JP2007179977A - Elパネル及びその製造方法 - Google Patents
Elパネル及びその製造方法 Download PDFInfo
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- JP2007179977A JP2007179977A JP2005380057A JP2005380057A JP2007179977A JP 2007179977 A JP2007179977 A JP 2007179977A JP 2005380057 A JP2005380057 A JP 2005380057A JP 2005380057 A JP2005380057 A JP 2005380057A JP 2007179977 A JP2007179977 A JP 2007179977A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 74
- 239000011347 resin Substances 0.000 claims abstract description 74
- 238000007789 sealing Methods 0.000 claims abstract description 69
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000012044 organic layer Substances 0.000 claims abstract description 40
- 238000005192 partition Methods 0.000 claims description 56
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 230000006866 deterioration Effects 0.000 abstract description 11
- 230000004888 barrier function Effects 0.000 abstract 3
- 239000000470 constituent Substances 0.000 abstract 1
- 230000000452 restraining effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 27
- 230000008569 process Effects 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JYLWJBTYJMIGDB-UHFFFAOYSA-N 1-(3-methylphenyl)-1,2-diphenylhydrazine Chemical compound CC=1C=C(C=CC=1)N(C1=CC=CC=C1)NC1=CC=CC=C1 JYLWJBTYJMIGDB-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 125000006268 biphenyl-3-yl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C1=C([H])C(*)=C([H])C([H])=C1[H] 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
【解決手段】 本発明に係るELパネル1は、透明基板10上に陽極12、有機層16及び陰極18が順次積層されて構成された複数のEL素子20と、隣り合うEL素子20の間に位置する隔壁14と、複数のEL素子20及び隔壁14を一体的に覆う封止プレート22とを有し、透明基板10と封止プレート22との間には樹脂24が介在し、且つ、隔壁14とEL素子20の有機層16との間に空間部26が形成されているため、封止樹脂24の樹脂成分がEL素子20の有機層16を浸食する事態が有意に抑制されている。
【選択図】 図1
Description
(実施例)
(比較例)
(ELパネルの輝度測定)
(ELパネルの輝度評価)
(ELパネルの外観評価)
Claims (5)
- 基板上に第1の電極、有機層及び第2の電極が順次積層されて構成された複数のEL素子と、
隣り合う前記EL素子の間に位置する隔壁と、
前記複数のEL素子及び前記隔壁を一体的に覆う封止プレートと
を有し、
前記基板上の前記EL素子と前記封止プレートとの間には樹脂が介在し、且つ、前記隔壁と前記EL素子の前記有機層との間に空間部が形成されている、ELパネル。 - 前記隔壁と前記樹脂とが接している、請求項1に記載のELパネル。
- 前記空間部が真空である、若しくは、前記空間部が不活性ガスで満たされている、請求項1又は2に記載のELパネル。
- 第1の電極が形成された基板上に隔壁を形成するステップと、
前記基板上に有機層及び第2の電極を順次積層して、前記第1の電極、前記有機層及び前記第2の電極を含む複数のEL素子を形成するステップと、
前記隔壁と前記EL素子の前記有機層との間に空間部が形成されるように、樹脂が塗布された封止プレートと前記基板とを、前記封止プレートの樹脂側と前記基板のEL素子側とを向かい合わせて貼り合わせるステップと
を有する、ELパネルの製造方法。 - 塗布された前記樹脂が未硬化状態である前記封止プレートで、前記複数のEL素子及び前記隔壁を覆う、請求項4に記載のELパネルの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005380057A JP2007179977A (ja) | 2005-12-28 | 2005-12-28 | Elパネル及びその製造方法 |
US11/644,965 US7602120B2 (en) | 2005-12-28 | 2006-12-26 | Electroluminescence panel and method of making the same |
TW095149286A TW200735698A (en) | 2005-12-28 | 2006-12-27 | Electroluminescence panel and method of making the same |
CNA2006101565828A CN1992332A (zh) | 2005-12-28 | 2006-12-28 | El面板及其制造方法 |
KR1020060136488A KR100799900B1 (ko) | 2005-12-28 | 2006-12-28 | El 패널 및 이의 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005380057A JP2007179977A (ja) | 2005-12-28 | 2005-12-28 | Elパネル及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007179977A true JP2007179977A (ja) | 2007-07-12 |
