TW393406B - Scalable wide-array inkjet printhead and method for fabricating same - Google Patents
Scalable wide-array inkjet printhead and method for fabricating same Download PDFInfo
- Publication number
- TW393406B TW393406B TW087109423A TW87109423A TW393406B TW 393406 B TW393406 B TW 393406B TW 087109423 A TW087109423 A TW 087109423A TW 87109423 A TW87109423 A TW 87109423A TW 393406 B TW393406 B TW 393406B
- Authority
- TW
- Taiwan
- Prior art keywords
- print head
- carrier substrate
- die
- array
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
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Description
經濟部中央標準局員工消費合作社印製 A7 B7 丨一一. —.— -- - 五、發明説明(1 ) 持術領城 , 本發明偽關於噴墨列印頭構造,且更特別地關於一種 寛陣列噴墨列印頭構造。 柃術背晷 有些己知和可得的商用列印装置,如使用如一噴墨筆 的噴墨技術之電腦印表機、圔形繪畫機及傳真機;一噴墨 筆典型上包括一墨水儲源和一陣列名為噴嘴的噴墨列印元 件;該陣列之列印元件被形成在一列印頭上;各列印元件 包括一噴嘴腔室、一發射電阻器及一噴嘴開孔;墨水被儲 存在一墨水儲源中並經由一墨水重填通道和墨水饋送通道 被動地載入列印頭之對應發射腔室中;毛細管作用將墨水 從儲源通過重填通道和墨水饋送通道移入對應的發射腔室 中;習用上,列印元件被形成在一共同基體上。 對於噴出墨汁的一給予列印元件,一輸出信號被輸出 至如此元件之發射電阻器;印表機控制電路産生控制信號 其又産生用於對應發射電阻器的驅動信號;一被致動發射 電阻器加熱在噴嘴腔室内的周圍墨汁引起一膨脹蒸汽氣泡 的形成;氣泡將墨汁從噴嘴腔室推擠出噴嘴開孔;鄰近於 障壁層的一噴嘴平板界定噴嘴開孔;噴嘴腔室之幾何形狀 、墨汁饋送通道和噴嘴開孔界定在發射後一對應噴嘴腔室 如何快速地被重填;為了逹成高品質列印,墨水滴或點以 設計的解析度被正確地布置在期望的位置;已知以毎英吋 3 00點和每英吋SCO點之解析度列印;較高的解析度也被尋 求;有掃描式噴墨筆和非掃描式噴墨筆;一掃描式噴墨筆 ________- 4 _ _ 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公楚) I —^n _ ^^1 - - - -- - !, i ! ^^1 ^^1 、一5J- I.---= — j In ~ I . (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 B7 —'—___________ 五、發明説明(2 ) 包括具有大約10G-200列印.元件的一列印頭;一非掃描式 噴墨筆包括一寬陣列或頁寬陣列列印頭;一頁寬陣列列印 頭包括横過一頁寬延伸的超過5, 00 0M噴嘴;如此噴嘴被 控制以一次列印一或多條線。 在製造寬陣列列印頭中列印頭之尺寸和噴嘴之數目引 入許多錯誤的機會;特別是,隨著在一基體上噴嘴之數目 增加,變得很難在製造中獲得一期望的處理;再者,隨著 基體之所期望尺寸增大,更難以獲得所期望材料特性之適 當尺寸的基髏。 本發明槪里 根據本發明,一可縮放寬陣列列印頭結構藉由將多重 熱性噴墨列印頭裝設於一承載基體而形成;各列印頭包括 多個列印元件;各列印元件包括一噴嘴腔室、一發射阻抗 器及一噴嘴開孔;另外,艏別配置線將各發射電阻器耦合 至在列印頭上的一接觸點;藉由對於不同實施例將列印頭 之不同數目預設於一承載基體,不同尺寸的寬陣列列印頭 結構實施例被達成;因此,裝設方法學之一利益在於一可 縮放列印頭建構被達成。 根據本發明之另一特擻,一焊接突塊裝設處理被使用 以将列印頭装設於承載基體;如此焊接突塊之一利益在於 它們供使用以沿著承載基體對齊各個列印頭;用於收納焊 錫的濕墊藉由使用徹影或其它適當製程而被精確地放置在 承載基體和列印頭上;一旦焊料被放置並加熱成液態,則 焊料再流發生;在焊料再流時如此墊傾向於彼此對齊並因 ____^_
本紙乐尺度^用中國國家標準(CNS ) A4規格(210X 297公f Y (讀先閱讀背面之注意事項再填寫本頁) 裝_
、1T 經濟部中央標準局員工消費合作社印製 A7 __B7__ 五'發明説明(3 ) 此將列印頭對齊於承載基體,。 在一實施例中,列印頭包括沿著列印頭之一表面且面 對承載基體的一下置墨水隙槽;根據本發明之另一待擻, 用於装設一列印頭的焊料形成圍繞如此墨水隙槽的一環; 該焊料環供使用作對於該墨水隙槽的一流體邊界;結果對 於列印頭墨水隙槽之流體隔離可省去一膠套。 用於列印頭的接觸點典型上傺沿著和噴嘴開孔相同的 表面形成;根據本發明之另一特歡,一前至後的相互連接 透過列印頭被形成以將列印頭互相連接於承載基體;根據 本發明之又一待徽,一配線接合互相連接被形成從列印頭 接觸點至承載基體接觸點;該配線接合互相連接在列印頭 外面延伸而非穿過它。 根據本發明之另一特徵,承載基體不包含主動電子電 路之積體元件;關於電氣特擻方面,承載基體只包括用於 將艏別列印頭之接觸點電氣地繙合至邏輯電路和驅動電路 的相互連接;因為承載基體不被使用予主動電子電路故所 用的矽可為一較低等级、較不昂貴的矽;如此矽被選取以 具有對於獲得一期望的墨水重琪隙槽倒寫為有用的結晶方 向。 根據本發明之另一特ί敦,邏輯電路和驅動電路積體電 路晶片被裝設於承載基體並介接於列印頭以控制多重列印 頭之列印元件;有邏輯I Cs、驅動I Cs及列印頭的承載基體 在此被參照為寬陣列列印頭。 根據本發明之另一特歡,列印頭被裝設於承載基體之 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210><297公雄.) ΊΝ 、-—裝------訂------線 ί - .---,4 (諳先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 __ 五、發明説明(4 ) —面且邏輯ICs和驅動1(:3彼裝設於承載基體之一反面;相 互連接透過承載基體被形成以將列印頭之接觸點電氣地耦 合至邏輯ICs和驅動ICs之接觸點;一前至後金屬化製程被 使用以形成透過承載基體的相互連接。 根據一較佳實施例,承載基體廖偽以與列印頭基體相 同材料(例如,矽)形成;對於承載基體和列印頭使用相 同材料之利益在於熱膨脹像數之不匹配可被避免;在另一 實施例中承載基體係以具有匹配於矽的一熱膨脹偽數之一 多層陶瓷材料所形成;用於基體之材料被蝕刻以形成供墨 水從一儲源透過承載基體流至列印頭的一墨水重填隙槽。 本發明之這些和其它待激與利益藉由參考於與所伴隨 圖式結合取出的下面詳細說明而將被較佳瞭解。 _式之簡蜇說明 第一圖傺根據本發明之一實施例具有一寬陣列列印頭 的一寬陣列噴墨筆之一〗透視圖; 第二圖係第一圖之寛陣列噴墨列印頭的一第一側之一 平視圖; 第三圖係相反於該第一側的第一圖之寬陣列噴墨列印 頭的一第二側之一透視匾; 第四圖偽第一圖之寛陣列噴墨列印頭的另一實施例之 透視圖; 第五圖係第一圖之寬陣列噴墨列印頭和承載基體的一 部分之一横截面圖; 第六圖係用於一列印元件的一配線和發射電阻器佈局 ___ -7-_ 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐) I 1 I I I ^ 線 ~-* (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(5 ) 之一圖; . 第七圖偽當在被製造之處理時第五圖之列印頭的一横 截面圖; 第八圔偽在被製造之一較後階段中第t圖.之列印頭的 一横截面圖; 第九圖偽在金屬化一穿過開孔供使用作一相互連接的 製程中一基體之一圖;及 第十画偽根據另一互相連接設計一寬陣列噴墨列印頭 和,承載基體之一部分的一横截面圖。 結姝審施例之說明 -_综觀 第一圖顯示根據本發明之一實施例的一寬陣列噴墨筆 10 ;筆10包括一寬陣列列印頭12和一筆本髏14 ;筆本體供 使用作列印頭12被附於其的一殼體;筆本髏14界定供使用 作一在地墨水儲源的一内部腔室16;在各種實施例中該儲 源像一可更換或再该充的儲源;在一實施例中該儲源被镄 合至供應該在地儲源的一外部儲源;在另一實施例中該儲 源是不可再充填的。 請參考第一和二圖,列印頭12包括裝設於一承載基醴 2 0的多値熱式噴墨列印頭晶粒18 ;列印頭18被對齊在承載 基體20之一第一表面28上的一或多條列26 ;各個列印頭18 包括也被稱為噴嘴(請看第四圖)的噴墨列印元件24之多 條列22 ;在第一至四圖之實施例中列印頭18被端點至端點 地對齊並以各列印頭之値別列也被對齊。 _ — 8 — 本紙張尺度適用中國國家標準(CNS ) Λ4規輅(2丨0X 297公釐) I T I I I 1 1 裝— I 訂 ! 3 線 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 、一 ___ i、發明説明(6 ) 如在形成混成多晶模組中使用的,承載基體20傜以矽 或多層陶瓷材料製成;基體20較佳具有匹配矽之者的一熱 膨脹係數,可機械加工以允許一墨水隙槽之形成,能夠收 納焊料和互相連接層,並能夠接收積體電路之裝設。 各列印頭18包括一陣列之列印元件24;請參考第五圖 ,各列印元件24包括具有一噴嘴開孔38的一噴嘴腔室36 ; 一發射電阻器40被設在噴嘴腔室36内;請參考第六圔,配 線46將發射電阻器40電氣地網合至一驅動信號和大地;請 再參考第五圖,各列印頭18也包括一再充填通道42;墨水 從在腔室16内的内部儲源透過一或多儲承載基體再充琪隙 槽32流至列印頭18之再充填通道42 ;墨水通過各列印頭再 充填通道42經由墨水饋送通道44流入列印頭噴嘴腔室36中 在一實施例中一或多脑列印頭18係被一矽晶粒52、一 薄膜結構54及一通孔層56形成的一全然積體熱式噴墨列印 頭;在一例示性實施例中,矽晶粒5 2大約6 7 5微米厚;在 替代實施例中玻璃或穩定聚合物被使用以取代矽;薄膜结 構54係被二氣化矽、碩化矽、氮化矽、鉅、多晶矽玻璃、 及其它適合材料之一或多鈍化或絶緣層所形成;該薄膜結 構也包括用於界定發射電阻器40和配線46的一傳導層;該 傳導層偽被鋁、金、钽、钽鋁或其它金屬或金靥合金所形 成;在一例示實施例中薄膜結構54大約3微米厚;一通孔 層5 6被顯示在此膜結構54之頂部;噴嘴開孔38具有大約10 -50徹米之一直徑;在一例示實施例中發射電阻器40偽以 在各邊約1Q-3Q微米之長度的大約正方形;支持發射阻抗 _____- 9 ~_ 本紙張尺度適用中國國家標準(CNS ) Λ4規格(2丨OX 297公炱) — 1.--------I 裝------訂-----.線 -' (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(7 ) 器40的噴嘴腔室36之基地表.面具有大約電阻器40之長度兩 倍的一直徑;在一實施例中一 54 . 7°蝕刻界定對於開孔38 和再充填通道42的壁角;雖然例示維度和角度被給予,對 於替換實施例如此維度和角度可以變化。 在另一實施例中一或多値列印頭18被在其内形成有發 射電阻器和配線的一基體所形成;一障壁層在發射電阻器 重疊基體;該障壁層具有界定噴嘴腔室的開孔;一通孔平 板或伸縮電路重疊該障壁層並包括噴嘴開孔;一墨水再充 填隙槽在基體中被一鑽孔處理形成。 在一給予發射電阻器4Q之致動上,在環繞噴嘴腔室36 内的墨水透過噴嘴開孔3S被噴出在一媒介薄片上;請參考 第二至四圖,邏輯電路29選取在一給予時間哪一艏發射電 阻器40是主動的;驅動電路30將一給予驅動信號供應至一 給予發射電阻器38以加熱該給予發射電阻器38 ;在一實施 例中,邏輯電路29和驅動電路30被裝設於承載基體20;在 另一實施例中,該邏輯電路和驅動電路被設置鏞離寬陣列 列印頭結構12;請參考第二和三圖,邏輯電路29和驅動電 路30被裝設於與在一例示實施例中的第一表面28柑反的基 體20之一第二表面32;在另一例示實施例中(請看第四圖 )邏輯電路29和驅動電路30被裝設於與列印頭18相同的表 面28;請參考第三圖,承載基體20包括被製造或施加於基 體20的相互連接50 ;列印頭晶粒18被装設於承載基體以與 脑別互相連接50電氣接觸;在一較佳實施例中對於各列印 頭18之各電氣接觸有一互相連接5G ;列印頭18包括用於將 _~10"__ 本紙張尺度適用中國國家標準(CNS ) A4規枱(210X297公趋) .—裝 訂 線 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局貝工消費合作,社印5? A7 B7 五、發明説明(8 ) 列印元件配線46耦合至個別驅動信號的多個接觸點;互連 點50延伸至歸源驅動信號的驅動電路30 ;在一實施例中一 子基體52披裝設於承載基鑤;邏輯電路29和驅動電路30被 裝設於如此子基體;子基體互相連接邐輯電路29和驅動電 路30彼此,且將驅動電路30互相連接至承載基體互連點50 ;在另一實施例中邏輯電路29和驅動電路30被直接裝設於 承載基體20。 