JP4755645B2 - データセンタの冷却 - Google Patents
データセンタの冷却 Download PDFInfo
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- JP4755645B2 JP4755645B2 JP2007527647A JP2007527647A JP4755645B2 JP 4755645 B2 JP4755645 B2 JP 4755645B2 JP 2007527647 A JP2007527647 A JP 2007527647A JP 2007527647 A JP2007527647 A JP 2007527647A JP 4755645 B2 JP4755645 B2 JP 4755645B2
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- 238000001816 cooling Methods 0.000 title claims description 141
- 238000000034 method Methods 0.000 claims description 33
- 230000007246 mechanism Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 6
- 239000003570 air Substances 0.000 description 127
- 239000007789 gas Substances 0.000 description 71
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 230000008569 process Effects 0.000 description 9
- 239000003507 refrigerant Substances 0.000 description 9
- 238000004378 air conditioning Methods 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 229920005372 Plexiglas® Polymers 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 239000000112 cooling gas Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 241000220010 Rhode Species 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Ventilation (AREA)
- Air Conditioning Control Device (AREA)
- Central Air Conditioning (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Surgical Instruments (AREA)
- Other Air-Conditioning Systems (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Freezers Or Refrigerated Showcases (AREA)
Description
または装備改良され得る。ユーザが、一般的に、新しいまたは変化するニーズに適合するように、設備機器ラックを配置し、設備機器室およびデータセンタを再構築する態様には、上げ床構成は、容易かつ安価に対応し得ない。
QT=(H1−H2)・CFM・4.45
ここで、T1は、冷却ユニット216に入るガスの温度であり、T2は、冷却ユニット216を出るガスの温度であり、H1は、冷却ユニット216に入るガスのエンタルピ−、H2は冷却ユニット216を出るガスのエンタルピーであり、1.08は、CFMによって乗ぜられるときの温度差をBTUに変換するための、標準的な空気に対する定数であり、4.45は、CFMによって乗ぜられるときのエンタルピー差をBTUに変換するための、標準的な空気に対する定数であり、CFMは、立方フィート毎分あたりのガスの量(ユニット216への、入りと出のそれぞれ)である。例えば、入りの温度T1が80°Fで36%RH(相対湿度)、入りのエンタルピーH1が27.82btu/lbmass、出の温度T2が50°Fで95%RH(相対湿度)、出のエンタルピーH2が19.89btu/lbmassに対し、SHRは約0.92である。
Claims (18)
- 電子設備機器を収容し、かつ、冷却するためのモジュラデータセンタであって、該データセンタは、
少なくとも1つの列に配置された複数のハウジングであって、該複数のハウジングの第1の部分は、熱を生じる電子設備機器を保持するように構成され、該複数のハウジングの第2の部分は、少なくとも1つの冷却ユニットを保持するように構成され、該第2の部分は、該少なくとも1つの列における該第1の部分のうちの2つハウジングの間に配置され、該第1の部分のうちの該複数のハウジングのそれぞれは、表と裏を有し、かつ、ガスが該設備機器の表から該設備機器の中に引き込まれ、該設備機器によって熱せられて熱ガスを生じ、該複数のハウジングの該裏を介して該電子設備機器によって放出されるように該熱を生じる電子設備機器を保持するように構成されている、複数のハウジングと、
該複数のハウジングのうちの1対のハウジングの間のギャップを埋めるための該1対のハウジングに連結された少なくとも1つのパネルと
を備え、
該少なくとも1つのパネルは、該複数のハウジングのうちの1つのハウジングの後ろに配置された取り外し可能なフレームにヒンジによって取り付けられたドアを備え、該取り外し可能なフレームは、該ドアが取り除かれることを可能にし、該ハウジングまたは該パネルが該取り外し可能なフレームを備え、
該複数のハウジングおよび該少なくとも1つのパネルは、側面囲いの配列を形成するように配置され、かつ、連結され、側方からホット領域を囲い込み、かつ、頂部の開口を規定し、ガスが該ホット領域から鉛直に抜け出すことを可能とし、該ドアは、該ホット領域へのアクセスを提供し、
該第1の部分のうちの該複数のハウジングの裏は、該熱を生じる設備機器が、該複数のハウジングに装備されたときに、該熱ガスを該ホット領域に放出するように該ホット領域に隣接して配置されている、データセンタ。 - 前記少なくとも1つの冷却ユニットをさらに備え、
該少なくとも1つの冷却ユニットは、前記ホット領域から該少なくとも1つの冷却ユニットの中に前記熱ガスの少なくとも一部を引き込むことにより、該引き込まれた熱ガスが、前記頂部の開口を介して該ホット領域から抜け出ることを防ぎ、該引き込まれた熱ガスを冷却し比較的クールなガスを生成し、該少なくとも1つの冷却ユニットから、前記複数のハウジングを取り囲むクール領域に該クールなガスを放出するように構成されている、請求項1に記載のデータセンタ。 - 前記少なくとも1つの冷却ユニットは、前記複数のハウジングの前記第1の部分の表のほうに前記クールなガスを導くように構成されている、請求項2に記載のデータセンタ。
- 前記少なくとも1つの冷却ユニットは、前記複数のハウジングの前記第1の部分の前記表の底の部分のほうに前記クールなガスを導くように構成されている、請求項3に記載のデータセンタ。
- 前記少なくとも1つの冷却ユニットは、22.2℃に前記ガスを冷却し、22.2℃で該ガスを放出するように構成されている、請求項2に記載のデータセンタ。
- 前記少なくとも1つの冷却ユニットに連結され、かつ、該少なくとも1つの冷却ユニットにバックアップ電力を提供するように構成された無停電電源をさらに備える、請求項2に記載のデータセンタ。
- 前記ドアは、前記ホット領域へのアクセスを提供するために開かれ、熱いガスが前記ギャップを介して該ホット領域から側方に前記データセンタを抜け出さないように閉じられるようにさらに構成されている、請求項1に記載のデータセンタ。
- 前記少なくとも1つのパネルは、前記複数のハウジングの前記第1および第2の部分のうちの最低部分の高さと少なくとも同じである、請求項1に記載のデータセンタ。
- 前記複数のハウジングは、平行な2つの列に配置され、前記少なくとも1つのパネルは、該列の反対の端に配置され、それぞれの端で該2つの列を互いに連結する2つのドアを含む、請求項1に記載のデータセンタ。
- 動作中に熱を生じる電子設備機器を含み、かつ、それを冷却するシステムであって、該システムは、
少なくとも1つの列に配置された複数のハウジングであって、該複数のハウジングの第1の部分は、該複数のハウジングの表を介し、該複数のハウジングの内部を介し、および、該複数のハウジングの裏を介して外へガスが通過することを可能とするように構成され、さらに、該複数のハウジングの該第1の部分は、該設備機器が、該複数のハウジングの表を介しガスを引き込み、該設備機器を介しそれにより該ガスを熱し熱ガスを生じ、かつ、該複数のハウジングの該裏を介し該熱ガスを放出するような配列で該電子設備機器を含むように構成され、該複数のハウジングは、ホット領域を側方から取り囲む実質的に側面囲いの部分を形成するように配置されている、複数のハウジングと、
該ホット領域を取り囲む該側面囲いを完成するために該複数のハウジングのうちの少なくとも2つのハウジングを側方に連結する封鎖手段であって、該封鎖手段および該複数のハウジングは、該システムが該ホット領域に上部限界を実質的にもたらさないように頂部の開口を提供し、該封鎖手段は、該複数のハウジングのうちの1つのハウジングの後ろに配置された取り外し可能なフレームにヒンジによって取り付けられたドアを備え、該取り外し可能なフレームは、該ドアが取り除かれることを可能にし、該ドアは、該ホット領域へのアクセスを提供し、該ハウジングまたは該封鎖手段が該取り外し可能なフレームを備える、封鎖手段と、
該熱ガスの少なくとも一部を引き込み、かつ、冷却し、比較的クールなガスを生成することにより、該引き込まれたガスが該頂部の開口を介して該ホット領域から抜け出ることを防ぐために、かつ、該複数のハウジングの該第1の部分の表に該比較的クールなガスを提供するために、該複数のハウジングのうちの少なくとも1つのハウジングに配置された冷却手段であって、該少なくとも1つの列における該複数のハウジングの該第1の部分のうちの2つのハウジングの間にある冷却手段と
