JP4668277B2 - プリント回路基板の信号層遷移を改善するための装置及び方法 - Google Patents
プリント回路基板の信号層遷移を改善するための装置及び方法 Download PDFInfo
- Publication number
- JP4668277B2 JP4668277B2 JP2007539262A JP2007539262A JP4668277B2 JP 4668277 B2 JP4668277 B2 JP 4668277B2 JP 2007539262 A JP2007539262 A JP 2007539262A JP 2007539262 A JP2007539262 A JP 2007539262A JP 4668277 B2 JP4668277 B2 JP 4668277B2
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- Prior art keywords
- circuit board
- vias
- coupled
- series
- boomerang
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
他の実施例に関して、異なるシステム構成が使用されても良いことは明らかである。例えば、システム800は単一のCPUを有するが、他の実施例では、(1又はそれ以上の処理装置が上記CPU140と構造及び動作が類似するところの)マルチプロセッサシステムが、様々な実施例の直列結合ビアから利益を享受しうる。更に、例えば、サーバ、ワークステーション、デスクトップコンピュータシステム、ゲームシステム、埋め込み式コンピュータシステム、ブレードサーバなどの他の形式のシステム又は他の形式のコンピュータシステムが、他の実施例のために使用されても良い。
Claims (17)
- 1又はそれ以上の回路基板層の間に信号層遷移を与えるよう直列に接続された少なくともひとまとまりの複数の信号ビアを有し、
前記少なくともひとまとまりの複数の信号ビアは、
第1のアンチパッドを有する第1のビアと、
前記第1のアンチパッドと異なる大きさを有する第2のアンチパッドを有する第2のビアと、
直列に前記第1のビア及び前記第2のビアを結合するマイクロストリップ層と、
第3のビアと、
前記第3のビアに直列に接続された第4のビアと
を有し、
前記第2のビアは、前記第1のビアと前記第2のビアとの間の電磁結合を可能にするよう前記第1のビアの近くに位置付けられ、
前記第4のビアは、前記第3のビアと前記第4のビアとの間の電磁結合を可能にするよう前記第3のビアの近くに位置付けられ、
前記第2のビア及び前記第4のビアは一対の差分信号ビアを形成する、回路基板。 - 前記第1のビアの直径は、前記第2のビアの直径よりも大きい、請求項1記載の回路基板。
- 前記第1のビアのアンチパッドの大きさは、前記第2のビアのアンチパッドの大きさよりも小さい、請求項1記載の回路基板。
- 前記第1のビアへ結合された第1のコネクタピンと、
前記第2のビアへ結合された第1のトレースと、
前記第3のビアへ結合された第2のコネクタピンと、
前記第4のビアへ結合された第2のトレースとを更に有し、
前記第1のトレース及び前記第2のトレースは、差分信号対を与える、請求項1記載の回路基板。 - 前記第2のビアと前記第4のビアとの間に形成された接地ビアを更に有する、請求項1記載の回路基板。
- 前記第4のビアは、前記第2のビアと前記第4のビアとの間の電磁結合を可能にするよう前記第2のビアの近くに位置付けられる、請求項1記載の回路基板。
- 前記第2のビアのアンチパッドの形は、前記第1のビアのアンチパッドの形とは異なる、請求項1記載の回路基板。
- 前記第2のビアのアンチパッドは、前記第1のビアのアンチパッドに交わる、請求項1記載の回路基板。
- バスと、
前記バスへ結合されたメモリと、
前記バスへ電気的に接続され、第1のアンチパッドを有する第1のビア及び該第1のアンチパッドと異なる大きさを有する第2のアンチパッドを有する第2のビアを有し、前記第2のビアが前記第1のビアと前記第2のビアとの間の電磁結合を可能にするよう前記第1のビアの近くに位置付けられ、前記第1のビア及び前記第2のビアが1又はそれ以上の回路基板層の間に信号層遷移を与えるよう直列に接続される回路基板と、
第3のビアと、
前記第3のビアに直列に接続された第4のビアと
を有し、
前記第4のビアは、前記第3のビアと前記第4のビアとの間の電磁結合を可能にするよう前記第3のビアの近くに位置付けられ、
前記第2のビア及び前記第4のビアは一対の差分信号ビアを形成する、システム。 - 前記第1のビアの直径は、前記第2のビアの直径よりも大きい、請求項9記載のシステム。
- 前記第1のビアへ結合された第1のコネクタピンと、
前記第2のビアへ結合された第1のトレースと、
前記第3のビアへ結合された第2のコネクタピンと、
前記第4のビアへ結合された第2のトレースとを更に有し、
前記第1のトレース及び前記第2のトレースは、差分信号対を与える、請求項9記載のシステム。 - 前記第2のビアのアンチパッドは、前記第1のビアのアンチパッドに交わる、請求項9記載のシステム。
- 前記第1のビアはブラインドビアを有し、前記第2のビアはめっきスルーホールビアを有する、請求項9記載のシステム。
- 前記第1のビアは埋め込みビアを有し、前記第2のビアはめっきスルーホールビアを有する、請求項9記載のシステム。