在操作時,寬陣列列印頭12接收來自基體20的印表機 控制倍號;如此佶號經由一連接器34被接牧於基體20上; 邐輯電路29和驅動電路30被直接或間接耦合於如此連接器 34;列印頭18被耦合於驅動電路30。 —装設列印頭之方法 各列印頭具有一第一表面58和舆第一表面58相反的一 第二表面60;噴嘴開孔38設在第一表面58;墨水再充填隙 榷42設在第二表面60;矽晶粒52具有在第二表面60的一或 多僱介電層62 (例如,気化或磺化層);在列印頭18之製 造時一互連金屬66和一濕潤金羼68M預定位置被沉積在第 二表面60上;互連金羼被沉積於介電層(等)62上,且滬 潤金屬被施加於該互連金羼上,在一實施例中,微影製程 被使用Μ界定濕潤金羼68之精確位置、尺寸及形狀;各製 程使濕润金屬之正確放置能在一微米内。 承載基髏20也包括一第一表面70和與第一表面70相反 的一第二表面72;如在第五圖中所示的列印頭18Μ列印頭 第二表面60面對承載基體20地被裝設於承載基體20;爲了 -11- 本紙張尺度適川中國€家標準(CNS ) Λ4規格(210X297公t _~~ --------1裝------訂-------線 . t (請先閲讀背面之注意事項再填寫本頁) 經濟部t央標準局員工消費合作社印製 A7 _B2__ 五'發明説明(9 ) 說明的目的在列印頭18和承載基體20間之區隔被誇大;像 列印頭18的,一介電層7 6 (例如,氮化層)被施加於表面 70、72且一互連金羼74和濕潤金屬76以預定位置被沉楨於 氮化層72上;在一實施例中,徹影製程被使用以界定濕潤 金靥68之精確位置、尺寸及形狀,·如此製程使濕潤金羼之 正確放置能在一撤米内;在較佳實施例中在基體20上的濕 潤金靨76被形成在對應於列印頭之濕潤金靨S6的位置上; 特別是,在承載基體2G上的濕潤金屬位置和列印頭18之間 有一個一對一的對應。 焊料突塊被沉積於列印頭18或承載基體2 0之濕潤金屬 上;為了裝設一列印頭18,列印頭18被衝壓於承載基體使 得各線之濕潤金颶上翹;濕潤金屬68、?6被焊接突塊78分 開;然後焊料被加熱以液化焊料;然後焊料沿箸濕塾68、 76流動並將列印頭18拉成與承載基體20精密對齊;更特別 地焊料78將列印頭濕塾S8拉成與對應承載基體金屬塾76精 確對齊;已被證實焊料重流力將個別濕潤金屬68、76對齊 於一微米内;因此,僳藉由使用撤影和其它沉積製程精確 地設置濕潤金屬68、76而列印頭18能夠在承載基髏20上被 精確地放置和對齊於期望的裕度内。 根據本發明之一持擻,焊料也形成一流體障壁;如上 述地,列印頭包括一或多値再充填隙槽42且承載基體包括 一或多條再充填通道32 ;各再充填隙槽42偽與一再充填通 道32連通;如在第五圖中所示的,再充填隙槽42偽對齊於 再充填通道32;為了防止墨水在列印頭18和承載基體20間 _____~ 12 -_ 本紙乐尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐) I -------Ί裝------訂------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消費合作社印製 A7 B7 五、發明説明(10 ) 的介面洩漏,一密封將要形.成;在一實施例中,焊料78傜 抗腐蝕的並供使用作該密封;特別是,濕潤金屬68、76繞 著再元请隙槽4 2和再充填通道3 2之傾別開孔被沉積;因此 ,當焊料被使用以將列印頭18裝設於基體20時,焊料界定 防止墨水在介面洩漏的一密封或流體障壁;在替代實施例 中一填隙製程被實施,其中一黏膠或一封膠被使用以形成 —流體障壁。 --將列印頭與承載基體網合的互相連接方法 如上逑的,有配線46的列印元件24向著列印頭之第一 表面58被形成;因為承載基體偽鄰近於列印頭18之第二表 面60,故一電氣互相連接要從第一表面58延伸至列印頭18 之第二表面60;第五圖顯示一實施例,其中一相互連接80 從鄰近第一表面58的薄膜結構54透過矽晶粒52延伸朝向第 二表面6G; —電氣連接從一配線46透過一路徑101至一傳 導線跡107延伸至路徑99和互相連接80 (如在第八圖中所 示);互相連接8G連接至在第二表面60的一互連金颶層82 和一瀛潤金靨層84 ;焊料78然後完成電氣連接於在承載基 體的一互相連接90 ; —濕潤金屬層86和一互連金羼88被設 置在焊料78和互相連接90間的承載基體上;在所示的實施 例中互相連接90通過承載基體延伸至有一驅動電路30的一 介面;在另一實施例中互相連接9 0沿著承載基髏之一第一 表面70延伸至有一驅動電路的一介面;對於装設於基髏20 之第二表面7 2的驅動電路30, —焊料連接也被建立,雖然 一替換電氣耦合設計可被使用。 -13- 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐) I------:、I 裝------訂------線 I Ι ν·'1· (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 __ 五、發明説明(11 ) 為了形成通過列印頭1纟延伸的互相連接80,一渠溝92 對於一或多個互相連接80在晶粒52之下侧(例如,第二表 ώ 60)甲被蝕刻;在一實施例中一四甲*阿摩尼亞氫氣化 物蝕刻被實施;一硬式光罩覆蓋其下表面不被蝕刻的晶粒 52之部分;該硬式光罩然後被濕式蝕刻移除;一電漿磺化 或氮化層62和一 Au/Hi/Au層9 6如在第七圖中所示地被沉積 在下表面上;一光敏感聚先安層或一電鍍光阻98被施用在 Au/Ni/Au層9 6之一部分上以界定對於互相連接80金颶要保 留在何處;Au/Ni/Au層96然後被濕式蝕刻且聚先安或光阻 98被移除以界定互相連接8G ;在蝕刻再充填隙槽42時為了 保護Au/Ni/Au,一電漿氧化物(未示)然後被沉積;電漿 氣化物和碩化或氮化層62然後被画型化來界定一窗戶以蝕 刻再充填隙槽42 ;再充填隙槽42和饋送通道44然後被蝕刻 ;請參考第八圖,在次一步驟一或多條路徑99被切通鈍化 層100、102、104及薄膜結構54之一磺化層106和磺化或氪 化層62;路徑99從互相連接80延伸至處理中上方表面;一 路徑101也被切以露出一配線46之一部分;金屬然後被沉 積在路徑99、101上;其次,一傳導線跡107 (請看第八圖 )通常被沉積、被撤影地圖型化、及被蝕刻於薄膜結構54 之一層上以電氣地網合配線46和互相連接80;第二介電層 64 (例如,氮化層)然後被沉積(請看第五圖);一聚先 安或電鍍光阻製程然後被實施以罩住層64並在層64上形成 一開孔以露出互相連接80之一部分(請看第五圖);互相 連接金靥82和濕潤金屬84然後被沉積於互相連接80之露出 _____-14-___ I紙張尺度適用國國家標準(CNS ) Λ4規格(21(^297公处~) 1------ 1裝------訂------線 | _ 1 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消費合作社印掣 A7 B7 五、發明説明(12 ) 部分並以和使用在第二表面.上的其它薄膜者相同的方式被 圖型化和蝕刻;如被製造的互相連接80從一配線46通過承 載基鳢20沿著一渠溝92而延伸至在列印頭18之一第二表面 6 0的一互連金羼82和濕潤金屬84;此後該薄膜結構完成且 通孔層56被施用。 --在承載基體上製造通過互相連接和再充填隙槽的方法 再請參考第五圖,承載基體20包括從基體之一表面延 伸至該基體之相k表面的一互相連接90 ;在一實施例中互 連黏90如上述地藉由蝕刻一渠溝和沉積互連金羼而被形成 予列印頭;在一替換實施例中一直線蝕刻被實施以界定在 基體20上的一通孔110; —電鍍方法然後被實施以用金屬 充填被蝕刻的通孔110 ;該金屬界定互連點90 ;請參考第 九圖,為了電鍍通孔11G,基板20被浸入一電鍍溶液中; 一偏壓信號被施加於基體2(3被附著於其之一電極板11S ; 電極板116被形成使得一偏壓電流不在基髏之墨水再充填 通道32區流通;更特別地,一金屬層115在基體2G和電極 板116間的期望位置形成一接觸;因此,再充填通道32不 被電鍍;另外,只有一値小間隙118在基體20和電極板間 形成;當浸泡在電鍍溶液112中時此防止電鍍基體20之下 表面72。 --耦合列印頭和承載基體的替換互相連接方法 並非形成透過列印頭18之晶粒52而延伸的一互相連接 ,在一替換實施例中一配線接合在列印頭外部形成;請參 考第十圖,一列印頭18 ’被顯示以相似零件給予相同號碼 _- 15 ~_ 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公錄) — 1^------' 1裝------訂------線 (請先閱讀背面之注意事項再填寫本頁) A7 A7 經濟部中央標準局員工消費合作社印製 B7 五、發明説明(U ) ;用於各列印元件24的假別.配線46延伸至個別接觸點120 ;接觸點120被設置在列印頭18’和噴嘴開孔38之同倒上; 一配線122被接合至在列印頭18’上的一接觸點120和在基 體20上的一接觸點130 ;接觸點130被設置在基謾20之一表 面70上;配線122在列印頭18’和基體20間的列印頭18’之 外面延伸;配線122被附於接觸點12G、130; —膠套繞著 配線122被施用以密封該配線並保護它不從列印頭18’或基 體20斷落;基體20包括通過其墨水流向列印頭晶粒18的一 再充填通道32;雖然如此通道被顯示為一筆直蝕刻的通道 ,通道之壁可替換地以一角度被蝕刻,(例如,54 . 7° ); --優點和有利的效果 本發明之一利益在於一可縮放列印頭建構被達成,其 中不同數目之列印頭晶粒被附著於一承載基體以界定該列 印頭之尺寸。 雖然本發明之一較佳實施例以被說明和描逑,各種替 換、修正和等效可被使用;因此,前述描逑不應被取為限 制被所附申請專利範圍所界定的本發明之範醻。 元件组號對昭弟 — 1^------1 裝------訂-----線 (請先閱讀背面之注意事項再填寫本頁) 10寬陣列噴墨筆 12寬陣列列印頭 14筆本體 16内部腔室 18熱式噴墨列印頭晶粒 20承載基體 58列印頭第一表面 60列印頭第二表面 S2、76、64介電層 66、74、88互連金靥 68、76濕潤金屬 78焊料突塊 -16- 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐) 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(w) 22 列 .82 互連金屬層 24 列印元件 84、 86濕潤金屬層 36 噴嘴腔室 99、 101路徑 38 噴嘴開孔 107 傳導線跡 40 發射電阻器 92 渠溝 46 配線 96 Au/Ni/Au層 32 再充填通 道 98 電鍍光阻 42 再充填隙 槽^ 100 、10 2、104 鈍化 44 饋送通道 106 碩化層 52 矽晶粒 110 通孔 54 薄膜結構 112 電鍍溶液 56 通孔層 114 偏壓信號 29 邏輯電路 116 電極板 30 驅動電路 115 金靥層 32、 72基體 第二 表面 118 間隙 28、 70基體 第一 表面 18, 列印頭 50、 80、90 互連 點 120 、130接觸點 52 子基體 122 金屣線 3 4 連接器
In nn —1 - - I —111 11 1^1 I Hu *- ! I— n^i - -- I . ---- - s— - -I— ^ '0 ?u' (請先閱讀背面之注意事項再填寫本頁) -1 7 - 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公f )
Claims (1)
- 經濟部中央標準局員工消費合作社印製 A8 B8 C8 D8 六、申請專利範圍 1 . 一種寬陣列噴墨筆(10),包含有: 一承載基體(20),具有被形成為該基髏中的多餹 逋孔之多個墨水冉无填隙槽(32);、 裝設於該承載基體之一第一面(28)的多舾列印頭 晶粒(18),各列印頭包含一陣列之列印元件(24)和一 墨水再充搆通道(42),該陣列之列印元件的各艏列印 元件包含一嗅嘴腔室(36)、一發射電阻器(4 0)、一饋 送通道(44)、一噴嘴開孔(38)及一配線(46),其中對 於各値列印頭晶粒,一墨水流通路徑被形成從該等多 個墨水再充填隙槽(32)之一經過該一列印頭晶粒之一 墨水再充填通道(4 2)並經過該陣列之多®列印元件之 画別饋送通道(44)進入該等多個列印元件之値別噴嘴 腔室; 裝設於該承載基體之一第二面(72)的多Μ驅動零 路(30),其中該第二面僳該第一面的反面,該等驅動 電路電氣地耦合於該陣列之列印元件的該等配線; 裝設於該承載基體之該第二面的多餹邏輯電路(2 9),該等邏輯電路電氣地耦合於該等驅動電路,其中 該等邏輯電路接牧控制信號並鎏應地産生输出信號給 多艏驅動電路以選取要發射的列印元件。 2·依據申請專利範圍第1項之寛陣列噴墨筆,其中多痼 互連黏(90)在該第一面和該第二面間穿過該承載基體 而形成,以將-各列印頭晶粒之各列印元件之該等配線 耦合至該等驅動電路。 ___- 18 _ 本紙張尺度適用中國國家標準(CNS ) Α4規格(2Ι0Χ297公釐) --------Γ.-裝------訂-------線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央榇準局負工消费合作社印製 A8 B8 C8 D8 六、申請專利範圍 3. 依據申請專利範圍第2,項之寬陣列噴墨筆,其中.用於 备値該,等多値列印頭晶粒之各痼列印元件的噴嘴開孔 ,(38)像在各傾該等多個列印頭聶粒上沿著一共同指向 面(58)遠離該承載基體,且其中各値孩等多健列印頭 晶粒更包含在該共同指向面上的多健接觸點(46),且 其中各個該等多艟列印頭晶粒更包含從該等多艏接觸 點中之一個別者穿過該一列印晶粒延伸成與穿過該承 載基體形成的該等多痼互連點中之一互連點(90)電氣 接觸的多値互連體(80)。 