A1 (de) * 2010-05-07 2011-11-10 Siemens Aktiengesellschaft Elektroisolationssystem für eine elektrische Hochspannungsrotationsmaschine

Also Published As

Publication number Publication date
CN104245837B (zh) 2018-08-10
EP2831172B1 (en) 2018-05-02
MX2014011753A (es) 2014-11-26
EP2831172A4 (en) 2016-01-20
EP2831172A1 (en) 2015-02-04
RU2014143477A (ru) 2016-05-27
WO2013143097A1 (en) 2013-10-03
CN104245837A (zh) 2014-12-24
RU2607746C2 (ru) 2017-01-10
KR20140127356A (ko) 2014-11-03
US20150011681A1 (en) 2015-01-08

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