TWI323191B - Coating method and coating apparatus - Google Patents

Description

1323191 IX. Description of the Invention: [Technical Field] The present invention relates to a coating method and a coating apparatus for forming a coating film by coating a liquid on a substrate to be processed. [Prior Art] In the photolithography method used in the manufacturing process of a flat panel display (fpd) such as an LCD, a method that is often used is a "spinless coating", that is, a slit is provided. (sHt) shaped spit

The strip-shaped photoresist liquid nozzle is scanned, and the photoresist is coated on the substrate to be processed (the glass substrate is coated. As disclosed in the prior art, the non-rotating coating method is on the mounting table or the platform) In the stage, the substrate is placed horizontally, and then a small gap of about 100' is set between the substrate on the stage and the discharge port of the elongated photoresist nozzle. The photoresist liquid spray & is moved in the scanning direction above the soil plate (generally moving perpendicular to the longitudinal direction of the nozzle) and - the photoresist is spattered in a strip shape on the substrate, as long as it will be long The strip-shaped liquid-contacting nozzle moves from the end of the substrate to the other end to form a photoresist coating film with a desired film thickness, and is not [Patent Document 1] Japanese Patent Laid-Open No. Hei 10_156255 [Invention] Therefore, it is easy to produce a photoresist coating film at the end of the cut. In order to cope with this problem, the industry has come up with one kind of:: = 5 S ) 1323191 connecting the photoresist supply source and the photoresist nozzle It sucks back to the nozzle end. However, when the photoresist is cut off instantaneously and the photoresist is sucked back into the nozzle of the photoresist, it is possible that the next time the coating is applied, the milk is also sucked in together. Due to the mixing of air bubbles in the liquid barrier, the effect of the law is determined, and the light flow supplied to the substrate is:::: returning to the supply to the first | making the light of the U tree _ spit (four) force will also bring cloth Fang Yu provides the equalization of the film thickness of the non-rotating coating thickness control scanning terminal portion in the above-mentioned problem of the known technology, and the coating method of the present invention moves the processed ΐ ΪΪ in the horizontal direction. Scanning is carried out to form a coating method of the coating film of the treatment liquid on the alumina board. And including: in the first step, when the nozzle passes the point set on the substrate in advance, at 1 o'clock, the device is stopped from the processing liquid for the nozzle to be pressed, and the nozzle is passed from the nozzle in advance to the substrate. The second pass η set at the beginning of the time, until the end of the scan, the nozzle is relatively moved upward at a predetermined speed with respect to the US plate; and, in the third step, the nozzle is passed from the nozzle in advance. At the third time point of the third passing point set on the substrate, the moving speed of the nozzle in the horizontal direction with respect to the substrate is slowed up until the end of scanning. Further, the coating device of the present invention comprises: a substrate supporting portion for supporting the substrate to be processed in a certain coating region.

6 S to the horizontal state; predetermined = 2: out = in the coating area, on the top surface of the substrate 'via the = liquid supply source, sent to the nozzle with the treatment; horizontal movement (four) in the coating 11 domain 'Making the nozzle facing relative to the substrate: 向ί in the cloth area, causing the nozzle to go up with respect to the substrate, such as: controlling: controlling the supply of the treatment liquid when the nozzle passes the point at the substrate beforehand The source is placed at a point in time before the second pass point set on the substrate, == to r:: drop: and the nozzle is set relative to the At the third passing point, the substrate is oriented at two == degrees s. The scanning portion is such that the nozzle is in the middle of the crucible, and when the coating scan is about to end, the point is first passed, and at the point (first time). Then, the action of the treatment liquid being sent from the treatment liquid supply source to the nozzle is stopped. Thus, the η point starts, and after a predetermined delay time, the nozzle discharge pressure starts. On the other hand, after the nozzle of t passes through the second passing point on the substrate, the nozzle starts to move upward with respect to the substrate. After the j mouth passes through the third passing point on the substrate, at this point (the third time point), the substrate (the fourth direction) is decelerated. This grin is straight until the end of the scan. The agricultural reduction is optimized with respect to the movement of the nozzle relative to the upper side of the substrate, and the embodiment is adjusted by adjusting the first pass 2 ϊ ί ί 面 iTile. Or to adjust the above-mentioned ith deceleration, the film thickness of the crucible will be optimized at a predetermined time. (10) 4,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, In the process of spitting out the Lili decline, = minus; this: rr horizontal movement and upper = movement in this case, before the coating scan is finished, due to the direction, the speed of the scanning direction is rapidly decreased, and another - On the other hand, "the pressure is attenuated - the side moves upwards at the angle of (4), so the photoresist can be separated from the liquid film on the substrate, and the embodiment will not be evasive. The deceleration of the nozzle relative to the substrate rod in the horizontal direction is moved upward with respect to the substrate at a substantially constant negative acceleration, and may be moved at a substantially constant speed f. In the end of the scan, the spray f ϊ 出 can be read at a position closer to the substrate _ than the rear end of the substrate, that is, at the upstream end of the scan. The coating scan is performed so that the substrate and the nozzle are both =, and the above relative movement can be performed. Whether the position at which the substrate is placed = stationary, the nozzle is moved in the horizontal direction in the straight direction, or the nozzle is positioned. for sure The position remains static, the mode of movement in the horizontal direction and the direction of the straight line, or the type of movement in the horizontal direction and/or the straight direction, any one of the three is in the horizontal direction. In general, it is a substrate that is relatively lighter to move, such as a substrate that moves relatively lighter. This is not only efficient at the basic level of scanning, but also makes it more effective at shifting the level of the money.仃. In addition to this, 'wire straight buckle, the same gas (four) small nozzle on the two movements, will also make the nozzle in the present invention relative to the substrate upwards at a relatively faster speed. ϋ 卜 '有有-比(四) In the application device, in the coating device of the present invention, a platform is provided for suspending the substrate in the air in the coating region. The adsorption port of the plurality of gas ejecting bodies is mixed on the '_ping#. As long as the nozzle is in the horizontal conveyance direction, it can be placed at the predetermined position, and the substrate has a substrate transporting portion, and the fixed-feeding (4) miscellaneous wire plate is used to lie in the direction of the horizontal chicken. Handling, passing down the nozzle The substrate transporting portion includes: a guide rail disposed on one side or both sides of the platform parallel to the moving direction of the substrate; a sliding member movable along the guiding track; and a carrying drive portion The driving moves the sliding member along the guiding way; the holding portion extends from the sliding member toward the central portion of the platform, and the side edge of the substrate is detachably fixed. The preferred embodiment of the nozzle. That is, the lifting and lowering portion includes: a nozzle support portion for integrally supporting the nozzle; and an actuator for moving the nozzle up and down from the second height position of the arbitrary gth, and the nozzle The support unit is coupled to each other; the nozzle 1) 'in order to eliminate the gravity of the nozzle' and the effect of the invention. According to the coating method and the coating device of the present invention, the above-mentioned "however" If stable, with good reproducibility, the film thickness of the coating scanning end portion is 1323191. [Embodiment] Hereinafter, preferred embodiments in accordance with the present invention will be described in detail with reference to the drawings. Fig. 1 shows a coating and developing treatment system which is applicable to the coating method and the coating apparatus of the present invention. The coating and developing treatment system is disposed in I. For example, an LCD substrate is used as a substrate to be processed, and in the process of the LCD, cleaning, photoresist coating, and baking are performed in a photolithography step (Prebake). , development, and post-baking (P〇stbake) treatment. Therefore, the light treatment is an external exposure device adjacent to the system (not shown, the coating development processing system can be divided into three parts, respectively: a substrate cassette station (C/S, Cassette Station) 10; processing station (P / S, Process Station) 12; and interface (I / F, Interface) 14, is composed of a substrate box (c / s) set at one end of the system, including : The cassette platform 16 can carry a predetermined number (for example, four) of cassettes c, and the cassette C is used to accommodate a plurality of substrates g;

The conveying path 17 is disposed in parallel with the arrangement direction of the side surface provided on the cassette platform μ;

Further, the transporting device 20 can move freely on the transport path 17, and abuts the cassette c on the cymbal 16 for carrying out the transport of the substrate g. The transport device 20 is provided with a mechanism for holding the substrate g, such as a transport arm. The transport mechanism 38 on the (P/S) 12 side delivers the substrate G. The processing station (P/S) 12 includes the following three parts, which are sequentially the cleaning processing unit 22, the coating processing unit 24, and the development processing unit 26 from the substrate g box station (c/s) 1 to == In the manner of the above, the substrate transfer portion 23, the chemical liquid supply early 25, and the space 27 are sandwiched. ', ', 1323191 cleaning processing unit 22 includes: two scrubber cleaning unit (SCR) 28; upper and lower two-stage ultraviolet irradiation / cooling unit (uv / COL) 30; heating unit (HP) 32; And a cooling unit (C0L) 34. The coating treatment unit 24 includes a photoresist coating unit (CT) 40 of a non-rotation coating method, a vacuum drying unit (VD) 42 , and an attachment/cooling unit (ADA: 0L) 46 of the upper and lower stages; Heating/cooling unit (hp/c〇L) 48; and heating unit (HP) 50. The development processing section 26 includes three developing units (DEV) 52; two upper and lower two-stage heating/cooling units (HP/COL) 53; and a heating unit (job) 55. In the central portion of the cleaning processing unit 22, the coating processing unit 24, and the development processing unit 26, transport paths 36, 51, and 58 are sequentially provided along the longitudinal direction. The transport structures 38 and 60 move along the transport paths 36, 51, and 58 and enter the respective units in the respective processing units to carry in/out or transport the substrate G. Further, in each of the processing units 22, 24, and 26 of the system, one of the transport paths 36, 51, and 58 has a unit (SCR, CT, bile, etc.) of the liquid processing system; and on the other side, It is equipped with a heat treatment system unit (HP, COL, etc.). Sigh on the other side of the entire system of the interface (I / F) i4, and the processing station (p / s) i2 - side, provided with an extension (substrate transmission part)%, and buffer bearing flat DuPont A conveying device 59 is provided on the side adjacent to the exposure device. The transporter 19 is freely movable in the transport path 19 extending in the γ-axis direction, and the carry-over platform 56 performs the transfer and delivery of the substrate G to perform the extension plate transfer portion 56 or the adjacent exposure device and substrate. The transfer between G. 2 shows the processing procedure in this coating development processing system. In the first gliC/S) 10, the cleaning unit of the predetermined box on the table 16 of the handling device 20 is a single unit Μ + 'New 6 _ _ _ UV irradiation / cold line irradiation unit In (UV), first dry the UV 4's secret under the 'cooling unit', and cool it 2=i=S2). The procedure of this ultraviolet cleaning is mainly to remove the particulate matter in the surface of the unit _28, and then to remove the particulate dirt on the surface (step S3). In the cleaning and cleaning, n^/n Gan1, early ^(O) 32 pairs of the substrate G are heated to perform dehydration treatment (step-production (. cattle unit (C°L) 34 towel') to cool the substrate to a predetermined The substrate is second (step, S5). At the stage, the pre-processing of the cleaning processing unit 22 has already been completed. The soil plate is transported to the coating portion by the transport mechanism 38 via the substrate transfer portion 23. The towel 'substrate G is first transported to the attachment/cooling unit first. = The initial attachment unit (AD) is hydrophobized (_S) (:). Then, in the next cooling unit (c〇L), The temperature of the substrate to which it is cooled (step S7). Then, the photoresist is applied to the substrate G by a photoresist coating unit (CT), and then dried under reduced pressure (Vd). 42, drying treatment under reduced pressure (step S8). Next, '^ plate G is sequentially transferred to the heating/cooling unit (Hp/c〇L) 48, in the most heating unit (HP), Bake after coating (prebaking) (step Deng). Next, in the cooling unit (C〇L), the substrate is cooled to a predetermined substrate temperature (step sio). In the baking after the application, a heating unit (Hp) 5 也 may be used. After the coating process described above, the substrate G is transported to the transport mechanism 54 of the coating processing unit 24 and the transport mechanism 60 of the development processing unit 26 to The interface (i/jt) 14 is then delivered from the place to the exposure device (step S11). In the exposure device, the photoresist on the substrate 6 is exposed to a predetermined circuit pattern. Then, the exposed substrate G, Returned from the exposure device to the face portion (I/F) 14. The substrate G received from the exposure device at the conveyance device 59' of the face portion (I/F) 14 is conveyed to the coating processing portion 12 via the extension portion 56. The development processing unit 26 (step S11). In the development processing unit 26, the substrate G is subjected to development processing in any of the developing units (DEV) 52 (step S12). Secondly, it is sequentially conveyed to the heating/cooling 12 1323191 One of the units (HP/COL) 53. The post-baking step S13) is performed in the initial heating unit (Hp). Secondly, in the cooling unit (C0L), the substrate is cooled to a predetermined 'substrate temperature (steps) S14). In addition, in the post-baking process, a twisting unit can also be used. HP) 55. After the development processing unit 26 completes a series of processes, the substrate G is returned to the substrate cassette station by the transport mechanisms 60, 54, 38 in the coating processing unit (p/s) 24 (c/s Ii, and the carrier device 20 is housed by any of the cassettes c (step μ). In the coating and developing treatment system, for example, the photoresist coating can be applied to the coating treatment portion (p/S) 24. The present invention is applied to a unit (CT) 40. Hereinafter, the present invention will be applied to a photoresist liquid application unit ((: 1〇4〇 one embodiment), with reference to Figs. 3 to 25 . Fig. 3 is a view showing the overall structure of a photoresist coating unit (CT) 4 〇 drying unit (VD) 42 in this embodiment, as shown in Fig. 3, on a support table or a support frame 7 ,, light The liquid-repellent coating O:T) 40 and the reduced-pressure drying unit (10) 42 are arranged side by side in the X-axis direction. The new substrate G to be coated and processed is transported to the photoresist liquid application unit (CT) 4 from the conveyance mechanism diagram of the end of the conveyance path ^, as indicated by the arrow FA. Then, the coating processing completion plate G is received by the liquid application unit (CT) 4G, and is guided by the transfer arm 74 provided on the guide rail 72 of the support 70 and movable in the X-axis direction as indicated by an arrow FB. Transfer to the reduced pressure drying unit (10) 42. Then, the drying unit (10) 42 completes the drying process of the substrate G, and is taken out via the conveying mechanism 54 (Fig. 1) provided on the conveyance 1 as indicated by an arrow fc. The photoresist coating unit (CT) 40 has the following structure: it has a platform 76 extending toward the yoke, on which the substrate G is oriented toward the same side; J = Sense and handling The strip above the platform 76, 78, will illuminate the supply plate G ±. Then, a photoresist coating film of a predetermined thickness is formed by a transfer coating method of the top surface 1 of the substrate. The configuration and gamma of each portion of the photoresist coating unit (CT) 4G (10) will be described later. '3 Zu dry, (10) 42 has: the lower chamber 80, the top surface of which has an opening, and presents a tray (_) shape or a container with a shallow bottom shape; a lid-shaped upper chamber 13 ^ 5; Room 191 (not shown) Show) 'located above the lower chamber 8〇, and

Closely 2 stitched together. The lower chamber 8G is approximately four (four), and in a, there is a ^ 82 ' for horizontally loading and supporting the G ° 83 ° ^ real pump (a not shown). In the embodiment, the photoresist is coated with i==unit (CT) 4° in the upper chamber, and the platform 76 is not as in the prior art- The second work is held by the loading table with the support plate G. Instead, the substrate is placed in the middle of the board as the substrate county. Further, the straight line disposed on both sides of the thousand 76 is advanced, and the substrate G is carried in the longitudinal direction (the x-axis direction) of the stage. In more detail, 5, the platform 76 is in its long-side direction (χ axis 4, Μ 5 (Fig. 5). The left end of the second: into the area M1, in order to be from the transport mechanism 54 (Fig. 载 and placed to the platform 76) Above, therefore, between the round-trip positions on the 3 two flat ports below the platform, 'the history has a plurality of lift pins. ^The lift locks 86 can be moved up and down' and separated by a predetermined distance. These lifts can be For example, a pneumatic cylinder (not shown) or the like is used as a drive source, and the lift pin lifting portion 85 (FIG. 13) for loading and unloading is driven up and down. The carry-in region M1 is also a region in which the suspension substrate transport starts. In the area, the top surface of the platform is provided with a plurality of discharges for ejecting high-pressure positive air at a predetermined density. The function of the discharge port 88 is to enable the button to be used for the movement; Or to hide {^. In the inspection area 8, the base w float Ha does not require considerable precision. Just make sure it is within the range of 丄丄y丄 = 0~. Preferably, the size of the carry-in area 1 exceeds the size of the substrate G in the conveyance direction (x-axis direction). In addition, the center portion of the 76 portion is engraved with a 3 channel photoresist supply region or a coating region. The preparation substrate Git passes through the coating region (4), and is located at the upper portion of the photoresist liquid nozzle 78. The plate 5 supplies the photoresist R. In M3, the substrate_floating rib is = meaning: between the lower end of the photoresist liquid nozzle 78 (discharge port) and the top surface of the substrate (where =), the gap s can be, for example, (10) eggs. The gap s can be said to be an important parameter of the thickness of the left and right coating film and the consumption of the New Zealand (4), so it must be solidified and transferred to the density. Therefore, the air ejection outlet 88' is provided on the top surface of the platform of the coating area (4). Ejecting high pressure or wishing dust to shrink air to suspend the desired amount of suspension Hb of the substrate; and air adsorption port 9〇 for inhaling the gas at a negative pressure, and the two are arranged in a mixed configuration. It may be arranged, for example, in the configuration or distribution pattern of Fig. 6. Therefore, such a structure may pass through the portion of the coating region m3 (10) for the substrate G, except that the air is ejected from the air σ 88 to apply a vertical force to the compressed air, while Apply vertical force from the air adsorption port 9G with a negative pressure adsorption force The lower force is maintained in an equilibrium state by controlling the force of the two opposing forces. The suspension amount Hb for coating can be maintained at a set value Hs (for example, 5 〇em). In the conveying direction (X axis) In the direction), it is preferable that the size of the coating region 吣 is directly under the photoresist liquid nozzle 78 as long as the narrow coating gap S can be stably formed. Usually, the substrate is set to be larger than the substrate. The size of G is smaller, for example, about 1/3 to 1/4 of it. As shown in Fig. 6, in the coating region ,, the air ejection port 88 and the air suction port are alternately arranged on the straight line W. The predetermined inclination angle is set with respect to the substrate conveyance direction (the y-axis direction), and an appropriate offset amount (0ffset)a is set between the adjacent columns and at the pitch of the straight line. According to this arrangement, not only the mixing density of the air ejection port 88 and the air suction port 9〇 can be equalized, but also the substrate suspension force on the stage can be equalized, and the substrate G can be moved in the direction of 5 1 153 191 191 ( When the X-axis direction is moved, the time ratio with respect to the air ejection port 88 and the air suction port 90 is equal in each portion of the substrate. Therefore, it is possible to prevent the traces or transfer marks of the air ejection port 88 or the air suction port 9 from adhering to the coating film formed on the substrate. In the coating region_inlet, in order to stabilize the front end portion of the substrate G in the direction perpendicular to the remaining direction (the γ-axis direction) to obtain an equal levitation force, the preferred state is to increase the same direction (straight line ^ The density of the air ejection port 88 or the air adsorption port 9〇 disposed above. In addition, 'the same 'in the coating region M3' is on the edge of both sides of the platform 76 (straight line κ

In order to avoid drooping of the edge portions of both sides of the substrate G, it is preferable to arrange only the air ejection port 88. The intermediate area between the loading area 涂布 and the coating area 吣 is set to τ, and the position of the levitation height of the substrate , is changed from the floating amount Ha′ located in the loading $ or moved. The migration area of the suspended amount in the coating zone Μ3. In the migration zone, the top surface of the platform 76 may be mixed, and the air ejection port 88 and the air suction port 9 are placed. In this case, the density of the air absorbing air can be gradually increased along the conveying direction, and in this way, the substrate and the floating amount are gradually converted from jja to Hb. Alternatively, it is also possible to adopt a configuration in which only the air ejection port 90 is provided without providing the air suction port 90 in the migration region 沁. In the adjacent region 下游 at the downstream end of the coating region Μ3, the amount of suspension of the substrate G during the conveyance process is changed from the coating amount _ float amount Hb to the amount He for carrying out (for example, 1〇〇~i5〇) "m) migration area. In this migration zone, the air ejection port 88 and the air suction port 9〇 are mixed and disposed on the top surface of the platform 76. f In this case, Wei Wei's Wei Yan Lai Yun will gradually shrink. Alternatively, it is also possible to adopt a configuration in which the air suction port 9 不 is not provided, and only the air nozzle outlet is provided. Alternatively, as shown in FIG. 6, another preferred mode is the same as that of the coating zone 3, in the migration zone, in order to avoid the transfer of the liquid-repellent coating film formed on the substrate 6 Therefore, the air suction port 9〇 (and the air spray tip if) is disposed on a straight line of a predetermined oblique angle with respect to the conveyance mode (the x-axis direction) of the substrate. In the way of arranging the spacing between adjacent columns, 1323191 sets the appropriate offset; The area Ms at the downstream end (right side) of the platform 76 is a carry-out area. The substrate G subjected to the coating treatment by the photoresist coating unit (CT) 40 is transported to the downstream end by the transfer arm 74 (FIG. 3) from the predetermined position or the carry-out position in the carry-out area Ms. Drying unit (VD) 42 (Figure 3). In the carry-out area, a plurality of air ejection ports 88 are provided at a predetermined density on the top surface of the platform, and the air ejection ports 88σ are used to suspend the substrate G by the suspension amount He for carrying out; The platform 76 is unloaded and delivered to the transport arm 74 (Fig. 3) so that a plurality of lifts I 92 are provided between the original position below the platform '" and the round trip position above the platform. This lift pin 92 can be moved up and down and spaced apart from each other by a predetermined distance. These = 2 may be, for example, a pneumatic cylinder (not shown) or the like as a drive source, and may be driven up and down by the carry-out and lowering lift portion 91 (Fig. 13). The μ nozzle 78 is provided with a long nozzle body, and is provided with a nozzle support 130 capable of setting the plate 76 plate G from 1 to the other end so as to have a resisting liquid. And with the light from int) # 136,

As shown in Si guides and 2, the board conveying portion 84 includes a sliding member 98, which can be mounted on each of the guide rails 96 and a square (X-axis direction). The conveyance driving unit 100 extends the center portion of the type fixing platform 76 on which the sliding member 98 is linearly detached forward, and the 51 guide rails 96 are configured to convey the left and right side edge portions. ° The 〇 system consists of a linear forward drive mechanism, such as a line 17 1323191 motor. In addition, gj holding part 1G2 possessed: The company sucks 1〇r4, the back side of the left and right sides of G, with vacuum adsorption force in the independent ΐ r adsorption pad (10) and pad support ι〇6 === ====The substrate g remains stable. #也 w君卞/b 5 is further provided with a position sensor 122, and this position is

Measure the number of presets in the direction (10) direction. The position sensors 122 are exemplified by directly detecting the substrate G, or detecting and the substrate G as shown in FIGS. 7 and 8. In this embodiment, the dams 108 ΐ / Ϊ ίίΐ are mounted on the sliding member 98. The inside side. The pad driving device (pad milk (10) 13), which is mounted on the sliding member 98, for example, by pressing red, causes the material drop member (10) to record lower than the _ high position of the substrate G = the starting position (retracted position), And moving up and down with the position (joining position) of the suspension height position of the substrate G. The return of m is as shown in Fig. 9. Each of the individual adsorption 塾1〇4 is made of, for example, synthetic rubber, and is provided with a suction port 112 on the top surface of the pad body 110 in a straight cubic shape. The adsorption σ 112 may be a slit shape (sUtw elongated hole ' or a circular or square hole. Further, the adsorption pad 1〇4 is connected to the strip-shaped vacuum tube 114 formed of rubber. The tube rain passages 116 of the vacuum tubes 114 are respectively connected to the vacuum source of the pad adsorption control portion 115 (Fig. 13). In the holding portion 102, a vacuum adsorption pad 104 in a row as shown in Fig. 4 is preferably used. The pad support portion 106 is preferably a separate type provided in units of each group; or a completely independent type structure. However, an integral structure as shown in Fig. ίο can also be employed. 1323191 one plate spring provided with the notch portion 118 is formed as a one-side row of pad support portions 12A, and then a single-sided column of vacuum adsorption pads 104 is disposed above it. As described above, by the platform 76 A plurality of air ejection ports 88 formed by the top surface, and a compressed air supply device 146 (FIG. 11) for supplying compressed air for generating a suspension force to the air, and a coating area of the platform 76, Internal 'mixed with air outlet 88 The plurality of air suction ports 9〇, 2 8=f, the vacuum supply device supplied to the air adsorption ports 9=, the moving m Μι, and the carry-out area Μ5 are suitable for carrying in or loading In the coating area M3, a positive ()' is set to generate a set suspension amount Hs which can make the substrate 6 stable and correct, and the substrate is suspended. The true nozzle lifting mechanism 75, _ The air supply device 146, and the ίτίί;?" structure. The nozzle lifting mechanism 75 includes: a gate-shaped support [above the two sides Μ = Μ 3, to straddle the direction of the transport direction "axis side = set type erection; The linear motion mechanism is disengaged, the motion mechanism body 130, and the coupling rod 136 are coupled to the horizontal column-shaped horizontal support member 134 i3t78 ° , 132 of the staggered linear moving body (lifting body): the horizontal supporting member and the rotating force are The ball screw 140, the guiding member 142, and the supporting member 134 are integrally rotated to the side of the body of the lifting body, and can be moved up and down in the direction of the straight body. The same photoresist solution = 8 The 5 rotations of the Erda team 138 and the rotation stop position, The core control unit 144 is used to reduce the gravity of the supporting member 134 at both ends of the member 134 when the lifting movement from the new liquid nozzle is removed, as described later. Sit pressure piston rod 144a is used to assist in its high speed rise. This flat support member j rod 136, and the photoresist liquid nozzle 78 is directly bonded to the water 19 ':S) 1323191 in the path of the tube 94 'set with 8 open Consider the core or the suction valve. The valve 188 is composed of, for example, a total guide, or a viscous liquid supply pipe such as an injection pump (Plus qing~), including: a pump body 190 having a chestnut to arbitrarily; The piston 19 and the pump drive unit 194 for reciprocating the piston 192. In the middle of the heart test (CT) 4 structure 75, the platform substrate suspension portion 145, the transport drive (four) ο, = 4115, the 塾 drive device 109, the lifting lift pin lifting portion milk, the moving = lifting portion 91, etc. Operation and overall operation (sequence processing) In this embodiment, the photoresist liquid application unit (the coating of (7) 40, the 200 series is stored in a photoresist coating process such as a recording medium such as a disc, and the control has been performed. The stylized continuous coating process moves the new substrate G that has not been processed to the pin 86 of the platform 76 to receive the substrate g at the round-trip position. After the moving ancient household, the rear lift pin 86 is lowered. , the substrate G is lowered to the transport dry) 疋 疋 suspension position Ha (Fig. 5). Secondly, the aligning portion (not shown, its member from the four directions to the suspended substrate 6 is tared on the platform 76 Positioning. When the fresh portion is finished, ^ after the side edge portion of the substrate G, the alignment portion causes the pressing member to retreat to a certain position t S ) 1323191 as the second portion holds the holding portion 1G2 to fix the substrate G Side member 98 from the transport position to the transport direction (stage 76 When the direction of the front end of the substrate G is near _, the _ 卩 84 is the drum, and the nozzle hoisting _5 causes the photoresist nozzle 78 to be above. When the substrate G is stopped, the nozzle lifting mechanism 75 is actuated to make the photoresist liquid nozzle straight. When the distance between the nozzle discharge port and the substrate 6 or the gap S reaches the slave value (for example, 1Q) /Zm), == gate ίΤί, 170 is started from the photoresist liquid nozzle 78, and the silk liquid is discharged toward the top of the substrate G. At this time, the photoresist solution is completely blocked, and the nozzle discharges D and the substrate. In the case of G, it is better to start the discharge at the normal flow rate. The second stage of the substrate transport is carried out. In the second stage of transportation, the second and fourth substrates are transported, and the speed is selected. The lower speed of the predetermined speed 疋 is at a constant speed Vs, in the transport direction (in the direction of the x-axis, the strip-shaped photoresist liquid nozzle 78 is directed to the substrate G directly below, and the photoresist R is strip-shaped) Then, as shown in Fig. 14, the photoresist liquid coating film RM is bonded to the rear end side on the substrate G. Further, since the photoresist is blocked The spit_force of the nozzle 78 is increased to a high level, and the nozzle 78 passes through the passing point at the upstream end of the scanning (the center side of the substrate G), and only passes from the rear end Eg of the substrate G to the predetermined distance mountain ( For example, 1 〇 15 15 v at the time point ti, the controller 200 transmits a predetermined 22 S ′′ of the photoresist liquid supply device 17 使 to stop the spit (4) of the light 176. Then, the photoresist is turned off = the tube 94 The switch 188 is thin because of the slow reaction speed and the residual pressure. Therefore, the photoresist liquid nozzle 78 can only sustain the discharge pressure for a short time or the flow of the discharge flow is seven, and the discharge pressure of the photoresist liquid nozzle 78 is In the embodiment, in order to make the nozzle discharge pressure attenuate/f, the nozzle rise start point (6), and the conveyance speed starter, the time is moderately close to the phase, so Timing setting and adjustment. = (8) is shown as 'When the nozzle of the photoresist nozzle 78 passes through the sweep' and only passes from the rear end of the substrate & to a predetermined distance of 7 =:" △ at this point t2, the controller 2 is the first to make the photoresist The nozzle 78 is applied from this time until the end of the coating, at a predetermined speed (for example, (10) coffee/s) in the mechanism 75, in order to eliminate the horizontal support member 134 and the photoresist ί mouth by the air cylinder 144 Pushing from the bottom up on the side of the r weight = can be two and the photoresist nozzle (four) real move = r: T this = two pass = the established deceleration, that is, the negative acceleration (such as this = the mobile part can be A large negative acceleration causes the conveyance speed to be also = sweep = so that the rear end portion of the substrate G is subjected to the damping of the liquid-repellent liquid P and the liquid discharge pressure, and the deceleration motion of the liquid-liquid nozzle 78 The coating (overlap) in the time overlap (coincident) allows the coating of the photoresist to be completed without the ridges, with approximately == 23 . In this embodiment, the discharge port of the photoresist nozzle 78 in the conveyance direction (X-axis direction) reaches the end point & ' at the upstream end of the scanning and advances only from the predetermined position on the substrate, that is, the rear end EG of the substrate. At a predetermined distance mountain (for example, i at this point seven, the upward movement of the photoresist liquid nozzle 78 and the conveyance of the substrate G are finished (still). At the height position He of the end point & in the vertical direction, it is about 1 〇 According to the present invention, the discharge opening of the photoresist liquid nozzle 78 can be completed without being positioned further toward the downstream side than the rear end Eg of the substrate G. Further, the coating scan can be performed. The position of the end point & is set on the downstream side of the rear end of the substrate. Further, since the embodiment does not require the use of the suckback valve, it is possible to prevent air from entering the photoresist liquid nozzle 78 at the completion of the coating scan. After the above-described coating process is completed in the application region M3, the substrate g is transported to the carry-out region Ms. Here, the substrate transport portion 84 is switched to the third-stage substrate transport in which the transport speed is relatively fast. Then, when the substrate G reaches the conveyance end position in the carry-out area Ms, the substrate conveyance unit 84 stops the substrate conveyance in the third stage. Then, the supply of oxygen to the adsorption pad 104 is stopped, and the adsorption pad 1〇4 is removed from the substrate. The round-trip position (joining position) is lowered to the original position (retracted position) and separated from the end portions of the substrate. In contrast, the lift pin 92 is unloaded from the original position below the platform to the upper and lower positions of the platform in order to unload the substrate G. After the processing is performed, the transporter (that is, the transport arm 74) enters the carry-out area Ms, and the substrate G' is received from the lift pin 92 and transported to the outside of the stage 76. The board transport unit 84 Immediately after the substrate G is transferred to the lift pin 92, it is returned to the carry-in area 高速 at a high speed. In the carry-out area Ms, when the processed substrate G is carried out, it is carried out in the moving area, and the next to be coated. The processed new substrate G starts to be loaded, aligned, or transported. Here, the effect and effect in the description of this embodiment will be described in more detail with reference to Figs. Figure 16 is a diagram showing the secret (A) of moving the manning relative to the mouth G of the US G ^ photoresist (four) in the coating scan of this embodiment; The time characteristic 24 (8) of the discharge pressure of the nozzle 78 is oscillated on the same time-time axis. In the time characteristic (8) of the discharge pressure of the nozzle; the point tb is the discharge port of the photoresist liquid nozzle 78. The time point at which the liquid film of the photoresist R on the substrate G is completely separated (cut). From this point on, the force of the nozzle discharge is rapidly lowered, and the photoresist R does not flow out of the nozzle discharge port. It is shown that the discharge pressure of the seven-liquid nozzle 78 starts to attenuate from the time when the photoresist pump 176 is stopped by the passage of the point & On the other hand, in the case of a close relationship, the rise of the photoresist nozzle 78 is in the process of attenuating the discharge pressure of the nozzle 78, and (2) the retardation of the photoresist nozzle 78 (the vertical 31 (3) scanning speed is extremely important. Because of the completeness of the three, as shown in (4), due to the end of the coating scan; ^2 (3) = the speed _ applied in the == drawing direction is lowered, and =, the photoresist can be moved from the substrate G. ' 继继生. Therefore': cloth film coating scan _ part; ° = 卜 substrate map = area is the product on the substrate G (formation of the magic of the ginseng will be on the i = but in the actual application ' still have to After obtaining the following surnames. ^ After repeated experiments and studies, at the end, when the moving speed of each pick is a fixed value (fixed value), when the film thickness profile of the coating film RM = axis square:; =: Influence; and in the direction perpendicular to the coating scanning direction, in the coating scanning direction, the stop point of the photoresist stop point L

25 S 1323191 If the position of the passing point X is farther away from the rear end of the substrate 2, the thickness of the diffusing film T becomes thicker, and it becomes easier to adjust to the direction of the direction. The t-gate of the photoresist liquid nozzle 78 is appropriately adjusted in the horizontal direction perpendicular to the coating scanning direction, and the rf of the point t3 at the start of the same direction ===== can be made by =τ. At the beginning, the point t2 and the horizontal scanning deceleration (6) are more limited than the latter (ί2')^ has a time-relationship between the front and the back. It can also make the former part of the remaining i (4) to the effect of the paste and paste, because the photoresist will be set to t The upstream end is made to be located further inside than the rear end Ec of the substrate (in the reference example, 'when the discharge σ of the photoresist liquid 78 is separated from the light 26 on the substrate G 丄丄 the liquid-repellent coating film RM') due to the photoresist liquid The coating film has a large follow-up speed, and the rising angle of the photoresist liquid nozzle 78 is small. Therefore, as shown in Fig. 22, the separation speed of the photoresist liquid is slow, so that it is easy to cause the photoresist liquid coating as shown in Fig. 23. The case where the membrane cyst protrudes in the direction in which the photoresist nozzle is separated. More specifically, as shown in FIG. 24 and FIG. At the left and right ends of the base correction, the photoresist coating film will protrude at the portion near the center of the sin. In addition, as shown in Fig., the end portion of the liquid-repellent coating film is unstable, so that unevenness is likely to occur. In addition, FIG. 25 is a cross-sectional view of the Α-Λ line in FIG. 24. In view of the above-mentioned reference example or comparative example, it is known that the start position of the present invention is set on the sweeping _, In the embodiment, the loading area is applied to the platform 76, and the cymbal is carried out; 5 are arranged in a line, and the substrate is sequentially transferred and the substrate is unloaded. The time it takes to move from the loading station to the loading area 3 °76 from the loading area to the area of the loading area ^ΐϋ): and the time required to move out of the moving out area - α + ΤΐΝ + ν) 4; ί = Jue, - The required spray pattern of the fine cloth shield ring is the air body pressure placed on the top surface of the platform 76, so that the base (four) floats in the air, and the side ii nozzle 78 is transported to the base '^ Static long strip of photoresist can be easily and efficiently In the trend of thick and thick, the present invention still has a nozzle 78 disposed on the nozzle, and moves the light-weight liquid nozzle 78 in a horizontal direction U-axis by means of (4) a larger weight of the filament-shaped photoresist liquid spray direction) The relative water 27 is applied to the substrate G at a time point when the coating of the 3191 coating is completed, and the large deceleration rate (negative acceleration) performed by the present invention can be performed at a high speed. This scanning starts the Wei point, and the photoresist liquid nozzle 78 is raised and moved on the substrate G to the lifting mechanism 75, and the electric motor 138 is used in combination with the rising angle; the speed is increased by the crane, so the rising speed of the comparison A can be set.乃非旋====! The suspension of the form is applied, and the substrate is fixed on the platform of the mounting type. The substrate is fixed horizontally by μ mu; ^ ΐ ΐ ΐ 长 长 长 长 长 长 长 长 长 长 ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ In the non-related coating and developing treatment system for the photoresist to be sprayed in a strip shape, the cloth is disposed at two: only the hair: month can be applied to the coated substrate on the substrate to be processed, y, this ^ Therefore, the treatment liquid of the present invention may be used as a treatment liquid of the present invention, such as an interlayer insulating material, a dielectric material, a wiring board, or a cleaning liquid. A circular substrate, a CD substrate, a glass substrate 11 for a flat display, a semiconductor crystal, a substrate, a photomask, a printed substrate, etc. Fig. 1 is a plan view showing a structure of a coating and developing treatment system to which the present invention is applicable. Li Cheng Lin Mingzhi - the place in the coating development processing system of the embodiment In the embodiment of the present invention, the entire structure of the photoresist liquid coating unit is in the embodiment of the photoresist liquid coating unit. In the plate coating area in the coating unit, the arrangement pattern of the air suction port of the nozzle is a top view of an example. Part of "Sit describes the structure of the substrate carrying portion in the photoresist coating unit. Adsorption of the substrate transporting unit [in the inside of the liquid-repellent coating unit in which the portion of the substrate transporting portion in the photoresist coating unit is superimposed, the substrate transporting portion is held in the photoresist liquid-coating unit, Structure drawing of nozzle riding mechanism, pressure, work supply/device, and vacuum supply device. Structural health 7 ^ in the above-mentioned photoresist recording single (four) towel, the structure of the level of the device is the filament of the above-mentioned New Zealand cloth unit (four), control · _ main junction side line shows the invention - in the embodiment, the coating scan The point-to-point diagram i5piAilci shows a side view of the action of each stage of the coating scan in one embodiment of the present invention. ^ At the time when each of the four (four)--------------------------------------------------------------------------------------------------------------------------------------------------------------- A side view of the action of separating the first liquid-repellent film on the discharge port of the nozzle of the present invention, which is shown in the present invention. The liquid coating lai+, the photoresist on the wire-cutting axis is applied to the photoresist, and the photoresist formed on the substrate is shown in Fig. 2. Fig. 2 is a cross-sectional view taken along line a-A of Fig. 19. 29 1323191 Fig. 21 is a view showing a comparison display on the same time axis at the end of the coating scan in the reference example. Fig. 22 is a side view showing the action of the discharge liquid film of the photoresist liquid nozzle in the reference example in the reference example. The end of the photoresist on the turbulent board includes the ginseng phase + ‘in the end of the wire on the silk 卿 触 臈 臈 转 转 转 转 转 , , , , , , , , , , , , , , , , , ,

