TWI298734B - Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high dielectric organic/inorganic hybrid material composition which can be used to prepare a high dielectric bonding layer having flexibility and high heat resistance. The prior art US Patent Publication No. US200 2/00481 37 A1 discloses a capacitor foil for making a two-layered embedded capacitor, comprising a conductive layer and formed on the conductive layer. A partially hardened bonding layer having a high dielectric constant on the layer, wherein the bonding layer is formed of an epoxy resin to which capacitive ceramic particles are added. The adhesive layer of the capacitor box is attached to a substrate having a patterned copper book to prepare a printed circuit board intermediate product having an embedded capacitor, wherein the patterned copper foil is a ground plane of the capacitor ( Gr〇und plane), and the conductive layer is a P〇wer plane. U.S. Patent No. 6,272,224 discloses a passive electrical article comprising a first layer of substrate, a second layer of substrate and an electrically insulating or electrically conductive layer comprising a polymer interposed therebetween. The specific embodiment of this patent is an in-line capacitor in which an epoxy resin composition of a ceramic powder is used as an intermediate layer. The epoxy resin used in the composition may be a blend of a double epoxy resin and a (iv) varnish epoxy resin (novolac epGxy), and the ceramic powder may be a 1298734 (barium titanate). The composition can be prepared by mixing an organic solution of barium titanate powder "epoxy resin" with a dispersing agent. The dispersant is preferably an anionic dispersant such as a copolypolymer of a polyester and a polyamine, available from iCI Americas,

Wilmington, De 1 ·, is available under the trade name "jjypermer psg". The epoxy resin composition of this patent still has room for further improvement. A high dielectric polymer composite material and a method of manufacturing the same are disclosed in U.S. Patent Publication No. 2003/0006402 A1. The high dielectric polymer composite has a dielectric constant greater than 20 0, and includes a polymer resin and a conductive material, wherein the conductive material may be a transition metal powder, a transition metal alpha gold, Stone anti-black, carbon fiber or graphite. However, the high dielectric polymer composite of this patent has a very large Dissipation factor, especially if the frequency is above the read edge and the frequency dependence is too high, and the mussel value is not used. Further, this patent application does not describe the heat resistance, adhesion and workability of the high dielectric polymer composite material. Therefore, there is still room for further improvement. SUMMARY OF THE INVENTION The present invention focuses on a blending technique of a polymer resin and a ceramic powder, so that the material has high dielectric properties, high tamper resistance, good adhesion, and excellent processability (flexibility). Wait. Technical ΛΛ 未 未 但 但 却 却 却 却 却 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂Inter-connectivity problem, big

^ ^ Large political loss factor as well as with traditional (existing) PCB

Custom processing compatibility, etc. County] CB knows the means including: · Selecting the appropriate resin composition, at the same time, flattening the clothes n thousand (four) difficult and adhesive; 2) filling the epoxy resin with one (four) electric ceramic powder to improve the mixture At least two or more kinds of particle size decoration, and which must contain a kind of nano: and the body and U have a dielectric property, and can be processed well: the rubber removes the enthalpy to ensure the quality of the substrate material; 3) The epoxy resin reacts with a part of the conductive powder (carbon black with functional groups on the surface) to form part of the epoxy resin coated carbon black to reduce the loss factor (Dlssipatic) n faet()r); 4) Select appropriate The polymer type dispersant' can improve the low heat resistance of low molecular type dispersibility, especially the solder resistance of 2 sheets, and on the other hand, it can greatly enhance the sinister steep principle of future product application. The molecular type dispersing agent can easily adhere to the surface of the inorganic powder, has excellent compatibility with the organic resin and even some reactivity, can effectively solve the shortcomings of the low molecular type dispersing agent; 5) adding a suitable softening agent to solve Too much ceramic powder (in order The effect of increasing the dielectric constant) is that the substrate is too brittle to be processed; and 6) adding other additives at the right time to improve the viscosity problem or further improve the adhesion. The obtained high dielectric mixture can be impregnated by the traditional fiberglass cloth. Bonding layer with high glass transition temperature (Tg>180°C) and excellent adhesion (>4 lb/in) between copper foils, precision coating technology or stencil/steel printing technology (bonding) The in-cell capacitor fabricated by the present invention has a dielectric constant of 30 to 150 at a frequency of 1 mHz, and a dissipation factor of 〇·〇2 to 0.07. An organic material is completed according to the present invention. /Inorganic hybrid material composition 1298734, comprising: a) - a high Tg epoxy resin system comprising an epoxy resin having the following structure:

b) - a strong dielectric ceramic powder containing two or more particle size distribution ranges, wherein a first particle size distribution range is 丨 丨 (10) nanometer, and a second particle size The distribution range is from 300 nm to 5 microns; and c) a conductive powder. Preferably, the conductive powder comprises a transition metal powder, a powder of an alloy of a transition metal, carbon black, or carbon fiber, wherein the conductive powder accounts for 总·〇1 to 2 of the total solid content of the composition. 〇% by weight. More preferably, the conductive powder is carbon black. Most preferably, the carbon black comprises a conductive carbon black and a carbon black having a mercapto group or a mercapto group. Preferably, the ferroelectric ceramic powder contains two main particle size distributions, wherein the first particle size distribution ranges from 5 to 1 nanometer, and the second particle size distribution The range is 0.3-5 microns, and the first dielectric particle size distribution of the strong dielectric ceramic powder accounts for 4% by weight of the total ferroelectric ceramic powder. The powder accounts for 50 to 95% by weight of the total solid content of the composition. The ferroelectric ceramic powder of the rut is BaTi〇3, SrTi〇3, Ba(Sr)Ti〇3' or their metal ion implants. 1298734 Preferably, the epoxy resin system further comprises - or a plurality of epoxy resins selected from the group consisting of bisphenol-human epoxy resin, cycloaliphatic epoxy resin containing naphthalene ring epoxy resin, double Phenyl epoxy resin, and Novolac epoxy resin. The far % oxygen resin system further comprises a polymeric dispersant. 0重量%。 The 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。. More preferably, the J sulphur resin system further comprises a soft polymer. The knives softener of the knives are more polysaccharides, polyamides, polyamines, quinones. P〇lyamide—imide), polyvinyi butyral, synthetic rubber, polylactone (P〇lycaprolact〇ne), or fat oxime type epoxy resin, and the polymer softener accounts for the total composition of the composition Preferably, the epoxy resin system further comprises a diluent or an adhesive (adhesi〇n pr〇m〇ter). More preferably, the dilution is 〇·5~2〇% by weight. Agent or adhesion promoter is shown below

9 1298734 Preferably, the oxy-oxygen resin system further comprises a hardener which may be a polyamine, a phenol res in or an acid anhydride. The hardener is used in an amount equivalent to about the equivalent of the epoxy resin system. Preferably, the epoxy resin system further comprises a hardening accelerator. Preferably, the hardening accelerator accounts for 1-5 wt% of the hardener. According to the car owner, the epoxy resin system further comprises a Silane Coupling agent to improve the dispersibility and compatibility of the dielectric ceramic powder in the composition. More preferably, the decane coupling agent is epoxysilane or Amin〇silane. Preferably, the high epoxy resin system further comprises a catalyst. More preferably, the catalyst comprises a phenylphosphine compound, and the catalyst comprises from 1 to 5% by weight of the total solid content of the composition. The car's epoxy system further contains an organic solvent. The present invention also provides a hardened organic/inorganic hybrid material which is hardened by the composition of the present invention. Preferably, the hardening is carried out by heating the composition. More preferably, the heating is carried out at 16 Torr to 2 Torr (rc is carried out for 2 to 6 hours. Preferably, the high oxygen-containing resin system containing the catalyst and the carbon black having a carboxyl group or a hydroxyl group on the surface before the hardening is performed. The reaction is carried out for 3-6 hours at 130 ° C. Embodiments The main point of the present invention is to manufacture a substrate material having a high dielectric constant, a low loss factor, and a high heat resistance (high Tg), which can be applied to high frequency and high speed. Communication, 1298734 for digital or digital power products, including the manufacture of internal and rear capacitors. The materials used include (&) 冋Tg 衣 oxy-resin system; (b) - strong dielectric ceramics Powder 'containing two or more particle size distributions, and must contain one type of nano-powder; (c) carbon black, which may contain one or more different types of carbon black, including conductive carbon black and having _ Carbon black of COOH or _0H functional group; (d) at least one polymeric softening agent; (e) polymeric dispersing agent; (f) other additives such as initiators, diluents, diluents, adhesion promoters (adhesi〇n promoter), catalysts, organic solvents, etc. The manufacturing process is as follows: 1 The epoxy resin and the solvent are placed in a reactor and heated to 90 to 95 〇c to completely dissolve them. 2. Add the dissolved epoxy resin to an appropriate amount of carbon black, and disperse the carbon black after dispersing at a high speed mixer. Add the catalyst to the temperature of 100~130C, and react for 3~6 hours. 3_Add appropriate amount of hardener and hardening accelerator, after fully dissolving, add appropriate amount of dispersant, softener and other additives. 4. Add in the above solution Appropriate amount of high dielectric powder of different size and particle size, and then stir evenly at high speed. The content of high dielectric powder added is about 20~70 volume of total solid content, or 50-95% by weight, and large grain The ratio of the diameter (0.3 to 5 // m) to the small particle size (<1〇()llin) is 1〇〇: 1~6〇: 4〇. 5 · The obtained organic-inorganic mixture is dispersed in a ball mill i 2 ~3 6 hours, you can get a well-dispersed mixture coating solution. 6. The above coating liquid is made into a substrate to measure the electrical properties, and the following three methods are produced: 11 1298734 (1) Glass fiber cloth impregnation process : Firstly obtain the fiberglass cloth and the coating liquid prepreg, and then press the pressure The procedure is 200QC for about three hours to obtain the copper foil substrate. (2) Precision coating process: first process backing copper foil (RCC), and then press it into the copper pig substrate with copper box. (3) by screen /Steel printing process printing the coating liquid on the substrate, and then pressing the metal layer or curing at high temperature and then plating the metal layer to form a substrate having the upper and lower electrodes. 7. After the substrate is electrically measured, The dielectric constant value obtained depending on the composition of the material ranges from about 30 to 150 at a frequency of 1 MHz, and the loss factor is about 0.02 to 0.07. 8. In the thermal property test, in addition to the solder resistance test of 288^(:, Tg is also in the range of 180~220 °C. The typical raw materials used in the present invention are as follows: Life Epoxy Resin (a)

