JP4731574B2 - プリント配線板及びプリント配線板の製造方法 - Google Patents

プリント配線板及びプリント配線板の製造方法 Download PDF

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Publication number
JP4731574B2
JP4731574B2 JP2007556031A JP2007556031A JP4731574B2 JP 4731574 B2 JP4731574 B2 JP 4731574B2 JP 2007556031 A JP2007556031 A JP 2007556031A JP 2007556031 A JP2007556031 A JP 2007556031A JP 4731574 B2 JP4731574 B2 JP 4731574B2
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JP
Japan
Prior art keywords
opening
diameter
small
solder
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007556031A
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English (en)
Japanese (ja)
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JPWO2007086551A1 (ja
Inventor
克彦 丹野
洋一郎 川村
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Ibiden Co Ltd
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Ibiden Co Ltd
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Publication date
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Priority to JP2007556031A priority Critical patent/JP4731574B2/ja
Publication of JPWO2007086551A1 publication Critical patent/JPWO2007086551A1/ja
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Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
JP2007556031A 2006-01-27 2007-01-29 プリント配線板及びプリント配線板の製造方法 Expired - Fee Related JP4731574B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007556031A JP4731574B2 (ja) 2006-01-27 2007-01-29 プリント配線板及びプリント配線板の製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006019065 2006-01-27
JP2006019065 2006-01-27
JP2007556031A JP4731574B2 (ja) 2006-01-27 2007-01-29 プリント配線板及びプリント配線板の製造方法
PCT/JP2007/051354 WO2007086551A1 (ja) 2006-01-27 2007-01-29 プリント配線板及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2007086551A1 JPWO2007086551A1 (ja) 2009-06-25
JP4731574B2 true JP4731574B2 (ja) 2011-07-27

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JP2007556031A Expired - Fee Related JP4731574B2 (ja) 2006-01-27 2007-01-29 プリント配線板及びプリント配線板の製造方法

Country Status (7)

