JP4130058B2 - Application method - Google Patents
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- JP4130058B2 JP4130058B2 JP2000309329A JP2000309329A JP4130058B2 JP 4130058 B2 JP4130058 B2 JP 4130058B2 JP 2000309329 A JP2000309329 A JP 2000309329A JP 2000309329 A JP2000309329 A JP 2000309329A JP 4130058 B2 JP4130058 B2 JP 4130058B2
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- slit nozzle
- coating
- plate
- pump
- coating liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/005—Curtain coaters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2203/00—Other substrates
- B05D2203/30—Other inorganic substrates, e.g. ceramics, silicon
- B05D2203/35—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2252/00—Sheets
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は板状被処理物の表面に対しスリットノズルを用いて塗膜を形成する塗布方法に関する。
【０００２】
【従来の技術】
ガラス基板などの板状被処理物の表面に、塗布液の無駄を生じないように均一な塗膜を形成する方法として、米国特許第4,938,994号公報に開示されるようなスリットノズルを用いた方法がある。
【０００３】
この方法は、板状被処理物の表面とスリットノズルとの間に所定のギャップを設け、この状態でポンプを駆動してスリットノズル下端から板状被処理物の表面に向けて塗布液を供給するとともに、スリットノズルを板状被処理物に対して相対的に水平移動せしめて、板状被処理物の表面に塗布液の層（以下、ウェット塗膜と称する）を形成するものである。そして、ウェット塗膜の厚みは塗布液の供給量とスリットノズルの相対的な移動速度によって決定され、一般には８μｍ前後である。また、これに対しスリットノズルと板状被処理物の表面とのギャップは２００μｍ程度とされている。
【０００４】
また、上述したスリットノズルを用いた塗布方法において、塗布開始からいきなりスリットノズルの相対移動を行うと、未だ、スリットノズルの全長に亘ってスリットノズルと板状被処理物の表面との間が塗布液で連続していない状態、換言すれば、スリットノズルと板状被処理物の表面との間に途切れ途切れで塗布液が存在している状態で、スリットノズルの相対移動が開始することになり、ウェット塗膜が筋状になってしまう。そこで、塗布開始からいきなりスリットノズルの相対移動を行わず、塗布開始位置でスリットノズルを停止させ、この状態でスリットノズルから塗布液を供給し、スリットノズルと板状被処理物の表面との間のギャップ（約２００μｍ）が塗布液で連結された後に、スリットノズルの相対移動を開始するようにしている。
【０００５】
しかしながら、塗布開始位置での塗布液の不連続を回避するため約２００μｍのギャップを塗布液で連結した後、スリットノズルを相対移動せしめて、８μｍ程度の厚さのウェット塗膜を形成すると、塗布開始位置におけるウェット塗膜の厚さが他の部分に比べ異常に厚くなってしまう。同様に塗布終了位置においてもスリットノズルを停止し、この状態でスリットノズルと板状被処理物の表面との間の塗布液は連続しているので、この連続を断つとそのまま塗布液は落下し、塗布終了位置におけるウェット塗膜の厚さが他の部分に比べ異常に厚くなってしまう。
【０００６】
塗布開始位置或いは塗布終了位置におけるウェット塗膜の厚膜化を改善する提案として、特開平９−２５３５６３号公報および特開平８−２２９４９７号公報がある。
【０００７】
特開平９−２５３５６３号公報は、塗布開始位置における厚膜化を改善する提案であり、ポンプからの吐出レートとスリットノズルの相対移動速度を同調させて、板状被処理物の表面に徐々にウェット塗膜を形成するというものである。
【０００８】
特開平８−２２９４９７号公報は、塗布終了位置における厚膜化を改善する提案であり、塗布終了位置において、ポンプを逆回転せしめてスリットノズルにより余分な塗布液を吸引するというものである。
また、塗布終了位置における厚膜化を防止する他の方法として、塗布終了位置の手前で塗布液の供給を停止し、スリットノズルのみを相対移動せしめることも行われた。
【０００９】
【発明が解決しようとする課題】
特開平９−２５３５６３号公報に開示される方法を実施するには、極めて正確に且つ細かくポンプの吐出レート及びスリットノズルの相対移動速度をコントロールできることが前提となるが、現実には困難である。
【００１０】
また、塗布開始位置において、スリットノズルと板状被処理物との間のギャップを一旦塗布液で連結することなく塗布を開始するため、スリットノズルと板状被処理物との間隔を目標ウェット膜厚（８μｍ程度）としてスリットノズルを相対移動させなければならない。しかしながら、使用部品の加工精度や組付け精度を考慮すると極めて困難である。
【００１１】
特開平８−２２９４９７号公報に開示される方法では、塗布液を吸引することによって、スリットノズルと板状被処理物表面との間に連続して存在していた塗布液がノズル側の塗布液と、板状被処理物側の塗布液に切断され、板状被処理物側の塗布液はそのまま取り残されるので、吸引しない場合よりは厚膜化は改善されるが、十分に改善することにはならない。
【００１２】
また、塗布終了位置の手前で塗布液の供給を停止し、スリットノズルのみを相対移動せしめる方法では、ウェット塗膜のうち膜厚が不足する部分が多くなってしまう。
【００１３】
【課題を解決するための手段】
請求項１に記載した本願発明は、板状被処理物の表面に対し、スリットノズルを相対的に水平移動しつつポンプを駆動して塗布液を供給するようにした塗布方法において、塗布開始位置でスリットノズル下端を板状被処理物の表面に接触しない範囲で接近せしめ、この状態でポンプを正回転させてスリットノズル下端と板状被処理物の表面との間を塗布液で連結せしめ、次いで、スリットノズルを塗布液の連続性を切断しない範囲で相対的に上昇せしめ、引き続いてポンプを正回転させるとともにスリットノズルを相対的に水平移動しつつ塗布液を供給し、更に塗布終了位置または塗布終了位置直前でスリットノズルを相対的に下降させつつポンプを逆転させて塗布液を吸引するようにした。
【００１４】
塗布開始位置でスリットノズル下端を板状被処理物の表面に接近せしめる目安としては、目標ウェット膜厚の２〜７倍が適当である。板状被処理物の表面の凹凸を考慮すると、スリットノズル下端と板状被処理物表面との間隔は目標ウェット膜厚の２倍以上とすべきであり、逆に、あまりギャップを大きくすると当該ギャップに保持される塗布液の量が多くなり、塗布開始位置での厚膜化につながるので目標ウェット膜厚の７倍以下とするのが好ましい。
【００２０】
請求項２に係る発明は、前記ポンプからの塗布液の吐出量が定常レートに達する前にスリットノズルの相対速度が定常速度に達するようにした
【００２１】
ここで、定常レートとは所定時間経過後に達する吐出量の最大値を指し、定常速度とは所定時間経過後に達する相対移動速度の最大値を指す。
【００２２】
【発明の実施の形態】
以下に本発明の実施の形態を説明する。図１（ａ）〜（ｅ）は第１発明に係る塗布方法を説明した図であり、先ず（ａ）に示すように、塗布開始位置でスリットノズル下端を板状被処理物の表面に接近せしめる。
具体的には目標ウェット膜厚の２〜７倍とする。例えば目標ウェット膜厚が８μｍの場合には、塗布開始位置における最初のギャップは１６〜５６μｍとする。
【００２３】
次いで、ポンプを駆動しスリットノズル下端から板状被処理物の表面に塗布液を供給する。この供給により（ｂ）に示すように、スリットノズル下端と板状被処理物の表面との間のギャップに塗布液が連結される。即ち、スリットノズルの長さ方向に沿った板状被処理物の表面との間のギャップは隙間なく塗布液が連結され表面張力によりその状態が維持される。
【００２４】
次いで、次の（ｄ）工程に進んでもよいが、（ｃ）に示すように、スリットノズルからの塗布液の流下速度よりも早い速度でスリットノズルを相対的に若干上昇せしめる。具体的な上昇量としては、板状被処理物の表面からウェット膜厚の１５〜３０倍程度とすることが好ましい。
このように、スリットノズルを相対的に上昇せしめることで、塗布開始位置に保持されていた塗布液の一部がスリットノズルとともに引き上げられる。
【００２５】
引き続いて、（ｄ）に示すように、スリットノズルを相対的に水平移動しつつ塗布液を供給することで、板状被処理物の表面に８μｍ程度のウェット塗膜を形成する。
【００２６】
そして、板状被処理物の表面との間隔をウェット膜厚の１５〜３０倍程度に保った状態で、スリットノズルが塗布終了位置まで相対移動してきたら、スリットノズルの相対移動を停止し、次いで、（ｅ）に示すように、スリットノズルを相対的に下降せしめる。そして、この下降と同時にポンプを逆回転せしめ、塗布終了位置において、板状被処理物の表面との間に存在する塗布液をスリットノズルから吸引する。
【００２７】
図２（ａ）〜（ｄ）は第２発明に係る塗布方法を説明した図であり、先ず（ａ）に示すように、塗布開始位置でスリットノズル下端を板状被処理物の表面に接近せしめ、次いで（ｂ）に示すように、スリットノズル下端と板状被処理物の表面との間のギャップに塗布液を連結する。ここまでは第１発明と同じである。
【００２８】
次いで、（ｃ）に示すように、ポンプを逆回転させてスリットノズル下端と板状被処理物の表面との間に連結した塗布液のうち余分な量を塗布液の連続性を切断しない範囲で吸引し、スリットノズルと板状被処理物の表面との間隔をウェット膜厚の２〜７倍程度に維持したままスリットノズルを相対的に水平移動しつつ塗布液を供給することで、（ｄ）に示すように板状被処理物の表面に８μｍ程度のウェット塗膜を形成する。
【００２９】
図３は第３発明に係る塗布方法を説明した図であり、第３発明にあっては、先ず（ａ）に示すように、塗布開始位置でスリットノズル下端を板状被処理物の表面に接近せしめ、次いで（ｂ）に示すように、スリットノズル下端と板状被処理物の表面との間のギャップに塗布液を連結する。ここまでは第１発明及び第２発明と同じである。
【００３０】
次いで、（ｃ）に示すように、ポンプを逆回転させてスリットノズル下端と板状被処理物の表面との間に連結した塗布液のうち余分な量を塗布液の連続性を切断しない範囲で吸引しつつ、（ｄ）に示すように、スリットノズルを相対的に板状被処理物の表面からウェット膜厚の１５〜３０倍程度まで上昇せしめ、引き続いて、（ｅ）に示すように、スリットノズルを相対的に水平移動しつつ塗布液を供給することで、板状被処理物の表面に８μｍ程度のウェット塗膜を形成する。
【００３１】
図４は第４発明に係る塗布方法を説明した図であり、第４発明には、（ａ）〜（ｅ）に示す工程は第３発明と同様であるが、最終工程において（ｅ）に示すようにスリットノズルを相対的に下降せしめ、この下降と同時にポンプを逆回転せしめ、塗布終了位置において、板状被処理物の表面との間に存在する塗布液をスリットノズルから吸引する。
【００３２】
図５は第５発明に係る塗布方法を説明した図であり、第５発明にあっては、前記第１〜第４発明と同様に、塗布開始位置でスリットノズル下端を板状被処理物の表面に接近せしめる。この時点をスタート時点とし、このスタート時点からポンプを駆動し、徐々にポンプの吐出レートを上げつつスリットノズル下端と板状被処理物の表面との間のギャップに塗布液を連結する。
【００３３】
そして、スタートから０．２０秒経過した時点でスリットノズルを相対的に上昇せしめてスリットノズル下端と板状被処理物の表面との間隔をウェット膜厚の１５〜３０倍程度とする。この間もポンプの吐出レートは徐々に上昇している。
【００３４】
そして、スリットノズルの上昇を停止すると同時にスリットノズルを取り付けているシャトルを板状被処理物の表面と平行に相対水平移動を開始する。
【００３５】
スリットノズルはスタートから０．２秒後に相対移動を開始しその速度は徐々に上昇して、スタートから０．７５秒で定常速度に達し以後は塗布終了位置の直前まで同一速度で相対移動する。
一方、ポンプの吐出レートも前記に引き続いて徐々に上昇し、スタートから０．９５秒で定常レートに達し以後は塗布終了位置の直前まで同一レートが維持される。
【００３６】
このように、ポンプの吐出量が定常レートに達する前に、スリットノズルの相対移動速度を定常速度にすることで、スリットノズル下端と板状被処理物の表面との間のギャップに連結した塗布液が塗布開始位置に残っても、その後の移動開始直後のポンプからの塗布液の供給量が相対速度に対して少ないため、厚膜化の範囲を狭くできる。
【００３７】
【発明の効果】
以上に説明したように第１発明によれば、塗布開始位置において、例えばスリットノズルからの塗布液を板状被処理物の表面との間に連結せしめ、次いでスリットノズルを相対的に水平移動しつつ塗布液を供給し、塗布終了位置または塗布終了位置直前でスリットノズルを相対的に下降させつつポンプを逆回転させて塗布液を吸引するようにしたので、塗布開始位置及び塗布終了位置でのウェット塗膜の厚膜化を改善することができる。
【００３８】
第２発明及び第３発明によれば、塗布開始位置において、ポンプを逆回転させてスリットノズル下端と板状被処理物の表面との間に連結した塗布液のうち余分な量を吸引するようにしたので、塗布開始位置でのウェット塗膜の厚膜化を改善することができる。
【００３９】
第４発明によれば、第２、第３発明に加えるに塗布終了位置での厚膜化も改善することができる。
【００４０】
第５発明によれば、ポンプからの塗布液の吐出量が定常レートに達する前に、スリットノズルの相対的移動速度が定常速度に達するようにしたことで塗布開始位置でのウェット塗膜の厚膜化を改善することができる。
【図面の簡単な説明】
【図１】（ａ）〜（ｅ）は本願の第１発明に係る塗布方法を説明した図
【図２】（ａ）〜（ｄ）は本願の第２発明に係る塗布方法を説明した図
【図３】（ａ）〜（ｅ）は本願の第３発明に係る塗布方法を説明した図
【図４】（ａ）〜（ｅ）は本願の第４発明に係る塗布方法を説明した図
【図５】本願の第５発明に係る塗布方法を説明したグラフ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a coating method for forming a coating film on a surface of a plate-like workpiece using a slit nozzle.
[0002]
[Prior art]
A method using a slit nozzle as disclosed in US Pat. No. 4,938,994 as a method of forming a uniform coating film on the surface of a plate-like object such as a glass substrate so as not to waste coating liquid There is.
[0003]
In this method, a predetermined gap is provided between the surface of the plate-like workpiece and the slit nozzle, and in this state, the pump is driven to supply the coating liquid from the lower end of the slit nozzle toward the surface of the plate-like workpiece. At the same time, the slit nozzle is moved horizontally relative to the plate-like workpiece to form a coating liquid layer (hereinafter referred to as a wet coating) on the surface of the plate-like workpiece. The thickness of the wet coating film is determined by the supply amount of the coating liquid and the relative moving speed of the slit nozzle, and is generally about 8 μm. On the other hand, the gap between the slit nozzle and the surface of the plate-like workpiece is about 200 μm.
[0004]
In addition, in the coating method using the slit nozzle described above, if the relative movement of the slit nozzle is performed suddenly from the start of coating, the gap between the slit nozzle and the surface of the plate-like workpiece is still applied over the entire length of the slit nozzle. The relative movement of the slit nozzle starts in a state where the liquid is not continuous, in other words, the coating liquid is present between the slit nozzle and the surface of the plate-like workpiece. The wet paint film becomes streaked. Accordingly, the relative movement of the slit nozzle is not performed suddenly from the start of application, the slit nozzle is stopped at the application start position, and the coating liquid is supplied from the slit nozzle in this state, and the gap between the slit nozzle and the surface of the plate-shaped object to be processed is set. After the gap (about 200 μm) is connected with the coating liquid, the relative movement of the slit nozzle is started.
[0005]
However, in order to avoid discontinuity of the coating solution at the coating start position, after connecting the gap of about 200 μm with the coating solution, the slit nozzle is moved relatively to form a wet coating film having a thickness of about 8 μm. The thickness of the wet coating film at the start position becomes abnormally thick compared to other parts. Similarly, the slit nozzle is also stopped at the coating end position, and since the coating liquid between the slit nozzle and the surface of the plate-like object is continuous in this state, the coating liquid falls as it is when this continuation is interrupted. The thickness of the wet coating film at the application end position becomes abnormally thick compared to other portions.
[0006]
JP-A-9-253563 and JP-A-8-229497 disclose proposals for improving the thickening of the wet coating film at the application start position or the application end position.
[0007]
Japanese Patent Laid-Open No. 9-253563 is a proposal for improving the film thickness at the coating start position, and by gradually synchronizing the discharge rate from the pump with the relative movement speed of the slit nozzle, the surface of the plate-like workpiece is gradually increased. It forms a wet paint film.
[0008]
Japanese Patent Laid-Open No. 8-229497 is a proposal for improving the film thickness at the coating end position, and at the coating end position, the pump is rotated in the reverse direction to suck excess coating liquid through the slit nozzle.
In addition, as another method for preventing the thickening at the application end position, the supply of the application liquid is stopped before the application end position, and only the slit nozzle is relatively moved.
[0009]
[Problems to be solved by the invention]
In order to carry out the method disclosed in Japanese Patent Laid-Open No. 9-253563, it is premised that the discharge rate of the pump and the relative movement speed of the slit nozzle can be controlled very accurately and finely, but it is actually difficult.
[0010]
In addition, at the coating start position, coating is started without once connecting the gap between the slit nozzle and the plate-like object to be treated with the coating liquid. The slit nozzle must be moved relative to the thickness (about 8 μm). However, it is extremely difficult considering the processing accuracy and assembly accuracy of the parts used.
[0011]
In the method disclosed in Japanese Patent Application Laid-Open No. 8-229497, the coating liquid that has been continuously present between the slit nozzle and the surface of the plate-like object is sucked by sucking the coating liquid. Then, it is cut into the coating liquid on the plate-like workpiece side, and the coating liquid on the plate-like workpiece side is left as it is, so that thickening is improved than when not sucked, but it is sufficiently improved Must not.
[0012]
Further, in the method in which the supply of the coating liquid is stopped before the coating end position and only the slit nozzle is relatively moved, a portion of the wet coating film where the film thickness is insufficient increases.
[0013]
[Means for Solving the Problems]
The present invention described in
[0014]
As a standard for bringing the lower end of the slit nozzle closer to the surface of the plate-like workpiece at the application start position, 2 to 7 times the target wet film thickness is appropriate. Considering the unevenness of the surface of the plate-like object to be processed, the distance between the lower end of the slit nozzle and the surface of the plate-like object to be processed should be more than twice the target wet film thickness. Since the amount of the coating liquid held in the gap increases and leads to a thick film at the coating start position, it is preferable to set the target wet film thickness to 7 times or less.
[0020]
The invention according to claim 2 is such that the relative speed of the slit nozzle reaches the steady speed before the discharge amount of the coating liquid from the pump reaches the steady rate.
Here, the steady rate refers to the maximum value of the discharge amount reached after the lapse of a predetermined time, and the steady speed refers to the maximum value of the relative movement speed reached after the lapse of the predetermined time.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below. FIGS. 1A to 1E are views for explaining a coating method according to the first invention. First, as shown in FIG. 1A, the lower end of the slit nozzle approaches the surface of the plate-like workpiece at the coating start position. Let me.
Specifically, it is 2 to 7 times the target wet film thickness. For example, when the target wet film thickness is 8 μm, the initial gap at the coating start position is 16 to 56 μm.
[0023]
Next, the pump is driven to supply the coating liquid from the lower end of the slit nozzle to the surface of the plate-like workpiece. By this supply, as shown in (b), the coating liquid is connected to the gap between the lower end of the slit nozzle and the surface of the plate-like workpiece. That is, the gap between the slit nozzle and the surface of the plate-like object to be processed is connected to the coating liquid without any gap, and the state is maintained by the surface tension.
[0024]
Next, the process may proceed to the next step (d), but as shown in (c), the slit nozzle is relatively slightly raised at a speed higher than the flow speed of the coating liquid from the slit nozzle. The specific amount of increase is preferably about 15 to 30 times the wet film thickness from the surface of the plate-like workpiece.
Thus, by raising the slit nozzle relatively, a part of the coating liquid held at the application start position is pulled up together with the slit nozzle.
[0025]
Subsequently, as shown in (d), a wet coating film of about 8 μm is formed on the surface of the plate-like workpiece by supplying the coating liquid while moving the slit nozzle relatively horizontally.
[0026]
And when the slit nozzle has moved relative to the application end position in a state where the distance from the surface of the plate-like object to be processed is about 15 to 30 times the wet film thickness, the relative movement of the slit nozzle is stopped, , (E), the slit nozzle is relatively lowered. Simultaneously with this lowering, the pump is rotated in the reverse direction, and the coating liquid existing between the surface of the plate-like workpiece is sucked from the slit nozzle at the coating end position.
[0027]
FIGS. 2A to 2D are views for explaining a coating method according to the second invention. First, as shown in FIG. 2A, the lower end of the slit nozzle approaches the surface of the plate-like workpiece at the coating start position. Then, as shown in (b), the coating liquid is connected to the gap between the lower end of the slit nozzle and the surface of the plate-like workpiece. The steps so far are the same as in the first invention.
[0028]
Next, as shown in (c), the range in which the continuity of the coating liquid is not cut off from the coating liquid connected between the lower end of the slit nozzle and the surface of the plate-like object by rotating the pump reversely. By supplying the coating liquid while relatively moving the slit nozzle horizontally while maintaining the distance between the slit nozzle and the surface of the plate-like object to be about 2 to 7 times the wet film thickness, As shown in d), a wet coating film of about 8 μm is formed on the surface of the plate-like workpiece.
[0029]
FIG. 3 is a view for explaining the coating method according to the third invention. In the third invention, first, as shown in FIG. 3A, the lower end of the slit nozzle is placed on the surface of the plate-like workpiece at the coating start position. Next, as shown in (b), the coating liquid is connected to the gap between the lower end of the slit nozzle and the surface of the plate-like workpiece. So far, this is the same as the first invention and the second invention.
[0030]
Next, as shown in (c), the range in which the continuity of the coating liquid is not cut off from the coating liquid connected between the lower end of the slit nozzle and the surface of the plate-like object by rotating the pump reversely. As shown in (d), the slit nozzle is relatively raised from the surface of the plate-like workpiece to about 15 to 30 times the wet film thickness, and subsequently, as shown in (e). A wet coating film of about 8 μm is formed on the surface of the plate-like object by supplying the coating liquid while moving the slit nozzle relatively horizontally.
[0031]
FIG. 4 is a diagram for explaining a coating method according to the fourth invention. In the fourth invention, the steps shown in (a) to (e) are the same as those in the third invention, but in the final step (e). As shown, the slit nozzle is relatively lowered, and simultaneously with this lowering, the pump is reversely rotated, and the coating liquid existing between the surface of the plate-like workpiece is sucked from the slit nozzle at the coating end position.
[0032]
FIG. 5 is a view for explaining the coating method according to the fifth invention. In the fifth invention, the lower end of the slit nozzle is placed at the coating start position of the plate-like workpiece at the coating start position as in the first to fourth inventions. Approach the surface. This point is set as a start point, and the pump is driven from this start point, and the coating liquid is connected to the gap between the lower end of the slit nozzle and the surface of the plate-like object to be processed while gradually increasing the discharge rate of the pump.
[0033]
Then, when 0.20 seconds have elapsed from the start, the slit nozzle is relatively raised so that the interval between the lower end of the slit nozzle and the surface of the plate-like object is about 15 to 30 times the wet film thickness. During this time, the pump discharge rate gradually increases.
[0034]
Then, the lift of the slit nozzle is stopped, and at the same time, the shuttle to which the slit nozzle is attached starts relative horizontal movement parallel to the surface of the plate-like workpiece.
[0035]
The slit nozzle starts relative movement 0.2 seconds after the start, and its speed gradually increases, reaches a steady speed in 0.75 seconds from the start, and thereafter relatively moves at the same speed until just before the coating end position.
On the other hand, the pump discharge rate gradually increases following the above, reaches a steady rate in 0.95 seconds from the start, and thereafter maintains the same rate until just before the coating end position.
[0036]
In this way, the application connected to the gap between the lower end of the slit nozzle and the surface of the plate-shaped workpiece by setting the relative movement speed of the slit nozzle to the steady speed before the pump discharge amount reaches the steady rate. Even if the liquid remains at the application start position, the supply amount of the application liquid from the pump immediately after the start of the subsequent movement is small relative to the relative speed, so that the range of thickening can be narrowed.
[0037]
【The invention's effect】
As described above, according to the first invention, at the coating start position, for example, the coating liquid from the slit nozzle is connected to the surface of the plate-shaped workpiece, and then the slit nozzle is moved relatively horizontally. While supplying the coating liquid, the pump was reversely rotated while the slit nozzle was relatively lowered immediately before the coating end position or just before the coating end position, so that the coating liquid was sucked. The thickening of the wet coating can be improved.
[0038]
According to the second and third aspects of the invention, at the application start position, the pump is rotated in the reverse direction so that an excess amount of the application liquid connected between the lower end of the slit nozzle and the surface of the plate-like object is sucked. Therefore, thickening of the wet coating film at the coating start position can be improved.
[0039]
According to the fourth invention, in addition to the second and third inventions, thickening at the coating end position can also be improved.
[0040]
According to the fifth aspect, the thickness of the wet coating film at the coating start position is such that the relative movement speed of the slit nozzle reaches the steady speed before the discharge amount of the coating liquid from the pump reaches the steady rate. Membrane formation can be improved.
[Brief description of the drawings]
FIGS. 1A to 1E are diagrams illustrating a coating method according to the first invention of the present application. FIGS. 2A to 2D are diagrams illustrating a coating method according to the second invention of the present application. FIGS. 3A to 3E are diagrams illustrating a coating method according to the third invention of the present application. FIGS. 4A to 4E are diagrams illustrating a coating method according to the fourth invention of the present application. FIG. 5 is a graph illustrating a coating method according to the fifth invention of the present application.
