GB1144638A - Improvements in or relating to electrical switchgear - Google Patents
Improvements in or relating to electrical switchgearInfo
- Publication number
- GB1144638A GB1144638A GB34253/66A GB3425366A GB1144638A GB 1144638 A GB1144638 A GB 1144638A GB 34253/66 A GB34253/66 A GB 34253/66A GB 3425366 A GB3425366 A GB 3425366A GB 1144638 A GB1144638 A GB 1144638A
- Authority
- GB
- United Kingdom
- Prior art keywords
- curing agent
- cured
- cycloaliphatic
- groups
- epoxy compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Abstract
1,144,638. Epoxy resin composition. CIBA Ltd. 18 July, 1967 [29 July, 1966], No. 34253/66. Addition to 997,496. Heading C3B. An epoxy resin composition used in the manufacture of electrical switchgear for insulating parts coming into contact with electrical arcs during actuation consists of a cured 1,2-epoxy compound containing, per average molecule, n groups of formula directly attached to single or different O atoms; n is > 1; R and R<SP>1</SP> are each H or together denote -CH 2 CH 2 -; if two groups of Formula I are attached to the same oxygen atom at least one pair of R and R<SP>1</SP> must be -CH 2 CH 2 -. The 1,2-epoxy compound is cured with a cycloaliphatic, aliphatic or heterocyclic polyamine or polythiol. The 1,2-epoxy compound and the curing agent are free from aromatic groups. Examples of suitable epoxy compounds are diglycidyl ethers of cycloaliphatic dihydric alcohols and diglycidyl esters of cycloaliphatic dicarboxylic acids. The curing agent is preferably free from ethylenic or acetylenic unsaturation or combined halogen. The cured composition preferably contains less than 2% by weight of halogen. When a polythiol curing agent is used an amine or polyamine accelerator may be present. Conventional fillers, plasticizers, pigments, dyestuffs, flame inhibitors and mould lubricants may also be present.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB34253/66A GB1144638A (en) | 1966-07-29 | 1966-07-29 | Improvements in or relating to electrical switchgear |
CH1050467A CH476377A (en) | 1966-07-29 | 1967-07-24 | Electric switchgear |
FR115507A FR1547491A (en) | 1966-07-29 | 1967-07-25 | Cured poly-epoxy mixtures for electrical insulation |
BE702012D BE702012A (en) | 1966-07-29 | 1967-07-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB34253/66A GB1144638A (en) | 1966-07-29 | 1966-07-29 | Improvements in or relating to electrical switchgear |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1144638A true GB1144638A (en) | 1969-03-05 |
Family
ID=10363330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB34253/66A Expired GB1144638A (en) | 1966-07-29 | 1966-07-29 | Improvements in or relating to electrical switchgear |
Country Status (3)
Country | Link |
---|---|
BE (1) | BE702012A (en) |
CH (1) | CH476377A (en) |
GB (1) | GB1144638A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8389630B2 (en) * | 2005-12-28 | 2013-03-05 | Kaneka Corporation | Curable composition |
WO2016150724A1 (en) | 2015-03-26 | 2016-09-29 | Huntsman Advanced Materials (Switzerland) Gmbh | A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom |
WO2017001182A1 (en) | 2015-07-02 | 2017-01-05 | Huntsman Advanced Materials (Switzerland) Gmbh | A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom |
CN113402697A (en) * | 2021-06-25 | 2021-09-17 | 厦门赛尔特电子有限公司 | Electrical insulating resin and preparation method and application thereof |
-
1966
- 1966-07-29 GB GB34253/66A patent/GB1144638A/en not_active Expired
-
1967
- 1967-07-24 CH CH1050467A patent/CH476377A/en not_active IP Right Cessation
- 1967-07-28 BE BE702012D patent/BE702012A/xx unknown
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8389630B2 (en) * | 2005-12-28 | 2013-03-05 | Kaneka Corporation | Curable composition |
WO2016150724A1 (en) | 2015-03-26 | 2016-09-29 | Huntsman Advanced Materials (Switzerland) Gmbh | A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom |
CN107743501A (en) * | 2015-03-26 | 2018-02-27 | 亨斯迈先进材料特许(瑞士)有限公司 | For the thermosetting epoxy resin composition for preparing outdoor articles and thus obtained product |
US20180118922A1 (en) * | 2015-03-26 | 2018-05-03 | Huntsman International Llc | A Thermosetting Resin Composition for the Preparation of Outdoor Articles and the Articles Obtained therefrom |
JP2018512474A (en) * | 2015-03-26 | 2018-05-17 | ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・(スイッツランド)・ゲーエムベーハー | Thermosetting epoxy resin composition for producing outdoor products, and outdoor products obtained therefrom |
US10696820B2 (en) | 2015-03-26 | 2020-06-30 | Huntsman International Llc | Thermosetting resin composition for the preparation of outdoor articles and the articles obtained therefrom |
JP2022116017A (en) * | 2015-03-26 | 2022-08-09 | ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・(スイッツランド)・ゲーエムベーハー | Thermosetting epoxy resin composition for preparation of outdoor articles, and outdoor articles obtained therefrom |
WO2017001182A1 (en) | 2015-07-02 | 2017-01-05 | Huntsman Advanced Materials (Switzerland) Gmbh | A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom |
CN113402697A (en) * | 2021-06-25 | 2021-09-17 | 厦门赛尔特电子有限公司 | Electrical insulating resin and preparation method and application thereof |
CN113402697B (en) * | 2021-06-25 | 2023-12-12 | 厦门赛尔特电子有限公司 | Electrical insulation resin and preparation method and application thereof |
Also Published As
Publication number | Publication date |
---|---|
BE702012A (en) | 1968-01-29 |
CH476377A (en) | 1969-07-31 |
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