JP4727948B2 - プローブカードに用いられる積層基板 - Google Patents

プローブカードに用いられる積層基板 Download PDF

Info

Publication number
JP4727948B2
JP4727948B2 JP2004153231A JP2004153231A JP4727948B2 JP 4727948 B2 JP4727948 B2 JP 4727948B2 JP 2004153231 A JP2004153231 A JP 2004153231A JP 2004153231 A JP2004153231 A JP 2004153231A JP 4727948 B2 JP4727948 B2 JP 4727948B2
Authority
JP
Japan
Prior art keywords
surface layer
layer
circuit board
base material
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004153231A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005337737A (ja
Inventor
純 望月
久富 保坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004153231A priority Critical patent/JP4727948B2/ja
Priority to US11/597,476 priority patent/US7750655B2/en
Priority to PCT/JP2005/009439 priority patent/WO2005114228A1/ja
Priority to KR1020067026970A priority patent/KR100812418B1/ko
Priority to TW094116910A priority patent/TW200620519A/zh
Publication of JP2005337737A publication Critical patent/JP2005337737A/ja
Application granted granted Critical
Publication of JP4727948B2 publication Critical patent/JP4727948B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2004153231A 2004-05-24 2004-05-24 プローブカードに用いられる積層基板 Expired - Fee Related JP4727948B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004153231A JP4727948B2 (ja) 2004-05-24 2004-05-24 プローブカードに用いられる積層基板
US11/597,476 US7750655B2 (en) 2004-05-24 2005-05-24 Multilayer substrate and probe card
PCT/JP2005/009439 WO2005114228A1 (ja) 2004-05-24 2005-05-24 積層基板及びプローブカード
KR1020067026970A KR100812418B1 (ko) 2004-05-24 2005-05-24 적층 기판 및 프로브 카드
TW094116910A TW200620519A (en) 2004-05-24 2005-05-24 Laminated board and probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004153231A JP4727948B2 (ja) 2004-05-24 2004-05-24 プローブカードに用いられる積層基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011000858A Division JP5079890B2 (ja) 2011-01-05 2011-01-05 積層基板及びプローブカード

Publications (2)

Publication Number Publication Date
JP2005337737A JP2005337737A (ja) 2005-12-08
JP4727948B2 true JP4727948B2 (ja) 2011-07-20

Family

ID=35428494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004153231A Expired - Fee Related JP4727948B2 (ja) 2004-05-24 2004-05-24 プローブカードに用いられる積層基板

Country Status (5)

Country Link
US (1) US7750655B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP4727948B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100812418B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW200620519A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2005114228A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4823667B2 (ja) * 2005-12-05 2011-11-24 日本発條株式会社 プローブカード
EP1959260B1 (en) 2005-12-05 2019-05-29 NHK Spring Company Limited Probe card
JP4842640B2 (ja) * 2005-12-28 2011-12-21 日本発條株式会社 プローブカードおよび検査方法
KR100904388B1 (ko) * 2007-05-08 2009-06-26 주식회사 파이컴 다층 기판 및 이를 포함하는 전기 검사 장치
JP5194215B2 (ja) * 2008-03-21 2013-05-08 豊丸産業株式会社 パチンコ機
KR20100019885A (ko) * 2008-08-11 2010-02-19 삼성전기주식회사 프로브 카드 제조 방법
KR20100025900A (ko) * 2008-08-28 2010-03-10 삼성전기주식회사 프로브 카드 및 그의 제조 방법
JP2010243303A (ja) * 2009-04-04 2010-10-28 Advanced Systems Japan Inc 低熱膨張インターポーザ
JP2010243302A (ja) * 2009-04-04 2010-10-28 Advanced Systems Japan Inc 干渉防止構造プローブカード
CN102033144B (zh) * 2009-09-30 2013-10-23 株式会社神户制钢所 电接点构件
KR101048497B1 (ko) * 2010-07-19 2011-07-12 (주) 마이크로프랜드 프로브 카드 및 그 제조방법
WO2012011627A1 (ko) * 2010-07-19 2012-01-26 (주) 마이크로프랜드 프로브 카드 및 그 제조방법
JP5079890B2 (ja) * 2011-01-05 2012-11-21 東京エレクトロン株式会社 積層基板及びプローブカード
JPWO2013061486A1 (ja) * 2011-10-26 2015-04-02 ユニテクノ株式会社 コンタクトプローブおよびそれを備えた検査ソケット
US10371719B2 (en) * 2016-04-17 2019-08-06 Kinsus Interconnect Technology Corp. Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon
JP2019160937A (ja) * 2018-03-09 2019-09-19 東京エレクトロン株式会社 位置補正方法、検査装置及びプローブカード
US11262401B2 (en) * 2020-04-22 2022-03-01 Mpi Corporation Wafer probe station