Country Link
US (2) US8087164B2 (cg-RX-API-DMAC7.html)
EP (1) EP1978556A1 (cg-RX-API-DMAC7.html)
JP (1) JP4731574B2 (cg-RX-API-DMAC7.html)
KR (1) KR20080017431A (cg-RX-API-DMAC7.html)
CN (2) CN101356642B (cg-RX-API-DMAC7.html)
TW (1) TW200742515A (cg-RX-API-DMAC7.html)
WO (1) WO2007086551A1 (cg-RX-API-DMAC7.html)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101171895B (zh) * 2005-06-30 2010-06-23 揖斐电株式会社 印刷线路板
WO2007086551A1 (ja) * 2006-01-27 2007-08-02 Ibiden Co., Ltd. プリント配線板及びプリント配線板の製造方法
JP5154271B2 (ja) * 2008-03-17 2013-02-27 日本特殊陶業株式会社 はんだバンプを有する配線基板及びその製造方法
US8587129B2 (en) * 2009-07-31 2013-11-19 Stats Chippac Ltd. Integrated circuit packaging system with through silicon via base and method of manufacture thereof
US8410376B2 (en) * 2009-08-28 2013-04-02 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
US20110048775A1 (en) * 2009-08-31 2011-03-03 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP5428667B2 (ja) 2009-09-07 2014-02-26 日立化成株式会社 半導体チップ搭載用基板の製造方法
US7867821B1 (en) * 2009-09-18 2011-01-11 Stats Chippac Ltd. Integrated circuit package system with through semiconductor vias and method of manufacture thereof
KR101055473B1 (ko) * 2009-12-15 2011-08-08 삼성전기주식회사 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법
US8604600B2 (en) * 2011-12-30 2013-12-10 Deca Technologies Inc. Fully molded fan-out
KR20110124993A (ko) * 2010-05-12 2011-11-18 삼성전자주식회사 반도체 칩 및 이를 포함하는 반도체 패키지 및 반도체 칩의 제조 방법
KR101740878B1 (ko) * 2011-03-22 2017-05-26 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치
US9236278B2 (en) * 2011-09-23 2016-01-12 Stats Chippac Ltd. Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof
US8546925B2 (en) * 2011-09-28 2013-10-01 Texas Instruments Incorporated Synchronous buck converter having coplanar array of contact bumps of equal volume
US9368439B2 (en) * 2012-11-05 2016-06-14 Nvidia Corporation Substrate build up layer to achieve both finer design rule and better package coplanarity
US8969191B2 (en) * 2013-07-16 2015-03-03 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms for forming package structure
KR102192356B1 (ko) * 2013-07-29 2020-12-18 삼성전자주식회사 반도체 패키지
JP6320066B2 (ja) * 2014-02-13 2018-05-09 イビデン株式会社 ボール搭載用マスクおよびボール搭載装置
JP2015231003A (ja) * 2014-06-06 2015-12-21 イビデン株式会社 回路基板および回路基板の製造方法
CN105530768B (zh) * 2014-09-28 2019-02-05 深南电路有限公司 一种电路板的制作方法及电路板
KR102632351B1 (ko) * 2016-02-05 2024-02-02 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 패키지 기판
CN107318228B (zh) * 2017-08-29 2019-09-06 郑州云海信息技术有限公司 一种印制电路板的制造方法及其制造装置
TWI650048B (zh) * 2017-09-19 2019-02-01 Nan Ya Printed Circuit Board Corporation 印刷電路板結構及其形成方法
CN108235591B (zh) * 2018-01-08 2020-08-18 昆山首源电子科技有限公司 5g通讯高频信号板镀金蚀刻工艺
CN110534451A (zh) * 2018-05-25 2019-12-03 唐虞企业股份有限公司 一种导电端子置件设备及其导电端子置件方法
TWI889679B (zh) * 2019-04-30 2025-07-11 日商迪睿合股份有限公司 對滑動對象物之表面提供或排除滑動處理物之方法
JP7257273B2 (ja) * 2019-06-26 2023-04-13 イビデン株式会社 プリント配線板およびその製造方法
CN113709972A (zh) * 2021-09-27 2021-11-26 合肥移瑞通信技术有限公司 一种电路板及其制造方法、封装件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263449A (ja) * 1994-03-18 1995-10-13 Hitachi Ltd 半導体装置及びその製法
JPH104127A (ja) * 1996-04-16 1998-01-06 Ngk Spark Plug Co Ltd 半田バンプを有する基板の製造方法
JPH11204687A (ja) * 1998-01-19 1999-07-30 Juki Corp バンプ形成方法及びバンプ形成装置
JP2001210749A (ja) * 2000-01-26 2001-08-03 Kyocera Corp バンプ電極付き配線基板およびその製造方法
JP2002151539A (ja) * 2000-11-10 2002-05-24 Hitachi Ltd バンプ形成方法およびその装置

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2974436B2 (ja) 1991-02-26 1999-11-10 シチズン時計株式会社 ハンダバンプの形成方法
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
JP3138159B2 (ja) * 1994-11-22 2001-02-26 シャープ株式会社 半導体装置、半導体装置実装体、及び半導体装置の交換方法
DE69626747T2 (de) * 1995-11-16 2003-09-04 Matsushita Electric Industrial Co., Ltd. Gedruckte Leiterplatte und ihre Anordnung
JP2842361B2 (ja) * 1996-02-28 1999-01-06 日本電気株式会社 半導体装置
JPH1013007A (ja) * 1996-03-29 1998-01-16 Ngk Spark Plug Co Ltd 半田バンプを有する配線基板及びその製造方法及び平坦化治具
US5660321A (en) * 1996-03-29 1997-08-26 Intel Corporation Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts
JP2861965B2 (ja) * 1996-09-20 1999-02-24 日本電気株式会社 突起電極の形成方法
US6217987B1 (en) * 1996-11-20 2001-04-17 Ibiden Co. Ltd. Solder resist composition and printed circuit boards
TW392315B (en) * 1996-12-03 2000-06-01 Nippon Electric Co Boards mounting with chips, mounting structure of chips, and manufacturing method for boards mounting with chips
KR100244580B1 (ko) * 1997-06-24 2000-02-15 윤종용 금속 범프를 갖는 회로 기판의 제조 방법 및 그를 이용한 반도체 칩 패키지의 제조 방법
US6028011A (en) * 1997-10-13 2000-02-22 Matsushita Electric Industrial Co., Ltd. Method of forming electric pad of semiconductor device and method of forming solder bump
JPH11145176A (ja) * 1997-11-11 1999-05-28 Fujitsu Ltd ハンダバンプの形成方法及び予備ハンダの形成方法
US6137164A (en) * 1998-03-16 2000-10-24 Texas Instruments Incorporated Thin stacked integrated circuit device
US6100112A (en) * 1998-05-28 2000-08-08 The Furukawa Electric Co., Ltd. Method of manufacturing a tape carrier with bump
WO2000010369A1 (en) * 1998-08-10 2000-02-24 Fujitsu Limited Method of forming solder bump, method of mounting electronic device, and mounting structure of electronic device
US6268114B1 (en) * 1998-09-18 2001-07-31 Taiwan Semiconductor Manufacturing Company, Ltd Method for forming fine-pitched solder bumps
US6746896B1 (en) * 1999-08-28 2004-06-08 Georgia Tech Research Corp. Process and material for low-cost flip-chip solder interconnect structures
JP2001102738A (ja) * 1999-09-30 2001-04-13 Matsushita Electric Ind Co Ltd 電子部品実装半田付け方法
JP2001203318A (ja) * 1999-12-17 2001-07-27 Texas Instr Inc <Ti> 複数のフリップチップを備えた半導体アセンブリ
JP2001267731A (ja) 2000-01-13 2001-09-28 Hitachi Ltd バンプ付き電子部品の製造方法および電子部品の製造方法
JP2001319992A (ja) * 2000-02-28 2001-11-16 Shinko Electric Ind Co Ltd 配線基板、半導体装置及びそれらの製造方法
JP2002043467A (ja) * 2000-07-31 2002-02-08 Hitachi Chem Co Ltd 半導体パッケージ用基板とその製造方法およびその基板を用いた半導体パッケージ並びに半導体パッケージの製造方法
JP2002050716A (ja) * 2000-08-02 2002-02-15 Dainippon Printing Co Ltd 半導体装置及びその作製方法
US6459150B1 (en) * 2000-08-17 2002-10-01 Industrial Technology Research Institute Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer
CN1156204C (zh) * 2000-09-04 2004-06-30 华泰电子股份有限公司 积体电路基板柱状凸块成型方法
US6596618B1 (en) * 2000-12-08 2003-07-22 Altera Corporation Increased solder-bump height for improved flip-chip bonding and reliability
US6910812B2 (en) * 2001-05-15 2005-06-28 Peregrine Semiconductor Corporation Small-scale optoelectronic package
JP2003188508A (ja) * 2001-12-18 2003-07-04 Toshiba Corp プリント配線板、面実装形回路部品および回路モジュール
US6940176B2 (en) * 2002-05-21 2005-09-06 United Microelectronics Corp. Solder pads for improving reliability of a package