を備え、
該複数のハウジングは、該電子機器設備が、動作する間、該ホット領域に該熱ガスを放出するように配置されている、システム。 - 前記冷却手段は、前記複数のハウジングの前記第1の部分の前記表の底の部分のほうに前記比較的クールなガスを導くように構成されている、請求項10に記載のシステム。
- 前記冷却手段は、前記熱ガスを22.2℃に冷却し、前記比較的クールなガスを生成するように構成されている、請求項10に記載のシステム。
- 前記ドアは、断熱性であり、かつ、前記ホット領域へのアクセスを提供するために開かれ、かつ、前記熱ガスが、該封鎖手段が連結された前記複数のハウジングの間の該ホット領域を側方に抜け出さないように閉じられるように構成されている、請求項10に記載のシステム。
- 前記複数のハウジングは、平行な2つの列に配置され、前記封鎖手段は、該列の反対の端に配置され、かつ、それぞれの端で該2つの列を互いに連結する2つのドアを含む、請求項10に記載のシステム。
- 前記冷却手段に連結され、かつ、該冷却手段にバックアップ電力を提供するように構成された無停電電源をさらに備える、請求項10に記載のシステム。
- ラック装備された電子設備機器を動作し、かつ、冷却する方法であって、該方法は、
該設備機器を含む複数のハウジングの中に該複数のハウジングの表を介してガスを引き込み、該ガスを熱し熱ガスを生成し、ホット領域に該熱ガスを放出するように、該ラック装備された電子設備機器に電力供給することであって、該複数のハウジングは、少なくとも1つの列に配置される、ことと、
少なくとも該複数のハウジングの頂部より上に該ガスが上昇するまでは実質的に妨げられることなく、該熱ガスがホット領域を上方に抜け出せるようにする一方で、該設備機器を含む該複数のハウジング、該少なくとも1つの列における該複数のハウジングのうちの2つのハウジングの間の冷却メカニズム、および、該複数のハウジングのうちの少なくとも2つのハウジングに連結された少なくとも1つのパネルを使用して、該熱ガスが、該冷却メカニズムの中へ抜け出す以外は、該ホット領域を側方に抜け出せないようにすることであって、該少なくとも1つのパネルは、該複数のハウジングのうちの1つのハウジングの後ろの取り外し可能なフレームにヒンジによって取り付けられたドアを備え、該取り外し可能なフレームは、該ドアが取り除かれることを可能にし、該ドアは、該ホット領域へのアクセスを提供し、該ハウジングまたは該パネルが該取り外し可能なフレームを備える、ことと、
該ホット領域から該冷却メカニズムの中に該熱ガスの少なくとも1部を引き込むことにより、該引き込まれた熱ガスが該ホット領域から抜け出ることを防ぎ、該引き込まれたガスを冷却し、クールなガスを生成することと、
該複数のハウジングの表に該クールなガスを提供することと
を包含する、方法。 - 前記抜け出せないようにすることは、前記ホット領域の中にさらに熱ガスを吹き込み、前記複数のハウジングのうちの1対のハウジングのギャップの間に連結された前記少なくとも1つのパネルによって該熱ガスの側方への流れを妨げることを含む、請求項16に記載の方法。
- 前記提供することは、前記複数のハウジングの前記表の底のほうに前記クールなガスを導くことを含む、請求項16に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/863,740 US7046514B2 (en) | 2003-03-19 | 2004-06-07 | Data center cooling |
US10/863,740 | 2004-06-07 | ||
PCT/US2005/019970 WO2005122664A1 (en) | 2004-06-07 | 2005-06-07 | Data center cooling |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
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JP2009024234A Division JP2009104650A (ja) | 2004-06-07 | 2009-02-04 | データセンタの冷却 |
JP2010043330A Division JP5113203B2 (ja) | 2004-06-07 | 2010-02-26 | データセンタの冷却 |
JP2010043329A Division JP2010182318A (ja) | 2004-06-07 | 2010-02-26 | データセンタの冷却 |
Publications (3)
Publication Number | Publication Date |
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JP2008502082A JP2008502082A (ja) | 2008-01-24 |