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218149A (ja) * 1992-02-04 1993-08-27 Tokyo Electron Ltd プローブ装置
JP3066784B2 (ja) * 1992-12-14 2000-07-17 東京エレクトロン株式会社 プローブカード及びその製造方法
JPH0763786A (ja) 1993-06-16 1995-03-10 Nitto Denko Corp プローブ構造
JPH0763787A (ja) * 1993-06-16 1995-03-10 Nitto Denko Corp プローブ構造
DE69416200T2 (de) 1993-06-16 1999-06-02 Nitto Denko Corp., Ibaraki, Osaka Sondenkonstruktion
JPH07263863A (ja) * 1994-03-24 1995-10-13 Matsushita Electric Ind Co Ltd 厚膜多層基板
JP4108784B2 (ja) * 1997-05-19 2008-06-25 松下電器産業株式会社 回路基板
JP3365612B2 (ja) * 1998-01-30 2003-01-14 富士通株式会社 電子装置用試験装置
JP3565086B2 (ja) 1999-04-16 2004-09-15 富士通株式会社 プローブカード及び半導体装置の試験方法
JP2003501819A (ja) 1999-05-27 2003-01-14 ナノネクサス インコーポレイテッド 電子回路のための大規模並列処理インターフェース
WO2001098793A2 (en) 2000-06-20 2001-12-27 Nanonexus, Inc. Systems for testing integraged circuits during burn-in
JP2003506686A (ja) 1999-07-28 2003-02-18 ナノネクサス インコーポレイテッド 集積回路ウェーハのプローブカード組立体の構造および製造方法
JP2001056346A (ja) 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法
JP4476467B2 (ja) 2000-11-06 2010-06-09 東京エレクトロン株式会社 コンタクタの組立装置及び組立方法
KR100445077B1 (ko) * 2001-06-28 2004-08-21 동부전자 주식회사 반도체소자의 제조방법
JP2004534957A (ja) * 2001-07-11 2004-11-18 フォームファクター，インコーポレイテッド プローブ・カードの製造方法
US7071714B2 (en) * 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
JP4391717B2 (ja) 2002-01-09 2009-12-24 富士通マイクロエレクトロニクス株式会社 コンタクタ及びその製造方法並びにコンタクト方法
JP2003279594A (ja) * 2002-03-26 2003-10-02 Toray Ind Inc プローバ用配線基板およびその製造方法
JP4099412B2 (ja) * 2003-03-19 2008-06-11 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
CN100539061C (zh) * 2004-03-31 2009-09-09 Jsr株式会社 探针设备，配备有该探针设备的晶片检测设备，以及晶片检测方法

Also Published As

Publication number Publication date
TW200620519A (en) 2006-06-16
KR100812418B1 (ko) 2008-03-10
JP2005337737A (ja) 2005-12-08
US20080191720A1 (en) 2008-08-14
US7750655B2 (en) 2010-07-06
KR20070026632A (ko) 2007-03-08
TWI373084B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2012-09-21
WO2005114228A1 (ja) 2005-12-01

Similar Documents

Publication Publication Date Title
JP4727948B2 (ja) プローブカードに用いられる積層基板
JP5396112B2 (ja) プローブカード
TW502354B (en) Inspection device for semiconductor
US8468690B2 (en) Holding member for use in test and method for manufacturing same
JP4745060B2 (ja) プローブカード
TWI555985B (zh) 用於探針卡之板件、製造該板件之方法，及探針卡
US7382143B2 (en) Wafer probe interconnect system
KR20130127108A (ko) 프로브 카드용 공간 변환기 및 그 제조방법
JP2007218890A (ja) プローブ組立体
US9459286B2 (en) Large-area probe card and method of manufacturing the same
KR101120405B1 (ko) 프로브 블록 조립체
JP4936275B2 (ja) 接触子組立体
KR101115958B1 (ko) 프로브 카드
KR20180092027A (ko) 프로브 카드 어셈블리
JP5079890B2 (ja) 積層基板及びプローブカード
TWI484192B (zh) Probe card, inspection device and inspection method
JP2003133375A (ja) 半導体装置の製造方法及び半導体装置
JP4962929B2 (ja) プローバ装置及びこれに用いるプローブ組立体
JP4264310B2 (ja) 基板検査装置
CN110888039A (zh) 探针和包括该探针的探针卡
KR20160095392A (ko) 공간 변환기 및 그 제조 방법, 및 공간 변환기를 포함하는 프로브 카드
TW201203417A (en) Circuit board of probe card
JP2003077967A (ja) 半導体回路の検査装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070524

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100427

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100628

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101005

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110105

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20110124

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110412

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110414

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140422

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees