JP5065453B2 - LIQUID DISCHARGE HEAD SUBSTRATE, METHOD FOR MANUFACTURING SAME, LIQUID DISCHARGE HEAD USING LIQUID DISCHARGE HEAD SUBSTRATE, AND METHOD FOR MANUFACTURING SAME - Google Patents

Description

  The present invention relates to a liquid discharge head substrate that discharges liquid to perform recording on a recording medium, a manufacturing method thereof, a liquid discharge head using the liquid discharge head substrate, and a manufacturing method thereof.

  A liquid discharge head (hereinafter also referred to as a head) provided by bonding a liquid discharge head substrate (hereinafter also referred to as a head substrate) to a support substrate is mounted on a liquid discharge device, and the discharge port of the liquid discharge head A recording operation is performed on the recording medium by discharging a liquid such as ink from the recording medium.

  In order to make such electrical connection between the head substrate and the support substrate, Patent Document 1 discloses a configuration in which an electrode is provided on the back surface penetrating from the front surface to the back surface of the silicon substrate. The head disclosed in Patent Document 1 is shown in FIG. The recording element substrate H1100 having the back electrode and the holding substrate H1200 are mounted by being electrically connected via an electric bump H1105 used as an electrical connection portion.

JP 2007-326240 A

  The head substrate is provided by simultaneously forming and cutting a plurality of head substrates on a silicon substrate or the like using a semiconductor manufacturing technique. For this reason, as the size of each head substrate increases, the number of head substrates that can be formed from a single silicon substrate decreases, resulting in increased manufacturing costs. Therefore, it is required to reduce the area of the head substrate. ing. Also, from the viewpoint of achieving a reduction in the size of a liquid discharge apparatus that mounts a liquid discharge head, there is a demand for downsizing the head substrate.

  However, in the configuration of the head of Patent Document 1, a certain distance is provided between the ink supply port and the electric bump H1105 in order to prevent ink penetration, and the sealant H1317 that blocks the ink around the electric bump H1105. Is provided. If this distance is shortened, the ink may permeate and the electrodes may corrode. Therefore, it is difficult to reduce the area of the head substrate by shortening the distance.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a liquid discharge head substrate that can achieve prevention of ink soaking into an electrode and reduce the area of the liquid discharge head substrate.

  A substrate for a liquid discharge head according to the present invention includes a first surface provided with a plurality of elements that generate energy used for discharging a liquid, and a second surface that is a surface opposite to the first surface. And a substrate electrically connected to the plurality of elements, from the first surface to the second surface, to a position between the first surface and the second surface A plurality of electrodes provided; an electrode layer commonly connected to the plurality of electrodes at a position between the first surface and the second surface; the first surface and the second surface; And a member made of a resin that is provided from a position between the surface and the second surface and covers the electrode layer.

  By providing a recess in the head substrate and sealing the gap between the recess and the support substrate, the distance between the electrode and the supply port can be prevented from penetrating ink into the electrode layer even when the head substrate is reduced. can do.

  As a result, it is possible to provide a liquid ejection head that can achieve both the prevention of ink soaking into the electrode layer and the reduction of the liquid ejection head substrate.

It is sectional drawing of the conventional board | substrate for heads. It is a perspective view of the liquid discharge head of an example of the present invention. It is an upper surface schematic diagram of the substrate for heads of an example of the present invention. It is an example of sectional drawing corresponding to A-A 'and C-C' of the board | substrate for heads of FIG. It is an example of sectional drawing explaining the manufacturing method of the board | substrate for heads. It is sectional drawing explaining the manufacturing method of the board | substrate for heads. FIG. 4 is an example of a cross-sectional view corresponding to B-B ′ of the head substrate of FIG. 3. It is an example of sectional drawing corresponding to A-A 'and C-C' of the board | substrate for heads of FIG. FIG. 4 is an example of a cross-sectional view corresponding to B-B ′ of the head substrate of FIG. 3. It is an example of sectional drawing explaining the manufacturing method of a support substrate. It is an example of sectional drawing explaining the manufacturing method of a support substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 2 is a top view of a liquid discharge head (hereinafter also referred to as a head) using the present invention. A liquid discharge head substrate 82 (hereinafter also referred to as a head substrate) is electrically connected by a flexible film wiring substrate 73 and is electrically connected to a contact pad 74. The head 83 is configured by pasting them on the ink tank 81. The contact pad 74 is used for connection between the head 83 and the liquid ejection device. Here, the head 83 is an example of a head in which the head and the ink tank are integrated, but the head and the ink tank may be separated.

  FIG. 3 is a top view schematically showing the head substrate. In FIG. 3A, three supply port arrays each including a plurality of ink supply ports 303 that supply one type of ink are provided, and the head uses three types of ink (for example, yellow, magenta, and cyan). A head substrate 82 is shown. FIG. 3B shows a head substrate 82 in which one supply port array including a plurality of ink supply ports 303 for supplying one type of ink is provided and one type of ink is used.

  The head substrate 82 shown in FIGS. 3A and 3B includes a heating element 201 that uses energy for ejecting ink as a generation element, and individual power that is individually provided to supply power to the heating element 201. Wiring 206 is provided. In addition, element rows configured by arranging a plurality of heating elements 201 are provided on both sides of the supply port row along a supply port row including a plurality of supply ports 303 for supplying one type of ink. . The drive circuit unit 204 is provided along the element row of the heating elements 201 at a position opposite to the supply port row, and outputs a signal for controlling the driving of each heating element 201.

  FIG. 4A shows an example of a cross-sectional view of such a head substrate corresponding to the position A-A ′ in FIG. The heating element 201 is provided on the first surface 102 of the substrate 101 made of silicon, and a protective layer 208 that protects the heating element 201 from ink or the like is provided on the heating element 201. On the protective layer 208, there are provided an ejection port 301 provided at a position corresponding to the heat generating element 201 and an ejection port member 304 constituting an ink flow path 302 communicating with the ejection port 301. The substrate 101 is provided with a plurality of supply ports 303 that supply ink to be discharged from the discharge ports 301 and communicate with the flow path 302 so as to penetrate the substrate 101.

  The substrate 101 is provided with a recess so that the third surface 104 is exposed between the first surface 102 and the second surface 103 which is the opposite surface of the first surface 102. Between the third surface and a surface parallel to the second surface of the substrate, that is, between the third surface 104 and the support substrate 401 that supports the head substrate 82 when mounted on the support substrate 401. The first recess 105 is used. Inside the first recess 105, it is electrically connected to two element rows provided between two adjacent supply port rows, and is used as an electrode layer 202 used as a common GNDH wiring and a VH wiring. An electrode layer 203 is provided.

  The substrate 101 is provided with a through electrode 205 in which a through hole penetrating the first surface 102 and the third surface 104 is filled with a conductive material. The electrode layer 202, the electrode layer 203, and the (power wiring 13) are provided so as to be connected to the plurality of through electrodes 205. The through electrode 205 is provided so that the plurality of heating elements 201 and the common electrode layer 202 and electrode layer 203 are electrically connected to each other by connecting to the individual power wiring 206 provided individually on the heating element 201. It has been.

  The electrode layer 202 and the electrode layer 203 are connected to a connection terminal 207 provided on the head substrate, and are electrically connected to the support substrate 401 of the head substrate via the connection terminal 207. Here, the electrode layer 202 also functions as a ground wiring of the drive circuit, and is desirably low resistance. By reducing the resistance of the ground wiring, the potential difference between the source and gate of the drive circuit constituted by a driver such as a MOSFET can be increased, and the drive capability of the FET can be improved. The resistance value of such an electrode layer can be controlled by adjusting the film thickness of the electrode layer 202 or the electrode layer 203.

  Further, only the electrode layer 202 used as the GNDH wiring or only the electrode layer 203 used as the VH wiring is connected to the heating element 201 provided on both sides of the first concave 105 inside the first concave portion 105. Either one can be provided. In this way, the number of head substrates that can be formed from one wafer can be increased only by providing one of the electrode layers inside the first recess 105.

  Further, as shown in FIG. 4B, the electrode layers that are electrically connected to the two element rows provided on both sides of the first recess 105 can be made common. Specifically, the heating element 201 of the first element row provided along the first supply port row and the second heating port 201 provided along the second supply port row adjacent to the first supply port row. The heating element 201 in the second element row is connected in common to the electrode layer 202 and the electrode layer 203 inside the first recess 105. Thus, by reducing the electrode layer 202 and the electrode layer 203 provided in the first recess 105, the area required for the first recess 105 can be reduced, and further cost reduction can be achieved.

  FIG. 4C is a cross-sectional view taken along the line C-C in FIG. 3B in which one supply port array including a plurality of supply ports 303 for supplying one type of ink is provided. The element rows are provided on both sides of the supply port row along one supply port row, and the electrode layers electrically connected to these element rows are provided on both sides of the supply port row along the supply port row. The first recess 105 is provided. Inside the first recess 105, both or one of the electrode layer 202 and the electrode layer 203 can be provided.

  A member 402 made of resin is provided inside the first recess 105 in which both or one of the electrode layer 202 and the electrode layer 203 is provided. By covering the entire third surface provided with the electrode layer 202 and the electrode layer 203 with the member 402, the electrode layer 202 and the electrode layer 203 can be protected from ink or the like. Further, by filling the first recess 105 with the member 402, the second surface 103 of the substrate 101 can be made flat.

  The head substrate is mounted by bonding the mounting surface opposite to the surface on which the discharge port 301 is provided and the connection surface of the support substrate 401. The mounting surface of the head substrate and the connection surface of the support substrate 401 can be joined using the same member 402 made of resin as that provided in the first recess 105. At this time, the bonding is performed so that the opening 30 of the support substrate and the supply port 303 of the liquid discharge head substrate 82 are aligned.

  The mounting surface of the head substrate and the connection surface of the support substrate were kept parallel by bonding the surface of the first recess 105 to the support substrate using the second substrate 103 and the flat substrate. The head substrate can be mounted in a state. Thus, the ink discharge direction from the discharge port can be set to a desired direction, and printing can be performed at a desired position.

  Further, the first recess 105 is sealed with a member 402 made of resin, and the electrode layer is formed from the supply port array without increasing the area of the substrate by joining the second surface 102 and the support substrate 401. The distance to 202 and the electrode layer 203 can be long. Accordingly, it is possible to provide a highly reliable head substrate that can prevent the corrosion of the electrode layer caused by the ink traveling through the interface between the support substrate 401 and the substrate 101 and can reduce the area of the substrate.

[First embodiment]
Next, a configuration in which the electrode layer connected to one element row and the electrode layer connected to the other element row provided between two adjacent supply port rows shown in FIG. Explained.

  The liquid discharge head substrate in FIG. 4B is provided with a plurality of supply port arrays each including a plurality of supply ports 303. On both sides of the supply port array, as shown in FIG. Two element rows composed of the elements 201 are provided so as to be symmetric with respect to the supply port row. Here, it is assumed that the adjacent supply port arrays are a first supply port array and a second supply port array.

  The head substrate 82 includes a plurality of heating elements 201 belonging to the first element row provided along the first supply port row between the first supply port row and the second supply port row; A plurality of heating elements 201 belonging to the second element row provided along the second supply port row are provided. Furthermore, one first recess 105 is provided between the first supply port row and the second supply port row. The heating element 201 made up of the first element row and the heating element 201 made up of the second element row provided along the second supply port row are connected to one first concave portion 105 through the through electrode 205. The electrode layer 202 and the electrode layer 203 provided inside are connected in common.

[Method for Manufacturing Substrate for Liquid Discharge Head]
A method for manufacturing the liquid discharge head substrate will be described below.

  A plurality of heating elements 201 are provided by forming a resistance layer made of TaSiN or the like and an electrode made of Al or the like on the first surface 102 of the substrate 101 made of silicon. Further, a drive circuit unit 204 including a plurality of drive circuits for driving the heat generating element 201 and a connection terminal 207 for obtaining an electrical connection with the outside are formed by a semiconductor manufacturing technique. A protective layer 208 that protects the heat generating element 201 from ink or the like is formed on the heat generating element 201. On the protective layer 208, a discharge port member mainly composed of a resin such as an epoxy resin having a discharge port 301 for discharging a liquid using a photolithography technique and a flow path 302 communicating with the discharge port 301. 304 is formed. Thereby, the substrate 101 shown in FIG.

  Next, as shown in FIG. 5B, a photosensitive resist is applied to the entire surface of the second surface 103 opposite to the first surface 102 of the substrate 101 by spin coating or the like. The applied photosensitive resist is exposed and developed using a photolithography technique. As a result, a mask 501 is formed on the second surface 103 for defining an opening region for etching the substrate 101. Next, crystal anisotropic etching of the substrate 101 is performed using a strong alkaline aqueous solution such as TMAH or KOH as an etchant. Since silicon has a slow etching rate on the <111> plane, the silicon has an inclined surface with an angle of about 54.7 degrees with respect to the second surface 102 of the substrate 101 when etching is performed using strong alkali. Etching is performed as described above.

  At this time, by providing the mask 501 so that the concave portion that forms the first concave portion 105 and the second concave portion 106 that is used as the first supply port portion that forms a part of the supply port are opened, The 1st recessed part 105 and the 2nd recessed part 106 can be formed in a lump. After the first concave portion 105 and the second concave portion 106 are simultaneously formed from the second surface 103 to the third surface 104 having a desired depth, the mask 501 is etched with a resist remover or a mask agent. Remove by immersion in liquid. Accordingly, the first concave portion 105 and the second concave portion 106 having inclined surfaces that are continuous from the second surface 102 to the third surface 103 can be provided on the substrate 101.

  Next, as shown in FIG. 5C, a photosensitive resist is applied to the entire surface of the second surface 103 side of the substrate using a method such as spin coating, slit coating, or spray coating. On this resist, exposure / development is performed using a photolithography technique to form a mask 502 that defines an opening position when dry etching is performed. Thereafter, etching is performed using a deep RIE method such as a BOSCH process, so that a through hole serving as a through electrode 205 is provided in a region between the first surface 102 and the third surface of the substrate 101. Thereafter, the mask 502 is removed by dipping in a resist remover or an etching solution of the mask agent (FIG. 5D).

  Next, an insulating layer for ensuring insulation between the through electrode 205 and the substrate 101 is formed over the entire surface by a CVD method using a resin such as silicon oxide, silicon nitride, or parylene. Thereafter, a mask is provided in a region where the through hole is provided by using a photolithography technique, and the insulating layer is etched by a technique such as RIE, so that an unnecessary insulating layer is removed.

  Further, by providing a metal film in the through hole using a vapor deposition method or the like and performing patterning using a photolithography technique or the like, the through electrode 205 that can be electrically connected from the third surface 104 to the first surface 102. Is formed. When the through electrode needs to have a low resistance, the inside of the through hole can be filled with a conductive material by using an electroplating method after depositing a metal film.

  Next, a refractory metal material such as titanium tungsten is formed on the entire surface of the second surface 103 as the diffusion preventing layer 503. Next, a plating conductor layer 504 that is excellent as a wiring layer is formed on the entire surface by vacuum film formation or the like. Here, gold is used as the conductor metal. At this time, in order to improve adhesion between the diffusion preventing layer and the plating conductor gold layer, the oxide film of the diffusion preventing film is removed before the plating conductor layer 504 is deposited, and then the plating conductor metal is formed. It is desirable.

  Thereafter, as shown in FIG. 5 (e), a photoresist is applied to the entire surface of the gold layer of the plating conductor using a spin coating method, a slit coating method, a spray coating method, or the like. At this time, a photoresist is applied so as to be thicker than a desired wiring thickness. For example, in the case of forming a plating thickness of 15 μm, the coating is performed under the condition that the photoresist film thickness is 20 μm.

  Next, resist exposure / development is performed by a photolithography method to expose the gold layer of the plating conductor in a portion where wiring is to be formed, and a mask 505 serving as a mold material is formed.

  Next, in an electrolytic bath of gold sulfite by electroplating, an electric current is passed through the gold layer of the plating conductor to deposit gold in a region not covered with the mask 505, and the electrodes connected to the plurality of through electrodes 205 A layer 202 and an electrode layer 203 are formed. When the electrode layer 202 and the electrode layer 203 have different film thicknesses, the wiring film thickness can be controlled by repeating the resist process and the gold plating process.

  After the electrode layer 203 and the electrode layer 202 are formed by the above process, the photoresist is removed by being immersed in a photoresist stripping solution.

  Next, the electrode layer 202 and the outermost layer of the electrode layer 203 and the plating conductor layer 504 are removed by immersion in an etching solution containing a nitrogen-based organic compound, iodine, and potassium iodide, and the diffusion prevention layer 503 is removed. To expose. After that, the diffusion prevention layer 503 is removed by immersing in a hydrogen peroxide-based etching solution using the electrode layer 202 and the electrode layer 203 as a mask. Through the above steps, the electrode layer 203 and the electrode layer 202 are formed on the third surface 104 of the substrate 101 as shown in FIG.

  As shown in FIG. 5G, a photoresist is applied to the entire surface of the second surface 103 by using a method such as spin coating, slit coating, or spray coating. Next, in order to provide a portion to be opened of the through-hole 109 which is a second supply port portion which becomes a part of the supply port 303, resist exposure / development is performed by a photolithography method, and pattern formation of the mask 506 is performed. Do.

  Next, as shown in FIG. 5H, the second surface that penetrates the third surface 104 of the substrate and the first surface 102 of the substrate from the third surface 104 of the substrate by a deep RIE method such as a BOSCH process. A through portion 109 used as a supply port portion is provided. As a result, a supply port 303 including the second recess 106 and the through portion 109 used for supplying ink is formed.

  The second recess 106 is provided so as to have a larger opening area with respect to the opening area of the penetrating portion 109 in order to ensure the amount of ink supplied. For this reason, the through hole of the through electrode 205 and the through part 109 of the supply port 303 may have different etching rates, so that etching can be performed under etching conditions suitable for each in order to suppress variation. Etching is performed in separate steps. However, as shown in FIG. 6, an opening is provided with a mask 502 at a position where the through hole of the through electrode 205 and the through hole 109 of the supply port 303 are to be provided, and the through hole of the through electrode 205 and the through hole 109 are formed by dry etching or the like. It can also be formed in a lump. By simultaneously performing the process of providing the through-hole of the through-electrode 205 and the process of providing the through-hole 109 of the supply port 303, the number of processes can be reduced, and the manufacturing cost of the head substrate can be reduced.

  Since a plurality of liquid discharge head substrates manufactured by the above steps are simultaneously formed on the wafer, one liquid discharge head substrate is provided by cutting them out.

  Next, the support substrate 401 is bonded to such a liquid discharge head substrate to form a liquid discharge head. Hereinafter, an example of the support substrate 401 will be described.

  As shown in FIG. 4B, the member 402 made of resin is in contact with the slope that continues from the second surface 103 provided by anisotropic etching of the first recess 105 and the third surface 104. It is provided as follows. Further, the member 402 is provided so that the surface of the member 402 of the first recess 105 and the second surface 103 of the substrate 101 are flat. The head substrate is mounted by bonding the mounting surface opposite to the surface on which the discharge ports 301 are provided to the connection surface of the support substrate 401. The mounting surface of the head substrate and the connection surface of the support substrate 401 are joined using a member 402 made of the same resin as that provided in the first recess 105 as a joining member. The joining member can be joined using a material other than the member 402 made of the same resin as that provided in the first recess 105, but the number of processes can be reduced by joining using the same material. In addition, the adhesion to the surface of the first recess 105 can be improved.

  As described above, the first concave portion 105 of the substrate 101 is sealed with the member 402 made of resin, and the second surface 102 and the support substrate 401 are bonded to each other, so that the electrode layer 202 and the electrode layer 203 are supplied from the supply port 303. The distance up to the slope can be longer. Thereby, it is possible to prevent ink from corroding the electrode layer through the interface between the support substrate 401 and the substrate 101, and to provide a highly reliable head substrate.

  FIG. 7A is an example schematically showing a cross section of the head substrate in the B-B ′ direction in FIG. 3. Here, the discharge port member 304 and the like are omitted. The electrode layer 202 and the electrode layer 203 provided inside the first recess 105 are electrically connected to a plurality of through-electrodes 205 connected to individual power wirings 206 provided individually for each heating element 201 to generate heat. The element 201 is provided in parallel with the element row. Further, the first recess 105 is provided so that the second surface 103 of the substrate 101 and the surface of the first recess 105 become flat by filling the first recess 105 with a resin member 402. Yes. Further, the second surface 103 which is the mounting surface opposite to the surface on which the discharge port 301 is provided is mounted by bonding the connection surface of the support substrate 401. The mounting surface of the head substrate and the connection surface of the support substrate 401 are joined using a member 402 made of the same resin as that provided in the first recess 105.

  The connection terminal 207 is connected to the connection portion 603 of the electric wiring substrate 602 provided on the support plate 601 on the first surface 102 of the substrate 101 via the through electrode 205 located at the end of the row of the plurality of through electrodes. And electrically connected to the outside. Further, the connecting portion is sealed with a sealant 604 so as not to come into contact with ink or the like. In this way, by providing the connection portion between the through electrode 205 and the connection terminal 207 on the first surface 102 side, the second surface of the substrate 101 connected to the support substrate 401 can be flattened.

  As described above, the plurality of through electrodes 205 penetrating the substrate are connected to the electrode layer 202 and the electrode layer 203 in the region located between the second surface and the third surface of the substrate, and are connected to the first recess 105. By providing the member 402 made of resin, the second surface of the substrate can be kept flat. Further, the first recess 105 is sealed with a member 402 made of resin, and the electrode layer is formed from the supply port array without increasing the area of the substrate by joining the second surface 102 and the support substrate 401. The distance to 202 and the electrode layer 203 can be long. Thereby, the corrosion of the electrode layer generated by the ink passing through the interface between the support substrate 401 and the substrate 101 can be prevented, and the area of the substrate can be reduced.

  Further, as shown in FIG. 7B, the electrode layer 202 can be connected to a connection terminal 207 provided on the second surface 103. At this time, a connection terminal 207 that is electrically connected to the outside is provided on the second surface 103. An electrode layer 202 and an electrode layer 203 provided on the third surface 104 and electrically connected to the plurality of through electrodes 205 are provided extending to the second surface 103 and electrically connected to the connection terminal 207. Connected. Further, the connection terminal 207 is electrically connected to the outside by being electrically connected to a connection portion 603 provided on the support substrate 401. The connecting portion is sealed with a sealant 604 so as not to come into contact with ink or the like. By providing the connection terminal 207 on the second surface 103, it is not necessary to secure a region for providing the connection terminal 207 on the first surface 102, and the area of the substrate can be reduced. Thus, by reducing the area of the substrate, the number of head substrates that can be formed from a single silicon substrate can be increased, and the manufacturing cost can be reduced.

  As described above, an object of the present invention is to provide a liquid ejection head substrate that can prevent ink from penetrating into an electrical connecting portion and can reduce the area.

  Furthermore, by connecting a plurality of through-electrodes 205 penetrating the substrate with an electrode layer 202 and an electrode layer 203 provided in a region located between the second surface and the third surface of the substrate, The surface can be kept flat so as not to be uneven. It is possible to provide a highly reliable head substrate that can be mounted in a state in which the connection surface of the support substrate 401 and the mounting surface of the head substrate are kept parallel, and the ejection direction of ink from the ejection port can be a desired direction.

[Second Embodiment]
Next, an example of a liquid discharge head using another support substrate 401 will be described. The liquid discharge head substrate 82 is provided using the same manufacturing method as in the first embodiment.

  FIG. 8A is an example of a schematic cross-sectional view in the AA ′ direction of FIG. 3A, in which a plurality of supply port arrays are provided, and a plurality of heating elements 201 are provided in a region between adjacent supply port arrays. The power wiring 13 which consists of the electrode layer 202 and the electrode layer 203 which connect to is shown. FIG. 8B shows an example of a schematic cross-sectional view in the C-C ′ direction of FIG. 3B of the liquid discharge head having one supply port array.

  A supply port array composed of a plurality of supply ports 303 for supplying ink to the heat generating element 201 is provided on the second surface 103 which is opposite to the first surface 102 of the substrate on which the heat generating element 201 is provided. It is composed of a second concave portion 106 and a penetrating portion 109 in the mouth row. The ink supplied from the opening 30 of the support substrate through the supply port 303 is ejected from the ejection port 301 by the energy generated by the heat generating element 201, whereby the recording operation to the recording medium is performed. The discharge port 301 and the flow path 302 communicating with the discharge port are formed by a discharge port member 304 made of resin. A protective layer 208 is provided above the heat generating element 201 to protect it from ink, and an ejection port member 304 is provided above the protective layer 208.

  An individual power wiring 206 that is connected to the heating element 201 and supplies current to the heating element 201 is common to the inside of the first recess 105 provided on the second surface 103 of the substrate 101 through the through electrode 205. It is connected to a power wiring 13 used for a GNDH wiring or a VH wiring. The power wiring 13 is provided along the element row, and one power wiring 13 is connected to only one of the GNDH wiring and the VH wiring. When both the GNDH wiring and the VH wiring are provided inside the first recess 105, two power wirings 13 are provided.

  A third surface 104 is provided inside the first recess 105 so that the thickness of the substrate is thinner than the thickness of the second surface 103 and the first surface 102 in the direction perpendicular to the surface of the substrate. It has been. The power wiring 13 is provided on the protrusion 22 having a film thickness larger than the mounting surface 21 of the support substrate 401 through the bumps 6 used as connection members, and is electrically connected to the electrical connection terminals 14 used as terminals. . Further, a bump 402, the electrical connection terminal 14, and the power wiring 13 are formed between the first recess 105 and the projection 22 provided with the bump 6, the electrical connection terminal 14, and the power wiring 13 using a member 402 made of resin or the like. It is sealed so as to cover.

  FIG. 9 is an example of a schematic cross-sectional view of the head in the B-B ′ direction of FIG. 3. A plurality of through-electrodes 205 connected to the individual power wirings 206 provided for the plurality of heating elements 201 are provided along the direction of the element rows. The plurality of through electrodes 205 are connected to the power wiring 13 inside the first recess 105 of the substrate 101.

  FIG. 9A shows a configuration in which the bump 6 is provided on the entire surface of the power wiring 13 and the electrical connection terminal 14. However, if electrical connection is possible, 2 as shown in FIG. Only one bump 6 can be provided. In this way, electrical connection is made between the concave portion of the substrate and the convex portion of the support substrate 401, and the periphery of the bump is covered and sealed with a member 402 made of a resin made of an amine curable epoxy resin composition or the like. ing. The member 402 may be sealed using not only one type of material but also a plurality of materials. An adhesive material can also be used.

  As described above, the recesses of the substrate and the convex portions of the support substrate 401 are electrically connected, and the gaps between the concave portions and the convex portions are sealed. The distance can be a distance that can prevent the ink from penetrating into the bump.

  Next, a specific description will be given while showing a method of manufacturing a support substrate to be bonded to the liquid discharge head substrate.

  A resist mask is provided on a substrate (third substrate) whose main component is silicon thinner than the depth of the first recess so that the opening width is about 900 μm. Further, similarly to the first substrate, a strong alkali such as TMAH is used as an etchant, and portions other than the portion to be the convex member are removed by crystal anisotropic etching. The surface of the third substrate used at this time is also the second inclined surface having the same inclination angle of about 54.7 degrees as the first inclined surface with respect to the surface of the substrate by making the crystal orientation <100> plane of silicon. A convex member can be provided.

  Further, a support substrate having a convex portion 22 shown in FIG. 6B by bonding a convex portion member to a mounting surface 21 of a substrate (second substrate) made of alumina or the like having an opening 30 for supplying ink. 401 is provided. Further, the bumps 6 made of a conductive material such as gold are provided on the convex portion 22 of the support substrate 401.

  Next, the first concave portion 105 having the first inclined surface of the head substrate 82 and the convex portion 22 having the second inclined surface of the support substrate 401 shown in FIG. At this time, the opening 30 of the support substrate 401 and the supply port 303 of the head substrate 82 are provided so as to coincide with each other. Accordingly, the power wiring 13 of the head substrate 82 and the bump 6 of the support substrate 401 can be electrically connected, and ink can be supplied from the opening 30 of the support substrate 401 to the supply port of the head substrate 82. .

  Thereafter, a member 402 made of a resin made of an amine curable epoxy resin composition is filled in the gap between the first concave portion 105 and the convex portion 22 provided with the bumps 6, the electrical connection terminals 14, and the power wirings 13. As a result, sealing is performed as shown in FIG.

  As described above, the first concave portion 105 is provided in the head substrate 82 and the convex portion 22 is provided in the support substrate 401 to perform electrical connection at the portion, and the inclined surface between the first concave portion and the convex portion is formed on the member 402. Seal with. Thereby, even if the head substrate is further reduced, the distance between the bump 6 and the supply port 303 can be set to a distance that can prevent the ink from penetrating into the bump 6.

  By sealing the space between the first inclined surface of the first concave portion 105 and the second inclined surface of the convex portion 22 with a member 402 made of resin or the like, it is possible to reliably cover and perform sealing. And corrosion due to ink can be more effectively prevented. Thereby, even if the head substrate is further reduced, it is possible to provide a liquid discharge head that can prevent ink from penetrating into the bumps 6 and the power wirings 13.

[Third embodiment]
In the present embodiment, another method for manufacturing the support substrate of the liquid discharge head shown in the second embodiment will be described. The head substrate is the same as that used in the first embodiment.

  The support substrate 401 is made of polysulfone resin having excellent heat resistance and chemical resistance, has a width of 900 μm in the direction orthogonal to the element row, has a convex portion 22 with a height of 425 μm, and an opening 30 for supplying ink. Injection molding is performed so as to have (FIG. 11A). In addition, any resin that can be injection-molded having heat resistance and chemical resistance can be similarly used as the support substrate 401. For example, polyether sulfone resin, polyphenylene ether resin, polyphenylene oxide resin, polypropylene resin, etc. Can also be used.

  At this time, the convex portion 22 is provided so as to have a second inclined surface having the same inclination angle as that of the first concave portion 105 of the head substrate.

  Next, the bumps 6 made of a conductive material such as gold and the electrical connection terminals 14 are formed on the convex portions 22 of the support substrate 401 (FIG. 11B).

  The head substrate 82 and the support substrate 401 shown in FIG. 11B are coupled to make electrical connection. The opening 30 of the support substrate 401 and the supply port 303 of the head substrate 82 are bonded so as to coincide with each other. Thereby, ink can be supplied from the support substrate 401 to the head substrate 82.

  Thereafter, a member 402 made of an amine curable epoxy resin composition is filled in a gap of about 50 μm between the first concave portion 105 and the convex portion 22 provided with the bump 6, the electrical connection terminal 14, and the power wiring 13. Then, as shown in FIG.

  As described above, the first concave portion 105 is provided in the head substrate 82 and the convex portion 22 is provided in the support substrate 401 to perform electrical connection at the portion, and the inclined surface between the first concave portion and the convex portion is formed on the member 402. Seal with. Thereby, even if the head substrate is further reduced, the distance between the bump 6 and the supply port 303 can be set to a distance that can prevent the ink from penetrating into the bump 6.

  Further, the support substrate 401 is provided if the support substrate 401 has an inclined surface having substantially the same inclination angle as the first inclined surface by injection molding with a resin member so as to correspond to the first recess. In this way, the bump 6 is more reliably sealed by sealing the gap between the first inclined surface of the first concave portion 105 and the second inclined surface of the substantially parallel convex portion 22 with the member 402 made of resin or the like. The power wiring 13 can be covered and sealed. Accordingly, it is possible to provide a liquid discharge head that can prevent ink penetration even if the head substrate is further reduced.

  Further, by using the injection molding technique as shown in this example, it is possible to reduce the convex etching process and the process of bonding the alumina substrate as shown in the second embodiment, thereby reducing the manufacturing cost. It can also be done.

  As described above, in the embodiment used in the description of the present invention, the liquid ejection head applicable to the recording apparatus using the ink jet recording method has been described. However, the present invention is not limited thereto, and vibration energy of a piezoelectric element or the like It is also applicable to a method of discharging droplets by

82 Liquid Discharge Head Substrate 83 Liquid Discharge Head 101 Substrate 102 First Surface 103 Second Surface 104 Third Surface 105 Region 201 Element 202, 203 Electrode Layer 205 Electrode 303 Supply Port 401 Support Substrate 402 Member

Claims (18)

A first surface provided with a plurality of elements for generating energy used for discharging liquid; a second surface opposite to the first surface provided with a recess; and the first surface. And a liquid supply port penetrating between the second surface and the second surface,
A plurality of electrodes electrically connected to each of the plurality of elements and provided through the substrate between the first surface and the inside of the recess;
An electrode layer electrically connected in common to the plurality of electrodes and provided on the inside;
A member made of resin provided in the recess to cover the electrode layer;
A substrate for a liquid discharge head, comprising:   The liquid discharge head substrate according to claim 1, wherein the substrate has a plurality of the supply ports, and a supply port array is formed by arranging the plurality of supply ports.   The liquid discharge head substrate according to claim 2, wherein an element array configured by arranging a plurality of the elements is provided so as to sandwich the supply port array.   A plurality of the supply port rows are provided, and the first element row corresponding to the first supply port row is located in a region between the adjacent first supply port row and the second supply port row. The element belonging to the second element row corresponding to the second supply port row is electrically connected to the electrode layer in common with the element belonging to the second supply port row. Liquid discharge head substrate.   The substrate is continuous with the second surface, and is provided from the second surface to a position between the first surface and the second surface in an oblique direction with respect to the second surface. 5. The liquid discharge head substrate according to claim 1, further comprising a slope, wherein the member is in contact with the slope. 6.   6. A connection terminal capable of being electrically connected to a connection terminal for supplying electric power to the liquid ejection head substrate is provided on the second surface. The substrate for a liquid discharge head according to any one of the above.   7. The liquid discharge head substrate according to claim 1, and a support substrate that supports the liquid discharge head substrate, wherein the second surface of the liquid discharge head substrate is provided. And a liquid discharge head to which the support substrate is bonded. A liquid discharge head substrate according to any one of claims 1 to 6,
Supporting the liquid discharge head substrate from the second surface side, a convex portion provided inside the concave portion, and a connecting member provided on the convex portion and electrically connected to the electrode layer; A support substrate in communication with the supply port, and an opening for supplying a liquid to the supply port;
Have
The member is provided so as to cover the electrode layer and the connection member between the liquid discharge head substrate and the support substrate from the inside of the recess to the second surface. A liquid discharge head. The recess has a first slope that is continuous with the second surface and is provided from the second surface to a position between the first surface and the second surface;
The convex portion has a second slope substantially parallel to the first slope,
The liquid ejection head according to claim 8, wherein a member made of the resin is provided between the first slope and the second slope. In a method for manufacturing a substrate for a liquid discharge head having an element that generates energy used for discharging a liquid,
A first surface provided with a plurality of the elements, a second surface opposite to the first surface provided with a recess, and a space between the first surface and the inner side of the recess. Preparing a substrate having a plurality of through holes and a liquid supply port penetrating between the first surface and the second surface;
Supplying a conductive material to the plurality of through-holes, and providing a plurality of electrodes electrically connected to the plurality of elements between the first surface and the inside of the recess;
Providing an electrode layer electrically connected in common to the plurality of electrodes on the inside;
Providing a member made of resin in the recess so as to cover the electrode layer;
A method for manufacturing a substrate for a liquid discharge head, comprising:   A plurality of the recesses are collectively provided in the substrate, a plurality of the through holes corresponding to the plurality of the recesses are provided, and the conductive material is provided to the through hole provided corresponding to one of the recesses. A first supply port that forms an electrode and has the other recess provided adjacent to the one recess, penetrating the substrate and serving as part of a supply port for supplying liquid to the element 11. The liquid ejection head according to claim 10, wherein the through hole provided corresponding to the other concave portion is a second supply port portion that is another portion of the supply port. A method for manufacturing a substrate.   The method for manufacturing a substrate for a liquid discharge head according to claim 10, wherein the substrate is made of silicon, and the recess is provided by crystal anisotropic etching.   The method for manufacturing a substrate for a liquid discharge head according to claim 10, wherein the substrate is made of silicon, and the plurality of through holes are provided by anisotropic etching.   The method for manufacturing a substrate for a liquid discharge head according to claim 10, wherein the electrode layer is formed by a plating method. A first surface provided with a plurality of elements for generating energy used for discharging liquid, a second surface opposite to the first surface, provided with a recess, and the first surface And a liquid supply port penetrating between the second surface and the second surface; and a plurality of the elements electrically connected to the first surface of the substrate and the recess Provided with a substrate for a liquid discharge head, comprising: a plurality of electrodes that are provided so as to penetrate between the electrodes; and an electrode layer that is electrically connected in common to the plurality of electrodes and provided on the inside. And a process of
A support substrate having a convex portion provided with a connecting member that can be electrically connected to the electrode layer, and an opening for supplying a liquid to the supply port; and the convex portion is a member of the liquid discharge head substrate. Providing the support substrate so that the opening and the supply port communicate with each other at an inner position;
Electrically connecting the electrode layer and the connecting member;
Providing a member made of a resin so as to cover the electrode layer and the connection member between the liquid discharge head substrate and the support substrate from the inside of the recess to the second surface;
A method of manufacturing a liquid discharge head, comprising: Providing the support substrate comprises:
Providing a second substrate having the opening;
Adhering the convex part member for forming the convex part and the second substrate;
Providing the connection member on the convex portion;
The method of manufacturing a liquid discharge head according to claim 15, comprising:   The first substrate is formed of silicon, the recess is obtained by removing a part of the first substrate by crystal anisotropic etching, and the convex member is a third of silicon. The method of manufacturing a liquid discharge head according to claim 16, wherein the liquid discharge head is obtained by crystal anisotropic etching to remove a portion other than the portion to be the convex portion member. Providing the support substrate comprises:
Forming a member made of a resin having the opening and the convex portion by injection molding;
Providing the connection member on the convex portion;
The method of manufacturing a liquid discharge head according to claim 15, comprising:

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