JP4776769B2 - 発光装置の作製方法 - Google Patents

発光装置の作製方法 Download PDF

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Publication number
JP4776769B2
JP4776769B2 JP2000338454A JP2000338454A JP4776769B2 JP 4776769 B2 JP4776769 B2 JP 4776769B2 JP 2000338454 A JP2000338454 A JP 2000338454A JP 2000338454 A JP2000338454 A JP 2000338454A JP 4776769 B2 JP4776769 B2 JP 4776769B2
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Japan
Prior art keywords
light
light emitting
emitting device
filler
substrate
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Expired - Fee Related
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JP2000338454A
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English (en)
Japanese (ja)
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JP2001203076A5 (OSRAM
JP2001203076A (ja
Inventor
舜平 山崎
利光 小沼
毅 西
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2000338454A priority Critical patent/JP4776769B2/ja
Publication of JP2001203076A publication Critical patent/JP2001203076A/ja
Publication of JP2001203076A5 publication Critical patent/JP2001203076A5/ja
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Publication of JP4776769B2 publication Critical patent/JP4776769B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8428Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8723Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/874Passivation; Containers; Encapsulations including getter material or desiccant
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851Division of substrate

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
JP2000338454A 1999-11-09 2000-11-07 発光装置の作製方法 Expired - Fee Related JP4776769B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000338454A JP4776769B2 (ja) 1999-11-09 2000-11-07 発光装置の作製方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP11-318252 1999-11-09
JP1999318252 1999-11-09
JP31825299 1999-11-09
JP2000338454A JP4776769B2 (ja) 1999-11-09 2000-11-07 発光装置の作製方法

Publications (3)

Publication Number Publication Date
JP2001203076A JP2001203076A (ja) 2001-07-27
JP2001203076A5 JP2001203076A5 (OSRAM) 2007-12-20
JP4776769B2 true JP4776769B2 (ja) 2011-09-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000338454A Expired - Fee Related JP4776769B2 (ja) 1999-11-09 2000-11-07 発光装置の作製方法

Country Status (3)

Country Link
US (2) US7112115B1 (OSRAM)
JP (1) JP4776769B2 (OSRAM)
KR (2) KR100720066B1 (OSRAM)

Families Citing this family (118)

* Cited by examiner, † Cited by third party
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JP2003228302A (ja) * 2002-02-04 2003-08-15 Toshiba Electronic Engineering Corp 表示装置及びその製造方法
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CN101882668B (zh) 2002-12-19 2012-05-09 株式会社半导体能源研究所 显示装置
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JP4801347B2 (ja) * 2003-12-26 2011-10-26 株式会社半導体エネルギー研究所 表示装置
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US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
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JP4590932B2 (ja) * 2004-05-18 2010-12-01 セイコーエプソン株式会社 エレクトロルミネッセンス装置の製造方法
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TWI517378B (zh) * 2005-10-17 2016-01-11 半導體能源研究所股份有限公司 半導體裝置及其製造方法
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US7977876B2 (en) 2011-07-12
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