TW200610786A - Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof - Google Patents
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereofInfo
- Publication number
- TW200610786A TW200610786A TW093128764A TW93128764A TW200610786A TW 200610786 A TW200610786 A TW 200610786A TW 093128764 A TW093128764 A TW 093128764A TW 93128764 A TW93128764 A TW 93128764A TW 200610786 A TW200610786 A TW 200610786A
- Authority
- TW
- Taiwan
- Prior art keywords
- dielectric constant
- compositions
- organic
- thermal stability
- high dielectric
- Prior art date
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- Inorganic Insulating Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes (a) a high Tg epoxy resin system; (b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; (c) an electrically conductive powder, such as an electrically conductive carbon black; (d) at least one macromolecular softer; (e) a macromolecular dispersant; and (f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93128764A TWI298734B (en) | 2004-09-22 | 2004-09-22 | Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof |
US11/003,411 US7271206B2 (en) | 2003-12-23 | 2004-12-06 | Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93128764A TWI298734B (en) | 2004-09-22 | 2004-09-22 | Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200610786A true TW200610786A (en) | 2006-04-01 |
TWI298734B TWI298734B (en) | 2008-07-11 |
Family
ID=45069474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93128764A TWI298734B (en) | 2003-12-23 | 2004-09-22 | Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI298734B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104245837A (en) * | 2012-03-29 | 2014-12-24 | 陶氏环球技术有限责任公司 | Curable compositions |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102115317B (en) * | 2009-12-31 | 2012-11-14 | 财团法人工业技术研究院 | Highly dielectric material |
-
2004
- 2004-09-22 TW TW93128764A patent/TWI298734B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104245837A (en) * | 2012-03-29 | 2014-12-24 | 陶氏环球技术有限责任公司 | Curable compositions |
Also Published As
Publication number | Publication date |
---|---|
TWI298734B (en) | 2008-07-11 |
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