TW200610786A - Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof - Google Patents

Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof

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Publication number
TW200610786A
TW200610786A TW093128764A TW93128764A TW200610786A TW 200610786 A TW200610786 A TW 200610786A TW 093128764 A TW093128764 A TW 093128764A TW 93128764 A TW93128764 A TW 93128764A TW 200610786 A TW200610786 A TW 200610786A
Authority
TW
Taiwan
Prior art keywords
dielectric constant
compositions
organic
thermal stability
high dielectric
Prior art date
Application number
TW093128764A
Other languages
Chinese (zh)
Other versions
TWI298734B (en
Inventor
Shur-Fen Liu
Meng-Huei Chen
Jinn-Shing King
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW93128764A priority Critical patent/TWI298734B/en
Priority to US11/003,411 priority patent/US7271206B2/en
Publication of TW200610786A publication Critical patent/TW200610786A/en
Application granted granted Critical
Publication of TWI298734B publication Critical patent/TWI298734B/en

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  • Inorganic Insulating Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes (a) a high Tg epoxy resin system; (b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; (c) an electrically conductive powder, such as an electrically conductive carbon black; (d) at least one macromolecular softer; (e) a macromolecular dispersant; and (f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.
TW93128764A 2003-12-23 2004-09-22 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof TWI298734B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW93128764A TWI298734B (en) 2004-09-22 2004-09-22 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof
US11/003,411 US7271206B2 (en) 2003-12-23 2004-12-06 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93128764A TWI298734B (en) 2004-09-22 2004-09-22 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof

Publications (2)

Publication Number Publication Date
TW200610786A true TW200610786A (en) 2006-04-01
TWI298734B TWI298734B (en) 2008-07-11

Family

ID=45069474

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93128764A TWI298734B (en) 2003-12-23 2004-09-22 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof

Country Status (1)

Country Link
TW (1) TWI298734B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104245837A (en) * 2012-03-29 2014-12-24 陶氏环球技术有限责任公司 Curable compositions

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102115317B (en) * 2009-12-31 2012-11-14 财团法人工业技术研究院 Highly dielectric material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104245837A (en) * 2012-03-29 2014-12-24 陶氏环球技术有限责任公司 Curable compositions

Also Published As

Publication number Publication date
TWI298734B (en) 2008-07-11

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