Claims (2)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000309329A JP4130058B2 (en) | 2000-10-10 | 2000-10-10 | Application method |
| TW090124720A TW508698B (en) | 2000-10-10 | 2001-10-05 | Coating method |
| KR1020010062349A KR100829084B1 (en) | 2000-10-10 | 2001-10-10 | A coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000309329A JP4130058B2 (en) | 2000-10-10 | 2000-10-10 | Application method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002113411A JP2002113411A (en) | 2002-04-16 |
| JP4130058B2 true JP4130058B2 (en) | 2008-08-06 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000309329A Expired - Fee Related JP4130058B2 (en) | 2000-10-10 | 2000-10-10 | Application method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4130058B2 (en) |
| KR (1) | KR100829084B1 (en) |
| TW (1) | TW508698B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100404145C (en) | 2003-03-03 | 2008-07-23 | 东丽株式会社 | Slit die, and method and device for producing base material with coating film |
| JP4562412B2 (en) * | 2004-03-25 | 2010-10-13 | 東京応化工業株式会社 | Coating method |
| KR100780718B1 (en) | 2004-12-28 | 2007-12-26 | 엘지.필립스 엘시디 주식회사 | Slit coater having apparatus of supplying coating fluid |
| KR100700180B1 (en) | 2004-12-31 | 2007-03-27 | 엘지.필립스 엘시디 주식회사 | Slit coater having pre-spreading unit and method of coating using thereof |
| KR100675643B1 (en) | 2004-12-31 | 2007-02-02 | 엘지.필립스 엘시디 주식회사 | Slit coater |
| KR100700181B1 (en) | 2004-12-31 | 2007-03-27 | 엘지.필립스 엘시디 주식회사 | Slit coater having standby unit of nozzle and method of coating using thereof |
| JP5127127B2 (en) * | 2005-09-15 | 2013-01-23 | 東京応化工業株式会社 | Coating method |
| JP4634265B2 (en) * | 2005-09-27 | 2011-02-16 | 東京エレクトロン株式会社 | Coating method and coating apparatus |
| TWI313193B (en) * | 2006-01-19 | 2009-08-11 | Tokyo Electron Limite | Coating method, coating apparatus and memory medium |
| JP4564454B2 (en) * | 2006-01-19 | 2010-10-20 | 東京エレクトロン株式会社 | Coating method, coating apparatus, and coating program |
| JP4799390B2 (en) * | 2006-12-15 | 2011-10-26 | 中外炉工業株式会社 | Application method |
| JP2008161741A (en) * | 2006-12-27 | 2008-07-17 | Chugai Ro Co Ltd | Coating apparatus and coating method |
| KR101401428B1 (en) | 2007-08-13 | 2014-06-02 | 주식회사 케이씨텍 | Method of Slit Coating |
| JP5204164B2 (en) * | 2010-08-03 | 2013-06-05 | 東京エレクトロン株式会社 | Coating apparatus and nozzle priming method |
| JP5314726B2 (en) * | 2011-03-18 | 2013-10-16 | 東京エレクトロン株式会社 | Coating film forming apparatus and coating film forming method |
| JP6310741B2 (en) * | 2014-03-20 | 2018-04-11 | 株式会社Ｓｃｒｅｅｎホールディングス | Intermittent coating method and intermittent coating apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60139369A (en) * | 1983-12-27 | 1985-07-24 | Natl House Ind Co Ltd | Groove coating method |
| JPH01207159A (en) * | 1988-02-12 | 1989-08-21 | Dainippon Toryo Co Ltd | Method and device for coating groove part and overlap part |
| JPH08141475A (en) * | 1994-11-24 | 1996-06-04 | Dainippon Printing Co Ltd | Method and device for removing excess coating liquid at end of substrate surface |
| KR100369571B1 (en) * | 1994-12-28 | 2003-04-10 | 도레이 가부시끼가이샤 | Coating method and coating device |
| JP3714369B2 (en) * | 1996-03-22 | 2005-11-09 | 東レ株式会社 | Coating apparatus and coating method |
| JP2003170099A (en) * | 2001-09-28 | 2003-06-17 | Fuji Photo Film Co Ltd | Coating method and coating apparatus |
-
2000
- 2000-10-10 JP JP2000309329A patent/JP4130058B2/en not_active Expired - Fee Related
-
2001
- 2001-10-05 TW TW090124720A patent/TW508698B/en not_active IP Right Cessation
- 2001-10-10 KR KR1020010062349A patent/KR100829084B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| TW508698B (en) | 2002-11-01 |
| KR20020028829A (en) | 2002-04-17 |
| JP2002113411A (en) | 2002-04-16 |
| KR100829084B1 (en) | 2008-05-16 |
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