JP4355777B2 - スケーラブルなワイドアレイインクジェットプリントヘッドの製作方法 - Google Patents
スケーラブルなワイドアレイインクジェットプリントヘッドの製作方法 Download PDFInfo
- Publication number
- JP4355777B2 JP4355777B2 JP2008165982A JP2008165982A JP4355777B2 JP 4355777 B2 JP4355777 B2 JP 4355777B2 JP 2008165982 A JP2008165982 A JP 2008165982A JP 2008165982 A JP2008165982 A JP 2008165982A JP 4355777 B2 JP4355777 B2 JP 4355777B2
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- Prior art keywords
- print head
- opening
- support substrate
- conductive material
- printhead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000011521 glass Substances 0.000 claims description 4
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
図1に、本発明の実施態様によるワイドアレイインクジェットペン10を示す。ペン10は、ワイドアレイプリントヘッド12およびペン本体14を含む。ペン本体14は、プリントヘッド12が取り付けられるハウジングとして働く。ペン本体14は、ローカルなインク槽としての働きをする内部チャンバ16を画定する。様々な実施態様では、インク槽は、交換可能または補充可能な貯槽である。一実施態様では、この貯槽は、ローカルなインク槽を満たす外部の貯槽に結合される。別の実施態様では、この貯槽は補充不可能である。
各プリントヘッドには、第1の表面58および、第1の表面58の反対側の第2の表面60がある。ノズル開口部38は、第1の表面58に存在する。インク補充スロット32は、第2の表面60に存在する。シリコンダイ52は、第2の表面60に1つまたは複数の誘電体層62(たとえば、チッ化物層またはカーバイド層)を有する。プリントヘッド18の製作中、相互接続金属66および濡れ金属(wetting metal)68は、第2の表面60上の規定の位置に溶着される。相互接続金属は誘電体層62上に溶着され、濡れ金属は相互接続金属上に塗布される。一実施態様では、写真製版処理が使用されて、濡れ金属68の正確な位置、大きさ、および形状が画定される。このような処理によれば、濡れ金属を1ミクロン以内に正確に配置することができる。
前記のように、配線ライン46を備えた印刷要素24が、プリントヘッドの第1の表面58の方を向いて形成される。支持基板は、プリントヘッド18の第2の表面60に隣接しているため、電気的相互接続はプリントヘッド18の第1の表面58から第2の表面60に延びなければならない。図5に、相互接続80が、第1の表面58に隣接する薄膜構造54から、シリコンダイ52を通って、第2の表面60に向かって延びる実施態様を示す。電気的接続が、配線ライン46からバイア101を介して導電性パターン107まで、およびバイア99を介して相互接続80まで延びる(図8に示すように)。相互接続80は、第2の表面60で相互接続金属層82および濡れ金属層84に接続する。次に、はんだ78が、支持基板で相互接続90への電気的接続を完了する。濡れ金属層86および相互接続金属88は、はんだ78と相互接続90の間の支持基板上に位置する。図に示す実施態様では、相互接続90が、支持基板を貫通して駆動回路30との境界面まで延びる。別の実施態様では、相互接続90は、支持基板の第1の表面70に沿って、駆動回路30との境界面まで延びる。代替の電気的結合方式を使用することができるが、基板20の第2の表面72に装着された駆動回路30に対しては、はんだ接続がまた実施される。
再度、図5を参照すると、支持基板20は、基板の1つの表面から基板の反対側の表面に延びる相互接続90を備えている。一実施態様では、前記のように、溝をエッチングし、相互接続金属を溶着することによって、相互接続90が、プリントヘッドのために形成される。代替実施態様では、基板20内に貫通開口部110を画定するために、直線的なエッチングが実施される。次に、エッチングされた貫通開口部110を金属で充填するために、電気メッキ法が実施される。この金属が相互接続90を画定する。図9を参照すると、貫通開口部110をメッキするために、基板20がメッキ溶液112中に浸漬される。基板20が取り付けられた電気メッキ物116に、バイアス信号114が印加される。電気メッキ物116は、バイアス電流が基板のインク補充流路42の領域に流れないように形成される。より具体的には、金属層115が、所望の位置で基板20と電気メッキ物116の間に接点を形成する。したがって、インク補充流路42は電気メッキされない。加えて、小さな隙間118が基板20と電気メッキ物の間に生じる。これによって、メッキ溶液112内に浸漬されている間に、基板20の下面72が電気メッキされることが防止される。
一代替実施態様では、プリントヘッド18のダイ52を貫通して延びる相互接続を形成するのではなく、ワイヤ結合がプリントヘッドの外部に形成される。図10では、プリントヘッド18’が同様な部品に同様な番号を付けて示されている。各印刷要素24用のそれぞれの配線ライン46が、それぞれの接点120に延びる。接点120は、ノズル開口部38と同じプリントヘッド18’の面上に配置される。ワイヤ122は、プリントヘッド18’上の接点120および基板20上の接点130に結合される。接点130は、基板20の表面70上に配置される。ワイヤ122は、プリントヘッド18’と基板20の間をプリントヘッド18’の外側に延びる。ワイヤ122は、接点120および130に固定される。ワイヤを密封して、ワイヤがプリントヘッド18’または基板20から離れないようにするために、ワイヤ122のまわりに、カプセル封入が適用される。基板20は、インクがプリントヘッドダイ18の方に流れるようにするためのインク補充流路42を備えている。この流路を直線的にエッチングされた流路として示すが、流路の壁は代替的にはある角度(たとえば、54.7°)でエッチングされる。
前記支持基板の第1の面(28)に装着され、各プリントヘッドは、多数の配列した印刷要素(24)およびインク補充流路(42)を備え、前記配列した印刷要素の各1つの印刷要素がノズルチャンバ(36)、射出用抵抗器(40)、供給流路(44)、ノズル開口部(38)および配線ライン(46)を備える複数のプリントヘッドダイであって、各1つのプリントヘッドダイに対して、インク流路が、前記複数のインク補充スロット(32)の1つスロットから、前記1つのプリントヘッドダイのインク補充流路(42)を通り、前記配列した多数の印刷要素のそれぞれの前記供給流路(44)を通って、前記多数の印刷要素のそれぞれの前記ノズルチャンバ内まで形成されることからなる複数個のプリントヘッドダイ(18)と、
前記支持基板の第2の面(72)に搭載される複数の駆動回路であって、前記第2の面が前記第1の面の反対側にあり、該駆動回路が、前記配列した印刷要素の前記配線ラインに電気的に結合されることからなる駆動回路(30)と、
前記支持基板の前記第2の面に搭載される複数の論理回路であって、該論理回路は、前記駆動回路に電気的に結合され、該論理回路が制御信号を受信し、それに応答して、射出すべき印刷要素を選択するために、多数の駆動回路に対して出力信号を発生する複数の論理回路(29)と
からなるワイドアレイインクジェットペン(10)。
前記支持基板の第1の表面(70)に沿って位置合せされる複数のはんだ濡れパッド(86)を製作するステップと、
前記複数のプリントヘッドダイの各1つに対して、該1つのプリントヘッドダイの第1の表面(60)上に、複数個のはんだ濡れパッド(84)を製作するステップであって、前記複数のプリントヘッドダイのはんだ濡れパッドの各一つのパッドが、前記支持基板上の対応する濡れパッドと共通の形状を有し、前記1つのプリントヘッドダイが、第1の表面および、該第1の表面の反対側の第2の表面(58)を有し、前記第2の表面が複数のノズル開口部(38)を備えることからなるステップと、
前記複数のプリントヘッドダイの各1つに対して、前記支持基板に前記1つのプリントヘッドダイを保持し、前記支持基板に前記1つのプリントヘッドダイをはんだ付けするステップであって、はんだ付け中、はんだリフローによって、前記1つのプリントヘッドダイの前記濡れパッドを、前記支持基板の対応する濡れパッドに位置合せするように移動させるステップと
からなる方法。
前記プリントヘッドダイの前記第1の表面の反対側の第2の表面(60)内に溝(92)をエッチングするステップと、
前記第1の溝の一部に沿って導電性部材(80)を溶着するステップと、
前記プリントヘッドダイの前記第2の表面で、前記インク補充流路(42)をエッチングするステップと、
前記プリントヘッドダイの前記第1の表面から、前記導電性部材に延びる開口部を形成するステップと、
前記開口部内に導電性部材(80)を溶着するステップと、
前記開口部の前記導性部材および前記溝を、所定の印刷要素の配線ライン(46)に電気的に結合するために、前記プリントヘッドダイの第1の表面に沿って導電性パターン(46)を溶着するステップと
からなる方法。
18 プリントヘッドダイ
20 支持基板
29 論理回路
30 駆動回路
32 インク補充スロット
36 ノズルチャンバ
38 ノズル開口部
40 射出用抵抗器
42 インク補充流路
44 供給流路
46 配線ライン
Claims (9)
- 第1の面と、該第1の面の反対側にある第2の面とを有する支持基板内に貫通開口部として形成された複数のインク補充スロットを有する支持基板と、
複数のプリントヘッドであって、該プリントヘッドの各々が複数の液滴噴射要素およびインク補充流路を備える、複数のプリントヘッドと、
前記液滴噴射要素を駆動制御するための回路
とを備えるインクジェットペンにおいて、前記液滴噴射要素と前記回路との間に電気的接続を形成するための方法であって、
前記プリントヘッドの各々は、第1の側面と第2の側面を有し、前記インク補充流路は該第1の側面及び該第2の側面と連絡し、前記複数の液滴噴射要素は前記第1の側面に形成され、前記複数の液滴噴射要素の各々は、前記インク補充流路と連絡するノズルチャンバ、前記ノズルチャンバに配置された射出用抵抗器、及び、前記射出用抵抗器に結合された配線ラインを有し、各プリントヘッド毎に、インク流路が、前記インク補充スロットの1つから、前記プリントヘッドの1つの前記インク補充流路を通って、前記複数の液滴噴射要素のそれぞれの前記ノズルチャンバ内まで形成され、
前記複数のプリントヘッドの各々は、各プリントヘッドの前記第2の側面と前記支持基板の前記第1の面とが対向するようにして前記支持基板の前記第1の面に装着され、前記回路は、前記支持基板の前記第2の面に搭載されると共に、前記支持基板を貫通する相互接続と電気的に接続され、
前記プリントヘッドの前記第2の側面に溝を形成するステップと、
前記溝に導電性材料を溶着するステップと、
前記プリントヘッドの前記第1の側面と前記溝の導電性材料との間の前記プリントヘッドに第1の開口部を形成するステップと、
前記第1の開口部に導電性材料を溶着するステップと、
