JP4634265B2 - 塗布方法及び塗布装置 - Google Patents

塗布方法及び塗布装置 Download PDF

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Publication number
JP4634265B2
JP4634265B2 JP2005279684A JP2005279684A JP4634265B2 JP 4634265 B2 JP4634265 B2 JP 4634265B2 JP 2005279684 A JP2005279684 A JP 2005279684A JP 2005279684 A JP2005279684 A JP 2005279684A JP 4634265 B2 JP4634265 B2 JP 4634265B2
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JP
Japan
Prior art keywords
substrate
nozzle
coating
scanning
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005279684A
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English (en)
Japanese (ja)
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JP2007090145A (ja
Inventor
文彦 池田
池本　　大輔
五男 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Hirata Corp
Original Assignee
Tokyo Electron Ltd
Hirata Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Hirata Corp filed Critical Tokyo Electron Ltd
Priority to JP2005279684A priority Critical patent/JP4634265B2/ja
Priority to CN2006101514898A priority patent/CN1939603B/zh
Priority to TW95135385A priority patent/TWI323191B/zh
Priority to KR1020060093616A priority patent/KR101384948B1/ko
Publication of JP2007090145A publication Critical patent/JP2007090145A/ja
Application granted granted Critical
Publication of JP4634265B2 publication Critical patent/JP4634265B2/ja
Active legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
JP2005279684A 2005-09-27 2005-09-27 塗布方法及び塗布装置 Active JP4634265B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005279684A JP4634265B2 (ja) 2005-09-27 2005-09-27 塗布方法及び塗布装置
CN2006101514898A CN1939603B (zh) 2005-09-27 2006-09-12 涂敷方法及涂敷装置
TW95135385A TWI323191B (en) 2005-09-27 2006-09-25 Coating method and coating apparatus
KR1020060093616A KR101384948B1 (ko) 2005-09-27 2006-09-26 도포 방법 및 도포 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005279684A JP4634265B2 (ja) 2005-09-27 2005-09-27 塗布方法及び塗布装置

Publications (2)

Publication Number Publication Date
JP2007090145A JP2007090145A (ja) 2007-04-12
JP4634265B2 true JP4634265B2 (ja) 2011-02-16

Family

ID=37958285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005279684A Active JP4634265B2 (ja) 2005-09-27 2005-09-27 塗布方法及び塗布装置

Country Status (4)