4. 依據申請專利範圍第1項之寛陣列噴墨筆,其中該承 載基體更包含在該承載基體第一面的多値焊料濕潤S (86),其中該等多艏列印頭晶粒各被焊接至一濕潤墊 (84),其中該等基體濕潤墊(86)和晶粒濕潤墊(84)被 ,精確地定置對齊,且其中在一焊料再熔回流時,各傾 該等多艇列印頭磊粒傷順應於濕潤塾對齊狀況。 5 .依據申請專利範圍第4項之寬陣列噴墨筆,其中對於 各個該等多個列印頭晶粒,焊料(78)繞箸在該一列印 晶粒和該承載基體間的該墨水流動路徑形成一流體邊 界。 6.依據申請專利範圍第1項之寬陣列噴墨筆,其中該承 載基體包含矽,且各舾該等多値列印頭晶粒包含矽。 7%依據申請專利範圍第1項之寬陣列噴墨筆,其中該承 載基體包含一個多層陶瓷體,且各値該等多傾列印頭 晶粒包含矽。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) .--------裝------訂------線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A8 B8 C8 D8 六、申請專利範圍 8. —種用於將多値全集搏熱噴墨列印頭晶粒(18)安裝於 '一承載基體(20)上钓方法,該方法包含下列步驟: 製造沿著該承載基艟之一第一表ώσ〇)對齊的多 値焊料濕潤墊(8S); 對於各値該等多個列印頭晶粒,製造在該一列印 頭晶粒之一第一表面(6 0)上的多個焊料濕潤墊(84), 該等多個列印頭晶粒焊料濕潤墊中之各値墊和在該承 載基體上的一對應濕潤墊具有一共同形狀,其中該一 列印頭晶粒具有一第一表面和相反於該第一表面的一 第二表面(58),該第二表面包含多舾噴嘴開孔(38); 對於各個該等多餹列印頭晶粒,將該一列印頭晶 粒固持於該承載基體上並將該一列印頭晶粒焊接於該 承載基體上,其中在焊接時,焊料再熔回流力將該一. 列印頭晶粒之該等濕潤墊移動成與該承載基體之對應 濕潤塾對齊。 9. 依據申請專利範圍第8項之方法,其中該承載基體具 有在該基體中形成為通孔的多値墨水再充填隙槽(32) ,且其中各列印頭晶粒包含一陣列之列印元件(24)和 一墨水再充填通道(42),其中對於各傾列印頭晶粒, 一墨水流動路徑被形成從該等多痼墨水再充填隙槽之 一至該一列印頭晶粒之一墨水再充谋通道,且其中對 於各鏑該等多個列印頭晶粒,焊料繞箸該墨水流動路 徑在該一列印頭晶粒和該承載基體間形成一流體邊界。 10. —種製造延伸通過一噴墨列印頭晶粒(18)的一傳導性 ? Π — 本紙張尺度適用中國國家襟準(CNS ) Α4規格(21{^297公釐) .I-ΊΚ-----装------訂------線 (請先閲讀背面之注意事項Hr#寫本頁) A8 B8 C8 D8 六、申請專利範園 互連點(80)之方法,咳列印頭晶粒包含一陣列之列印 元件(24)和一墨水再充镇通道(42),該陣列之列印元 件中的各個列印元件包含一噴嘴腔室(36)、一發射電 阻器(40)、一饋送通道(44)、一噴嘴開孔(38)及一配 線(4 6),用於各列印元件的噴嘴開孔偽沿著該列印頭 晶粒之一第一表面(58),該方法包含下列步驟: 在該列印頭晶粒相反於該第一表面之一第二表面 (60)上蝕刻出一渠溝(9 2); 沿箸該第一渠溝之一部分沉積一傳導性材料(8〇); 在該列印頭晶粒之該第二表面蝕刻出該墨水再充 填通道(42); 形成從該列印頭晶粒之該第一表面延伸至該傳導 性材料的一開孔; 在該開孔中沉積傳導性材料(80);及 沿著該列印頭晶粒之一第一表面沉積一傳導性線 跡(46),以將該開孔和該渠溝之該傳導性材料電氣地 耦合至一給定列印元件之該配線(46)。 丨-ΊΚ--------裝------訂-------線 *9 / (請先聞讀背面之注意事項寫本頁) 經濟部中央標準局負工消費合作社印製 ------- —__ 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
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-
1997
- 1997-10-28 US US08/959,376 patent/US6123410A/en not_active Expired - Lifetime
-
1998
- 1998-04-30 US US09/070,864 patent/US6325488B1/en not_active Expired - Lifetime
- 1998-09-23 DE DE69828734T patent/DE69828734T2/de not_active Expired - Lifetime
- 1998-09-23 EP EP98307718A patent/EP0913261B1/en not_active Expired - Lifetime
- 1998-10-22 JP JP30051498A patent/JP4202485B2/ja not_active Expired - Fee Related
- 1998-10-27 KR KR10-1998-0045093A patent/KR100496095B1/ko not_active IP Right Cessation
- 1998-12-02 TW TW087109423A patent/TW393406B/zh not_active IP Right Cessation
- 1998-12-17 US US09/216,606 patent/US6322206B1/en not_active Expired - Lifetime
-
2000
- 2000-03-08 US US09/521,872 patent/US6508536B1/en not_active Expired - Fee Related
-
2001
- 2001-08-07 US US09/925,094 patent/US6513907B2/en not_active Expired - Fee Related
- 2001-08-07 US US09/924,879 patent/US6592205B2/en not_active Expired - Fee Related
- 2001-10-05 US US09/972,648 patent/US6435653B1/en not_active Expired - Lifetime
-
2002
- 2002-07-11 US US10/194,843 patent/US6679596B2/en not_active Expired - Lifetime
-
2003
- 2003-11-26 US US10/723,891 patent/US7226156B2/en not_active Expired - Fee Related
-
2008
- 2008-06-25 JP JP2008165982A patent/JP4355777B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0913261A2 (en) | 1999-05-06 |
US20020018101A1 (en) | 2002-02-14 |
US6513907B2 (en) | 2003-02-04 |
JP4202485B2 (ja) | 2008-12-24 |
JP2008221857A (ja) | 2008-09-25 |
US20040113996A1 (en) | 2004-06-17 |
JPH11192705A (ja) | 1999-07-21 |
DE69828734T2 (de) | 2006-01-05 |
US20020033861A1 (en) | 2002-03-21 |
DE69828734D1 (de) | 2005-03-03 |
US20020180835A1 (en) | 2002-12-05 |
KR19990037428A (ko) | 1999-05-25 |
US6435653B1 (en) | 2002-08-20 |
KR100496095B1 (ko) | 2005-09-26 |
US6508536B1 (en) | 2003-01-21 |
US6325488B1 (en) | 2001-12-04 |
US7226156B2 (en) | 2007-06-05 |
JP4355777B2 (ja) | 2009-11-04 |
EP0913261B1 (en) | 2005-01-26 |
US20020015073A1 (en) | 2002-02-07 |
US6679596B2 (en) | 2004-01-20 |
EP0913261A3 (en) | 2000-03-22 |
US6322206B1 (en) | 2001-11-27 |
US6592205B2 (en) | 2003-07-15 |
US6123410A (en) | 2000-09-26 |
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