JP4655039B2 - ステージ装置、露光装置及び露光方法 - Google Patents

ステージ装置、露光装置及び露光方法 Download PDF

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Publication number
JP4655039B2
JP4655039B2 JP2006514487A JP2006514487A JP4655039B2 JP 4655039 B2 JP4655039 B2 JP 4655039B2 JP 2006514487 A JP2006514487 A JP 2006514487A JP 2006514487 A JP2006514487 A JP 2006514487A JP 4655039 B2 JP4655039 B2 JP 4655039B2
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Japan
Prior art keywords
axis
stage
supply device
power supply
wafer stage
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Expired - Fee Related
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JP2006514487A
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English (en)
Japanese (ja)
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JPWO2005122242A1 (ja
Inventor
祐一 柴崎
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • G—PHYSICS
    • G12—INSTRUMENT DETAILS
    • G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G12B5/00—Adjusting position or attitude, e.g. level, of instruments or other apparatus, or of parts thereof; Compensating for the effects of tilting or acceleration, e.g. for optical apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2006514487A 2004-06-07 2005-06-06 ステージ装置、露光装置及び露光方法 Expired - Fee Related JP4655039B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004168481 2004-06-07
JP2004168481 2004-06-07
PCT/JP2005/010315 WO2005122242A1 (ja) 2004-06-07 2005-06-06 ステージ装置、露光装置及び露光方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010245715A Division JP5246243B2 (ja) 2004-06-07 2010-11-01 ステージ装置、露光装置、ステージ装置の駆動方法、露光方法、及びデバイス製造方法

Publications (2)

Publication Number Publication Date
JPWO2005122242A1 JPWO2005122242A1 (ja) 2008-04-10
JP4655039B2 true JP4655039B2 (ja) 2011-03-23

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Family Applications (2)

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JP2006514487A Expired - Fee Related JP4655039B2 (ja) 2004-06-07 2005-06-06 ステージ装置、露光装置及び露光方法
JP2010245715A Expired - Lifetime JP5246243B2 (ja) 2004-06-07 2010-11-01 ステージ装置、露光装置、ステージ装置の駆動方法、露光方法、及びデバイス製造方法

Family Applications After (1)

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JP2010245715A Expired - Lifetime JP5246243B2 (ja) 2004-06-07 2010-11-01 ステージ装置、露光装置、ステージ装置の駆動方法、露光方法、及びデバイス製造方法

Country Status (6)

Country Link
US (5) US20080192226A1 (https=)
EP (1) EP1780786A4 (https=)
JP (2) JP4655039B2 (https=)
KR (1) KR101119814B1 (https=)
TW (1) TW200614342A (https=)
WO (1) WO2005122242A1 (https=)

Cited By (1)

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JP2011077528A (ja) * 2004-06-07 2011-04-14 Nikon Corp ステージ装置、露光装置及び露光方法

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JP5130714B2 (ja) * 2004-04-09 2013-01-30 株式会社ニコン 移動体の駆動方法、ステージ装置、露光装置、露光方法、及びデバイス製造方法
JP4905135B2 (ja) 2004-12-01 2012-03-28 株式会社ニコン ステージ装置及び露光装置
US8693006B2 (en) 2005-06-28 2014-04-08 Nikon Corporation Reflector, optical element, interferometer system, stage device, exposure apparatus, and device fabricating method
TW200710616A (en) 2005-07-11 2007-03-16 Nikon Corp Exposure apparatus and method for manufacturing device
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US8681314B2 (en) 2005-10-24 2014-03-25 Nikon Corporation Stage device and coordinate correction method for the same, exposure apparatus, and device manufacturing method
JP2007305778A (ja) * 2006-05-11 2007-11-22 Nikon Corp ステージ装置、露光装置、デバイスの製造方法、配線方法
JP4962903B2 (ja) * 2006-12-28 2012-06-27 株式会社ニコン 用力供給装置、移動体システム及びパターン形成装置、並びに移動体装置
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JP2010238985A (ja) * 2009-03-31 2010-10-21 Nikon Corp 露光装置及びデバイスの製造方法
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JP5107984B2 (ja) * 2009-09-18 2012-12-26 株式会社日立ハイテクノロジーズ ステージ装置
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US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8988655B2 (en) * 2010-09-07 2015-03-24 Nikon Corporation Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method
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WO2014054188A1 (ja) * 2012-10-05 2014-04-10 株式会社ミラック光学 手動ステージ用電動化ユニット、及び電動化ユニット付き手動ステージ
CN106104385B (zh) 2014-04-16 2018-08-10 Asml荷兰有限公司 光刻设备、用于将物体定位在光刻设备中的方法以及器件制造方法
JP2016207756A (ja) * 2015-04-17 2016-12-08 株式会社ニコン ステージ装置及び露光装置
TWI619145B (zh) * 2015-04-30 2018-03-21 佳能股份有限公司 壓印裝置，基板運送裝置，壓印方法以及製造物件的方法
JP6701873B2 (ja) * 2016-03-28 2020-05-27 セイコーエプソン株式会社 プロジェクター
CN109563608A (zh) * 2017-02-24 2019-04-02 应用材料公司 用于基板载体和掩模载体的定位配置、用于基板载体和掩模载体的传送系统及其方法
JP6735693B2 (ja) * 2017-02-27 2020-08-05 株式会社日立ハイテク ステージ装置、及び荷電粒子線装置
US10564553B2 (en) * 2017-09-26 2020-02-18 Guangdong University Of Technology Large load-bearing guide mechanism and multi-DOF large-stroke high-precision motion platform system
US20200286764A1 (en) * 2017-09-29 2020-09-10 Onto Innovation, Inc. High resolution stage positioner
CN113118787A (zh) * 2021-03-24 2021-07-16 广州市昊志机电股份有限公司 一种机床转台和机床
CN119196462B (zh) * 2024-10-11 2025-03-21 山东中维世纪科技股份有限公司 一种广播电视录制用三维移动式录制设备
CN118938612B (zh) * 2024-10-14 2025-01-28 上海芯东来半导体科技有限公司 高精度滑台组件及光刻机工作台

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US20130120731A1 (en) 2013-05-16
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US20130148094A1 (en) 2013-06-13
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EP1780786A4 (en) 2009-11-25
KR20070022139A (ko) 2007-02-23
US20080192226A1 (en) 2008-08-14
TW200614342A (en) 2006-05-01
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US20100060877A1 (en) 2010-03-11
JP5246243B2 (ja) 2013-07-24

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