- 前記第1のビアはバックドリルビアを有し、前記第2のビアはめっきスルーホールビアを有する、請求項9記載のシステム。
- 前記第2のビアと前記第4のビアとの間に形成された接地ビアを更に有する、請求項9記載のシステム。
- 前記第4のビアは、前記第2のビアと前記第4のビアとの間の電磁結合を可能にするよう前記第2のビアの近くに位置付けられる、請求項9記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/976,423 US7501586B2 (en) | 2004-10-29 | 2004-10-29 | Apparatus and method for improving printed circuit board signal layer transitions |
PCT/US2005/039316 WO2006050286A2 (en) | 2004-10-29 | 2005-10-27 | An apparatus and method for improving printed circuit board signal layer transitions |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008518486A JP2008518486A (ja) | 2008-05-29 |
JP4668277B2 true JP4668277B2 (ja) | 2011-04-13 |
Family
ID=36216815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007539262A Expired - Fee Related JP4668277B2 (ja) | 2004-10-29 | 2005-10-27 | プリント回路基板の信号層遷移を改善するための装置及び方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7501586B2 (ja) |
JP (1) | JP4668277B2 (ja) |
KR (1) | KR100900832B1 (ja) |
CN (1) | CN101341806B (ja) |
DE (1) | DE112005002368T5 (ja) |
TW (1) | TWI308037B (ja) |
WO (1) | WO2006050286A2 (ja) |
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2004
- 2004-10-29 US US10/976,423 patent/US7501586B2/en active Active
-
2005
- 2005-10-27 WO PCT/US2005/039316 patent/WO2006050286A2/en active Application Filing
- 2005-10-27 KR KR1020077007418A patent/KR100900832B1/ko not_active IP Right Cessation
- 2005-10-27 CN CN2005800354077A patent/CN101341806B/zh active Active
- 2005-10-27 JP JP2007539262A patent/JP4668277B2/ja not_active Expired - Fee Related
- 2005-10-27 DE DE112005002368T patent/DE112005002368T5/de not_active Withdrawn
- 2005-10-28 TW TW094137821A patent/TWI308037B/zh active
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JPS61100178U (ja) * | 1984-12-05 | 1986-06-26 | ||
JPH11330703A (ja) * | 1998-05-13 | 1999-11-30 | Nec Corp | 多層プリント配線板 |
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US20060090933A1 (en) | 2006-05-04 |
TWI308037B (en) | 2009-03-21 |
CN101341806A (zh) | 2009-01-07 |
WO2006050286A3 (en) | 2006-07-20 |
US7501586B2 (en) | 2009-03-10 |
WO2006050286A2 (en) | 2006-05-11 |
DE112005002368T5 (de) | 2007-09-27 |
JP2008518486A (ja) | 2008-05-29 |
TW200631473A (en) | 2006-09-01 |
KR100900832B1 (ko) | 2009-06-04 |
CN101341806B (zh) | 2011-04-27 |
KR20070049240A (ko) | 2007-05-10 |
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