Family
ID=38214402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005380057A Pending JP2007179977A (ja) | 2005-12-28 | 2005-12-28 | Elパネル及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7602120B2 (ja) |
JP (1) | JP2007179977A (ja) |
KR (1) | KR100799900B1 (ja) |
CN (1) | CN1992332A (ja) |
TW (1) | TW200735698A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010014475A (ja) * | 2008-07-02 | 2010-01-21 | Casio Comput Co Ltd | 指針盤用発光パネル及び指針盤用発光パネルの製造方法 |
JP2011249021A (ja) * | 2010-05-24 | 2011-12-08 | Lumiotec Inc | 有機el照明パネル及び有機el照明パネルの製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347041A (ja) * | 2002-05-22 | 2003-12-05 | Casio Comput Co Ltd | 発光パネル及びその製造方法 |
JP2004014531A (ja) * | 1995-03-13 | 2004-01-15 | Pioneer Electronic Corp | 有機エレクトロルミネッセンスディスプレイパネルとその製造方法 |
JP2004288456A (ja) * | 2003-03-20 | 2004-10-14 | Denso Corp | 有機elパネル |
JP2005276754A (ja) * | 2004-03-26 | 2005-10-06 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置の製造装置、有機エレクトロルミネッセンス装置の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3942770B2 (ja) * | 1999-09-22 | 2007-07-11 | 株式会社半導体エネルギー研究所 | El表示装置及び電子装置 |
KR100720066B1 (ko) | 1999-11-09 | 2007-05-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치 제작방법 |
JP2001338755A (ja) | 2000-03-21 | 2001-12-07 | Seiko Epson Corp | 有機el素子およびその製造方法 |
US6924594B2 (en) * | 2000-10-03 | 2005-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
JP2003197366A (ja) | 2001-12-25 | 2003-07-11 | Sanyo Electric Co Ltd | 表示装置及びその製造方法 |
KR100477745B1 (ko) | 2002-05-23 | 2005-03-18 | 삼성에스디아이 주식회사 | 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널 |
JP4801346B2 (ja) | 2003-12-26 | 2011-10-26 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
JP4572561B2 (ja) | 2004-03-31 | 2010-11-04 | Tdk株式会社 | 自発光型表示装置 |
-
2005
- 2005-12-28 JP JP2005380057A patent/JP2007179977A/ja active Pending
-
2006
- 2006-12-26 US US11/644,965 patent/US7602120B2/en not_active Expired - Fee Related
- 2006-12-27 TW TW095149286A patent/TW200735698A/zh unknown
- 2006-12-28 KR KR1020060136488A patent/KR100799900B1/ko not_active IP Right Cessation
- 2006-12-28 CN CNA2006101565828A patent/CN1992332A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004014531A (ja) * | 1995-03-13 | 2004-01-15 | Pioneer Electronic Corp | 有機エレクトロルミネッセンスディスプレイパネルとその製造方法 |
JP2003347041A (ja) * | 2002-05-22 | 2003-12-05 | Casio Comput Co Ltd | 発光パネル及びその製造方法 |
JP2004288456A (ja) * | 2003-03-20 | 2004-10-14 | Denso Corp | 有機elパネル |
JP2005276754A (ja) * | 2004-03-26 | 2005-10-06 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置の製造装置、有機エレクトロルミネッセンス装置の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010014475A (ja) * | 2008-07-02 | 2010-01-21 | Casio Comput Co Ltd | 指針盤用発光パネル及び指針盤用発光パネルの製造方法 |
JP2011249021A (ja) * | 2010-05-24 | 2011-12-08 | Lumiotec Inc | 有機el照明パネル及び有機el照明パネルの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US7602120B2 (en) | 2009-10-13 |
US20070159097A1 (en) | 2007-07-12 |
KR20070070119A (ko) | 2007-07-03 |
TW200735698A (en) | 2007-09-16 |
CN1992332A (zh) | 2007-07-04 |
KR100799900B1 (ko) | 2008-01-31 |
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