Country Link
JP (1) JP4634265B2 (zh)
KR (1) KR101384948B1 (zh)
CN (1) CN1939603B (zh)
TW (1) TWI323191B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101401428B1 (ko) * 2007-08-13 2014-06-02 주식회사 케이씨텍 슬릿코팅방법
JP4803613B2 (ja) * 2007-10-15 2011-10-26 芝浦メカトロニクス株式会社 ペースト塗布装置
KR101267530B1 (ko) * 2008-04-30 2013-05-23 엘지디스플레이 주식회사 포토레지스트 코팅장비 및 방법
CN102231325B (zh) * 2010-01-11 2014-07-02 特变电工股份有限公司 一种对绝缘纸板进行湿水处理的湿水机
KR101154184B1 (ko) * 2010-09-17 2012-06-18 주식회사 케이씨텍 기판 코터 장치의 예비 토출 기구 및 이를 이용한 기판 코팅 방법
KR101578993B1 (ko) * 2011-06-01 2015-12-18 다즈모 가부시키가이샤 펌프의 유량 제어 방법 및 도막 형성 방법
KR102158033B1 (ko) * 2013-08-13 2020-09-21 주식회사 탑 엔지니어링 슬릿노즐을 이용하는 도포층 형성방법 및 도포장치
CN103599878A (zh) * 2013-11-15 2014-02-26 四川虹欧显示器件有限公司 一种在等离子显示屏不同介质表面上uv胶的涂敷方法
JP6230893B2 (ja) * 2013-12-10 2017-11-15 株式会社ヒラノテクシード 間欠塗工装置
JP6452318B2 (ja) * 2014-05-20 2019-01-16 中外炉工業株式会社 基板の塗布装置及び基板の塗布方法
JP6460694B2 (ja) * 2014-09-22 2019-01-30 Ntn株式会社 塗布方法および塗布装置
KR101787009B1 (ko) 2015-07-07 2017-10-17 주식회사 케이씨텍 기판 코팅장치
JP6721956B2 (ja) * 2015-07-28 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
JP2018043200A (ja) * 2016-09-15 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
KR102017834B1 (ko) * 2016-11-22 2019-09-03 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6860356B2 (ja) * 2017-01-20 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
CN117062334B (zh) * 2018-04-04 2024-05-24 苏州康尼格电子科技股份有限公司 Pcba板封装设备及pcba板封装方法
JP7155827B2 (ja) * 2018-09-28 2022-10-19 日本ゼオン株式会社 長尺複層フィルムの製造方法及び長尺複層フィルム
KR102023728B1 (ko) * 2018-11-28 2019-11-04 주식회사 로스코 기판 코팅 장치
WO2020262251A1 (ja) * 2019-06-27 2020-12-30 日本ゼオン株式会社 複層フィルムの製造方法
JP7402005B2 (ja) * 2019-09-30 2023-12-20 タクボエンジニアリング株式会社 塗装方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002086044A (ja) * 2000-09-19 2002-03-26 Toray Ind Inc 塗布方法および塗布装置並びにディスプレイ用部材およびプラズマディスプレイの製造方法およびその製造装置
JP2002365037A (ja) * 2001-06-05 2002-12-18 Sony Corp アライメント装置およびアライメント方法
JP2005132626A (ja) * 2003-10-06 2005-05-26 Sumitomo Heavy Ind Ltd 搬送装置、塗布システム、及び検査システム
JP2005228881A (ja) * 2004-02-12 2005-08-25 Tokyo Electron Ltd 浮上式基板搬送処理方法及びその装置
JP2005244155A (ja) * 2004-01-30 2005-09-08 Tokyo Electron Ltd 浮上式基板搬送処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4006799B2 (ja) * 1996-12-03 2007-11-14 東レ株式会社 塗布装置および塗布方法並びにカラーフィルターの製造方法および製造装置
JPH1190295A (ja) * 1997-09-18 1999-04-06 Hirata Corp 塗布装置及び塗布方法
JP3874547B2 (ja) * 1998-08-20 2007-01-31 松下電器産業株式会社 バンプ付きｉｃ封止剤塗布方法及びバンプ付きｉｃ封止剤塗布装置
JP3684878B2 (ja) * 1998-11-24 2005-08-17 東レ株式会社 塗布装置および塗布部材の製造方法、ならびに、カラーフィルタの製造装置および製造方法
JP4130058B2 (ja) * 2000-10-10 2008-08-06 東京応化工業株式会社 塗布方法
TW569288B (en) * 2001-06-19 2004-01-01 Tokyo Electron Ltd Substrate processing apparatus, liquid processing apparatus and liquid processing method
CN2622131Y (zh) * 2003-05-14 2004-06-30 东捷半导体科技股份有限公司 气浮式液晶基板运输承载装置
JP4049751B2 (ja) * 2004-02-05 2008-02-20 東京エレクトロン株式会社 塗布膜形成装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002086044A (ja) * 2000-09-19 2002-03-26 Toray Ind Inc 塗布方法および塗布装置並びにディスプレイ用部材およびプラズマディスプレイの製造方法およびその製造装置
JP2002365037A (ja) * 2001-06-05 2002-12-18 Sony Corp アライメント装置およびアライメント方法
JP2005132626A (ja) * 2003-10-06 2005-05-26 Sumitomo Heavy Ind Ltd 搬送装置、塗布システム、及び検査システム
JP2005244155A (ja) * 2004-01-30 2005-09-08 Tokyo Electron Ltd 浮上式基板搬送処理装置
JP2005228881A (ja) * 2004-02-12 2005-08-25 Tokyo Electron Ltd 浮上式基板搬送処理方法及びその装置

Also Published As

Publication number Publication date
CN1939603A (zh) 2007-04-04
TWI323191B (en) 2010-04-11
KR20070035445A (ko) 2007-03-30
TW200727991A (en) 2007-08-01
CN1939603B (zh) 2010-04-21
JP2007090145A (ja) 2007-04-12
KR101384948B1 (ko) 2014-04-11

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