(b) Di-single bisphenol Aepoxy (c) Tetrabromobisphenol Adiglycidyl ether epoxy (d) Cyclo aliphatic epoxy For example, dicyclopentadiene epoxy resin 12 1298734 (e) Naphthalene epoxy resin (f) Diphenylene epoxy resin (g) Phenolic novolac epoxy resin (h) o-cresolNovolac epoxy resin ♦ hardener (a) diamine: ΗζΝ-Ι ^ — ΝΙ^

Ri may be an aromatic group, a fat group, a cycloaliphatic group or a decane-containing aliphatic group, for example

R3~R10: H, CH3, C2H5, C3H7, or c(ch3)3 (b) phenol resin

> Phenolic resin, for example, > Naphthol based resin, for example

OH 13 1298734 > Terpene phenol resin

> Dicyclopentadiene resin

> 4,4',4"^j^6*SS^(4,4',4"-Ethylidenetrisphenol) H〇-^) ---

OH > Tetra phenylolethane

> Tetraxylenol ethane

> Tetracresololethane 14 1298734

♦ Hardening accelerator (a) Cationic catalyst boron trifluoride complex, such as RNH2.BF3, R2NH.BF3, R3N.BF3, etc., where R can be an aromatic group, a fat group or a cycloaliphatic group (b) an anion system Catalytic tertiary amine, metal hydroxide, monoepoxide coordination anion catalyst, such as R3N, NCH2C-C(NH)-N(CH3)2, etc., wherein R can be an aromatic group, a fat group or a ring Fat-based (c) mouth Imidazole 1- 1-methylimidazole 1,2-dime thy limid azole 2-15-alkyl 2_heptadecylimidazole 2-ethyl-4-methylimidazole ♦ Catalyst phenylphosphine compound triphenylphosphine (triphenylphosphine) carbon black 1. Conductive carbon black 2. Carbon black inorganic filler 15 1298734 with COOH or 0H functional group is mainly high dielectric ferroelectric ceramic powder, such as: BaTi03, SrTi03, Ba(Sr)Ti03, BaTi03 implanted with metal ions , SrZr03, etc. ♦ softeners can be applied to the softeners of the present invention including polyesters, polyamides, polyamines Polyamide-imide, polyvinyl Butyral, elastomer (eg Carboxyl-Terminated Butadiene Acrylonitrile, CTBN), polycaprolactone (R-[-0[-CO(CH2) ) 5-〇-]n-]f), a fat-chain epoxy resin such as a fat-bonded type of earth-alkali resin:

: For ' 〇, 1298734 : Q,

Z V 0 〇 pin volume m CH2~0~fcH24H~CireH^ I : 〇 I GHS 〇 Cht-0

1 ....... 1. V etVO-G -(ehyr^H^H-eHrCH-翁13⁄4 - CHj ο o-辞ώ-_ -..I ... ,.( GH~0~ GRCH4 广CH«Grt-CHfCH -(GHJs-eHs t '夕:0, I 0 O-CH^^GH-GHj IK r

C 0- G- (CHa)?~ GH ~C H-*CCH~ fC H^s ^ C These different kinds of softeners have reactivity and compatibility with resin systems due to structural differences. There are differences, and the gain of flexibility is also different. Therefore, it is also possible to achieve a softening effect by a mixed use method, so as to simultaneously at the same time as the workability at the time of manufacture and the heat resistance of the last copper-cadmium substrate, including solder resistance and Tg temperature. ♦ Dispersant In the present invention, a polymer type dispersant is used to have good adhesion to inorganic powder, and has excellent compatibility with a certain organic resin and a little reactivity, which can greatly improve the heat resistance of the substrate. reliability. The polymer dispersant which can be used includes copolyester-melamine, polyester or polyamine.

♦ Other additives □Diluent and adhesion promoter* Q”ch’, repair 0, iron seven, _rQ duck _ίι% m-mi 〇 5 Μ 17 1298734

The present invention will be further understood by the following examples, which are to be understood by way of illustration only in the accompanying claims, the singular s s s s s s s s s s s s s s s s s s s s s s s s s s s It is not intended to limit the scope of the invention. EXAMPLES Comparative Example: Different raw material compositions were used, the contents of which are shown in Table 1, and the practices of Examples 1 and 2 were first added to the reactor with an appropriate amount of epoxy resin, including bisphenol_A diglycidyl ether. (Epoxy 1) (code: 1 8 8EL, Changchun Resin Co., Ltd., Taiwan), tetrabromo disphenol-A diglcidyl ether (Epoxy2) (code name BEB-350 'Changchun Company, Taiwan) , CyCi〇aliphatic epoxy (Epoxy 3) (code HP-7200, DIC Corporation, 曰本), Multifunctional epoxy (Epoxy 4) (the aforementioned epoxy resin ( a), purchased from Sakamoto Chemical Co., Ltd., adding an appropriate amount of dimethylformamide (DMF), and then heating to 90 ° C to 95 ° C to completely dissolve the epoxy resin. The dissolved epoxy resin was added with an appropriate amount of carbon black (carbon black of code XE-2B produced by Degussa Co., Ltd., and carbon black codenamed M800 produced by Cabot Corporation. The weight ratio of the two carbon blacks was 1: U 'Use a high-speed mixer to stir and disperse the carbon black at a high speed. After dispersing, add triphenyl 18 1298734 phosphine 0.1% by weight, heat up to 105 ° C, and react for 4 hours. Add an appropriate amount of hardener 4, 4 - methyl group. Amine (4,4'-Methylenedianiliiie) (ACROS, USA), and the appropriate hardening accelerator 2-Ethyl-4-methylimidazole (ACROS, USA). The hardener and hardening accelerator are completely dissolved in the epoxy resin solution, and then an appropriate amount of polymeric dispersant Hypermer (Uniqema, USA) is added, as well as different softeners such as polyvinyl butyral (p〇lyVinyl Butyral). PVB, Changchun Resin Company, Taiwan) (softener i), CTBN (ΖΕΟΝ Chemical Company, USA) (softener 2), completely dissolved and then lowered to room temperature. Then add appropriate amount of high dielectric of different size and size Filler (eg BaTi03 A: Ba Ti03 average particle size 〇·8 μιη; this aTi03 B: BaTi〇3 average particle size 60 nm), uniformly mixed at a high speed to form a resin/BaTi03/carbon black mixed solution. The mixed solutions of Comparative Examples 1 to 5 were similarly implemented. The steps of Examples 1 and 2 were prepared according to the formulation of Table 1, wherein the carbon black of Comparative Example 4 was directly added to the resin and was not heated at a high temperature to react with the epoxy resin. The mixture of different compositions in different ratios prepared in Table 1 was prepared. The solution was separately dispersed using a ball mill. The organic/inorganic mixed solution formed after the dispersion was applied to the copper foil using a doctor blade, and baked to remove the solvent (1 〇〇〇C, 3 hr hours) to partially harden the mixture. (partially cure) forming a so-called Resin Coated Copper, and separately hardening these backing copper foils with copper foil at a high temperature (compression temperature of about 20 (TC, 2.5 hours) to form organic/inorganic The copper foil substrate materials were mixed and finally tested for physical properties, which are shown in Table 2. 19 1298734 Table 1 Example 1 Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Composition Comparative Example 1 Comparative Example 2 Edoxv 1 7.22 6·63 7.73 8.28 8.90 8 .28 8.00 Eooxv 2 i 5.18 4.95 5.77 6.18 —6·80 6·18 5·97 Eooxv 3 (gl) 1.05 1.04 1.21 1.30 1.92 1·30 1.26 Eooxv 4 L50 1.50 1·75 1.88 0 1.88 1.82 Hardener (g) 3·78 3·42 3.99 4.28 4.1 4.28 4·14 Hardening accelerator (g) 0.06 0.06 0.06 0.07 0.07 0.07 0.07 Dispersant (g) 3.60^ 3.61 4.20 4.50 4.50 4.50 4·32 Carbon black (g) 0 0 0 0.88 0 0·88 Ι·71 Softener 1 (g) 0 0 0 1·50 1.50 1·50 0 Softener 2(g) 0 1.00 1·41 0 0 0 1·45 BaTi〇3 A (g) 120.00 120.00 120.00 128.56 128.45 128.56 124.28 BaTi03 B (g) 0 0 20.00 21.43 21.41 2L43 20.72 Table 2 Characteristics Comparison Example I Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Example I Example 2 Tg (°C) 203 197 189 186 158 192 189 Dielectric constant (ΙΜζ) 30.02 33.12 35.53 118.52 37.62 58.86 102.65 Loss factor (ΙΜζ) 0.0232 0.0243 0.0252 0.152 0.0262 0.0287 0.042 ------ Peel strength a) (lb/in) 2.2 3.6 5.2 4.1 5.8 5.3 4.8 Flexibility b) Excellent, excellent, excellent, excellent, excellent, excellent, excellent, excellent, _ PCB processability, c) easy to be brittle, good, good, good, good Good ____ Solderability d) Untested Failure Qualified Failure Qualified Qualified a) Peel strength measured by IPC-650 method b) Flexibility Evaluate current PCB process according to IPC-650 method d) Solder resistance is 2 atm , heating at lliTC for 2 hours and then at 288 ° C for 3 minutes 20 1298734 Comparative Examples 1 and 2 use a single particle size of BaTi〇3, not added

BaTi〇3 nano-powder has poor processability and poor peeling strength at the same BaTi〇3 ratio; if an appropriate amount of softener can be added (Comparative Example 2), the flexibility and process can be improved. Processability, but the peel strength is still poor, mainly due to insufficient glue. The addition of BaTi〇^ with different particle sizes can increase the bulk density of BaTi〇3, increase the dielectric constant, and

The increase in the BaTi〇3 nanopowder can increase the amount of the gel, increase the thickness, and the weldability is also improved, as can be seen from Comparative Examples 2 and 3. Of course, an important factor in the rise of Tg is the choice of epoxy resin system. In principle, the addition of a polyfunctional oxo tree will greatly increase the T g. Further, in Comparative Example 4, carbon black was directly added to the resin, and was not heated at a high temperature to react with the epoxy resin, and the loss factor was much higher than that of Examples 1, 2, so that the carbon black and the epoxy resin were previously reacted to lower the loss factor. From the above results, it is known that a high-temperature organic/inorganic hybrid with high heat resistance, which has good processing applicability, must contain high Tg epoxy resin, carbon black, carbon black. Pre-reacted with epoxy resin, softener, polymer dispersant, and at least two kinds of dielectric ceramic powders, which must contain a kind of nano-powder, etc. A class of highly dielectric substrate materials that are of practical value. The present disclosure has been described above, and those skilled in the art can still make various changes and modifications without departing from the scope of the following claims.

Claims (1)