JP2004055628A (ja) * 2002-07-17 2004-02-19 Dainippon Printing Co Ltd ウエハレベルの半導体装置及びその作製方法
JP4181510B2 (ja) * 2003-02-28 2008-11-19 日本特殊陶業株式会社 樹脂製配線基板
JP4094982B2 (ja) * 2003-04-15 2008-06-04 ハリマ化成株式会社 はんだ析出方法およびはんだバンプ形成方法
JP4269834B2 (ja) 2003-07-23 2009-05-27 トヨタ自動車株式会社 多段変速機
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
WO2006013742A1 (ja) * 2004-08-04 2006-02-09 Ibiden Co., Ltd. 半田ボール搭載方法及び半田ボール搭載装置
US7405474B1 (en) * 2004-10-12 2008-07-29 Cypress Semiconductor Corporation Low cost thermally enhanced semiconductor package
US7215026B2 (en) * 2005-04-14 2007-05-08 Samsung Electonics Co., Ltd Semiconductor module and method of forming a semiconductor module
KR100702969B1 (ko) * 2005-04-19 2007-04-03 삼성전자주식회사 더미 솔더 볼을 갖는 ｂｇａ형 반도체 칩 패키지의 기판 실장 구조
WO2006126621A1 (ja) 2005-05-23 2006-11-30 Ibiden Co., Ltd. プリント配線板
JP2006344824A (ja) * 2005-06-09 2006-12-21 Nec Electronics Corp 半導体装置および半導体装置の製造方法
CN101171895B (zh) 2005-06-30 2010-06-23 揖斐电株式会社 印刷线路板
JP5021472B2 (ja) * 2005-06-30 2012-09-05 イビデン株式会社 プリント配線板の製造方法
US7566650B2 (en) * 2005-09-23 2009-07-28 Stats Chippac Ltd. Integrated circuit solder bumping system
DE102005055280B3 (de) * 2005-11-17 2007-04-12 Infineon Technologies Ag Verbindungselement zwischen Halbleiterchip und Schaltungsträger sowie Verfahren zur Herstellung und Verwendung des Verbindungselements
US20070145104A1 (en) * 2005-12-28 2007-06-28 Mengzhi Pang System and method for advanced solder bumping using a disposable mask
US7517788B2 (en) * 2005-12-29 2009-04-14 Intel Corporation System, apparatus, and method for advanced solder bumping
US20070155154A1 (en) * 2005-12-29 2007-07-05 Mengzhi Pang System and method for solder bumping using a disposable mask and a barrier layer
DE102006001767B4 (de) * 2006-01-12 2009-04-30 Infineon Technologies Ag Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben
WO2007086551A1 (ja) * 2006-01-27 2007-08-02 Ibiden Co., Ltd. プリント配線板及びプリント配線板の製造方法
US7472473B2 (en) * 2006-04-26 2009-01-06 Ibiden Co., Ltd. Solder ball loading apparatus
US7823762B2 (en) * 2006-09-28 2010-11-02 Ibiden Co., Ltd. Manufacturing method and manufacturing apparatus of printed wiring board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263449A (ja) * 1994-03-18 1995-10-13 Hitachi Ltd 半導体装置及びその製法
JPH104127A (ja) * 1996-04-16 1998-01-06 Ngk Spark Plug Co Ltd 半田バンプを有する基板の製造方法
JPH11204687A (ja) * 1998-01-19 1999-07-30 Juki Corp バンプ形成方法及びバンプ形成装置
JP2001210749A (ja) * 2000-01-26 2001-08-03 Kyocera Corp バンプ電極付き配線基板およびその製造方法
JP2002151539A (ja) * 2000-11-10 2002-05-24 Hitachi Ltd バンプ形成方法およびその装置

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TWI330512B (cg-RX-API-DMAC7.html) 2010-09-11
US9480170B2 (en) 2016-10-25
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CN101888747A (zh) 2010-11-17
US8087164B2 (en) 2012-01-03
CN101356642A (zh) 2009-01-28
TW200742515A (en) 2007-11-01
WO2007086551A1 (ja) 2007-08-02
US20120031659A1 (en) 2012-02-09
CN101888747B (zh) 2012-09-05
JPWO2007086551A1 (ja) 2009-06-25
US20080302560A1 (en) 2008-12-11
EP1978556A1 (en) 2008-10-08

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