US20020033861A1 - Multilayered ceramic substrate serving as ink manifold and electrical interconnection platform for multiple printhead dies - Google Patents
Multilayered ceramic substrate serving as ink manifold and electrical interconnection platform for multiple printhead dies Download PDFInfo
- Publication number
- US20020033861A1 US20020033861A1 US09/972,648 US97264801A US2002033861A1 US 20020033861 A1 US20020033861 A1 US 20020033861A1 US 97264801 A US97264801 A US 97264801A US 2002033861 A1 US2002033861 A1 US 2002033861A1
- Authority
- US
- United States
- Prior art keywords
- ink
- reservoir
- substrate
- inlet opening
- manifold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 110
- 239000000919 ceramic Substances 0.000 title claims abstract description 31
- 238000007639 printing Methods 0.000 claims description 33
- 238000010304 firing Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 239000012530 fluid Substances 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 238000007641 inkjet printing Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000976 ink Substances 0.000 description 117
- 239000003086 colorant Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
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- 230000008569 process Effects 0.000 description 4
- 230000003134 recirculating effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
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- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
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- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- ORMNNUPLFAPCFD-DVLYDCSHSA-M phenethicillin potassium Chemical compound [K+].N([C@@H]1C(N2[C@H](C(C)(C)S[C@@H]21)C([O-])=O)=O)C(=O)C(C)OC1=CC=CC=C1 ORMNNUPLFAPCFD-DVLYDCSHSA-M 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
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- 230000004888 barrier function Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Abstract
Description
- This is a continuation in part of commonly-assigned U.S. Pat. application Ser. No. 08/959,376, “Scalable Wide-Array Inkjet Printhead and Method for Fabricating Same,” filed on behalf of Timothy Beerling et al. on Oct. 28, 1997.
- This invention relates generally to inkjet printhead construction, and more particularly, to wide-array inkjet printhead construction.
- There are known and available commercial printing devices such as computer printers, graphics plotters and facsimile machines which employ inkjet technology, such as an inkjet pen. An inkjet pen typically includes an ink reservoir and an array of inkjet printing elements, referred to as nozzles. The array of printing elements is formed on a printhead. Each printing element includes a nozzle chamber, a firing resistor and a nozzle opening. Ink is stored in the ink reservoir and passively loaded into respective firing chambers of the printhead via an ink refill channel and ink feed channels. Capillary action moves the ink from the reservoir through the refill channel and ink feed channels into the respective firing chambers. Conventionally, the printing elements are formed on a common substrate.
- For a given printing element to eject ink a drive signal is output to such element's firing resistor. Printer control circuitry generates control signals which in turn generate drive signals for respective firing resistors. An activated firing resistor heats the surrounding ink within the nozzle chamber causing an expanding vapor bubble to form. The bubble forces ink from the nozzle chamber out the nozzle opening.
- A nozzle plate adjacent to the barrier layer defines the nozzle openings. The geometry of the nozzle chamber, ink feed channel and nozzle opening defines how quickly a corresponding nozzle chamber is refilled after firing. To achieve high quality printing ink drops or dots are accurately placed at desired locations at designed resolutions. It is known to print at resolutions of 300 dots per inch and 600 dots per inch. Higher resolution also are being sought
- There are scanning-type inkjet pens and non-scanning type inkjet pens. A scanning-type inkjet pen includes a printhead having approximately 100-200 printing elements. A non-scanning type inkjet pen includes a wide-array or page-wide-array printhead. A page-wide-array printhead includes more than 5,000 nozzles extending across a pagewidth. Such printhead is controlled to print one or more lines at a time.
- In fabricating wide-array printheads the size of the printhead and the number of nozzles introduce more opportunity for error. Specifically, as the number of nozzles on a substrate increases it becomes more difficult to obtain a desired processing yield during fabrication. Further, it is more difficult to obtain properly sized substrates of the desired material properties as the desired size of the substrate increases.
- In the related matter, cross-referenced above, a scalable wide-array printhead structure is described in which multiple inkjet printhead dies are mounted to a carrier substrate. One of the challenges in forming a wide array printhead with multiple printhead dies is the number of interconnections which occur. Many electrical interconnections are needed. In addition, many ink connections are required to deliver the inks. In a three-color, four inch, wide-array printhead having 34 printhead dies, for example, there are at least 102 fluid interconnections (i.e., 3×34=102).
- According to the invention, a multilayer ceramic substrate includes many ink channels for routing ink from a reservoir to a plurality of printhead dies. The ceramic substrate serves as a carrier substrate for the dies and as an ink manifold for routing ink. The ceramic substrate also serves to interconnect the printhead dies and provide electrical signal routing.
- According to one aspect of the invention, an inkjet pen includes the multilayered ceramic substrate. Ink is received from an ink reservoir at an inlet opening. The ink flows through a manifold to a plurality of ink feed slots adjacent to corresponding printhead dies. The printhead dies are mounted to a first side of the carrier substrate. Each printhead die includes an array of printing elements and an ink refill slot. Each one of the plurality of printhead dies receives ink at the ink refill slot from the reservoir by way of the carrier substrate's ink feed slot. Ink flows from the die's refill slot to the printing elements. For a recirculating ink system, ink leaves the manifold back toward the reservoir through an outlet opening.
- According to another aspect of the invention, the inkjet manifold is formed within the carrier substrate. Layers of the carrier substrate include overlapping slots which, when the layers are stacked, define ink channels which carry ink from one side of the carrier substrate (e.g., adjacent the ink reservoir) to the other side of the carrier substrate (e.g., to the printhead dies). The reservoir is fluidly coupled to one side of the carrier substrate. The printhead dies are fluidly coupled to the other side of the carrier substrate.
- According to another aspect of the invention, layers of the carrier substrate include slots which define a portion of one or more manifold channels and electrical wiring lines for interconnecting the printhead dies.
- According to another aspect of the invention, a manifold channel may be of various shapes, such as a large cavity or a serpentine channel. The ink inlet opening occurs in one layer of the substrate. For a recirculating system the outlet opening back to the reservoir also occurs in such one layer. The manifold channel extends through the layers of the substrate to a plurality of ink feed slots open in another layer of the substrate. The printhead dies are mounted adjacent to such ink feed slots in such other layer.
- According to another aspect of the invention, the pen includes multiple reservoirs, one for each color of ink. Separate inlet openings and manifold channels are formed in the carrier substrate to pass ink from a respective reservoir to the printhead dies. A first fluid path occurs from a first inlet opening to a first set of the ink feed slots and a second fluid path occurs from a second inlet opening to a second set of ink feed slots.
- The inkjet pen is part of a printing system which also includes a housing, a mounting assembly, a media transport assembly, and a controller. The inkjet pen is positioned at the mounting assembly and includes a plurality of printing elements. A print zone occurs adjacent to the plurality of printing elements along a media path. The media transport assembly moves a media sheet along the media path into the print zone. The controller determines a timing pattern for ejecting ink from the plurality of printing elements onto the media sheet.
- According to another aspect of the invention, one method for loading the plurality of inkjet nozzles, includes replacing the internal reservoir of the pen, and flowing ink from the internal reservoir into the ink manifold of the carrier substrate. The carrier substrate has an inlet opening coupled to the internal reservoir. The ink manifold fluidly connects the inlet opening to a plurality of ink feed slots at the carrier substrate. The ink feed slots are positioned adjacent to ink refill slots of printhead dies which are mounted to the carrier substrate. Ink flows into the respective ink refill slots, then into a plurality of nozzle chambers. Ink is fired from the nozzle chambers to print onto a media sheet.
- One advantage of the invention is that a manifold for handling multiple colors of ink is formed in an unitary printhead assembly. These and other aspects and advantages of the invention will be better understood by reference to the following detailed description taken in conjunction with the accompanying drawings.