.1298734 ? / year 'month / / Japanese law (吏) is replacing the page, the scope of the patent application · · ~ organic / inorganic mixed material composition, including · (Revised in January 2008) a) - high Tg Epoxy resin system: Epoxy resin: Contains a structure of -CH-H2V "CH2CVch Ganshan b) _ 'where η is 0-10; Bufanyuan dielectric pottery powder, containing two or Two or more particle sizes are divided into one... one of the first particle size distribution ranges from 1 to 100 nm, and ~ one particle size distribution ranges from 300 nm to 5 μm; and C) - conductive powder Body, greater than 〇, medium ° Haiqiang; 1 electrical ceramic powder accounts for the total solid content of the composition is not more than 95% by weight of the total solid, and the conductive powder accounts for the composition of the composition · 〇1~20重量。/〇. Sex powder ^ ^ Qing patent range of the composition of the first item, the conductive + mountain contains transition metal powder, transition metal gold-containing powder, carbon black, Or a stone anti-fiber. 3. The composition of claim 2, wherein the conductive powder is carbon black. 4. As claimed in claim 3 The composition, wherein the carbon black comprises a conductive carbon black and a carbon black having a carboxyl group or a hydroxyl group on the surface. 22 • 1298734 τ " _ - Μ / / 月 V 日 (corrected in January of the following year) 1 1 '_· _· ιιι > Ι· — , „ ; 5- The composition of any one of claims 1 to 4 wherein the ferroelectric ceramic powder contains two main particle size distribution ranges The first particle size distribution ranges from 50 to 100 nanometers, and the second grain size is about 3-5 micrometers, and the first particle size distribution range is 1 package. The corrugated body accounts for 丨4% by weight of the total ferroelectric ceramic powder. The composition according to any one of items 1 to 4, which constitutes the total solid content of the composition, is as claimed in the patent application, wherein the ferroelectricity is 50-95% by weight. For example, the composition of any one of the patent ranges 1 to 4, '4 strong dielectric ceramic powder 4 BaTi03, SrTi03, Ba(Sr)T1〇3, or their implanted metal Ion. 8. The composition of any one of the preceding claims, wherein the epoxy resin system comprises one or more % oxime resins selected from the group consisting of: By 乂 # # 八 # 私 ~ A 裱 裱 树脂 , 环 环 环 环 环 环 环 环 环 环 环 环 环 环 环 环 环 环 环 环 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪 脂肪The composition of any one of the above-mentioned epoxy resin systems includes a polymer dispersant. 23 1298734 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 II. The composition of claim 1, wherein the epoxy resin system further comprises a diluent or an adhesion promoter. The composition of claim 1, wherein the epoxy resin system further comprises a hardener, which is a polyamine, a phenol resin or an acid anhydride. 〇 13. The composition according to claim 9, wherein the polymer dispersant is a polyester, a polyamide or a copolymer thereof, and the polymer dispersant accounts for the total solid content of the composition. 〇.;[~5. 0% by weight. The composition according to the first aspect of the invention, wherein the polymer softener is a polyester, a polyamide, a polyamide-imide, or a polyimide-imide. Polyvinyl Butyral, synthetic rubber, polycaprolactone, or an aliphatic chain type epoxy resin, and the polymer softener accounts for 总. 5~2 0% by weight of the total solid content of the composition. . 24 1298734 .........丨_, 兮怦/用/ /日渗透(动正正换页 I IIIII ------ (Amended in January 2008) 1 5. If the scope of application for patents The composition according to Item 1, wherein the diluent or the 増10 agent is the following # nQ-0 - (3⁄4-CH -CH2 CglV 〇-OC HfCH"CH (just ~ ClVChUj-GH~GIV〇CHRIA:H2 or #士#·/ The composition of claim 1, wherein the epoxy tree system comprises a stone sinter-type coupling agent ( Silane P nS agent) to improve the dispersibility and compatibility of the dielectric ceramic powder in the composition. 17. The composition of claim 16, wherein the composition The burning coupling agent is ep〇xysUane or Aminosilane 〇18. The composition according to claim 12, wherein the epoxy resin further includes An r* η -fet +χ., ^ ^ ^ hardening accelerator, wherein the hardening accelerator accounts for the sclerosing agent. 〇U * IQ / ^ 宣 里 % and the amount of the hardener and the cyclic resin system The same equivalent. 19. The composition of claim 4, wherein the epoxy 25 1298734 竹年/月"日修(more) replacement page (corrected in January 2008) the resin system further comprises a stupid phosphide The catalyst and the catalyst constitute 〇· —1 to 5% by weight of the total solid content of the composition. 20. The composition of claim 3, wherein the epoxy resin system further comprises an organic solvent. The hardening organic/inorganic hybrid material is obtained by hardening the composition according to any one of items 1 to 20, wherein the hardening is contained in the range of 160 to 200. (: heating the composition for 2 to 6 hours.,, for example, the hardened organic/inorganic material of the range of item 21, which has a dielectric constant of 3 〇 to a loss factor at a frequency of 1 ΜΗζ. Between 0·02~〇〇7, and high glass transfer temperature between 17 0~23〇〇c. 26