前記第1の開口部の導電性材料と前記液滴噴射要素のうちの1つの液滴噴射要素の前記配線ラインの間に導電性経路を形成するステップと、
前記第1の開口部の導電性材料と前記支持基板を貫通する前記相互接続とを電気的に接続するステップ
を含む方法。 - 前記溝に導電性材料を溶着するステップと前記第1の開口部に導電性材料を溶着するステップは、前記プリントヘッドを貫通する電気的相互接続を形成するステップを含む、請求項1の方法。
- 前記プリントヘッドの前記第2の側面に溝を形成するステップは、該第2の側面から前記プリントヘッドの前記第1の側面に向かって前記プリントヘッドをエッチングするステップを含む、請求項1の方法。
- 前記溝に導電性材料を溶着するステップは、前記プリントヘッドの前記第2の側面に沿って前記導電性材料を溶着するステップをさらに含む、請求項1の方法。
- 前記第1の開口部の導電性材料と前記液滴噴射要素のうちの1つの液滴噴射要素の配線ラインの間に導電性経路を形成するステップは、前記プリントヘッドの前記第1の側面と前記配線ラインとの間の前記プリントヘッドに第2の開口部を形成するステップと、前記第2の開口部に導電性材料を溶着するステップを含む、請求項1の方法。
- 前記第1の開口部の導電性材料と前記液滴噴射要素のうちの1つの液滴噴射要素の配線ラインの間に導電性経路を形成するステップは、前記第1の開口部の導電性材料と前記第2の開口部の導電性材料の間の前記プリントヘッドの前記第1の側面に沿って導電性パターンを溶着するステップをさらに含む、請求項5の方法。
- 前記プリントヘッドは、基板層と、該基板層に形成された少なくとも1つのパッシベーション層を有し、前記プリントヘッドの前記第2の側面に溝を形成するステップは、前記基板層に前記溝を形成するステップを含み、前記プリントヘッドに前記第1の開口部を形成するステップは、前記少なくとも1つのパッシベーション層を貫通して前記第1の開口部を形成するステップを含む、請求項1の方法。
- 前記少なくとも1つのパッシベーション層は、前記液滴噴射要素のうちの1つの液滴噴射要素の配線ラインの上に形成され、前記第1の開口部の導電性材料と前記液滴噴射要素のうちの1つの液滴噴射要素の配線ラインの間に導電性経路を形成するステップは、前記少なくとも1つのパッシベーション層を貫通して前記導電性経路を形成するステップを含む、請求項7の方法。
- 前記基板層は、シリコン、ガラス、ポリマーのうちの1つを含み、前記少なくとも1つのパッシベーション層は、二酸化ケイ素、炭化ケイ素、チッ化ケイ素、タンタル、ポリシリコンガラスのうちの1つを含む、請求項7の方法。
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US08/959,376 US6123410A (en) | 1997-10-28 | 1997-10-28 | Scalable wide-array inkjet printhead and method for fabricating same |
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JP2008165982A Expired - Fee Related JP4355777B2 (ja) | 1997-10-28 | 2008-06-25 | スケーラブルなワイドアレイインクジェットプリントヘッドの製作方法 |
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EP (1) | EP0913261B1 (ja) |
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KR (1) | KR100496095B1 (ja) |
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- 1998-09-23 EP EP98307718A patent/EP0913261B1/en not_active Expired - Lifetime
- 1998-10-22 JP JP30051498A patent/JP4202485B2/ja not_active Expired - Fee Related
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US20020033861A1 (en) | 2002-03-21 |
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US20040113996A1 (en) | 2004-06-17 |
JP2008221857A (ja) | 2008-09-25 |
KR19990037428A (ko) | 1999-05-25 |
US6325488B1 (en) | 2001-12-04 |
JP4202485B2 (ja) | 2008-12-24 |
US6123410A (en) | 2000-09-26 |
US6435653B1 (en) | 2002-08-20 |
JPH11192705A (ja) | 1999-07-21 |
EP0913261A2 (en) | 1999-05-06 |
US20020015073A1 (en) | 2002-02-07 |
KR100496095B1 (ko) | 2005-09-26 |
DE69828734D1 (de) | 2005-03-03 |
DE69828734T2 (de) | 2006-01-05 |
US6592205B2 (en) | 2003-07-15 |
US20020018101A1 (en) | 2002-02-14 |
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