- FIG. 1 is a block diagram of an inkjet printing system according to an embodiment of this invention;
- FIG. 2 is a perspective view of an inkjet pen according to an embodiment of this invention;
- FIG. 3 is a perspective view of a portion of an inkjet printhead assembly according to an embodiment of this invention;
- FIG. 4 is a partial cross-sectional view showing an ink flow path from a reservoir to an inkjet nozzle according to the printing system of FIG. 1;
- FIG. 5 is a diagram of multiple layers of a ceramic carrier substrate of FIG. 4;
- FIG. 6 is a planar view of a top layer of the ceramic substrate of FIG. 5;
- FIG. 7 is a planar view of a bottom layer of the ceramic substrate of FIG. 5;
- FIG. 8 is a planar view of a manifold layer of the ceramic substrate of FIG. 5;
- FIG. 9 is a planar view of a manifold layer of the ceramic substrate of FIG. 5 according to an alternative embodiment of this invention;
- FIG. 10 is a diagram of a manifold channel and multiple printhead dies according to an embodiment of this invention;
- FIG. 11 is a planar view of a top layer of the ceramic substrate of FIG. 5 according to a 2-color embodiment of substrate of FIG. 4;
- FIG. 12 is a planar view of a layer of the ceramic substrate of FIG. 5 according to a 3-color embodiment;
- FIG. 13 is a planar view of another layer of the ceramic substrate of FIG. 5 according to a 3-color embodiment;
- FIG. 14 is a planar view of another layer of the ceramic substrate of FIG. 5 according to a 3-color embodiment;
- FIG. 15 is a planar view of another layer of the ceramic substrate of FIG. 5 according to a 3-color embodiment;
- FIG. 16 is a planar view of another layer of the ceramic substrate of FIG. 5 according to a 3-color embodiment; and
- FIG. 17 is a diagram of a 3-color inkjet pen according to an embodiment of this invention.
- Printing System
- Referring to FIG. 1, a thermal
inkjet printing system 10 includes aninkjet printhead assembly 12, anink supply assembly 14, a mountingassembly 16, amedia transport assembly 18, ahousing 20 and anelectronic controller 22. Theinkjet printhead assembly 12 is formed according to an embodiment of this invention, and includes one or more printheads having a plurality ofinkjet nozzles 17 which eject ink onto a media sheet M. Theprinthead assembly 12 receives ink from theink supply assembly 14. Theink supply assembly 14 includes areservoir 15 for storing the ink. Theink supply assembly 14 andprinthead assembly 12 form either a one-way ink delivery system or a recirculating ink delivery system. For the recirculating ink delivery system, ink flows from the reservoir into the printhead assembly. Some of the ink travels into printhead dies and nozzle chambers, while other portions of ink return to the ink reservoir. - In some embodiments the
ink supply assembly 14 andinkjet printhead assembly 16 are housed together in an inkjet pen or cartridge. In other embodiments theink supply assembly 14 is separate from theinkjet printhead assembly 12 and feeds ink to the printhead assembly through an interface connection, such as a supply tube. For either approach the ink supply may be removed, replaced and/or refilled. For example, in an inkjet pen having an internal reservoir, the pen may be disassembled and the internal reservoir removed. A new, filled reservoir then is placed within the pen, and the pen reassembled for re-use. Alternatively, the prior reservoir may be refilled and reinstalled in the pen or filled in place without removal from the pen (an in some embodiments without even disassembling the pen). In some embodiments there is a local reservoir within the pen along with a larger reservoir located separate from the pen. The separate reservoir serves to refill the local reservoir. In various embodiments, the separate reservoir and/or the local reservoir may be removed, replaced and/or refilled. - The
inkjet printhead assembly 12 is mounted relative to thehousing 20 to define aprint zone 19 adjacent to theprinthead nozzles 17 in an area which is to receive the media sheet M. The media sheet M is moved into theprint zone 19 by themedia transport assembly 18. The mountingassembly 16 positions theprinthead assembly 12 relative to themedia transport assembly 18. For a scanning type inkjet printhead assembly, the mountingassembly 16 includes a carriage for moving theprinthead assembly 12 relative to a media transport path to scan theprinthead assembly 12 relative to the media sheet. For a non-scanning type inkjet printhead assembly, the mountingassembly 16 fixes theinkjet printhead assembly 12 at a prescribed position along the media transport path. - The
electronic controller 22 receives documents, files orother data 21 to be printed from a host system, such as a computer. Typically, a print job is sent to theinkjet printing system 10 along an electronic, infrared, optical or other information transfer path. The print job includes data and one or more commands or command parameters. Theelectronic controller 22 includes memory for temporarily storing the data. Theelectronic controller 22 provides timing control for firingrespective inkjet nozzles 17 to define a pattern of ejected ink drops which form characters, symbols or other graphics on the media sheet M. The pattern is determined by the print job data and print job commands or command parameters. - Upon activation of a given
firing resistor 50, ink within the surroundingnozzle chamber 46 is ejected through thenozzle opening 48 onto a media sheet M. Theelectronic controller 22 selects whichfiring resistors 50 are active at a given time by activating corresponding drive signals to heat thecorresponding firing resistors 50. In one embodiment logic circuits and drive circuits forming a portion of thecontroller 22 are mounted to thesubstrate 32 of theprinthead assembly 12. In an alternative embodiment logic circuitry and drive circuitry are located off theprinthead assembly 12. - Referring to FIG. 2, according to a preferred embodiment the
printhead assembly 12 includes a plurality of inkjet printhead dies 30 mounted to a multilayeredceramic carrier substrate 32. Illustrated is a pagewide array inkjet pen. Thesubstrate 32 is affixed to apen body 34. Within thepen body 34 is areservoir 36 which serves as, or is part of theink supply assembly 14. Theprinthead assembly 12 may span a nominal page width or a shorter or longer width, and may be of the scanning type or non-scanning type. In various embodiments, as described above, the reservoir is a replaceable or refillable reservoir. In one embodiment the reservoir is coupled to an external reservoir which supplies the local reservoir. In another embodiment the reservoir is non-refillable. - Referring to FIG. 3, the
printhead assembly 12 may be formed by a plurality ofprinthead subassemblies 13. Eachsubassembly 13 includes a plurality of inkjet printhead dies 30 mounted to a multilayeredceramic carrier substrate 32. Thesubstrate 32 has stairstepedges 24 allowing thesubassemblies 13 to be mounted end to end to form theprinthead assembly 12. Eachsubassembly 13 hasmultiple rows 38 of printhead dies 30.Such rows 38 are staggerred to the stairstep design of thecarrier substrate 32. In a preferred embodiment the printhead dies are spaced at a distance d. The printhead dies closest to theedges 24 are sppaced a distance d/2 from theedge 24. When the carrier substrates are mounted end to end, continuous rows of dies 30 are formed with each die evenly spaced (e.g., at a spacing distance ‘d’). - Printhead Dies
- The printhead dies30 are aligned in one or
more rows 38 on afirst surface 40 of thecarrier substrate 32. Referring to FIG. 2, each one of the printhead dies 30 includes a plurality ofrows 42 ofinkjet printing elements 44, also referred to as nozzles. Each printhead die 30 includes an array ofprinting elements 44. Referring to FIG. 4, eachprinting element 44 includes anozzle chamber 46 having anozzle opening 48. A firingresistor 50 is located within thenozzle chamber 46.Wiring lines 52 electrically couple the firingresistor 50 to a drive signal and ground. Each printhead die 30 also includes arefill channel 54. Ink flows from theinternal reservoir 36 through one or more carriersubstrate refill channels 60 to therefill channels 54 of the printhead dies 30. Ink flows through eachprinthead refill channel 54 into theprinthead nozzle chambers 46 viaink feed channels 56. - In one embodiment one or more of the printhead dies30 is a fully integrated thermal inkjet printhead formed by a
silicon die 62, athin film structure 64 and anorifice layer 66. Glass or a stable polymer are used in place of the silicon in alternative embodiments. Thethin film structure 64 is formed by one or more passivation or insulation layers of silicon dioxide, silicon carbide, silicon nitride, tantalum, poly silicon glass, or another suitable material. The thin film structure also includes a conductive layer for defining the firingresistor 50 and the wiring lines 52. The conductive layer is formed by aluminum, gold, tantalum, tantalum-aluminum or other metal or metal alloy. - Carrier Substrate
- The
carrier substrate 32 in a preferred embodiment is made of a multilayered ceramic material, such as used in forming hybrid multichip modules. Thesubstrate 32 preferably has a coefficient of thermal expansion approximating that of silicon, is able to receive solder and interconnect layers, and is able to receive mounting of integrated circuits. Referring to FIG. 5, thesubstrate 32 includes atop layer 70 upon which the printhead dies 30 are mounted, abottom layer 72 upon which anintegrated circuit 79 may be mounted, and severalintermediary layers 73. The intermediary layers 73 may be allocated into oneset 74 for electrical interconnection and another set 76 for ink manifold distribution. The electrical interconnection layers include one or more signal distribution layers 78,apower plane layer 80, and aground plane layer 82 as well as interconnection to the printheads and integrated circuits. Even the electrical interconnection layers, however, may include slots for allowing ink to move vertically from one layer to another. - In a preferred embodiment, electrical interconnection layers and manifold layers are embodied in common layers. Thus, many of the
intermediary layers 73 serve to provide wiring lines and to define portions of one or more ink manifold channels. The ink manifold channels 60 (see FIG. 4) receive ink from thereservoir 36. The ink flows through the manifold channels to respective slots 54 (see FIG. 4) for each printhead die 30. For multi-colored printhead assemblies, there are isolated manifold channels for each ink color and separate output slots for dies receiving a respective color. - Each of the ceramic layers70-73 has a thickness ranging from 0.004 inches to 0.030 inches. The
layers 73 which include circuit patterns include conductive vias which pierce thelayers 73 to form electrical interconnects between circuits. In one fabrication methodology, circuit patterns are formed in layers of unfired tape (referred to as a green sheet) using a screen printing process. The green sheet is made of ceramic particles in a polymer binder. Alumina preferably is used for the particles, although other oxides or various glass/ceramic blends also may be used. The green tape has the texture of flexible vinyl. - Each green sheet layer receives conductor lines and other metallization patterns as needed to define the signal distribution planes78, the
power plane 80, and theground plane 82. Such lines and patterns are formed with a refractory metal, such as tungsten, by screen printing on the corresponding green sheet layer. Electrical interconnects are made from one layer to the next through via holes punched out from the green sheet and filled in, for example, with a tungsten paste. - The
ink channels 60 are formed by punching holes and cavities of desired size and shape through the alumina tape. Once each layer has received the desired metallization, vias and openings, the layers 70-73 are stacked in the desired configuration and laminated under pressure. The substrate then is shaped to a desired outer dimension size allotting for shrinkage during a subsequent processing. Next, the ceramic and metallization materials are cosintered at approximately 1600 C., creating a monolithic structure having a three dimensional wiring system and internal ink manifold. Metal parts such as I/O pins and seal rings are attached with a molten brazing process, such as a silver-copper eutectic brazing or a pure silver brazing. Exposed metal and metallization surfaces then are covered in a plating process, such as a nickel plating process and a finish plating, such as a gold plating with nickel undercoating. The finish plating provides a surface which may receive solder or wire bonding material allowing electrical connections to thesubstrate 32. Thetop layer 70 typically is metallized in preparation for surface mounting the printhead dies 30. - Embodiments of the ink manifold now are described with respect to FIGS.6-17. FIGS. 6-9 refer to a single color ink manifold. The
top layer 70 of theceramic substrate 32 includes anink feed slot 84 for each printhead die 30. Referring to FIG. 7, thebottom layer 72 includes at least oneinlet opening 86 for receiving ink from thereservoir 36. In some embodiments the ink cycles through thesubstrate 32 back to thereservoir 36. In such an embodiment thebottom layer 72 also includes at least oneoutlet opening 88. For a non-cycling embodiment there is no need for an ink outlet opening at thebottom layer 72. The flow path for the ink through thesubstrate 32 between thetop layer 70 andbottom layer 72 is defined primarily by the set oflayers 73. - In one embodiment, a large cavity90 as shown in FIG. 8 serves as the manifold for fluidly coupling the
inlet openings 86 to theoutlet opening 88 and theink slots 84. In another embodiment aserpentine path 92 as shown in FIG. 9 serves as the manifold for fluidly coupling theinlet openings 86 to theoutlet opening 88 and theink slots 84. It is desired that theflow path 90 or 92 minimize flow resistance, avoid bubble traps and achieve a desired ink flow rate. The cavity 90 or theserpentine path 92 may be ofrmed in one or more layers 73. Vertical openings are formed in the intervening layers to complete a channel from thetop layer 70 to thebottom layer 72. - In another embodiment, the
manifold channels 60 are formed by slots in the various layers 73. When thelayers 73 are stacked a three-dimensional channel 60 is formed having a desired shape and path. A givenlayer 73 may include ink slots along with electircal interconnection vias or wiring lines. FIG. 10 shows anexemplary manifold channel 60. For purposes of illustration thechannel 60 is shown without the defining walls of the forming layers 73. Ink flows from aninlet opening 86 through thechannel 60 to areturn outlet opening 88 and to severalink feed slots 84 adjacent respective printhead dies 30. In the embodiment illustrated there are twomajor trunks manifold channel 60. One trunk feeds the other. Eachtrunk more rows 38 of printhead dies 30.Subchannels 65 extend to and from a trunk to acorresponding feed slot 84. - For printhead dies30 which concurrently handle multiple colors of ink, there are separate slots in the
die 30 for each color of ink. Such slot is connected to inkjet nozzles which eject ink of the same color, and is isolated from nozzles which eject ink of different color. For such an embodiment theceramic substrate 32 includes correspondingslots 84 in thetop layer 70. FIG. 11 shows an embodiment of atop layer 70′ withslots 84′, 84″ for each die 30.Slot 84′ handles ink of one color.Slot 84″ handles ink of another color. The bottom layer includes an inlet opening and an outlet opening for each color ink (in similar manner as shown for a single color ink system in FIG. 7). The inlet opening and outlet opening for a given color are coupled to a reservoir of ink for such color. - FIGS.12-16 show respective layers forming a
substrate 32 for a three color printing system. Referrring to FIG. 12,layer 72 includes threerespective inlet openings 86 a-c, one for each color of ink and threerespective outlet openings 88 a-c, one for each color of ink. Also shown are a plurality ofvias 89 for electrical interconnection. Referring to FIG. 13, alayer 73 a for being mounted adjacent to layer 72, includes a plurality of slots 100-111 and thevias 89. Referring to FIG. 14, alayer 73 b for being mounted adjacent to layer 73 a (opposite layer 72), includes a plurality of slots 112-135, thevias 89 andseveral wiring lines 136. Referring to FIG. 15, alayer 73 c for being mounted adjacent to layer 73 b (oppositelayer 73 a), includes a plurality of slots 137-166, thevias 89 andseveral wiring lines 167. Referring to FIG. 16, alayer 70 for being mounted adjacent to layer 73 c (oppositelayer 73 b), includes a plurality ofslots 84′, 84″, and 84′″, thevias 89 andseveral wiring lines 168. Eachslot 84′ corresponds to a feed slot for feeding one color of ink. Eachslot 84″ corresponds to a feed slot for feeding a second color of ink. Eachslot 84′″ corresponds to a feed slot for feeding a third color of ink. Theslots 84 are arranged in groups of threeslots 84′, 84″ and 84′″. A given printhead die 30 is mounted to fluidly couple to a corresponding group of three slots for a die 30 which prints three colors of ink. When theselayers inlet 86 a to feedslots 84′ andoutlet 88 a. An independent channel is formed which connectsinlet 86 b to feedslots 84″ andoutlet 88 b. A third channel is formed which connectsinlet 86 c to feedslots 84′″ andoutlet 88 c. One channel serves a first reservoir. The second channel serves a second reservoir. The third channel serves a third reservoir. - FIG. 17 shows a block diagram for a
pen 200 embodying a three channel printing system which prints 3 colors of ink. Thepen 200 includes threereservoirs ceramic substrate 32 includes abottom layer 72 having at least threeinlet openings 86 a-c and at least threecorresponding outlet openings 88 a-c. Aninlet opening 86 and a corresponding outlet opening 88 are coupled to a corresponding reservoir. In addition manifold layers 73 define 3independent fluid paths 92′, 92″, 92′″ for the 3 respective colors of ink. The manifold layers 73 are coupled to thetop layer 70 adjacent to the printhead dies 30. Thetop layer 70 includes a set of 3slots 84′, 84″, 84′″ for each printhead die 30. One slot is coupled to a corresponding one of the three independent channels and thus to a corresponding color of ink. - Detailed descriptions of the method for mounting and interconnecting the printhead dies30 to the
substrate 32 are described in the related application of Beerling et al. cross-referenced above and included herein by reference. - Meritorious and Advantageous Effects
- One advantage of the invention is that a manifold for handling multiple colors of ink is formed in a unitary printhead assembly. Another advantage is that a scalable printhead architecture is achieved in which different numbers of printhead dies are attached to a carrier substrate to define the size of the printhead. Printhead which are a page wide array of printing elements may be formed. Smaller printheads also may be formed.
- Although a preferred embodiment of the invention has been illustrated and described, various alternatives, modifications and equivalents may be used. For example, although a page wide array printhead is illustrated, a smaller array scanning type printhead also may be formed. Therefore, the foregoing description should not be taken as limiting the scope of the inventions which are defined by the appended claims.
Claims (19)
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EP1415812A1 (en) * | 2002-10-30 | 2004-05-06 | Hewlett-Packard Development Company, L.P. | Fluid delivery for printhead assembly |
US20050024457A1 (en) * | 2003-07-30 | 2005-02-03 | Fuji Xerox Co., Ltd. | Devices for dissipating heat in a fluid ejector head and methods for making such devices |
US20060028505A1 (en) * | 2004-08-09 | 2006-02-09 | Olympus Corporation | Liquid jet head |
US20080299361A1 (en) * | 2007-06-04 | 2008-12-04 | Frank Edward Anderson | Composite Ceramic Substrate For Micro-Fluid Ejection Head |
US20150070438A1 (en) * | 2013-09-10 | 2015-03-12 | Canon Kabushiki Kaisha | Liquid ejection head and liquid ejection apparatus |
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Also Published As
Publication number | Publication date |
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DE69828734T2 (en) | 2006-01-05 |
TW393406B (en) | 2000-06-11 |
KR19990037428A (en) | 1999-05-25 |
US20020015073A1 (en) | 2002-02-07 |
US6508536B1 (en) | 2003-01-21 |
US6435653B1 (en) | 2002-08-20 |
JP4355777B2 (en) | 2009-11-04 |
JP4202485B2 (en) | 2008-12-24 |
JP2008221857A (en) | 2008-09-25 |
KR100496095B1 (en) | 2005-09-26 |
JPH11192705A (en) | 1999-07-21 |
US20020180835A1 (en) | 2002-12-05 |
US6592205B2 (en) | 2003-07-15 |
US7226156B2 (en) | 2007-06-05 |
US6325488B1 (en) | 2001-12-04 |
US6679596B2 (en) | 2004-01-20 |
US6123410A (en) | 2000-09-26 |
DE69828734D1 (en) | 2005-03-03 |
US6322206B1 (en) | 2001-11-27 |
US6513907B2 (en) | 2003-02-04 |
EP0913261A2 (en) | 1999-05-06 |
US20040113996A1 (en) | 2004-06-17 |
EP0913261A3 (en) | 2000-03-22 |
US20020018101A1 (en) | 2002-02-14 |
EP0913261B1 (en) | 2005-01-26 |
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