KR101384948B1 - 도포 방법 및 도포 장치 - Google Patents

도포 방법 및 도포 장치 Download PDF

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Publication number
KR101384948B1
KR101384948B1 KR1020060093616A KR20060093616A KR101384948B1 KR 101384948 B1 KR101384948 B1 KR 101384948B1 KR 1020060093616 A KR1020060093616 A KR 1020060093616A KR 20060093616 A KR20060093616 A KR 20060093616A KR 101384948 B1 KR101384948 B1 KR 101384948B1
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KR
South Korea
Prior art keywords
substrate
nozzle
coating
resist
point
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KR1020060093616A
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English (en)
Korean (ko)
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KR20070035445A (ko
Inventor
후미히코 이케다
다이스케 이케모토
이츠오 후지와라
Original Assignee
히라따기꼬오 가부시키가이샤
도쿄엘렉트론가부시키가이샤
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Publication of KR20070035445A publication Critical patent/KR20070035445A/ko
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Publication of KR101384948B1 publication Critical patent/KR101384948B1/ko

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
KR1020060093616A 2005-09-27 2006-09-26 도포 방법 및 도포 장치 KR101384948B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00279684 2005-09-27
JP2005279684A JP4634265B2 (ja) 2005-09-27 2005-09-27 塗布方法及び塗布装置

Publications (2)

Publication Number Publication Date
KR20070035445A KR20070035445A (ko) 2007-03-30
KR101384948B1 true KR101384948B1 (ko) 2014-04-11

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KR1020060093616A KR101384948B1 (ko) 2005-09-27 2006-09-26 도포 방법 및 도포 장치

Country Status (4)

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JP (1) JP4634265B2 (zh)
KR (1) KR101384948B1 (zh)
CN (1) CN1939603B (zh)
TW (1) TWI323191B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101787009B1 (ko) 2015-07-07 2017-10-17 주식회사 케이씨텍 기판 코팅장치
KR102023728B1 (ko) * 2018-11-28 2019-11-04 주식회사 로스코 기판 코팅 장치

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101401428B1 (ko) * 2007-08-13 2014-06-02 주식회사 케이씨텍 슬릿코팅방법
JP4803613B2 (ja) * 2007-10-15 2011-10-26 芝浦メカトロニクス株式会社 ペースト塗布装置
KR101267530B1 (ko) * 2008-04-30 2013-05-23 엘지디스플레이 주식회사 포토레지스트 코팅장비 및 방법
CN102231325B (zh) * 2010-01-11 2014-07-02 特变电工股份有限公司 一种对绝缘纸板进行湿水处理的湿水机
KR101154184B1 (ko) * 2010-09-17 2012-06-18 주식회사 케이씨텍 기판 코터 장치의 예비 토출 기구 및 이를 이용한 기판 코팅 방법
KR101578993B1 (ko) * 2011-06-01 2015-12-18 다즈모 가부시키가이샤 펌프의 유량 제어 방법 및 도막 형성 방법
KR102158033B1 (ko) * 2013-08-13 2020-09-21 주식회사 탑 엔지니어링 슬릿노즐을 이용하는 도포층 형성방법 및 도포장치
CN103599878A (zh) * 2013-11-15 2014-02-26 四川虹欧显示器件有限公司 一种在等离子显示屏不同介质表面上uv胶的涂敷方法
JP6230893B2 (ja) * 2013-12-10 2017-11-15 株式会社ヒラノテクシード 間欠塗工装置
JP6452318B2 (ja) * 2014-05-20 2019-01-16 中外炉工業株式会社 基板の塗布装置及び基板の塗布方法
JP6460694B2 (ja) * 2014-09-22 2019-01-30 Ntn株式会社 塗布方法および塗布装置
JP6721956B2 (ja) * 2015-07-28 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
JP2018043200A (ja) * 2016-09-15 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
KR102017834B1 (ko) * 2016-11-22 2019-09-03 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6860356B2 (ja) * 2017-01-20 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
CN117062334B (zh) * 2018-04-04 2024-05-24 苏州康尼格电子科技股份有限公司 Pcba板封装设备及pcba板封装方法
JP7155827B2 (ja) * 2018-09-28 2022-10-19 日本ゼオン株式会社 長尺複層フィルムの製造方法及び長尺複層フィルム
WO2020262251A1 (ja) * 2019-06-27 2020-12-30 日本ゼオン株式会社 複層フィルムの製造方法
JP7402005B2 (ja) * 2019-09-30 2023-12-20 タクボエンジニアリング株式会社 塗装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1190295A (ja) * 1997-09-18 1999-04-06 Hirata Corp 塗布装置及び塗布方法
JP2000153205A (ja) * 1998-11-24 2000-06-06 Toray Ind Inc 塗布装置および塗布部材の製造方法、ならびに、カラーフィルタの製造装置および製造方法
JP2002086044A (ja) 2000-09-19 2002-03-26 Toray Ind Inc 塗布方法および塗布装置並びにディスプレイ用部材およびプラズマディスプレイの製造方法およびその製造装置
JP2002113411A (ja) * 2000-10-10 2002-04-16 Tokyo Ohka Kogyo Co Ltd 塗布方法

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* Cited by examiner, † Cited by third party
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JP4006799B2 (ja) * 1996-12-03 2007-11-14 東レ株式会社 塗布装置および塗布方法並びにカラーフィルターの製造方法および製造装置
JP3874547B2 (ja) * 1998-08-20 2007-01-31 松下電器産業株式会社 バンプ付きｉｃ封止剤塗布方法及びバンプ付きｉｃ封止剤塗布装置
JP2002365037A (ja) * 2001-06-05 2002-12-18 Sony Corp アライメント装置およびアライメント方法
TW569288B (en) * 2001-06-19 2004-01-01 Tokyo Electron Ltd Substrate processing apparatus, liquid processing apparatus and liquid processing method
CN2622131Y (zh) * 2003-05-14 2004-06-30 东捷半导体科技股份有限公司 气浮式液晶基板运输承载装置
JP4426276B2 (ja) * 2003-10-06 2010-03-03 住友重機械工業株式会社 搬送装置、塗布システム、及び検査システム
JP4305918B2 (ja) * 2004-01-30 2009-07-29 東京エレクトロン株式会社 浮上式基板搬送処理装置
JP4049751B2 (ja) * 2004-02-05 2008-02-20 東京エレクトロン株式会社 塗布膜形成装置
JP4033841B2 (ja) * 2004-02-12 2008-01-16 東京エレクトロン株式会社 浮上式基板搬送処理方法及びその装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1190295A (ja) * 1997-09-18 1999-04-06 Hirata Corp 塗布装置及び塗布方法
JP2000153205A (ja) * 1998-11-24 2000-06-06 Toray Ind Inc 塗布装置および塗布部材の製造方法、ならびに、カラーフィルタの製造装置および製造方法
JP2002086044A (ja) 2000-09-19 2002-03-26 Toray Ind Inc 塗布方法および塗布装置並びにディスプレイ用部材およびプラズマディスプレイの製造方法およびその製造装置
JP2002113411A (ja) * 2000-10-10 2002-04-16 Tokyo Ohka Kogyo Co Ltd 塗布方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101787009B1 (ko) 2015-07-07 2017-10-17 주식회사 케이씨텍 기판 코팅장치
KR102023728B1 (ko) * 2018-11-28 2019-11-04 주식회사 로스코 기판 코팅 장치

Also Published As

Publication number Publication date
CN1939603A (zh) 2007-04-04
TWI323191B (en) 2010-04-11
KR20070035445A (ko) 2007-03-30
TW200727991A (en) 2007-08-01
CN1939603B (zh) 2010-04-21
JP2007090145A (ja) 2007-04-12
JP4634265B2 (ja) 2011-02-16

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