JP2008502082A5 JP2008502082A5 (ja) | 2009-03-26 |
JP4755645B2 true JP4755645B2 (ja) | 2011-08-24 |
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JP2007527647A Active JP4755645B2 (ja) | 2004-06-07 | 2005-06-07 | データセンタの冷却 |
JP2009024234A Pending JP2009104650A (ja) | 2004-06-07 | 2009-02-04 | データセンタの冷却 |
JP2010043330A Expired - Fee Related JP5113203B2 (ja) | 2004-06-07 | 2010-02-26 | データセンタの冷却 |
JP2010043329A Pending JP2010182318A (ja) | 2004-06-07 | 2010-02-26 | データセンタの冷却 |
JP2012105703A Active JP5301009B2 (ja) | 2004-06-07 | 2012-05-07 | データセンタの冷却 |
JP2013045057A Withdrawn JP2013131235A (ja) | 2004-06-07 | 2013-03-07 | データセンタの冷却 |
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JP2009024234A Pending JP2009104650A (ja) | 2004-06-07 | 2009-02-04 | データセンタの冷却 |
JP2010043330A Expired - Fee Related JP5113203B2 (ja) | 2004-06-07 | 2010-02-26 | データセンタの冷却 |
JP2010043329A Pending JP2010182318A (ja) | 2004-06-07 | 2010-02-26 | データセンタの冷却 |
JP2012105703A Active JP5301009B2 (ja) | 2004-06-07 | 2012-05-07 | データセンタの冷却 |
JP2013045057A Withdrawn JP2013131235A (ja) | 2004-06-07 | 2013-03-07 | データセンタの冷却 |
Country Status (12)
Country | Link |
---|---|
US (7) | US7046514B2 (ja) |
EP (1) | EP1774842B2 (ja) |
JP (6) | JP4755645B2 (ja) |
CN (2) | CN101686629B (ja) |
AT (1) | ATE487362T1 (ja) |
DE (1) | DE602005024564D1 (ja) |
DK (1) | DK1774842T4 (ja) |
ES (1) | ES2355574T5 (ja) |
HK (1) | HK1107742A1 (ja) |
PL (1) | PL1774842T3 (ja) |
PT (1) | PT1774842E (ja) |
WO (1) | WO2005122664A1 (ja) |
Families Citing this family (243)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7046514B2 (en) * | 2003-03-19 | 2006-05-16 | American Power Conversion Corporation | Data center cooling |
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JPS5768100A (en) * | 1980-10-15 | 1982-04-26 | Nippon Telegraph & Telephone | Electronic device cooling system |
JPH07202464A (ja) * | 1993-12-28 | 1995-08-04 | Toshiba Corp | 電子機器装置並びに電子機器装置用冷却方法及びファン装置 |
JPH0997989A (ja) * | 1995-09-29 | 1997-04-08 | Toshiba Corp | 補助冷却装置及びその設置方法 |
JP2002156136A (ja) * | 2000-11-20 | 2002-05-31 | Takasago Thermal Eng Co Ltd | 通信機器室等の空調システム |
US6374627B1 (en) * | 2001-01-09 | 2002-04-23 | Donald J. Schumacher | Data center cooling system |
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