Figure 25 is a cross-sectional view taken along line A-A of Figure 24. [Description of main component symbols] 10~Substrate cassette station (C/S) 12~ Processing station (p/s) 14~Interface (I/F) 16~匣Platform 17~Transportation path 19~Transportation path 20~ Transport device 22 to cleaning processing unit 23 to substrate transfer unit 24 to coating processing unit (p/s) 25 to chemical liquid supply unit 26 to development processing unit 27 to space 28 to scrubber cleaning unit (SCR) 30 to ultraviolet irradiation/ Cooling unit (UV/COL) 32~heating unit (HP) 34~cooling unit (c〇L) 36~transporting path 1323191 38~transporting mechanism 40~ photoresist liquid coating unit (CT) 42~ decompression drying unit (VD 46~ Attachment/Cooling Unit (AD/COL) 48~ Heating/Cooling Unit (HP/COL) 50~ Heating Unit (HP) 51~Transportation Path 52~Development Unit (DEV) 53~Heating/Cooling Unit (HP/ COL) 54 to transport mechanism 55 to heating unit (HP) 56 to extension (substrate transfer unit) 57 to buffer transfer platform 58 to transport path 59 to transport device 60 to transport mechanism 70 to support table/support frame 72 to guide track 74~Transport arm 75~Nozzle lift mechanism 76~Platform 78~Photoresist liquid nozzle 80~Under chamber 82~Platform 83~Exhaust 84 to the substrate transporting portion 85 to the loading/unloading lift pin lifting portion 86 to the lift pin 88 to the air discharge port 31 1323191 90 to the air sucking port 91 to the carry-out lift pin lifting portion 92 to the lift pin 94 to the photoresist liquid supply pipe 96 to Guide channel 98 to slide member 100 to transport drive unit 102 to hold unit 104 to vacuum suction pad 106 to pad support portion 108 to pad lift member 109 to pad drive device 110 to pad body 112 to suction port 114 to vacuum tube 115 to pad Adsorption control unit 116 to tubular passage 118 to notched portion 120 to pad support portion 122 to position sensor 130 to nozzle support 132 to vertical linear motion mechanism 134 to horizontal support member 136 to joint rod 138 to electric motor 142 to guide member 144· empty cylinder 144a to piston rod 145 to platform substrate floating portion 32 1323191 146~ compressed air supply device 148 to vacuum supply device 150 to positive pressure manifold 152 to compressed air supply source 154 to compressed air supply pipe 156 to 160 to vacuum source 162 to vacuum tube 164 to throttle valve 170 to photoresist liquid supply device 172 to liquid storage bottle 174 to suction tube 176 to photoresist spring 178 to gas delivery Tube 180 to opening and closing valve 182 to filter element 184 to degassing module 186 to opening and closing valve 188 to opening and closing valve 190 to pump body 192 to piston 194 to pump driving unit 200 to controller C to S box di, d2, d3, d4 Established distance E~ straight line

Eg ~ substrate back end

Ha, Hb, He~ suspension

He~height position 33 1323191

Hs~mounting amount G~substrate 〜ι~ carry-in area M2~migration area M3~application area M4~migration area Μδ~ carry-out area R~ photoresist liquid RM~ photoresist liquid coating film S~ gap h~ stop point t2~rise start Time point t3 to horizontal scanning deceleration start point ta to time point tb to time point (t2) to nozzle raising start point (t3) to the conveyance speed start deceleration point Vs to speed W to straight line

Xl, X2, X3~ pass point χ4<^ coating scan end point α~offset /5~offset amount X. Patent application scope: 1. A coating device characterized by: 34

Claims (1)

1323191 Hs~mounting amount G~substrate 〜ι~ carry-in area M2~migration area M3~application area M4~migration area Μδ~ carry-out area R~ photoresist liquid RM~ photoresist liquid coating film S~ gap h~ stop point t2~rise From the start point t3 to the horizontal scanning deceleration start point ta to the time point tb to the time point (t2) to the nozzle rise start point (t3) to the conveyance speed start deceleration point Vs to the speed W to the straight line X1, X2, X3 to the point χ4<^ coating Scanning end point α~offset /5~offset amount ten, patent application scope: 1. A coating device characterized in that: 34 1323191 is held in a state of being substantially horizontal in the coating area a strip nozzle 'for discharging a gap of the treatment liquid from the top surface of the substrate in the coating zone, a processing liquid supply source for sending the treatment hydraulic pressure to the nozzle; and a scanning portion' for Moving the nozzle in a horizontal direction relative to the substrate in the coating region; and elevating portion for 'moving the nozzle in a wrong direction with respect to the substrate in the coating region; a control unit configured to control the processing liquid supply source to stop being pumped to the nozzle when the nozzle passes the first passing point set on the substrate; the nozzle passes through the substrate Controlling the lifting portion so that the nozzle moves relatively upward with respect to the substrate at a predetermined speed from the time when the point is set to the end of the scanning; the nozzle is set in advance on the substrate The scanning unit is controlled so that the nozzle faces the horizontal moving speed 相对 with respect to the substrate from the time point of the third passing point until the end of scanning. 2. The coating device of claim 1, wherein the substrate support portion has a platform for suspending the substrate in the air in the coating region. The coating device of claim 2, wherein in the coating region, a plurality of nozzles for injecting gas and a suction port for sucking gas are mixed and arranged on a top surface of the platform. . 4. The coating device of claim 2, wherein the nozzle is disposed at a predetermined position fixed in a horizontal direction in the coating region; and the scanning portion has a substrate carrying portion for being placed on the platform The substrate in a suspended state is conveyed toward a predetermined transport direction corresponding to the horizontal movement so as to pass through the positive side of the nozzle. 5. The coating device of claim 4, wherein the substrate carrying portion has: ° 35 s S; one side I extends parallel to the moving direction of the substrate, and the platform is disposed to move along the material path And; 邛 'used to drive the sliding member along the guiding track to move = the center of the table extends' and can be loaded and unloaded by the lifting of the patent range of items 1 to 5 a coating device, wherein: the support portion holds the nozzle; the first ancient drive device' is combined with the nozzle support portion to make the nozzle from any arbitrary degree The height position is moved up and down; and the weight of the nozzle is removed to be combined with the nozzle support. The state of the coating method is such that the top surface of the substrate to be processed is substantially horizontally opposed to the discharge port of the long fine nozzle, and the treatment liquid is used to treat the nozzle from the treatment liquid. Scanning with respect to the water 7 to form a coating film of the processing liquid on the substrate, the coating method comprising the steps of: the first step 2: the nozzle passes through the first pass point set on the substrate At 1 o'clock, the processing liquid is stopped from being sent to the nozzle from the processing liquid supply source; in the second step, the nozzle passes through the second time point of the second passing point set on the substrate until the end of the scanning. Moving the nozzle upward with respect to the substrate at a predetermined speed; and '^3rd step' from the nozzle through the 3rd point of the third passing point set on the substrate until the end of the scanning, The relative movement speed of the nozzle relative to the substrate in the horizontal direction is slowed down. 8. The coating method according to claim 7, wherein the coating film in the vicinity of the end portion of the substrate is adjusted by adjusting the positions of the first passing point, the second passing point, and the third passing point The film thickness profile is optimized. 36 1323191 9. The coating method according to claim 7 wherein, at 2 o'clock, at 3 o'clock, the first film thickness profile is optimized at the end of the substrate. Further, the film 10 is as claimed. The coating method according to any one of items 7 to 9, wherein the discharge pressure of the nozzle is reversed after the passage of the predetermined delay from 1 o'clock; in the depression of the discharge pressure, the nozzle is upward with respect to the substrate The movement of the movement is simultaneously performed with the deceleration of the horizontal movement. Among them, 11. The coating method according to any one of claims 7 to 9 wherein the negative acceleration of the deceleration caused by the movement of the nozzle relative to the horizontal direction of the substrate is β. 12. The coating method according to any one of the items 9, wherein the nozzle is moved upward with respect to the substrate, and is performed at a substantially constant speed. The coating method according to any one of claims 7 to 9, wherein when the nozzle reaches the 4th point of the predetermined scanning end point, the relative horizontal movement and the rising movement of the nozzle relative to the substrate are about At the same time. The coating method according to any one of claims 7 to 9, wherein, at the end of the scanning, the discharge port of the nozzle is located closer to the inner side of the substrate than the rear end of the substrate. The coating method according to any one of claims 7 to 9, wherein the nozzle is fixed at a certain position in the scanning direction to horizontally move the substrate. The coating method of claim 15, wherein the substrate is horizontally moved while suspending the substrate in the air on a floating platform that imparts a vertical upward gas pressure. The coating method of claim 15, wherein the nozzle is left in the vertical direction, and the nozzle is held at a predetermined reference height position from the start of scanning to the third time point 'the nozzle is made from the third time point Move up at a given speed. XI. 囷: 37