TWI373084B - - Google Patents

Info

Publication number
TWI373084B
TWI373084B TW094116910A TW94116910A TWI373084B TW I373084 B TWI373084 B TW I373084B TW 094116910 A TW094116910 A TW 094116910A TW 94116910 A TW94116910 A TW 94116910A TW I373084 B TWI373084 B TW I373084B
Authority
TW
Taiwan
Application number
TW094116910A
Other languages
Chinese (zh)
Other versions
TW200620519A (en
Inventor
Jun Mochizuki
Hisatomi Hosaka
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200620519A publication Critical patent/TW200620519A/zh
Application granted granted Critical
Publication of TWI373084B publication Critical patent/TWI373084B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW094116910A 2004-05-24 2005-05-24 Laminated board and probe card TW200620519A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004153231A JP4727948B2 (ja) 2004-05-24 2004-05-24 プローブカードに用いられる積層基板

Publications (2)

Publication Number Publication Date
TW200620519A TW200620519A (en) 2006-06-16
TWI373084B true TWI373084B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2012-09-21

Family

ID=35428494

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116910A TW200620519A (en) 2004-05-24 2005-05-24 Laminated board and probe card

Country Status (5)

Country Link
US (1) US7750655B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP4727948B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100812418B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW200620519A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2005114228A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4823667B2 (ja) * 2005-12-05 2011-11-24 日本発條株式会社 プローブカード
EP1959260B1 (en) 2005-12-05 2019-05-29 NHK Spring Company Limited Probe card
JP4842640B2 (ja) * 2005-12-28 2011-12-21 日本発條株式会社 プローブカードおよび検査方法
KR100904388B1 (ko) * 2007-05-08 2009-06-26 주식회사 파이컴 다층 기판 및 이를 포함하는 전기 검사 장치
JP5194215B2 (ja) * 2008-03-21 2013-05-08 豊丸産業株式会社 パチンコ機
KR20100019885A (ko) * 2008-08-11 2010-02-19 삼성전기주식회사 프로브 카드 제조 방법
KR20100025900A (ko) * 2008-08-28 2010-03-10 삼성전기주식회사 프로브 카드 및 그의 제조 방법
JP2010243303A (ja) * 2009-04-04 2010-10-28 Advanced Systems Japan Inc 低熱膨張インターポーザ
JP2010243302A (ja) * 2009-04-04 2010-10-28 Advanced Systems Japan Inc 干渉防止構造プローブカード
CN102033144B (zh) * 2009-09-30 2013-10-23 株式会社神户制钢所 电接点构件
KR101048497B1 (ko) * 2010-07-19 2011-07-12 (주) 마이크로프랜드 프로브 카드 및 그 제조방법
WO2012011627A1 (ko) * 2010-07-19 2012-01-26 (주) 마이크로프랜드 프로브 카드 및 그 제조방법
JP5079890B2 (ja) * 2011-01-05 2012-11-21 東京エレクトロン株式会社 積層基板及びプローブカード
JPWO2013061486A1 (ja) * 2011-10-26 2015-04-02 ユニテクノ株式会社 コンタクトプローブおよびそれを備えた検査ソケット
US10371719B2 (en) * 2016-04-17 2019-08-06 Kinsus Interconnect Technology Corp. Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon
JP2019160937A (ja) * 2018-03-09 2019-09-19 東京エレクトロン株式会社 位置補正方法、検査装置及びプローブカード
US11262401B2 (en) * 2020-04-22 2022-03-01 Mpi Corporation Wafer probe station

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218149A (ja) * 1992-02-04 1993-08-27 Tokyo Electron Ltd プローブ装置
JP3066784B2 (ja) * 1992-12-14 2000-07-17 東京エレクトロン株式会社 プローブカード及びその製造方法
JPH0763786A (ja) 1993-06-16 1995-03-10 Nitto Denko Corp プローブ構造
JPH0763787A (ja) * 1993-06-16 1995-03-10 Nitto Denko Corp プローブ構造
DE69416200T2 (de) 1993-06-16 1999-06-02 Nitto Denko Corp., Ibaraki, Osaka Sondenkonstruktion
JPH07263863A (ja) * 1994-03-24 1995-10-13 Matsushita Electric Ind Co Ltd 厚膜多層基板
JP4108784B2 (ja) * 1997-05-19 2008-06-25 松下電器産業株式会社 回路基板
JP3365612B2 (ja) * 1998-01-30 2003-01-14 富士通株式会社 電子装置用試験装置
JP3565086B2 (ja) 1999-04-16 2004-09-15 富士通株式会社 プローブカード及び半導体装置の試験方法
JP2003501819A (ja) 1999-05-27 2003-01-14 ナノネクサス インコーポレイテッド 電子回路のための大規模並列処理インターフェース
WO2001098793A2 (en) 2000-06-20 2001-12-27 Nanonexus, Inc. Systems for testing integraged circuits during burn-in
JP2003506686A (ja) 1999-07-28 2003-02-18 ナノネクサス インコーポレイテッド 集積回路ウェーハのプローブカード組立体の構造および製造方法
JP2001056346A (ja) 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法
JP4476467B2 (ja) 2000-11-06 2010-06-09 東京エレクトロン株式会社 コンタクタの組立装置及び組立方法
KR100445077B1 (ko) * 2001-06-28 2004-08-21 동부전자 주식회사 반도체소자의 제조방법
JP2004534957A (ja) * 2001-07-11 2004-11-18 フォームファクター，インコーポレイテッド プローブ・カードの製造方法
US7071714B2 (en) * 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
JP4391717B2 (ja) 2002-01-09 2009-12-24 富士通マイクロエレクトロニクス株式会社 コンタクタ及びその製造方法並びにコンタクト方法
JP2003279594A (ja) * 2002-03-26 2003-10-02 Toray Ind Inc プローバ用配線基板およびその製造方法
JP4099412B2 (ja) * 2003-03-19 2008-06-11 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
CN100539061C (zh) * 2004-03-31 2009-09-09 Jsr株式会社 探针设备，配备有该探针设备的晶片检测设备，以及晶片检测方法

Also Published As

Publication number Publication date
TW200620519A (en) 2006-06-16
KR100812418B1 (ko) 2008-03-10
JP2005337737A (ja) 2005-12-08
US20080191720A1 (en) 2008-08-14
US7750655B2 (en) 2010-07-06
JP4727948B2 (ja) 2011-07-20
KR20070026632A (ko) 2007-03-08
WO2005114228A1 (ja) 2005-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees