JP4745060B2 - プローブカード - Google Patents
プローブカード Download PDFInfo
- Publication number
- JP4745060B2 JP4745060B2 JP2005517125A JP2005517125A JP4745060B2 JP 4745060 B2 JP4745060 B2 JP 4745060B2 JP 2005517125 A JP2005517125 A JP 2005517125A JP 2005517125 A JP2005517125 A JP 2005517125A JP 4745060 B2 JP4745060 B2 JP 4745060B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- probe card
- contactor
- connecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
11 コンタクタ
11A セラミック基板
11B プローブ
11E 接触子
12 プリント配線基板(回路基板)
13 連結部材
14 補強部材
15 インターポーザ
15B,15C 接触子
本実施例のプローブカード10は、例えば図1に示すように、コンタクタ11と、コンタクタ11に電気的に接続されたプリント配線基板12と、これら両者11、12を連結して一体化する連結部材13と、この連結部材13によって一体化したプリント配線基板12を補強する補強部材14とを備え、ウエハ等の被検査体の電気的特性検査に用いられる。
本実施例のプローブカード10は、図1、図2に示すインターポーザ15に代えて例えば図3に示すように弾性変形自在な複数の接触子11Eをコンタクタ11の上面に設けた以外は上記実施例に同様に構成されている。
Claims (5)
- 被検査体の電気的特性検査を行うプローブカードであって、
コンタクタと、回路基板と、上記コンタクタと上記回路基板の間に、これら両者を弾力的且つ電気的に接触させる中間部材と、これらを一体化する連結部材と、この連結部材を介して一体化した上記回路基板を補強する補強部材とを備え、
上記コンタクタと上記回路基板の間及び上記回路基板と上記補強部材の間にそれぞれ弾性部材を介装している。 - 請求項1に記載のプローブカードにおいて,
上記中間部材は、基板と、この基板の少なくとも上記回路基板側に配設された弾性変形自在な複数の接触子を有するインターポーザである。 - 請求項1に記載のプローブカードにおいて,
上記中間部材として、弾性変形自在な接触子を上記コンタクタに複数設けている。 - 請求項1に記載のプローブカードにおいて,
上記中間部材は、導電性ゴムからなる。 - 請求項1に記載のプローブカードにおいて,
上記コンタクタは、セラミック基板と、このセラミック基板の上記被検査体との接触面側に設けられた複数のプローブとを有する。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005517125A JP4745060B2 (ja) | 2004-01-20 | 2005-01-20 | プローブカード |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004012077 | 2004-01-20 | ||
JP2004012077 | 2004-01-20 | ||
PCT/JP2005/000657 WO2005069019A1 (ja) | 2004-01-20 | 2005-01-20 | プローブカード |
JP2005517125A JP4745060B2 (ja) | 2004-01-20 | 2005-01-20 | プローブカード |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2005069019A1 JPWO2005069019A1 (ja) | 2007-09-06 |
JP4745060B2 true JP4745060B2 (ja) | 2011-08-10 |
Family
ID=34747311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005517125A Expired - Fee Related JP4745060B2 (ja) | 2004-01-20 | 2005-01-20 | プローブカード |
Country Status (6)
Country | Link |
---|---|
US (2) | US20050156613A1 (ja) |
JP (1) | JP4745060B2 (ja) |
KR (2) | KR20050076599A (ja) |
CN (2) | CN100422747C (ja) |
TW (1) | TW200525675A (ja) |
WO (1) | WO2005069019A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170064058A (ko) * | 2015-11-30 | 2017-06-09 | 삼성전자주식회사 | 프로브 카드 및 그를 포함하는 테스트 장치 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4704426B2 (ja) * | 2005-05-23 | 2011-06-15 | 株式会社日本マイクロニクス | 電気的接続装置、その製造方法および電気的接続装置 |
JP4979214B2 (ja) * | 2005-08-31 | 2012-07-18 | 日本発條株式会社 | プローブカード |
KR100805531B1 (ko) * | 2006-06-13 | 2008-02-20 | 삼성에스디아이 주식회사 | 증발원 |
KR100775583B1 (ko) * | 2006-10-02 | 2007-11-09 | 주식회사 코리아 인스트루먼트 | 프로브 카드의 탐침부 및 이를 포함한 프로브 카드 |
KR100780454B1 (ko) * | 2006-12-19 | 2007-11-28 | 세크론 주식회사 | 프로브 카드 및 그 제조 방법 |
KR20090120513A (ko) * | 2007-03-26 | 2009-11-24 | 가부시키가이샤 아드반테스트 | 접속용 보드, 프로브 카드 및 이를 구비한 전자부품 시험장치 |
KR101340416B1 (ko) * | 2007-05-28 | 2013-12-13 | 주식회사 코리아 인스트루먼트 | 프로브 시트, 이를 포함하는 프로브 카드 및 이의 제조방법 |
JP5164543B2 (ja) * | 2007-12-05 | 2013-03-21 | 東京エレクトロン株式会社 | プローブカードの製造方法 |
JP5021519B2 (ja) * | 2008-02-22 | 2012-09-12 | 日本電子材料株式会社 | プローブカード |
KR101010666B1 (ko) * | 2008-10-28 | 2011-01-24 | 윌테크놀러지(주) | 프로브 유닛 및 이를 포함하는 프로브 카드 |
TW201018917A (en) * | 2008-11-13 | 2010-05-16 | Mpi Corp | Method of manufacturing probe card and structure thereof |
JP2010133787A (ja) * | 2008-12-03 | 2010-06-17 | Tokyo Electron Ltd | プローブカード |
KR101250306B1 (ko) * | 2011-03-11 | 2013-04-04 | 주식회사 유니멤스 | 프로브카드 |
US8622752B2 (en) * | 2011-04-13 | 2014-01-07 | Teradyne, Inc. | Probe-card interposer constructed using hexagonal modules |
KR101270036B1 (ko) * | 2011-06-08 | 2013-06-10 | 수도 겐조 | 칩 검사용 프로브 장치 |
US8957691B2 (en) * | 2011-10-21 | 2015-02-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe cards for probing integrated circuits |
KR101366670B1 (ko) * | 2013-03-15 | 2014-02-25 | 주식회사 테크웍스플러스 | 인터포저조립체와 이를 포함한 프로브 카드 |
JP2015529964A (ja) * | 2013-04-22 | 2015-10-08 | ▲華▼▲為▼▲終▼端有限公司 | 通信カードの変形を防止するための装置 |
JP6209376B2 (ja) * | 2013-07-08 | 2017-10-04 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP6209375B2 (ja) * | 2013-07-08 | 2017-10-04 | 株式会社日本マイクロニクス | 電気的接続装置 |
KR102328101B1 (ko) | 2015-07-07 | 2021-11-17 | 삼성전자주식회사 | 프로브 카드, 프로브 카드용 단열 커버 어셈블리, 및 이를 갖는 반도체 디바이스의 검사 장치 |
TWI604198B (zh) * | 2016-06-22 | 2017-11-01 | 思達科技股份有限公司 | 測試裝置、夾持組件及探針卡載具 |
JP7170494B2 (ja) * | 2018-10-15 | 2022-11-14 | 東京エレクトロン株式会社 | 中間接続部材及び検査装置 |
US11943886B2 (en) * | 2020-11-11 | 2024-03-26 | Te Connectivity Solutions Gmbh | Electronic assembly including a compression assembly for cable connector modules |
TWI792528B (zh) * | 2021-08-31 | 2023-02-11 | 旺矽科技股份有限公司 | 探針卡及其晶圓測試組件 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134570A (ja) * | 2000-10-20 | 2002-05-10 | Japan Electronic Materials Corp | プローブカード及びそれに用いられる異方性導電シートの製造方法 |
JP2003506686A (ja) * | 1999-07-28 | 2003-02-18 | ナノネクサス インコーポレイテッド | 集積回路ウェーハのプローブカード組立体の構造および製造方法 |
JP2003324132A (ja) * | 2002-04-30 | 2003-11-14 | Japan Electronic Materials Corp | テスト用基板 |
JP2004077153A (ja) * | 2002-08-09 | 2004-03-11 | Japan Electronic Materials Corp | プローブカード |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05218149A (ja) * | 1992-02-04 | 1993-08-27 | Tokyo Electron Ltd | プローブ装置 |
US5974662A (en) * | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
AU4160096A (en) | 1994-11-15 | 1996-06-06 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6483328B1 (en) * | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
US6690185B1 (en) * | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
US6215320B1 (en) * | 1998-10-23 | 2001-04-10 | Teradyne, Inc. | High density printed circuit board |
US6441629B1 (en) * | 2000-05-31 | 2002-08-27 | Advantest Corp | Probe contact system having planarity adjustment mechanism |
US6756797B2 (en) * | 2001-01-31 | 2004-06-29 | Wentworth Laboratories Inc. | Planarizing interposer for thermal compensation of a probe card |
JP3891798B2 (ja) * | 2001-06-19 | 2007-03-14 | 松下電器産業株式会社 | プローブ装置 |
TW578910U (en) * | 2003-05-21 | 2004-03-01 | Mjc Probe Inc | Integrated circuit probe card |
JP2004014845A (ja) | 2002-06-07 | 2004-01-15 | Shinko Electric Ind Co Ltd | インターポーザの製造方法 |
TWI292196B (en) * | 2002-09-30 | 2008-01-01 | Via Tech Inc | Flip chip test structure |
JP2005010052A (ja) * | 2003-06-19 | 2005-01-13 | Japan Electronic Materials Corp | プローブカード |
US7071715B2 (en) * | 2004-01-16 | 2006-07-04 | Formfactor, Inc. | Probe card configuration for low mechanical flexural strength electrical routing substrates |
JP2006010629A (ja) * | 2004-06-29 | 2006-01-12 | Tokyo Electron Ltd | 平行調整機構を備えたプローブカード |
JP4472593B2 (ja) * | 2005-07-12 | 2010-06-02 | 東京エレクトロン株式会社 | プローブカード |
-
2004
- 2004-11-02 TW TW093133381A patent/TW200525675A/zh not_active IP Right Cessation
- 2004-12-20 KR KR1020040108829A patent/KR20050076599A/ko not_active Application Discontinuation
-
2005
- 2005-01-10 US US11/031,152 patent/US20050156613A1/en not_active Abandoned
- 2005-01-20 US US10/586,651 patent/US7663386B2/en not_active Expired - Fee Related
- 2005-01-20 JP JP2005517125A patent/JP4745060B2/ja not_active Expired - Fee Related
- 2005-01-20 CN CNB2005800028523A patent/CN100422747C/zh not_active Expired - Fee Related
- 2005-01-20 WO PCT/JP2005/000657 patent/WO2005069019A1/ja active Application Filing
- 2005-01-20 CN CNA2005100025584A patent/CN1645589A/zh active Pending
- 2005-01-20 KR KR1020067015290A patent/KR100828053B1/ko not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003506686A (ja) * | 1999-07-28 | 2003-02-18 | ナノネクサス インコーポレイテッド | 集積回路ウェーハのプローブカード組立体の構造および製造方法 |
JP2002134570A (ja) * | 2000-10-20 | 2002-05-10 | Japan Electronic Materials Corp | プローブカード及びそれに用いられる異方性導電シートの製造方法 |
JP2003324132A (ja) * | 2002-04-30 | 2003-11-14 | Japan Electronic Materials Corp | テスト用基板 |
JP2004077153A (ja) * | 2002-08-09 | 2004-03-11 | Japan Electronic Materials Corp | プローブカード |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170064058A (ko) * | 2015-11-30 | 2017-06-09 | 삼성전자주식회사 | 프로브 카드 및 그를 포함하는 테스트 장치 |
KR102466151B1 (ko) * | 2015-11-30 | 2022-11-15 | 삼성전자주식회사 | 프로브 카드 및 그를 포함하는 테스트 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20060127938A (ko) | 2006-12-13 |
US20080258745A1 (en) | 2008-10-23 |
JPWO2005069019A1 (ja) | 2007-09-06 |
KR100828053B1 (ko) | 2008-05-09 |
WO2005069019A1 (ja) | 2005-07-28 |
TWI338929B (ja) | 2011-03-11 |
CN1910460A (zh) | 2007-02-07 |
US20050156613A1 (en) | 2005-07-21 |
CN100422747C (zh) | 2008-10-01 |
CN1645589A (zh) | 2005-07-27 |
TW200525675A (en) | 2005-08-01 |
KR20050076599A (ko) | 2005-07-26 |
US7663386B2 (en) | 2010-02-16 |
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